Heating tape

Abstract

The utility model discloses a heating tape. The heating tape comprises a heating main tape which is connected with a temperature control thermocouple and is used for adjusting the temperature of the heating main tape; the heating sub-belt is connected with the heating main belt and comprises a second heating layer and at least one force application structure, the second heating layer covers the surface of a heated part, and the at least one force application structure is located on the surface of the second heating layer and used for adjusting the pressure applied to the second heating layer. And the heat conductivity coefficient between the second heating layer and the heated part is adjusted. By means of the heating belt, the heating temperature of the heating sub-belts can be reversibly adjusted in real time, and therefore the uniformity and sensitivity of overall temperature adjustment of the heating belt are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor equipment, concretely relates to a heating band. BACKGROUND

[0002] In the current semiconductor equipment, the heating band is a long strip structure, which is composed of a heat insulation layer and a heating layer. Generally, the power supply (AC) device of the heating band, as well as some temperature control equipment, such as temperature control thermocouples and over-temperature alarm thermocouples, will only be installed on a certain section of the heating band, and will not be distributed on the entire section of the heating band. This means that the temperature control and adjustment range of the entire heating band is limited, and can only be accurately reflected on the heating band section including the temperature control equipment, while the temperature of the heating band area far from the other sections connected to the above-mentioned temperature control devices cannot be well controlled, thus easily causing the problem of uneven heating temperature of the entire heating band. At this time, if the environmental temperature and the difference in processing and installation are affected, the temperature difference between the other sections of the heating band will be obvious, ultimately increasing the defect of uneven heating temperature of the entire heating band.

[0003] In order to solve the above-mentioned problems existing in the prior art, there is an urgent need in the field for an improved heating technology that can reversibly adjust the heating temperature of the heating sub-band in real time, thereby improving the uniformity and sensitivity of the overall temperature adjustment of the heating band. SUMMARY

[0004] The following gives a brief summary of one or more aspects to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all contemplated aspects, and is neither intended to identify key or critical elements of all aspects nor to delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description to be given later.

[0005] In order to overcome the above-mentioned defects existing in the prior art, the utility model provides a heating band, which can reversibly adjust the heating temperature of the heating sub-band in real time, thereby improving the uniformity and sensitivity of the overall temperature adjustment of the heating band.

[0006] Specifically, according to the above-mentioned heating band provided by the first aspect of the utility model, it comprises: a heating main band connected to a temperature control thermocouple for adjusting the temperature of the heating main band; a heating sub-band connected to the heating main band, comprising a second heating layer and at least one force applying structure, wherein the second heating layer covers the surface of a heated part, and the at least one force applying structure is located on the upper surface of the second heating layer for adjusting the pressure applied to the second heating layer to adjust the thermal conductivity between the second heating layer and the heated part.

[0007] Further, in some embodiments of the present application, the second heating layer comprises a plurality of heating units, and the heating sub-belt comprises a plurality of the force applying structures, wherein the first force applying structure above the heating unit is used to apply a first pressure, and the second force applying structure between adjacent heating units is used to apply a second pressure, and the second pressure is greater than the first pressure.

[0008] Further, in some embodiments of the present application, the heating sub-belt further comprises a heat conducting layer between the heating layer and the heated part, wherein the heat conducting coefficient of the heat conducting layer is positively correlated with the change degree of the stress field, and the change degree of the stress field is positively correlated with the pressure applied on the force applying structure.

[0009] Further, in some embodiments of the present application, the force applying layer comprises a force applying part made of a high-temperature-resistant material with shape deformation recovery.

[0010] Further, in some embodiments of the present application, the force applying layer is provided with a scale part for recording the force applying pressure scale corresponding to the change degree of the stress field of the heat conducting layer.

[0011] Further, in some embodiments of the present application, a heat insulation layer is arranged between the heating layer and the force applying structure, and the force applying structure is detachably fixed on the heat insulation layer.

[0012] Further, in some embodiments of the present application, a plurality of heating sub-belts are connected in series or in parallel with the heating main belt.

[0013] Further, in some embodiments of the present application, the heating main belt and the heating sub-belt are arranged outside the gas conveying pipeline and / or the exhaust pipeline in the semiconductor device. BRIEF DESCRIPTION OF DRAWINGS

[0014] The above features and advantages of the present application can be better understood by reading the detailed description of embodiments of the present application in conjunction with the following drawings, in which: the components are not necessarily drawn to scale, and components having similar or related properties or features can have the same or similar reference numbers.

[0015] Figure 1 Fig. 1 shows a structure schematic diagram of a heating belt according to some embodiments of the present application;

[0016] Figure 2 Fig. 2 shows a structure schematic diagram of a heating belt according to some other embodiments of the present application;

[0017] Figure 3A structure diagram of a heating subband is shown according to some embodiments of the present application; and

[0018] Figure 4 A flow chart of a heating method is shown according to some embodiments of the present application.

[0019] Reference signs:

[0020] 100 heating band;

[0021] 110 heating main band;

[0022] 111 first heating layer;

[0023] 112, 214 heat insulation layer;

[0024] 120 controller;

[0025] 131 power supply device;

[0026] 132 temperature control thermocouple;

[0027] 133 over-temperature alarm thermocouple;

[0028] 134 monitoring thermocouple;

[0029] 210 heating subband;

[0030] 211 second heating layer;

[0031] 212 force applying structure;

[0032] 213 heat conducting layer; and

[0033] S410-S430 steps. DETAILED DESCRIPTION

[0034] The embodiments of the present application will be described in detail by specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the description. Although the description of the present application will be introduced in combination with the preferred embodiments, this does not mean that the features of the present application are limited to the embodiments. On the contrary, the purpose of introducing the present application in combination with the embodiments is to cover other options or modifications that can be extended based on the claims of the present application. In order to provide a deep understanding of the present application, many specific details will be included in the following description. The present application can also be implemented without using these details. In addition, in order to avoid confusion or obscure the focus of the present application, some specific details will be omitted in the description.

[0035] In the description of the utility model, it is necessary to explain that, unless there is definite stipulation and limitation, the terms "mount", "link", "connect" should be understood in broad sense, for example, it can be fixed connection, also can be detachable connection, or integrally connected, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirectly connected through intermediate medium, can be the intercommunication of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0036] In addition, "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" used in the following description should be understood as the orientation shown in the section and related drawings. The relative terms are only for the convenience of description, and do not represent that the device described should be manufactured or operated in a particular orientation, so it should not be understood as a limitation on the utility model.

[0037] It can be understood that although the terms "first", "second", "third" and the like can be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below can be referred to as the second component, region, layer and / or part without deviating from some embodiments of the utility model.

[0038] As described above, in the current semiconductor device, the heating band is a long strip structure, which is composed of a heat insulation layer and a heating layer. Generally, the power supply (AC) device of the heating band and some temperature control devices, such as temperature control thermocouple and over-temperature alarm thermocouple, will only be installed on a certain section of the heating band, and will not be distributed on the whole section of the heating band. This means that the temperature control and adjustment range of the whole heating band is limited, and can only be accurately reflected on the heating band section including the temperature control device, and the temperature of the heating band area far away from the other section connected with the above-mentioned temperature control device cannot be well controlled, so the problem of uneven heating temperature of the whole heating band is prone to occur. At this time, if the environmental temperature and the difference in processing and installation are affected, the temperature difference between other sections of the heating band will occur, which will eventually lead to the defect of uneven heating temperature of the whole heating band.

[0039] In order to solve the above problems existing in the prior art, the utility model provides a kind of heating band, can carry out real-time reversible adjustment to the heating temperature of heating subband, to improve the uniformity and sensitivity of the whole temperature regulation of heating band.

[0040] The working principle of the heating belt will be described below in combination with some embodiments of heating methods. Those skilled in the art can understand that the embodiments of the heating methods are only some non-limiting embodiments provided by the present application, which are intended to clearly show the main concept of the present application and provide some specific schemes for the public to implement, rather than to limit all working modes or all functions of the heating belt. Similarly, the heating belt is also only a non-limiting embodiment provided by the present application, which does not limit the implementation subject of each step in the heating methods.

[0041] Please refer to Figure 1 , Figure 1 A structural schematic diagram of a heating belt according to some embodiments of the present application is shown.

[0042] As Figure 1 shown, in some embodiments of the present application, the heating belt 100 can include a heating main belt 110 and a controller 120 connected thereto. A power supply device 131 and a temperature control thermocouple 132 for adjusting the temperature of the heating main belt 110 can be connected between the heating main belt 110 and the controller 120. Specifically, the heating main belt 110 can include a first heating layer 111. The first heating layer 111 covers the surface of a heated part (not shown in the drawing) for heating the heated part. Optionally, the first heating layer 111 can be an electric resistance heating layer, i.e., the first heating layer 111 includes a resistance wire. After the heating main belt 110 is powered on, the electric energy is converted into heat energy, thereby being able to heat the heated part. Preferably, a heat insulation layer 112 can also be added between the first heating layer 111 and the heated part for reducing the heat loss inside the first heating layer 111.

[0043] As Figure 1 shown, the controller 120 can directly adjust the temperature of the heating main belt 110 by adjusting the output power of the temperature control thermocouple 132. Specifically, after the target temperature is preset in the controller 120, the controller can then adjust the output power of the temperature control thermocouple 132 to make the first heating layer 111 reach the target temperature. Preferably, an over-temperature alarm thermocouple 133 can also be provided on the heating main belt 110 for timely alarming and reminding the staff when the temperature of the heating main belt 110 is too high.

[0044] Further, for the heating tape 100 applied in the semiconductor equipment, it is usually required to be arranged in the gas delivery pipeline and / or outside the exhaust pipeline. When the heating tape 100 is arranged in the gas delivery pipeline, its main function is to control the temperature of the reaction source to keep it in a suitable temperature range for the process reaction. When the heating tape 100 is arranged outside the exhaust pipeline, its main function is to prevent the condensed exhaust gas from blocking the pipeline. For these heating tapes 100 arranged in the pipeline, the length of the single heating main tape 110 cannot meet the pipeline heating requirement, and the length of the heating tape 100 usually needs to match the length of the pipeline to ensure that the temperature of the gas in the pipeline is uniform during the transmission process.

[0045] To further extend the length of the heating tape 100 to improve its heating range, the heating sub-tape 210 can be connected to the heating main tape 110. Please refer to Figure 2 , Figure 2 A structural schematic diagram of a heating tape according to some embodiments of the present application is shown.

[0046] As shown in Figure 2 , the heating tape 100 can include the heating sub-tape 210. The number of segments of the heating sub-tape 210 can be increased or decreased according to the actual requirement of the pipeline. Preferably, the heating tape 100 can include a plurality of heating sub-tapes 210, and the plurality of heating sub-tapes 210 can be connected to the heating main tape 110 in series or in parallel. Further, each segment of the heating sub-tape 210 can be connected to a monitoring thermocouple 134 for real-time monitoring of the temperature change of the heating sub-tape 210 and feedback to the controller 120 for adjusting the temperature of the heating sub-tape 210 by heating or cooling.

[0047] Due to the limitation of installation conditions, it is impossible to arrange corresponding controllers for each segment of the heating sub-tape 210 in the whole heating tape 100 to adjust the temperature thereof. For the plurality of segments of the heating sub-tape 210 far away from the controller 120, the adjustment of the output power of the controller 120 cannot well control the temperature thereof to reach the target temperature. To ensure that the heating temperature of the plurality of segments of the heating sub-tape 210 can be consistent with the heating temperature of the heating main tape 110, please refer to Figure 3 , Figure 3 A structural schematic diagram of a heating sub-tape according to some embodiments of the present application is shown.

[0048] As shown in Figure 3As shown, in some embodiments of this invention, the heating sub-strip 210 may include a second heating layer 211 and at least one force-applying structure 212. The second heating layer 211 may cover the surface of the heated portion (not shown in the figures) for heating the heated portion. At least one force-applying structure 212 may be located on the upper surface of the second heating layer 211 for adjusting the pressure applied to the second heating layer 211, thereby adjusting the thermal conductivity between the second heating layer 211 and the heated portion.

[0049] In some alternative embodiments, at least one force-applying structure 212 may be configured as a single layer structure laid on the upper surface of the second heating layer 211. In other embodiments, at least one force-applying structure 212 may also be configured as multiple force-applying structures laid on the upper surface of the second heating layer 211 in an array structure.

[0050] In this invention, the controller 120 connected to the main heating belt 110 can be configured to execute a heating method, which may include the following steps: in response to the main heating belt 110 reaching the target temperature, obtaining the current temperature of the heating sub-belt 210; determining whether the current temperature of the heating sub-belt 210 has reached the target temperature; and in response to the current temperature of the heating sub-belt 210 not reaching the target temperature, adjusting the pressure applied on the force-applying structure 212 to adjust the thermal conductivity between the second heating layer 211 and the heated part.

[0051] Specifically, such as Figure 2 As shown, the target temperature of the main heating strip 110 can be preset in the controller 120 to meet the piping temperature requirements of the semiconductor equipment. The controller 120 can reach the target temperature by adjusting the output power of the temperature-controlled thermocouple 132 and ensuring the temperature of the main heating strip 110 stabilizes. At this time, the controller 120 can obtain the current temperature data of each heating sub-strip 210 by connecting the monitoring thermocouples 134 to each heating sub-strip 210. Since no corresponding temperature-controlled thermocouple 132 is configured on each heating sub-strip 210, the temperature of each heating sub-strip 210 cannot uniformly reach the target temperature. Therefore, the temperature can be further adjusted by adjusting the force applied by the force-applying structure 212 to ensure uniform heating of the entire heating strip 100.

[0052] In some optional embodiments, the controller 120 can compare the difference between the current temperature of the heating sub-strip 210 and a preset target temperature. When it is determined that the current temperature of the heating sub-strip 210 is less than the target temperature, the pressure applied to the force-applying structure 212 can be increased, thereby increasing the contact area between the second heating layer 211 and the surface of the heated part, thereby increasing the thermal conductivity between the second heating layer 211 and the heated part, and thus enabling the temperature of the heated part to rise.

[0053] For example, in the initial state, there can be a gap between the second heating layer 211 and the heated part, and heat is transferred between them by heat radiation. After the second heating layer 211 is pressed by the pressing structure 212, the second heating layer 211 is in close contact with the heated part, and the heat transfer between them is changed to heat conduction, thereby reducing the thermal resistance between the second heating layer 211 and the heated part and improving the thermal conductivity between them.

[0054] Conversely, when it is judged that the current temperature of the heating sub-band 210 is greater than the target temperature, the pressure applied to the pressing structure 212 can be reduced, thereby reducing the contact area between the second heating layer 211 and the surface of the heated part, reducing the thermal conductivity between the second heating layer 211 and the heated part, and further reducing the temperature of the heated part.

[0055] For example, in the initial state, the second heating layer 211 can be in close contact with the heated part, and heat is transferred between them by heat conduction. After the pressure applied to the second heating layer 211 by the pressing structure 212 is reduced, there is a gap between the second heating layer 211 and the heated part, and the heat transfer between them is changed to heat radiation, thereby increasing the thermal resistance between the second heating layer 211 and the heated part and reducing the thermal conductivity between them.

[0056] Further, in some preferred embodiments, the second heating layer 211 can further include a plurality of heating units, and the heating sub-band 210 can further include a plurality of pressing structures 212 (not shown in the drawings). Optionally, the plurality of heating units in the second heating layer 211 and the plurality of pressing structures 212 can be arranged in an array, and the number of heating units and pressing structures 212 can not be equal. The first pressing structure located above the heating unit can be used to apply a first pressure, and the second pressing structure located between adjacent heating units can be used to apply a second pressure, wherein the second pressure can be greater than the first pressure. In this embodiment, different pressures are applied to the pressing structures located at different positions above the second heating layer 211 according to the distribution of the heating units in the second heating layer 211, thereby being able to adjust the thermal conductivity between the second heating layer 211 and the heated part in different regions, and further achieving uniform heating of the heating sub-band 210 as a whole, avoiding the situation that local regions of the heating sub-band 210 are unevenly heated.

[0057] Those skilled in the art can understand that the arrangement of the plurality of heating units and the plurality of pressing structures 212 is only one non-limiting embodiment provided by the present application, which is intended to clearly demonstrate the main idea of the present application and provide a specific scheme for the public to implement, rather than to limit the protection scope of the present application.

[0058] Next, please refer toFigure 3 , Figure 3 A structure diagram of a heating sub-band is shown according to some embodiments of the present application.

[0059] As shown in the figure, in some preferred embodiments, the heating sub-band 210 can further comprise a heat-conducting layer 213 with a reversible adjustable heat-conducting coefficient. Figure 3 The heat-conducting layer 213 can be located between the second heating layer 211 and the heated part, and the heat-conducting coefficient of the heat-conducting layer 213 can be positively correlated with the degree of change of its stress field, and the degree of change of the stress field is positively correlated with the pressure applied on the force applying structure 212.

[0060] Specifically, when the temperature of the heating sub-band 210 is detected to be less than the target temperature, the pressure applied on the force applying structure 212 is increased to press the heat-conducting layer 213, which not only increases the contact area between the second heating layer 211 and the surface of the heated part, but also increases the degree of change of the stress field of the heat-conducting layer 213, so as to reduce the thickness of the heat-conducting layer 213. The heat-conducting coefficient of the heat-conducting layer 213 increases with the decrease of the thickness of the heat-conducting layer 213, so as to increase the temperature of the heated part.

[0061] Conversely, when the temperature of the heating sub-band 210 is detected to be greater than the target temperature, the pressure applied on the force applying structure 212 is reduced, which not only reduces the contact area between the second heating layer 211 and the surface of the heated part, but also reduces the degree of change of the stress field of the heat-conducting layer 213, so as to restore the thickness of the heat-conducting layer 213, i.e. the thickness of the heat-conducting layer 213 increases compared with the thickness in the previous pressed state. The heat-conducting coefficient of the heat-conducting layer 213 decreases with the increase of the thickness of the heat-conducting layer 213, so as to reduce the temperature of the heated part. Figure 3 In the embodiment shown in the figure, the force applying structure 212 can cooperate with the heat-conducting layer 213 to further change the thickness of the heat-conducting layer 213, so as to adjust the temperature of the heated part.

[0062] Optionally, in some embodiments, the material of the heat-conducting layer 213 can be compressible graphene foam. The heat-conducting coefficient of the heat-conducting layer 213 made of the compressible graphene composite foam can decrease with the increase of the thickness of the heat-conducting layer 213.

[0063] In some embodiments of the present application, the force applying structure 212 can be composed of a high-temperature-resistant material with reversible deformation. By selecting a material with reversible deformation and high-temperature resistance, not only the service life of the force applying structure 212 can be prolonged, but also the sensitivity of the force change of the force applying structure 212 can be maintained, so as to avoid the problem of temperature adjustment delay of the heating sub-band 210. The material of the force applying structure 212 can include but is not limited to silicone, polyester, etc.

[0064] Optionally, the force applying structure 212 can further be provided with a scale part (not shown in the drawings) for recording the force applying pressure scale corresponding to the change degree of the stress field of the heat conducting layer 213. In the embodiment, the scale part is added for the purpose of recording the force applying pressure scale corresponding to the thickness of the heat conducting layer 213 compressed each time, so that the adjustment of the force applying structure 212 after the installation of the heating sub-belt 210 during the subsequent equipment maintenance can be facilitated.

[0065] Further, as shown in Figure 3 , a heat insulation layer 214 can be further added between the second heating layer 211 and the force applying structure 212 for reducing the heat loss inside the second heating layer 211. Moreover, the force applying structure 212 can be detachably fixed on the heat insulation layer 214, so that the force applying structure 212 can be replaced periodically to maintain its sensitivity to the force change. For example, one end of the force applying structure 212 can be detachably fixed on the heat insulation layer 214 by using a magic tape, and the scale part can be provided on the edge of the magic tape by printing or the like. Alternatively, the force applying structure 212 can be fixed on the heat insulation layer 214 by using other forms such as adhesives or sewing.

[0066] In order to more clearly introduce the above heating belt 100, next, please refer to Figure 4 , Figure 4 a flow chart of a heating method according to some embodiments of the present application is shown.

[0067] As shown in Figure 4 , in some embodiments of the present application, the heating method can include the following steps. First, step S410 can be performed: in response to the target temperature of the heating main belt in the heating belt being reached, the current temperature data of the heating sub-belt is acquired.

[0068] Specifically, it can be understood in combination with Figure 2 and Figure 3 that in some embodiments, the target temperature of heating can be set in advance in the controller 120, and then the heating belt 100 is powered by the power supply device 131. The temperature of the heating main belt 110 is directly adjusted by adjusting the output power of the temperature control thermocouple 132 in the controller 120, so as to reach the target temperature. After the temperature read by the temperature control thermocouple 132 on the heating main belt 110 is stable, the current temperature data of each heating sub-belt 210 can be collected in real time by the monitoring thermocouple 134 corresponding to each heating sub-belt 210, and the signal of the current temperature is fed back to the controller 120.

[0069] Then, step S420 can be performed: whether the current temperature of the heating sub-belt reaches the target temperature is judged.

[0070] Specifically, as shown in Figure 2 andFigure 3 As shown, since each heating sub-belt 210 is not configured with a temperature control thermocouple 132 that can directly adjust the temperature as the heating main belt 110, in the heating sub-belt without the temperature control thermocouple 132, especially some heating sub-belts 210 far away from the heating main belt 110, and due to environmental and processing factors, etc., their temperatures are easy to fail to reach the target temperature. The controller 120 can compare the difference between the current temperature and the preset target temperature of each heating sub-belt 210.

[0071] Then, step S430 can be performed: in response to the current temperature of the heating sub-belt not reaching the target temperature, adjusting the pressure applied to the force applying structure in the heating sub-belt to adjust the thermal conductivity between the second heating layer and the heated part.

[0072] Specifically, as shown in Figure 2 and Figure 3 When the controller 120 determines that the current temperature of a certain section (or several sections) of the heating sub-belt 210 is less than the target temperature, the pressure applied to the force applying structure 212 in this section of the heating sub-belt 210 can be increased, so as to not only increase the contact area between the second heating layer 211 and the surface of the heated part, but also increase the degree of change of the stress field of the thermal conduction layer 213, so as to reduce the thickness of the thermal conduction layer 213. Since the thermal conductivity of the thermal conduction layer 213 in the present application increases with the decrease of the thickness of the thermal conduction layer 213, the temperature of the heated part can be increased to make the section of the heating sub-belt 210 reach the target temperature.

[0073] When the controller 120 determines that the current temperature of a certain section (or several sections) of the heating sub-belt 210 is greater than the target temperature, the pressure applied to the force applying structure 212 in this section of the heating sub-belt 210 can be reduced, so as to not only reduce the contact area between the second heating layer 211 and the surface of the heated part, but also reduce the degree of change of the stress field of the thermal conduction layer 213, so as to restore (i.e. increase) the thickness of the thermal conduction layer 213. Since the thermal conductivity of the thermal conduction layer 213 in the present application decreases with the increase of the thickness of the thermal conduction layer 213, the temperature of the heated part can be reduced to make the section of the heating sub-belt 210 reach the target temperature.

[0074] Further, in some preferred embodiments, the second heating layer 211 of the heating sub-band 210 comprises a plurality of heating units, and the heating sub-band 210 can also comprise a plurality of force applying structures 212. When the controller 120 determines that the current temperature of the heating sub-band 210 does not reach the target temperature, the controller 120 can control the first force applying structure located above the heating unit to apply a smaller first pressure, and the second force applying structure located between adjacent heating units to apply a larger second pressure, so as to adjust the thermal conductivity coefficient of each region between the second heating layer 211 and the heated part. According to the distribution of the heating units in the second heating layer 211, a smaller pressure is applied above the first force applying structure corresponding to the heating unit, so as to slightly reduce the deformation of the thermal conductive layer 213 in the region provided with the heating unit, thereby slightly reducing the thermal conductivity coefficient thereof. A larger pressure is applied above the second force applying structure without the heating unit (for example, located between the heating units), so as to slightly increase the deformation of the thermal conductive layer 213 in the region without the heating unit, thereby slightly increasing the thermal conductivity coefficient thereof. In this way, the thermal conductivity coefficient of each region between the second heating layer 211 of the heating sub-band 210 and the heated part can be adjusted regionally, so as to further realize the uniform heating of the whole heating sub-band 210, thereby avoiding the temperature difference between the heating sub-bands in the prior art due to the influence of environmental temperature and processing and installation differences, and the uneven heating temperature of the whole heating band.

[0075] In some optional embodiments of the present application, when the monitored current temperature data of the heating sub-band 210 after adjustment is consistent with the target temperature, the force applying pressure scale corresponding to the change degree of the stress field of the thermal conductive layer 213 of each heating sub-band 210 can be recorded on the scale part of each heating sub-band 210, so as to facilitate the rapid adjustment of the force applying structure 212 after the installation of the heating sub-band 210 during subsequent equipment maintenance.

[0076] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it should be understood and appreciated that the methods are not limited by the order of acts, as some acts can, in accordance with one or more embodiments, occur in different orders and / or concurrently with other acts from that set of acts described herein and / or described in other acts not illustrated and / or described herein but which would be understood by one skilled in the art.

[0077] In summary, the present application provides a heating band, which can reversibly adjust the heating temperature of the heating sub-band in real time, thereby improving the uniformity and sensitivity of the overall temperature adjustment of the heating band.

[0078] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heating tape, characterized in that, The application relates to a heating device for a semiconductor device, comprising: a heating main belt connected with a temperature control thermocouple for adjusting the temperature of the heating main belt; a heating sub-belt connected with the heating main belt, comprising a second heating layer and at least one force applying structure, wherein the second heating layer covers the surface of a heated part, and the at least one force applying structure is located on the upper surface of the second heating layer for adjusting the pressure applied to the second heating layer to adjust the heat conduction coefficient between the second heating layer and the heated part.

2. The heating belt of claim 1, wherein The second heating layer comprises a plurality of heating units, and the heating sub-belt comprises a plurality of the force applying structures, wherein the first force applying structure located above the heating unit is used for applying a first pressure, and the second force applying structure located between adjacent heating units is used for applying a second pressure, and the second pressure is greater than the first pressure.

3. The heating band of claim 1 wherein, The heating sub-belt further comprises: a heat conduction layer located between the second heating layer and the heated part, wherein the heat conduction coefficient of the heat conduction layer is positively correlated with the change degree of the stress field of the heat conduction layer, and the change degree of the stress field is positively correlated with the pressure applied to the force applying structure.

4. The heating band of claim 3, wherein, The force applying structure is composed of a force applying part made of a high-temperature-resistant material with deformation recovery.

5. The heating band of claim 3 wherein, A scale part is arranged on the force applying structure for recording the force applying pressure scale corresponding to the change degree of the stress field of the heat conduction layer.

6. The heating band of claim 5, wherein, A heat insulation layer is arranged between the second heating layer and the force applying structure, and the force applying structure is detachably fixed on the heat insulation layer.

7. The heating band of claim 1 wherein, The application further relates to a heating device for a semiconductor device, comprising: a plurality of heating sub-belts connected in series or in parallel with the heating main belt.

8. The heating band of claim 1 wherein, The heating main belt and the heating sub-belt are arranged outside the gas conveying pipeline and / or the exhaust pipeline in the semiconductor device.

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