Compression correction device for deformation of electronic component

Abstract

The utility model provides an electronic component deformation compressing and correcting device which comprises a base, a correcting piece and a compressing piece, the compressing piece sequentially penetrates through the correcting piece and the base, and the lower portion of the compressing piece is fixedly connected with the base. The lower end of the correcting piece is open, the upper end of the correcting piece is closed and provided with a through hole, the lower end of the bolt is in threaded connection with the base, and the upper end of the bolt penetrates through the through hole of the correcting piece and is connected with the nut. The correction piece comprises a central correction sleeve and peripheral correction sleeves, the central correction sleeve is sleeved outside the central sleeve, the bottom end of the central correction sleeve is contacted with the circuit board, the peripheral correction sleeves are in one-to-one correspondence with the small sleeves, the peripheral correction sleeves are sleeved outside the small sleeves, and the bottom ends of the peripheral correction sleeves are contacted with the circuit board. The circuit board bonded with the sleeve is pressed by the correcting piece through the base and the pressing piece, so that the lower end faces of the central sleeve and the small sleeve of the electronic piece are located on the same horizontal plane, and meanwhile, the deformation of the circuit board caused by surface mount welding and wave soldering can be corrected.

Description

Technical Field

[0001] This utility model belongs to the field of electronic component processing technology, and specifically relates to an electronic component deformation clamping and correction device. Background Technology

[0002] With the development of technology, products have also put forward many technical requirements such as low cost, miniaturization, and multi-functionality. The size of electronic components is constantly shrinking, the functions are constantly being enhanced, the integration degree of single boards is getting higher and higher, and the component density of single boards is high. This makes it easier to install and solder components, and the debugging work is also easier and faster, reducing the production cost of products and improving the productivity of products.

[0003] However, with the widespread application of surface mount welding and wave soldering technologies, varying degrees of deformation occur after the electronic compartment panels are welded, resulting in unevenness after the adhesive sleeves are bonded. This has a significant impact on subsequent electronic compartment assembly.

[0004] With the development of electronic products, printed circuit board (PCB) structures are becoming increasingly complex. During the soldering process, various soldering defects are inevitable. Surface mount soldering is mainly for small components such as capacitors and resistors that require manual assembly, while wave soldering is primarily for large-volume PCB assembly that requires manual assembly. As electronic products continue to shrink in size and weight, while their functionality continues to improve, soldering defects are more likely to occur. Therefore, it is crucial to curb the occurrence of soldering defects, prevent expansion and detachment of PCBs under prolonged heating, and address the issue of excessive stress on electronic components due to increased single-board deformation, thereby facilitating mass production.

[0005] Printed circuit board (PCB) deformation is itself a soldering defect. Regardless of whether heat dissipation is normal during soldering, the heat generated will cause varying degrees of deformation in the PCB. Therefore, when this phenomenon occurs, gaps or misalignments exist between the electronic components and the central tubes after assembling the electronic compartment. After vibration and impact tests of the electronic compartment, the assembly gaps and misalignments of the electronic components become significantly larger. This leads to leakage of potting compound through these gaps and misalignments during the encapsulation process, affecting the quality of the electronic compartment and subsequent assembly. Utility Model Content

[0006] The purpose of this invention is to provide an electronic component deformation clamping and correction device to overcome the above-mentioned technical problems existing in the prior art.

[0007] Therefore, the technical solution provided by the present invention is as follows:

[0008] An electronic component deformation clamping and correction device includes a base, a correction component, and a clamping component. The clamping component passes through the correction component and the base in sequence, and the lower part of the clamping component is fixedly connected to the base.

[0009] The electronic component includes a circuit board with a central sleeve attached to its center and multiple small sleeves evenly attached to its circumference. Both the central sleeve and the multiple small sleeves pass through the circuit board.

[0010] The clamping component includes a bolt and a nut. The lower end of the calibrating component is open, and the upper end is closed and has a through hole. The lower end of the bolt is threaded to the base, and the upper end passes through the through hole of the calibrating component and is connected to the nut.

[0011] The calibration component includes a central calibration sleeve and four peripheral calibration sleeves. The central calibration sleeve is fitted outside the central sleeve and its bottom end contacts the circuit board. The four peripheral calibration sleeves correspond one-to-one with the small sleeves and are fitted outside the small sleeves with their bottom ends contacting the circuit board.

[0012] The bolt has a step at its lower part, and the step is located between the central sleeve and the base.

[0013] The nut is a butterfly nut.

[0014] Both the central correction sleeve and the surrounding correction sleeves have notches.

[0015] The beneficial effects of this utility model are:

[0016] The electronic component deformation clamping and correction device provided by this utility model uses a base and a clamping component to clamp the circuit board with the adhesive sleeve with a correction component, so that the lower end face of the central sleeve and the small sleeve of the electronic component are on the same horizontal plane, and at the same time it can correct the deformation of the circuit board caused by surface mount soldering and wave soldering. Attached Figure Description

[0017] Figure 1 This is a structural cross-sectional view of one embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the electronic components in the embodiment;

[0019] Figure 3 This is a schematic diagram of the center correction sleeve structure.

[0020] In the diagram: 1. Bolt; 2. Peripheral alignment sleeve; 3. Butterfly nut; 4. Center alignment sleeve; 5. Small sleeve; 6. Center sleeve; 7. Base; 8. Circuit board; 9. Notch; 10. Step. Detailed Implementation

[0021] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0022] Exemplary embodiments of the present invention are now described with reference to the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided to fully and completely disclose the present invention and to fully convey its scope to those skilled in the art. The terminology used in the exemplary embodiments shown in the drawings is not intended to limit the present invention. In the drawings, the same units / elements are referred to by the same reference numerals.

[0023] Unless otherwise stated, the terms used herein (including technical terms) have their common meaning as understood by one of ordinary skill in the art. Furthermore, it is understood that terms defined in commonly used dictionaries should be understood to have a meaning consistent with the context of their relevant field, and not to be interpreted as having an idealized or overly formal meaning.

[0024] Example 1

[0025] This utility model provides an electronic component deformation clamping and correction device, including a base 7, a correction component and a clamping component, wherein the clamping component passes through the correction component and the base 7 in sequence, and the lower part of the clamping component is fixedly connected to the base 7.

[0026] The electronic component deformation clamping and correction device provided by this utility model uses a base 7 and a clamping component to clamp the circuit board 8 with the adhesive sleeve, which can correct the deformation of the circuit board 8 caused by surface mount soldering and wave soldering.

[0027] Example 2

[0028] Based on Embodiment 1, this embodiment provides an electronic component deformation clamping correction device. The electronic component includes a circuit board 8, a central sleeve 6 is attached to the center of the circuit board 8, and a plurality of small sleeves 5 are uniformly attached to the circumference of the circuit board 8. The central sleeve 6 and the plurality of small sleeves 5 all pass through the circuit board 8.

[0029] After assembly, electronic products require environmental testing (vibration and shock tests). Following these tests, gaps and misalignments between electronic components widened, and the adhesive on the peripheral sleeves and circuit board 8 cracked, severely impacting the structural strength of the electronic compartment and the normal operation of electronic components, thus hindering subsequent mass production. Therefore, it is necessary to clamp and correct the deformation of the single board (circuit board 8) and the flatness of the rear end face of the adhesive sleeve during the electronic component bonding process.

[0030] like Figure 2As shown, after the sleeve and circuit board 8 of an electronic component in a certain product are bonded together, they cannot be effectively clamped and corrected using general tools. Multiple of these electronic components are subsequently stacked vertically for assembling an electronic compartment. After assembly, gaps or misalignments exist between the electronic components and the central sleeve. After vibration and impact tests of the electronic compartment, the assembly gaps and misalignments of the electronic components significantly increase. This not only affects the structural strength of the product but also causes leakage of potting compound through the gaps and misalignments when the electronic compartment is potted through the central sleeve 6, affecting the quality of the electronic compartment and subsequent assembly.

[0031] Example 3

[0032] Based on Embodiment 2, this embodiment provides an electronic component deformation clamping and correction device. The clamping component includes a bolt 1 and a nut. The lower end of the correction component is open, the upper end is closed and has a through hole. The lower end of the bolt 1 is threaded to the base, and the upper end passes through the through hole of the correction component and is connected to the nut.

[0033] Example 4

[0034] Based on Example 2, this example provides a deformation clamping and correction device for electronic components, such as... Figure 1 As shown, the calibration component includes a central calibration sleeve 4 and a surrounding calibration sleeve 2. The central calibration sleeve 4 is fitted outside the central sleeve 6 and its bottom end contacts the circuit board 8. The surrounding calibration sleeve 2 and the small sleeve 5 correspond one-to-one. The surrounding calibration sleeve 2 is fitted outside the small sleeve 5 and its bottom end contacts the circuit board 8.

[0035] Tightening and calibration method:

[0036] Will Figure 2 The central sleeve 6 and small sleeve 5 of the single-board electronic components are fitted one-to-one onto the bolts 1 of the fastener. The electronic components are placed on the base 7 through the central sleeve 6. Then, the central correction sleeve 4 is put on the central sleeve 6, and the peripheral correction sleeve 2 is put on the small sleeve 5. Nuts are screwed on the bolts 1 respectively. Finally, the screw threads of the nuts are used to apply pressure to correct the deformation of the single board 8 during wave soldering and to ensure that the rear end faces of the central sleeve 6 and the small sleeve 5 are on the same horizontal plane after the single board and the sleeves are bonded.

[0037] After compression and correction, the circuit board is placed in a 50°C high-temperature chamber for 3 hours and then left to stand at room temperature for 12 hours to release the stress caused by surface mounting and wave soldering of the circuit board 8. This process corrects the flatness and position of the mounting surfaces of the central sleeve 6 and the outer sleeves of the circuit board 8, and resolves issues such as gaps appearing in the sleeves after the electronic compartment is installed.

[0038] The electronic component deformation clamping and correction device uses aging to level the electronic component and release the corresponding stress, so that the flatness of the single board component meets the installation requirements.

[0039] Example 5

[0040] Based on Embodiment 3, this embodiment provides an electronic component deformation clamping correction device, wherein the lower part of the bolt 1 is provided with a step 10, and the step 10 is located between the central sleeve 6 and the base 7.

[0041] like Figure 1 As shown, bolt 1 has a step 10, which can support circuit board 8.

[0042] Example 6

[0043] Based on Example 3, this example provides an electronic component deformation clamping and correction device, wherein the nut is a butterfly nut 3.

[0044] The butterfly nut 3 is easy to operate; it can be loosened and tightened by hand without the need for a wrench or torque wrench.

[0045] This embodiment utilizes butterfly nuts 3 to clamp the sleeve and circuit board, and can also correct the deformation control of the circuit board caused by surface mount soldering and wave soldering. It can quickly, stably, and safely solve the gap adjustment and component tightening correction of single boards with special structures caused by surface mount soldering and wave soldering.

[0046] Example 7

[0047] Based on Embodiment 4, this embodiment provides an electronic component deformation clamping and correction device, wherein notches 9 are provided on both the central correction sleeve 4 and the surrounding correction sleeves 2. Figure 3 As shown, the function of notch 9 is to allow space for surface-mount capacitors and resistors when electronic components are pressed into the sleeve, thus enabling the electronic component circuit board 8 to be pressed.

[0048] In summary, this deformation clamping and correction device effectively controls the deformation of circuit boards caused by surface mount soldering and wave soldering in the mass production of electronic components, greatly improving the product qualification rate and providing a reliable guarantee for subsequent assembly and potting. It plays a significant role in improving the product assembly qualification rate.

[0049] The above examples are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. A deformation clamping and correction device for electronic components, characterized in that: It includes a base, a calibrator, and a clamping component, wherein the clamping component passes through the calibrator and the base in sequence, and the lower part of the clamping component is fixedly connected to the base; The electronic component includes a circuit board, a central sleeve is attached to the center of the circuit board, and multiple small sleeves are evenly attached to the circumference of the circuit board, with the central sleeve and the multiple small sleeves passing through the circuit board. The clamping component includes a bolt and a nut. The lower end of the straightening component is open, the upper end is closed and has a through hole. The lower end of the bolt is threaded to the base, and the upper end passes through the through hole of the straightening component and is connected to the nut. The calibration component includes a central calibration sleeve and a four-sided calibration sleeve. The central calibration sleeve is fitted outside the central sleeve and its bottom end contacts the circuit board. The four-sided calibration sleeve and the small sleeve correspond one-to-one. The four-sided calibration sleeve is fitted outside the small sleeve and its bottom end contacts the circuit board. The bolt has a step at its lower part, and the step is located between the central sleeve and the base; Both the central correction sleeve and the surrounding correction sleeves have notches.

2. The electronic component deformation clamping and correction device according to claim 1, characterized in that: The nut is a butterfly nut.

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