Base material gluing machine for manufacturing flexible circuit board

Abstract

The utility model relates to the technical field of gluing equipment, and discloses a base material gluing machine for manufacturing a flexible circuit board, which comprises a base, two first slide rails and a second slide rail, the two first slide rails are supported and arranged above two sides of the base in parallel, the second slide rail is supported and arranged on slide blocks of the two first slide rails, and the first slide rails and the second slide rails are arranged on the base. A side plate is fixed to the side edge of a sliding block of the second sliding rail, an electric push rod is installed on the side plate, a gluing chamber is fixed to the tail end of the bottom of the electric push rod, and a main gluing pipe communicated with the interior of the gluing chamber is connected to the middle of the bottom of the gluing chamber. According to the technical scheme, the auxiliary gluing pipes capable of changing the communication state with the gluing chamber are connected below the gluing chamber on the outer ring of the main gluing pipe, when the gluing area and the gluing amount of the flexible circuit board are small, the main gluing pipe is independently used for accurately gluing, and when the gluing area and the gluing amount of the flexible circuit board are large, the main gluing pipe is independently used for accurately gluing the flexible circuit board. And meanwhile, the main gluing pipe and the auxiliary gluing pipe are used for gluing, so that the gluing efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to gluing equipment technical field, concretely is a base material gluing machine for flexible circuit board manufacturing. BACKGROUND

[0002] The main purpose of flexible circuit board gluing is to enhance the anti-vibration of components, protect components from moisture or corrosion, reinforce and protect FPC wire, chip welding points, improve production efficiency, ensure the stability of connecting points, maintain the service life of connection in FPC, reduce environmental impact, and adapt to more severe working environment and more complex use scenarios. When gluing, the glue solution is pressurized by the glue storage equipment and then supplied to the gluing pipe, and then the glue solution is coated on the components on the surface of the flexible circuit board.

[0003] Different flexible circuit boards require different gluing areas and gluing amounts. In order to adapt to the use of all flexible circuit boards, the prior art uses a single gluing pipe for gluing operation. However, when it comes to flexible circuit boards that require a larger gluing area, the gluing area and the gluing amount required are both increased, and the gluing efficiency of a single gluing pipe is relatively low. Therefore, we propose a base material gluing machine for flexible circuit board manufacturing. SUMMARY

[0004] The utility model aims at providing a base material gluing machine for flexible circuit board manufacturing, by connecting multiple secondary gluing pipes below the gluing chamber of the outer circle of the main gluing pipe, which can change the communication state with the gluing chamber. When the gluing area and the gluing amount of the flexible circuit board are small, the main gluing pipe is used alone for precise gluing. When the gluing area and the gluing amount of the flexible circuit board are large, the secondary gluing pipes are connected to the gluing chamber, and the main gluing pipe and the secondary gluing pipes are used for gluing at the same time, which improves the gluing efficiency and solves the problems raised in the background technology.

[0005] To achieve the above object, the utility model provides the following technical scheme: A base material gluing machine for flexible circuit board manufacturing, including base, first sliding rail and second sliding rail, the first sliding rail is provided with two and parallel support is placed on the top of both sides of base, the second sliding rail support is placed on the sliding block of two first sliding rails, The sliding block side of second sliding rail is fixed with side plate, and the electric push rod is installed on the side plate, and the bottom end of electric push rod is fixed with gluing chamber, and the bottom middle position of gluing chamber is connected with main gluing pipe that communicates with its inside, The vertical slidable of the outer ring of main gluing pipe is penetrated with vice gluing pipe, and the top of vice gluing pipe is fixed with the limiting plate located above gluing chamber, and the outer ring of vice gluing pipe is fixed with ring plate around below gluing chamber, and the outer ring of vice gluing pipe is buckled with limiting buckle between limiting plate and gluing chamber, and the outer ring of vice gluing pipe is sleeved with spring between gluing chamber and ring plate, The top surface of vice gluing pipe is provided with the through hole that communicates with its inside, when limiting buckle is buckled in the outer ring of vice gluing pipe, the through hole is located above gluing chamber, after limiting buckle is taken away, the height of vice gluing pipe is lowered under the resistance of spring, the limiting plate is supported on the surface of gluing chamber, and the height of through hole is lowered to the inside of gluing chamber.

[0006] Through the above technical scheme, the flexible circuit board is placed on the surface of base, the gluing chamber is driven to lift by first sliding rail, second sliding rail and electric push rod, and moves position on X axis and Y axis, under normal circumstances, main gluing pipe is used alone to carry out the gluing work of flexible circuit board, when the gluing area and the gluing amount are large, according to the need, the corresponding number of vice gluing pipes are communicated with gluing chamber, and main gluing pipe and vice gluing pipe are used to carry out efficient gluing work.

[0007] Optionally, the sealing ring is fixed in the through hole of the gluing chamber.

[0008] Through the above technical scheme, when the vice gluing pipe penetrates the gluing chamber, the sealing ring ensures good sealing effect at the penetration place to avoid glue leakage.

[0009] Optionally, the side of the gluing chamber is connected with the glue inlet pipe, and the glue inlet pipe is communicated with the inside of the gluing chamber.

[0010] Through the above technical scheme, the glue liquid pressurized by the glue storage equipment enters the gluing chamber from the feeding pipe.

[0011] Optionally, the side of the limiting buckle is connected with the handle, and the handle and the limiting buckle are connected as an integral structure.

[0012] Through the above technical scheme, the handle can be used to realize the purpose of pulling and taking down the limiting buckle.

[0013] Optionally, after the height of the vice gluing pipe is lowered, the bottom height of the vice gluing pipe is same with the bottom height of the main gluing pipe.

[0014] By adopting the technical scheme, the main glue coating pipe and the auxiliary glue coating pipe can discharge glue solution at the same height.

[0015] Optionally, the number of the auxiliary glue coating pipes is at least four, and the auxiliary glue coating pipes are uniformly distributed outside the main glue coating pipe.

[0016] Compared with the prior art, the technical scheme has the following beneficial effects:

[0017] 1. The technical scheme can precisely coat the flexible circuit board by using only the main glue coating pipe when the coating area and the coating amount of the flexible circuit board are small, and can coat the flexible circuit board by using the main glue coating pipe and the auxiliary glue coating pipe when the coating area and the coating amount of the flexible circuit board are large, thereby improving the coating efficiency.

[0018] 2. The technical scheme can seal the position where the auxiliary glue coating pipe penetrates the glue coating chamber by fixing the sealing ring around the outer circle of the auxiliary glue coating pipe in the penetration opening of the glue coating chamber. BRIEF DESCRIPTION OF DRAWINGS

[0019] Other features, objects and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments with reference to the attached drawings:

[0020] Figure 1 Fig. 1 is a schematic diagram of the overall structure of a base material glue coating machine for manufacturing flexible circuit boards according to the present application;

[0021] Figure 2 Fig. 2 is a schematic diagram of the detailed structure of a glue coating chamber of a base material glue coating machine for manufacturing flexible circuit boards according to the present application;

[0022] Figure 3 Fig. 3 is a schematic diagram of the structure of a glue coating chamber after removing a limiting buckle of a base material glue coating machine for manufacturing flexible circuit boards according to the present application;

[0023] Figure 4 Fig. 4 is a schematic diagram of the structure of a limiting buckle of a base material glue coating machine for manufacturing flexible circuit boards according to the present application.

[0024] In the drawings: 1, base; 2, first sliding rail; 3, second sliding rail; 4, side plate; 41, electric push rod; 5, glue coating chamber; 51, glue inlet pipe; 52, main glue coating pipe; 53, sealing ring; 6, auxiliary glue coating pipe; 61, ring plate; 62, spring; 63, limiting plate; 64, penetration opening; 7, limiting buckle; 71, handle. DETAILED DESCRIPTION

[0025] Please refer to Figures 1-4The utility model provides a kind of technical scheme: a base material gluing machine for flexible circuit board manufacturing, including base 1, first slide rail 2 and second slide rail 3, first slide rail 2 is provided with two and mutually parallel support is placed on the top of base 1 both sides, the height of two first slide rail 2 is same, and second slide rail 3 is supported on the slider of two first slide rail 2, when working, first slide rail 2 can be used to drive second slide rail 3 to move back and forth, and second slide rail 3 can drive the slider on its surface to move left and right when working, realize its position movement on X axis and Y axis.

[0026] The side of the slider of second slide rail 3 is fixed with side plate 4, and electric push rod 41 is installed on side plate 4, the protruding end of electric push rod 41 penetrates to the lower side of side plate 4, and the bottom end of electric push rod 41 is fixed with gluing chamber 5, which can drive gluing chamber 5 to lower the height and move the position on X axis and Y axis.

[0027] The middle position of the bottom of gluing chamber 5 is connected with main gluing pipe 52 which is communicated with the inside of gluing chamber 5, at the same time, the side of gluing chamber 5 is connected with glue inlet pipe 51 which is communicated with the inside of gluing chamber 5, when the gluing area and the gluing amount required by flexible circuit board are small, the glue solution can be pressurized by glue storage equipment, then injected into gluing chamber 5 through glue inlet pipe 51, and then extruded from main gluing pipe 52, so that the glue solution can be coated on the surface of components of flexible circuit board, and the glue can be accurately coated.

[0028] In order to facilitate the flexible circuit board to require larger gluing area or gluing amount, the vertical gluing chamber 5 outside the main gluing pipe 52 is slidably penetrated by the secondary gluing pipe 6, the number of secondary gluing pipe 6 is at least four, and the secondary gluing pipe 6 is evenly distributed outside the main gluing pipe 52, the secondary gluing pipe 6 penetrates the gluing chamber 5 through the through hole arranged on the surface of gluing chamber 5, the top of secondary gluing pipe 6 is fixed with limiting plate 63 located above gluing chamber 5, and the outer ring of secondary gluing pipe 6 below gluing chamber 5 is fixed with ring plate 61, the outer ring of secondary gluing pipe 6 between limiting plate 63 and gluing chamber 5 is buckled with limiting buckle 7, the outer ring of secondary gluing pipe 6 between gluing chamber 5 and ring plate 61 is sleeved with spring 62, the spring 62 normally has downward force on ring plate 61, but under the support limiting effect of limiting buckle 7, limiting plate 63 is supported to a height, and secondary gluing pipe 6 cannot be lowered, the top surface of secondary gluing pipe 6 is provided with through hole 64 which is communicated with the inside of secondary gluing pipe 6, the through hole 64 is arranged on the surface of secondary gluing pipe 6 inside limiting buckle 7, at this time, the through hole 64 is located outside gluing chamber 5, and secondary gluing pipe 6 keeps isolation state with gluing chamber 5, so that main gluing pipe 52 can be used for gluing work alone.

[0029] In order to achieve the purpose of large area or large amount of glue coating, the limiting buckle 7 can be pulled down through the pull handle 71 connected to the side edge of the limiting buckle 7, losing the support to the limiting plate 63, and under the action of the spring 62 pushing the ring plate 61 downward, the height of the auxiliary glue coating pipe 6 is lowered as a whole to the upper surface of the glue coating chamber 5 supported by the limiting plate 63. After the height of the auxiliary glue coating pipe 6 is lowered, the height of the bottom of the auxiliary glue coating pipe 6 is the same as that of the main glue coating pipe 52, and the through hole 64 on the upper side edge of the auxiliary glue coating pipe 6 enters the glue coating chamber 5. In the subsequent glue coating process, the glue liquid will also be pressed into the auxiliary glue coating pipe 6 from the through hole 64. The glue liquid can be coated on the surface of the components of the flexible circuit board from the main glue coating pipe 52 and the auxiliary glue coating pipe 6 at the same time, increasing the glue coating speed. After the glue coating is completed, the auxiliary glue coating pipe 6 can be pushed upward, so that the limiting plate 63 is raised in height, and then the limiting buckle 7 can be buckled again under the auxiliary glue coating pipe 6 outside the circle of the limiting plate 63. The pull handle 71 and the limiting buckle 7 are connected as a whole structure, and the limiting buckle 7 is made of plastic and can be deformed to facilitate pulling down or buckling again.

[0030] The auxiliary glue coating pipe 6 is fixed with a ring-shaped sealing ring 53 in the through hole of the glue coating chamber 5. The inner ring of the sealing ring 53 is in contact with the surface of the auxiliary glue coating pipe 6. When the auxiliary glue coating pipe 6 penetrates the glue coating chamber 5 through the through hole, it can maintain good sealing effect at the penetration position to prevent glue liquid from leaking out.

[0031] In use, the glue outlet pipe of the glue storage device is connected to the glue inlet pipe 51, and the control ends of the first sliding rail 2, the second sliding rail 3 and the electric push rod 41 are all connected to the control computer. The flexible circuit board to be coated with glue is placed on the surface of the base 1, and then the equipment is started. The glue coating chamber 5 and the structure below it are lifted in height by the electric push rod 41, and the glue coating chamber 5 is moved in position in the X-axis and Y-axis directions by the first sliding rail 2 and the second sliding rail 3. The glue storage device injects glue liquid into the glue coating chamber 5 at high pressure, and then the glue liquid is extruded from the main glue coating pipe 52 to be coated on the surface of the components of the flexible circuit board. When the flexible circuit board needs a large area and a large amount of glue coating, the limiting buckle 7 can be pulled out through the pull handle 71 before glue coating. The top limiting plate 63 of the auxiliary glue coating pipe 6 is no longer supported and limited by the limiting buckle 7, and under the action of the spring 62 pushing the ring plate 61 downward, the height of the auxiliary glue coating pipe 6 is lowered as a whole to the upper surface of the glue coating chamber 5 supported by the limiting plate 63. The through hole 64 on the upper side edge of the auxiliary glue coating pipe 6 enters the glue coating chamber 5. In the subsequent glue coating process, the glue liquid will also be pressed into the auxiliary glue coating pipe 6 from the through hole 64. The glue liquid can be coated on the surface of the components of the flexible circuit board from the main glue coating pipe 52 and the auxiliary glue coating pipe 6 at the same time, increasing the glue coating speed.

Claims

1. A base material gluing machine for flexible circuit board manufacturing, comprising a base (1), a first slide rail (2) and a second slide rail (3), characterized in that: The first slide rail (2) is provided with two supports which are parallel to each other and are arranged above the two sides of the base (1), and the second slide rail (3) is arranged on the slider of the two first slide rails (2); The slider side of the second slide rail (3) is fixed with a side plate (4), the side plate (4) is provided with an electric push rod (41), the bottom end of the electric push rod (41) is fixed with a glue applying chamber (5), and the bottom middle position of the glue applying chamber (5) is connected with a main glue applying pipe (52) which is in communication with the inside of the glue applying chamber (5); The glue applying chamber (5) of the outer ring of the main glue applying pipe (52) is vertically and slidably penetrated by a secondary glue applying pipe (6), the top of the secondary glue applying pipe (6) is fixed with a limiting plate (63) which is located above the glue applying chamber (5), the outer ring of the secondary glue applying pipe (6) below the glue applying chamber (5) is fixed with a ring plate (61), the outer ring of the secondary glue applying pipe (6) between the limiting plate (63) and the glue applying chamber (5) is buckled with a limiting buckle (7), and the outer ring of the secondary glue applying pipe (6) between the glue applying chamber (5) and the ring plate (61) is sleeved with a spring (62). The upper surface of the secondary glue applying pipe (6) is provided with a through hole (64) which is in communication with the inside of the secondary glue applying pipe (6), when the limiting buckle (7) is buckled on the outer ring of the secondary glue applying pipe (6), the through hole (64) is located above the glue applying chamber (5), after the limiting buckle (7) is removed, the secondary glue applying pipe (6) is lowered in height under the resistance of the spring (62), so that the limiting plate (63) is supported on the surface of the glue applying chamber (5), and the through hole (64) is lowered in height to the inside of the glue applying chamber (5).

2. The base material coating machine for flexible circuit board manufacturing according to claim 1, characterized by: The secondary glue applying pipe (6) is fixed with a ring-shaped sealing ring (53) which penetrates the through hole of the glue applying chamber (5), and the inner ring of the sealing ring (53) is in contact with the surface of the secondary glue applying pipe (6).

3. The base material coating machine for flexible circuit board manufacturing according to claim 1, characterized by: The side of the glue applying chamber (5) is connected with a glue inlet pipe (51), and the glue inlet pipe (51) is in communication with the inside of the glue applying chamber (5).

4. The base material coating machine for flexible circuit board manufacturing according to claim 1, characterized by: The side of the limiting buckle (7) is connected with a handle (71), and the handle (71) and the limiting buckle (7) are connected as an integral structure.

5. The base material coating machine for flexible circuit board manufacturing according to claim 1, characterized by: After the secondary glue applying pipe (6) is lowered in height, the bottom height of the secondary glue applying pipe (6) is the same as the bottom height of the main glue applying pipe (52).

6. The base material coating machine for flexible circuit board manufacturing according to claim 1, characterized by: The number of the secondary glue applying pipes (6) is at least four, and the secondary glue applying pipes (6) are evenly distributed on the outer ring of the main glue applying pipe (52).

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