OCuLink and M.2 dual-interface storage device
By setting up a storage device with both OCuLink and M.2 interfaces on the storage carrier board, the problem that the single interface of existing solid-state storage cards cannot meet the high data transfer requirements is solved, achieving more efficient data transfer and faster data read and write speeds.
Patent Information
- Application Number
- CN202422822375.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2034-11-19
AI Technical Summary
Existing solid-state storage cards mostly use a single interface, which cannot meet the high data transfer requirements of mid-to-high-end computers, and traditional USB interfaces cannot meet the multi-purpose connection needs.
The storage carrier board features dual interfaces, OCuLink and M.2, supporting two data transmission methods. The transmission rates of OCuLink and M.2 interfaces are higher than those of traditional USB interfaces, and high-speed data transmission and power management are achieved through components such as gold fingers and power management chips.
It improves the computing power of servers within a unit space, enhances the connection capability with artificial intelligence processors, and achieves more efficient data transmission and faster data read and write speeds.
Smart Images
Figure CN223650997U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of storage device technology, and in particular to a storage device with dual OCuLink and M.2 interfaces. Background Technology
[0002] Current solid-state storage cards mostly use standard SATA, SAS, mSATA, PCIe, and M.2 interfaces. These interfaces all use a gold-finger structure, and each solid-state storage card only has one type of interface. With the increasing data transfer demands of mid-to-high-end computers, traditional USB interfaces can no longer meet the actual needs of connecting artificial intelligence processors, and a single interface cannot meet the needs of multiple uses. Utility Model Content
[0003] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention may be realized and obtained by means of the structures particularly pointed out in the description and other accompanying drawings.
[0004] The purpose of this invention is to overcome the above-mentioned shortcomings and provide a storage device with dual OCuLink and M.2 interfaces. By setting OCuLink and M.2 interfaces on the storage carrier board and connecting them based on memory slots, more artificial intelligence processors and solid-state storage can be packed into a server per unit space. The storage capacity, computing power and processing capacity per unit space are significantly increased. Moreover, the transmission rates of both OCuLink and M.2 interfaces are higher than those of traditional USB interfaces. OCuLink can communicate with solid-state storage and transmit calculation results with artificial intelligence processors at the same time.
[0005] This utility model provides a storage device with dual OCuLink and M.2 interfaces, including a storage carrier board and an OCuLink interface and an M.2 interface disposed on the storage carrier board. The storage carrier board has gold fingers on its bottom side and a foolproof notch. The storage carrier board includes a front and a back side. The OCuLink interface is disposed on the back side of the storage carrier board and the interface of the OCuLink interface faces the foolproof notch.
[0006] The storage carrier board features both an OCuLink interface and an M.2 interface, enabling the storage chip to support two data transmission methods. Both the OCuLink and M.2 interfaces offer higher transmission rates than traditional USB interfaces, achieving more efficient data transfer. The gold fingers serve as pins on the storage carrier board, acting as its input and output ports. The OCuLink interface, located on the keyed-out side, provides high-speed PCI-E expansion capabilities while facilitating easier compatibility of external devices with different hosts or devices, eliminating the need for additional converters or adapters.
[0007] In some embodiments, the M.2 interface is located on the front of the storage carrier. Compared to a traditional USB interface, the M.2 interface located on the storage carrier improves operating speed and provides faster data read / write speeds and higher storage capacity when connected to a computer.
[0008] In some embodiments, the M.2 interface is located on the back of the storage carrier board. The M.2 interface can be located on either the front or back to suit specific application needs. During actual installation, the connection direction of the transmission port varies depending on the computer's configuration and structure; therefore, the M.2 interface can be installed on any side.
[0009] In some embodiments, the slot end of the M.2 interface is m-key. The short end of the M.2 interface with an m-key slot end has 5 pins and uses a PCI-E x4 channel, enabling the storage device to operate at high speed and making it suitable for mid-to-high-end computers.
[0010] In some embodiments, the storage carrier board is further provided with a power management chip, which is connected to a power failure protection module. The power failure protection module contains several supercapacitors. The power management chip manages the power supply of the entire storage device. When power is available, it selects the appropriate power source. When power fails, the power management chip activates the power failure protection and uses the supercapacitors to supply power to the entire storage device.
[0011] In some embodiments, the gold finger output terminal is connected to a boost converter chip, the output voltage of which supplies power to the power management chip. The supercapacitor requires a voltage of 5V, while the gold finger output voltage is 1.2V. To ensure the required voltage for the supercapacitor, a boost converter chip is used to charge the supercapacitor. The boost converter chip used is MAX1709.
[0012] In some embodiments, the gold finger output voltage is 1.2V, and the boost chip output voltage is 3.3V and 5V. The storage carrier board also includes other chips and components. This application focuses on setting up an OCuLink interface and an M.2 interface on the storage carrier board, therefore other components are not shown. However, this does not mean that this technical solution lacks the necessary components required for the storage device to store data. Other chips, components, and connection circuits can refer to existing technologies. Furthermore, the components used on the storage carrier board are typically connected to a 3.3V power supply; a step-down circuit can be set up based on a voltage boost to 5V to meet the power supply needs of other components.
[0013] In some embodiments, a fixing copper post is provided on the side of the storage carrier opposite to the foolproof opening. One end of the solid-state storage is connected to the M.2 interface, and the other end is fixed to the storage carrier via the fixing copper post. The M.2 interface is compatible with 2280 form factor solid-state storage or artificial intelligence processors.
[0014] In some embodiments, the gold finger is provided with metal pins for PCI-E communication. These metal pins on the gold finger, connected to a pre-defined motherboard, allow for perfect matching and data transfer without the need for external wiring, reducing the risks associated with external wiring and improving overall aesthetics.
[0015] By adopting the above technical solution, the beneficial effects of this utility model are:
[0016] This invention, by setting up OCuLink and M.2 interfaces on the storage carrier board and connecting them based on memory slots, allows more artificial intelligence processors and solid-state storage to be packed into a server per unit space. The storage capacity, computing power, and processing capacity per unit space are all increased to a considerable extent. Moreover, the transmission rates of both the OCuLink and M.2 interfaces are higher than those of the traditional USB interface. OCuLink can communicate with solid-state storage and transmit calculation results to the artificial intelligence processor at the same time.
[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure.
[0018] Undoubtedly, such and other objects of this invention will become more apparent after the following detailed description of the preferred embodiments, which are illustrated in various accompanying drawings and illustrations.
[0019] To make the above and other objects, features and advantages of this utility model more apparent and understandable, one or more preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description
[0020] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.
[0021] In the accompanying drawings, the same parts use the same reference numerals, and the drawings are schematic and not necessarily drawn to actual scale.
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one or more embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on such drawings without creative effort.
[0023] Figure 1 This is a schematic diagram of the front structure of the storage device in some embodiments of the present invention;
[0024] Figure 2 This is a schematic diagram of the back structure of the storage device in some embodiments of the present invention.
[0025] Explanation of key figure labels:
[0026] 1. Storage carrier board; 2. OCuLink interface; 3. M.2 interface; 4. Gold fingers; 5. Foolproof mount; 6. Power management chip; 7. Supercapacitor; 8. Fixing copper pillars. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining the present utility model and are not intended to limit the present utility model.
[0028] Furthermore, it should be understood in the description of this utility model that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two main bodies at the connection point are not connected through a transitional structure, but are simply connected to form a whole through a connecting structure. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0030] In this utility model, unless otherwise expressly specified and limited, the first feature "on" or "below" the second feature may be in direct contact with the first and second features, or indirect contact through an intermediate medium. In the description of this specification, references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0031] Refer to 1, Figure 1 This is a schematic diagram of the front structure of the storage device in some embodiments of the present invention.
[0032] According to some embodiments of the present invention, the present invention provides a storage device with dual OCuLink and M.2 interfaces, including a storage carrier board 1 and an OCuLink interface 2 and an M.2 interface 3 disposed on the storage carrier board 1. The storage carrier board 1 has gold fingers 4 disposed on its bottom side and a foolproof opening 5 provided on the storage carrier board 1. The storage carrier board 1 includes a front and a back side. The OCuLink interface 2 is disposed on the back side of the storage carrier board 1 and the interface of the OCuLink interface 2 faces the foolproof opening 5.
[0033] An OCuLink interface 2 and an M.2 interface 3 are provided on the storage carrier board 1, enabling the storage chip to support two data transmission methods. The transmission rates of both the OCuLink interface 2 and the M.2 interface 3 are higher than those of the traditional USB interface, enabling more efficient data transmission. The gold fingers 4 are pins of the storage carrier board 1, serving as its input and output ports. The OCuLink interface 2, located on the side of the keyed port 5, provides high-speed PCI-E expansion capabilities while making it easier for external devices to connect to different hosts or devices without the need for additional converters or adapters.
[0034] The M.2 interface 3 is located on the front of the storage carrier board 1. Compared with the traditional USB interface, the M.2 interface 3 on the storage carrier board 1 improves the operating speed and can provide faster data read and write speeds and higher storage capacity when connected to a computer.
[0035] The M.2 interface 3 has an m-key slot end. The short end of the m-key M.2 interface 3 has 5 pins and uses a PCI-E x4 channel, enabling high-speed operation of the storage device, suitable for mid-to-high-end computers.
[0036] The storage carrier board 1 is also equipped with a power management chip 6, which is connected to a power failure protection module. The power failure protection module contains several supercapacitors 7. The power management chip 6 manages the power supply of the entire storage device. When the power supply is available, it selects the power source. When the power supply fails, the power management chip 6 activates the power failure protection and calls upon the supercapacitors 7 to supply power to the entire storage device.
[0037] A fixing copper post 8 is provided on the side of the storage carrier board 1 opposite to the foolproof opening 5. One end of the solid-state storage is connected to the M.2 interface 3, and the other end is fixed to the storage carrier board 1 by the fixing copper post 8. The M.2 is compatible with 2280 form factor solid-state storage or artificial intelligence processors.
[0038] Reference Figure 2 , Figure 2 This is a schematic diagram of the back structure of the storage device in some embodiments of the present invention.
[0039] According to some embodiments of this utility model, the M.2 interface 3 is optionally disposed on the back side of the storage carrier board 1. The M.2 interface 3 can be disposed on the front or back side to adapt to actual application needs. In actual installation, the connection direction of the transmission port varies depending on the computer's configuration and structure; therefore, the M.2 interface 3 can be installed on any side.
[0040] The output terminal of the gold finger 4 is connected to a boost converter chip, which outputs voltage to power the power management chip 6. The supercapacitor 7 requires 5V, while the output voltage of the gold finger 4 is 1.2V. To ensure the required voltage for the supercapacitor 7, a boost converter chip is used to charge the supercapacitor 7. The boost converter chip used is MAX1709.
[0041] The gold finger 4 outputs a voltage of 1.2V, and the boost chip outputs voltages of 3.3V and 5V. The storage carrier board 1 also includes other chips and components. This application focuses on setting up the OCuLink interface 2 and M.2 interface 3 on the storage carrier board 1, therefore other components are not shown. However, this does not mean that this technical solution lacks the necessary components required for the storage device to store data. Other chips, components, and connection circuits can refer to existing technologies. Furthermore, the components used on the storage carrier board 1 are typically connected to a 3.3V power supply; a step-down circuit can be set up based on a voltage boost to 5V to meet the power supply needs of other components.
[0042] The gold finger 4 has metal pins for PCI-E communication. These pins connect to the pre-configured motherboard, eliminating the need for external wiring. This achieves perfect matching and data transfer, reducing the risks associated with external wiring and improving the overall aesthetics.
[0043] It should be understood that the embodiments disclosed herein are not limited to the specific processing steps or materials disclosed herein, but should be extended to equivalent substitutions of such features as understood by those skilled in the art. It should also be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting.
[0044] The term "embodiment" in this specification refers to a specific feature or characteristic described in connection with an embodiment that is included in at least one embodiment of the present invention. Therefore, phrases or "embodiments" appearing in various places throughout the specification do not necessarily refer to the same embodiment.
[0045] Furthermore, the described features or characteristics may be incorporated into one or more embodiments in any other suitable manner. In the above description, specific details, such as thickness, quantity, etc., are provided to provide a comprehensive understanding of embodiments of the present invention. However, those skilled in the art will understand that the present invention can be implemented without the aforementioned one or more specific details or may be implemented using other methods, components, materials, etc.
Claims
1. A storage device with both OCuLink and M.2 interfaces, characterized in that, The storage carrier includes a storage board and an OCuLink interface and an M.2 interface disposed on the storage carrier. The storage carrier has gold fingers on its bottom side and a foolproof notch. The storage carrier includes a front and a back. The OCuLink interface is disposed on the back of the storage carrier and the interface of the OCuLink interface faces the foolproof notch. The storage carrier board is also equipped with a power management chip, which is connected to a power failure protection module. The power failure protection module contains several supercapacitors. The gold finger output terminal is connected to a boost chip, and the output voltage of the boost chip supplies power to the power management chip.
2. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, The M.2 interface is located on the front of the storage carrier.
3. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, The M.2 interface is located on the back of the storage carrier.
4. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, The slot end of the M.2 interface is m key.
5. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, The gold finger outputs a voltage of 1.2V, while the boost chip outputs voltages of 3.3V and 5V.
6. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, A fixing copper post is provided on the side of the storage carrier board opposite to the foolproof opening. One end of the solid-state storage is connected to the M.2 interface, and the other end is fixed to the storage carrier board through the fixing copper post.
7. The storage device with both OCuLink and M.2 interfaces according to claim 1, characterized in that, The gold finger has metal pins for PCI-E communication.