Novel foam structure

Abstract

The utility model relates to the technical field of foam, in particular to a novel foam structure. The adhesive tape comprises a base material, a double-sided adhesive tape and a release film, the base material is of a hard sheet structure, and a plurality of grooves which are positioned and mounted with the components are formed in the back surface of the base material; the double-sided adhesive covers the back surface of the base material; the release film covers the adhesive surface of the base material and covers the groove and the double-sided adhesive tape; after the release film is torn off, the base material is pasted and fixed with the flexible circuit board through the double-sided adhesive tape; a plurality of protruding components are arranged on the flexible circuit board, and after the base material is pasted, the components are located in the grooves. According to the utility model, the grooves are arranged on the back surface of the single-sided adhesive foam (PC material with high hardness), the gap between the grooves can be set according to the actual placement position of the component, and the depth of the grooves can be adjusted according to the height of the component; according to the technical scheme of the utility model, each component is preferably covered by the protective film, so that the interference between adjacent components is reduced while each component is protected, the protective film can also play a role in buffering between the protective film and a casing, the protective force of the components is greatly increased, and the service life of the product is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to a foam technology field especially a novel foam structure. BACKGROUND

[0002] In the vehicle-mounted project, in order to protect component from water vapor corrosion short circuit, will be attached to the surface of component protection paper or foam, can reduce the interference from outside while protecting, but due to the structure limitation, some components will be placed on the side, foam attachment is not fastened, cannot completely protect the component, such as Figures 1-3 As shown in the conventional structure, the whole single-sided adhesive foam is PSR material, and the whole is soft, as shown in Figure 3 When it covers on the component, it protects the component and plays the buffering effect between the shell. The disadvantage is that due to the height difference of each component, after attaching, the component cannot contact the foam, cannot play the complete protection effect, is easy to enter the water vapor and dust, and is easy to damage the component.

[0003] Therefore, it is urgent to improve the existing foam structure to solve the above problems. INVENTION CONTENTS

[0004] The utility model aims at the problems in the background art, proposes a novel foam structure, increases the groove on the single-sided adhesive foam with PC as the base material, realizes the protection of each component while reducing the interference between adjacent components, greatly increases the protection of the component, and improves the service life of the product.

[0005] The technical scheme of the utility model relates to a novel foam structure, including base material, double-sided adhesive and release film.

[0006] The base material is a hard sheet structure, and the back of the base material is provided with a plurality of grooves for positioning and installing components; the double-sided adhesive covers the back of the base material; and the release film covers the adhesive surface of the base material and covers the grooves and the double-sided adhesive.

[0007] After tearing the release film, the base material is fixed by the double-sided adhesive and the flexible circuit board; a plurality of components in a protruding shape are arranged on the flexible circuit board, and after being pasted with the base material, the components are located in the grooves.

[0008] Preferably, a positioning hole is reserved on one side of the flexible circuit board pasted with the foam.

[0009] Preferably, a through hole matched with the positioning hole is arranged on the base material.

[0010] Preferably, the position, shape and depth of the groove are set according to the actual placement position of the component.

[0011] Preferably, the depth of the groove is not more than 0.8 mm.

[0012] Preferably, the overall thickness of the foam structure is 1.2mm.

[0013] Preferably, the thickness of the substrate is 1.0mm; the thickness of the double-sided adhesive is 0.1mm; and the thickness of the release film is 0.1mm.

[0014] Preferably, the substrate is a hard polycarbonate PC material.

[0015] Preferably, after the foam structure is pasted to the flexible circuit board, the adjacent components are separated by the grooves, and the adjacent components do not contact each other.

[0016] Preferably, the foam structure and the flexible circuit board form a relatively sealed structure.

[0017] Compared with the prior art, the foam structure has the following beneficial technical effects:

[0018] The utility model discloses a recess is set up on the back of single -sided adhesive foam (PC material, high hardness) to the recess gap between the recess depth can be set according to the actual position of component, can be adjusted according to the component height, and the foam structure is pasted to the flexible circuit board, and the adjacent components are separated by the grooves, and the adjacent components do not contact each other. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is the structure schematic drawing of the flexible circuit board in the prior art;

[0020] Figure 2 It is the structure schematic drawing of the conventional single -sided adhesive foam in the prior art;

[0021] Figure 3 It is the structure schematic drawing of the conventional single -sided adhesive foam and the flexible circuit board in the prior art;

[0022] Figure 4 It is the structure schematic drawing of the flexible circuit board in the embodiment of the utility model;

[0023] Figure 5 It is the structure schematic drawing of the improved foam in the embodiment of the utility model;

[0024] Figure 6 It is the structure schematic drawing of the improved foam structure and the flexible circuit board in the utility model;

[0025] Figure 7 It is the enlarged view of the improved foam structure in the embodiment of the utility model;

[0026] Figure 8It is the cross section schematic view of the improved foam structure in the embodiment of the utility model.

[0027] Figure 9 It is the perspective view of the improved foam structure in the embodiment of the utility model.

[0028] Figure 10 It is the back perspective view of the improved foam structure in the embodiment of the utility model.

[0029] The figure mark: 1, soft circuit board;11, positioning hole;2, base material;21, through hole;22, recess. Specific implementation

[0030] Embodiment 1

[0031] As Figure 9 shown, the utility model provides a novel foam structure, including base material 2, double-sided adhesive and release film;

[0032] Base material 2 is hard sheet structure;As Figure 10 Shown, the back of base material 2 is provided with several recesses 22 for positioning and installing component 11;Double-sided adhesive covers the back of base material 2;Release film covers the adhesive surface of base material 2 and covers recess 22 and double-sided adhesive;

[0033] After tearing release film, base material 2 is fixed by double-sided adhesive and soft circuit board 1;Form as Figure 6 Shown, several component 11 in protruding form are provided on soft circuit board 1, and after being pasted with base material 2, component 11 is located in recess 22.

[0034] In the embodiment, as Figure 7 Shown, the position, shape and depth of recess 22 are set according to the actual placement position of component 11;The depth and width of recess 22 are slightly greater than the size of component 11 to be prevented, so that component 11 can be conveniently placed in recess 22.As Figure 8 Shown, the depth of recess 22 is not more than 0.8mm. The overall thickness of foam structure is 1.2mm;The thickness of base material 2 is 1.0mm;The thickness of double-sided adhesive is 0.1mm;The thickness of release film is 0.1mm.

[0035] In the embodiment, base material 2 is hard polycarbonate PC material;Because polycarbonate PC material is hard, therefore, it is more convenient to set recess 22 in its back, and the size is more accurate;After being attached with component 11, the sealing property is better.

[0036] In the embodiment, as Figure 6The adjacent components 11 are separated by the grooves 22 after the shown foam structure is pasted with the flexible circuit board 1, and the adjacent components 11 do not contact each other. The foam structure and the flexible circuit board 1 form a relatively sealed structure, which protects each component and reduces the interference between adjacent components, and also plays a buffering role between the casing.

[0037] Embodiment 2

[0038] As Figure 9 shown, the utility model provides a novel foam structure, including base material 2, double -faced adhesive and release film,

[0039] The base material 2 is a hard sheet structure; as Figure 10 shown, the back of base material 2 is provided with several grooves 22 for positioning and installing components 11; the double -faced adhesive covers the back of base material 2; the release film covers the adhesive surface of base material 2 and covers the grooves 22 and double -faced adhesive,

[0040] After tearing the release film, the base material 2 is pasted and fixed with the flexible circuit board 1 through the double -faced adhesive; forms as Figure 6 shown, the several components 11 in the form of protrusions provided on the flexible circuit board 1 are in the grooves 22 after being pasted with the base material 2.

[0041] In this embodiment, as Figure 4 shown, the side of the flexible circuit board 1 pasted with the foam is reserved with positioning holes. Correspondingly, as Figure 5 shown, the base material 2 is provided with through holes 21 matched with the positioning holes; the through holes 21 can be used for positioning with the positioning holes on the flexible circuit board 1, and the foolproof design prevents pasting reversely.

[0042] The embodiment of the utility model is described in detail in combination with the drawings above, but the utility model is not limited to this, within the knowledge range possessed by the person skilled in the art in the technical field, various changes can be made without departing from the purpose of the utility model.

Claims

1. A novel foam structure, characterized in that, Includes substrate (2), double-sided adhesive and release film; The substrate (2) is a rigid sheet structure. Several grooves (22) are provided on the back of the substrate (2) for positioning and mounting the components (11). Double-sided adhesive is applied to the back of the substrate (2). Release film is applied to the adhesive surface of the substrate (2) and covers the grooves (22) and the double-sided adhesive. After tearing off the release film, the substrate (2) is glued to the flexible circuit board (1) with double-sided adhesive; after the flexible circuit board (1) is glued to the substrate (2), the protruding components (11) are located in the groove (22).

2. The novel foam structure according to claim 1, characterized in that, A positioning hole is reserved on one side of the flexible circuit board (1) where the foam is pasted.

3. The novel foam structure according to claim 2, characterized in that, The substrate (2) is provided with a through hole (21) that mates with the positioning hole.

4. The novel foam structure according to claim 1, characterized in that, The position, shape, and depth of the groove (22) are set according to the actual placement position of the component (11).

5. The novel foam structure according to claim 3, characterized in that, The depth of the groove (22) does not exceed 0.8 mm.

6. The novel foam structure according to claim 1, characterized in that, The overall thickness of the foam structure is 1.2mm.

7. The novel foam structure according to claim 6, characterized in that, The thickness of the substrate (2) is 1.0 mm; the thickness of the double-sided adhesive is 0.1 mm; and the thickness of the release film is 0.1 mm.

8. The novel foam structure according to claim 1, characterized in that, The substrate (2) is made of rigid polycarbonate (PC).

9. The novel foam structure according to claim 1, characterized in that, After the foam structure is pasted onto the flexible circuit board (1), the adjacent components (11) are separated by the groove (22) and the adjacent components (11) do not contact each other.

10. The novel foam structure according to claim 1, characterized in that, The foam structure and the flexible circuit board (1) form a relatively sealed structure.

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