Test system
By enabling wireless interconnection between the test fixture and the test platform through a wireless transceiver module, the problems of interface wear and low operational efficiency are solved, thereby improving the operability and reliability of electronic product testing.
Patent Information
- Application Number
- CN202520299603.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-24
AI Technical Summary
In current electronic product manufacturing and testing, pin-type plug-in interfaces and cable connection methods suffer from problems such as easy wear and tear on the interfaces and low operational efficiency.
A wireless transceiver module is used to realize signal transmission between the test fixture and the test platform. The first and second wireless transceiver modules are wirelessly interconnected to avoid wear and tear on the interface and simplify the operation process.
It effectively avoids interface wear, improves operability and operational efficiency, reduces testing costs, and enhances testing reliability and maintenance difficulty.
Smart Images
Figure CN223679308U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] Embodiments of the present application relate to the field of electronic product manufacturing testing, and in particular, to a testing system for electronic products. BACKGROUND
[0002] The existing testing method for electronic product manufacturing usually adopts a testing platform cooperating with a testing fixture to achieve the testing. Specifically, the testing fixture is used to fix the product to be tested, and then the testing fixture and the testing platform are interconnected through a pin-to-pin interface or a cable to simulate the actual functional application for testing. For example, but not limited to, In-Circuit Test (ICT) and Functional Circuit Test (FCT) of a circuit board. The typical ICT testing platform and the testing fixture are interconnected through a pin-to-pin interface, and the typical FCT testing platform and the testing fixture are interconnected through an integrated cable bundle. However, the above-mentioned physical interconnection methods such as pin-to-pin interface and cable interface have the problems of easy wear of the interface and low operation efficiency in actual application. CONTENT OF THE UTILITY MODEL
[0003] Embodiments of the present application provide a testing system, which can improve the operability and work efficiency on the basis of effectively avoiding the wear of the interface through the structural optimization of the system interconnection architecture.
[0004] The first aspect of embodiments of the present application provides a testing system, which includes a testing fixture and a testing platform that are interconnected. The testing fixture includes a first wireless transceiver module and a mounting portion. The first wireless transceiver module is connected to the mounting portion. The mounting portion is used to mount an electronic product to be tested. The first wireless transceiver module is used to wirelessly interconnect with the testing platform. The testing platform includes a second wireless transceiver module and a management control unit. The second wireless transceiver module is connected to the management control unit. The second wireless transceiver module is used to wirelessly interconnect with the testing fixture. In this way, the first wireless transceiver module and the second wireless transceiver module wirelessly transmit signals between the testing fixture and the testing platform. For example, but not limited to, control signals, data signals, and power signals. Compared with the implementation of interconnection through a pin interface or a cable, the first wireless transceiver module and the second wireless transceiver module are interconnected to realize the signal transmission between the testing fixture and the testing platform, which can effectively avoid the wear of the interface. At the same time, in the testing operation, the testing fixture and the testing platform do not need to be aligned and then plugged, which can further improve the operability and work efficiency.
[0005] In addition, based on the architecture characteristics of the test fixture and the test platform realized by wireless transmission, the embodiments of the present application have good technical advantages in test cost control and ensuring test reliability. In addition, based on wireless transmission, the occurrence of contact problem failure can be effectively avoided, and further, the operation and maintenance difficulty can be reasonably controlled.
[0006] Based on the first aspect, the embodiments of the present application also provide a first implementation of the first aspect: the first wireless transceiver module includes a first signal transceiver module, and the second wireless transceiver module includes a second signal transceiver module; the first signal transceiver module and the second signal transceiver module are matched with each other and are used for transmitting control signals and / or data signals. In actual application, the first signal transceiver module and the second signal transceiver module arranged correspondingly can configure corresponding transmission functions as needed. For example, but not limited to, used for transmitting digital input and output (digital IO, DIO) signals and analog input and output (analog IO, AIO) signals, serial peripheral interface (Serial Peripheral Interface, SPI) signals, inter-integrated circuit (Inter-Integrated Circuit, I2C) signals, and / or peripheral component interconnect express (peripheral component interconnect express, PCIe) signals, etc.
[0007] Exemplarily, the first signal transceiver module and the second signal transceiver module arranged correspondingly can adopt an 8b10b encoding mode.
[0008] Based on the first implementation of the first aspect, the embodiments of the present application also provide a second implementation of the first aspect: the first signal transceiver module is arranged in multiple, the second signal transceiver module is arranged in multiple, and the first signal transceiver module and the second signal transceiver module are arranged one by one. In this way, different application scenarios can be configured, and good adaptability is achieved.
[0009] Based on the first implementation of the first aspect, the embodiments of the present application also provide a third implementation of the first aspect: the first signal transceiver module is arranged in N1, the second signal transceiver module is arranged in M1, N1
[0010] Exemplarily, the first signal transceiver module is arranged in three, the second signal transceiver module is arranged in nine, and the three first signal transceiver modules are arranged one by one with three second signal transceiver modules in the nine second signal transceiver modules.
[0011] With reference to the first aspect, the first implementation of the first aspect, the second implementation of the first aspect, or the third implementation of the first aspect, in a fourth implementation of the first aspect, the first wireless transceiver module further comprises a first power transceiver module, and the second wireless transceiver module further comprises a second power transceiver module; the first power transceiver module and the second power transceiver module are matched with each other and used for transmitting a power signal. In this way, the first power transceiver module and the second power transceiver module arranged correspondingly can realize the transmission of the power signal.
[0012] With reference to the fourth implementation of the first aspect, in a fifth implementation of the first aspect, the first power transceiver module is arranged in a plurality of forms, the second power transceiver module is arranged in a plurality of forms, and the first power transceiver module and the second power transceiver module are arranged in a one-to-one correspondence. In actual application, the first power transceiver modules on the test fixture side can be used in parallel to increase the overall use of power for the purpose of meeting the needs of corresponding functional tests.
[0013] With reference to the fourth implementation of the first aspect, in a sixth implementation of the first aspect, the first power transceiver module is arranged in N2 forms, the second power transceiver module is arranged in M2 forms, N2 < M2, and the N2 first power transceiver modules and part of the M2 second power transceiver modules are arranged in a one-to-one correspondence. In this way, the test platform can reuse the test fixture suitable for different types of electronic products to adapt to the test loop needs of the corresponding products to be tested.
[0014] For example, the first power transceiver module is arranged in two forms, the second power transceiver module is arranged in three forms, and the two first power transceiver modules and two of the three second power transceiver modules are arranged in a one-to-one correspondence.
[0015] With reference to the fourth implementation of the first aspect, in a seventh implementation of the first aspect, the test fixture comprises a base, and the first power transceiver module is embedded in the bottom of the base; the test platform comprises a cabinet, and the second wireless transceiver module is embedded in the top of the cabinet. In this way, the operator can place the test fixture with the product to be tested on the test platform to realize the functional test.
[0016] In the eighth implementation of the first aspect based on the seventh implementation of the first aspect, the bottom inner wall surface of the base is provided with a first mounting recess and a second mounting recess, the first signal transceiver module is embedded in the first mounting recess, and the first power transceiver module is embedded in the second mounting recess; the top inner wall surface of the cabinet is provided with a third mounting recess and a fourth mounting recess, the second signal transceiver module is embedded in the third mounting recess, and the second power transceiver module is embedded in the fourth mounting recess. In this way, the first wireless transceiver module on the test fixture side and the second wireless transceiver module on the test platform side are not exposed to the external environment, which can effectively avoid the wireless transceiver module from being exposed and being dirty or damaged, and can improve the overall use reliability.
[0017] For example, the bottom wall thickness of the corresponding base at the first mounting recess is not greater than 2 cm, and the bottom wall thickness of the corresponding base at the second mounting recess is not greater than 8 mm; the top wall thickness of the corresponding cabinet at the third mounting recess is not greater than 2 cm, and the top wall thickness of the corresponding cabinet at the fourth mounting recess is not greater than 8 cm.
[0018] For another example, the transceiver end of the first wireless transceiver module can be exposed to the bottom surface of the base or flush with the bottom surface of the base, and the transceiver end of the second wireless transceiver module can be exposed to the top surface of the cabinet or flush with the top surface of the cabinet. In this way, wireless zero-distance transmission can be achieved between the test fixture and the test platform.
[0019] In the ninth implementation of the first aspect based on the fourth implementation of the first aspect, the test fixture further includes a first circuit board, the first signal transceiver module and the first power transceiver module are arranged on the first circuit board, and the first circuit board is connected with the mounting portion; the test platform further includes a second circuit board, the second signal transceiver module and the second power transceiver module are arranged on the second circuit board, and the second circuit board is connected with the management control unit. Overall, the integration degree is good. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 A schematic diagram of the architecture of a test system provided by an embodiment of the present application is shown in the figure;
[0021] Figure 2 Another schematic diagram of the architecture of a test system provided by an embodiment of the present application is shown in the figure;
[0022] Figure 3 An exploded view of the assembly relationship of a test system provided by an embodiment of the present application is shown in the figure;
[0023] Figure 4 A bottom view of the test fixture shown in the figure; Figure 3
[0024] Figure 5 for Figure 3 The diagram shows the assembly relationship between the first wireless transceiver module of the test fixture and the bottom of the base.
[0025] Figure 6 for Figure 5 CC partial section view in the middle;
[0026] Figure 7 for Figure 3 A schematic diagram showing the assembly relationship between the second wireless transceiver module of the test platform and the top of the cabinet;
[0027] Figure 8 for Figure 7 Figure 3 Partial sectional view of DD in the middle;
[0028] Figure 9 This is a schematic diagram showing the arrangement of the first wireless transceiver module on another test fixture side provided in an embodiment of this application. Detailed Implementation
[0029] This application provides a test system architecture scheme for functional testing of electronic products, which can effectively avoid interface wear and tear, and also has good operability and work efficiency.
[0030] A typical electronic product testing system mainly consists of two components: a test fixture and a test platform. The product under test (DUT) is secured in the test fixture and electrically connected. The test fixture and test platform are then interconnected via pin-to-pin interfaces or cables to simulate actual functional applications for testing. Examples include functional testing of electronic products such as circuit boards.
[0031] Taking a circuit board under test (PCB) as an example, the test fixture, acting as a tooling fixture, can hold and fix the PCB to maintain a stable test posture during the test, ensuring reliable conduction of all electrical connections. After the signal data interfaces and power interfaces on the test fixture side and the test platform side are interconnected, the corresponding functional tests are performed through the test platform. For example, the test platform can send input / output (I / O) signals (control signals) or low-speed signals (data signals), etc., which are connected through the electrical connection between the test fixture and the PCB, and then return to the test platform to form a loop. The test platform detects the signal in this loop and determines whether the PCB is functioning correctly. It is understood that the specific functional testing principle can be implemented using existing technology, and will not be elaborated here.
[0032] In the related art, the test fixture and the test platform can be interconnected by using a needle type interface and / or a cable. For the needle type interface connection structure, the plug-in interconnection needs to be accurately aligned and then plugged in. For the cable connection structure, each cable needs to be connected to the corresponding connector interface one by one. The above-mentioned physical interconnection modes such as the needle type plug-in interface and the cable plug-in interface all have the problems of easy wear of the interface and low operability and operation efficiency.
[0033] Based on this, an embodiment of the present application provides a test system. Please refer to Figure 1 , which is an architecture schematic diagram of a test system provided by an embodiment of the present application.
[0034] The test system 100 includes a test fixture 10 and a test platform 20 that are interconnected. The test fixture 10 is used to install a circuit board 30 to be tested. Here, “installation” includes reliable fixation of the circuit board 30 to be tested on the test fixture 10, and also includes electrical connection between the circuit board 30 to be tested and the test fixture 10, so as to perform a function test.
[0035] The test fixture 10 includes a first wireless transceiver module 101 and a mounting portion 102. The first wireless transceiver module 101 is used to interconnect with the test platform 20 side. The mounting portion 102 is used to install the circuit board 30 to be tested. The first wireless transceiver module 101, as an external interconnection interface of the test fixture 10, is connected to the mounting portion 102.
[0036] The test platform 20 includes a second wireless transceiver module 201 and a management control unit 202. The second wireless transceiver module 201 is used to interconnect with the test fixture 10 side. The second wireless transceiver module 201, as an external interconnection interface of the test platform 20, is connected to the management control unit 202.
[0037] In the embodiment of the present application, the first wireless transceiver module 101 and the second wireless transceiver module 201 interconnect between the test fixture 10 and the test platform 20 to transmit signals. For example, but not limited to, control signals, data signals and power signals. Compared with the implementation mode of using a needle type interface or a cable to realize interconnection, the first wireless transceiver module 101 and the second wireless transceiver module 201 interconnect to realize transmission of signals between the test fixture 10 and the test platform 20, which can effectively avoid the problem of wear of the docking interface. At the same time, in the test operation, the test fixture 10 and the test platform 20 do not need to be aligned and then plugged in, which can further improve the operability and operation efficiency.
[0038] It can be understood that the interconnection link between the test fixture 10 and the test platform 20 can be as many as thousands of roots, and for the interconnection mode using a cable, repeated plugging of the cable is also easy to cause damage to the cable body, thereby increasing the actual test cost; and each integrated cable needs to be connected one by one, in addition to the low operation efficiency, the signals defined by different wire harnesses are different, and the cable line sequence is easy to be inserted incorrectly, resulting in test failure, operation failure and other problems. The scheme of the application is based on wireless transmission to realize the architecture characteristics of the test fixture 10 and the test platform 20, and has good technical advantages in test cost control and guarantee of test reliability. In addition, the scheme of the application can effectively avoid the occurrence of contact problem failure, and the operation and maintenance difficulty can be reasonably controlled.
[0039] Optionally, the first wireless transceiver module 101 and the second wireless transceiver module 201 can be respectively configured as a plurality of wireless sub-transceiver modules. For example Figure 1 As shown in the figure, the first wireless transceiver module 101 includes a first signal transceiver module 101a and a first power transceiver module 101b, and correspondingly, the second wireless transceiver module 201 includes a second signal transceiver module 201a and a second power transceiver module 201b. The first signal transceiver module 101a can be matched with the second signal transceiver module 201a for transmitting control signals and data signals, and the first power transceiver module 101b can be matched with the second power transceiver module 201b for transmitting power signals.
[0040] In specific implementation, the number of each wireless sub-transceiver module can be determined according to needs, and the corresponding transmission function can be configured according to the overall system design requirement. Please refer to Figure 2 , which is an architecture schematic diagram of another test system provided by the embodiment of the application. In order to clearly show the difference and connection between the present embodiment and the foregoing embodiment, the same function or structure is shown in the figure with the same mark.
[0041] As Figure 2 shown, the first wireless transceiver module 101 includes a plurality of first signal transceiver modules 101a and a plurality of first power transceiver modules 101b; correspondingly, the second wireless transceiver module 201 includes a plurality of second signal transceiver modules 201a and a plurality of second power transceiver modules 201b.
[0042] Here, the first signal transceiver module 101a and the second signal transceiver module 201a arranged correspondingly can be configured with corresponding transmission functions as needed. For example, but not limited to, for transmitting DIO signals and AIO signals, SPI signals, I2C signals, and / or PCIe signals, etc. Exemplarily, the first signal transceiver module 101a and the second signal transceiver module 201a can adopt an 8b10b encoding mode, and can be compatible with different field programmable gate arrays (FPGA) to flexibly program and realize corresponding interconnection to realize the function test of the to-be-tested circuit board.
[0043] Similarly, the first power transceiver module 101b and the second power transceiver module 201b arranged correspondingly can realize the transmission of power signals respectively. Among them, each first power transceiver module 101b on the test fixture 10 side can be used in parallel to increase the overall use of power for the purpose of meeting the needs of corresponding function tests. In other possible implementation schemes, the first power transceiver module 101b and the second power transceiver module 201b arranged correspondingly can be configured as a group only. The embodiments of the present application are not limited.
[0044] In specific implementation, the first signal transceiver module 101a and the first power transceiver module 101b on the test fixture 10 side can be arranged on the first circuit board 103, and the first circuit board 103 can be the same as the number of the first signal transceiver module 101a and the first power transceiver module 101b arranged, and the first circuit board 103 is arranged one-to-one with the first signal transceiver module 101a and the first power transceiver module 101b. For example, but not limited to, the first signal transceiver module 101a and the first power transceiver module 101b can be surface-mounted on the corresponding first circuit board 103. Specifically, a first connector 104 can be arranged on the first circuit board 103, and the first connector 104 is connected with the to-be-tested circuit board 30 through a connecting cable 105 and a second connector 106 to form a test loop. Exemplarily, the second connector 106 can be arranged on the mounting portion 102, so that the corresponding interface of the to-be-tested circuit board 30 mounted on the mounting portion 102 is connected with the second connector 106.
[0045] The first connector 104 and the second connector 106 can adopt a universal base connector (UBC), and the overall structure of the connection is compact, which can be used for transmitting PCIe signals. Specifically, the first signal transceiver module 101a and the second signal transceiver module 201a can realize transmission of control signals and data signals, and the signals can be decompiled on the corresponding first circuit board 103 and transmitted to the test platform 20 side through the first power transceiver module 101b and the second power transceiver module 201b arranged correspondingly, so as to realize corresponding signal testing of the circuit board under test. At the same time, the first power transceiver module 101b and the second power transceiver module 201b arranged correspondingly can realize power supply, and the voltage conversion can be realized through the corresponding first circuit board 103 to provide corresponding power for the circuit board under test, such as but not limited to 12V or 3.3V, etc.
[0046] In other specific implementations, the first signal transceiver module 101a and the first power transceiver module 101b can also be connected with a first circuit board 103, and a corresponding test loop can also be constructed. In other possible implementation manners, the first signal transceiver module 101a and the first power transceiver module 101b on the test fixture 10 side can also be connected with the first circuit board 103 through a cable, instead of being limited to the surface mounting connection mode. The selection can be made according to product design requirements, and the embodiments of the present application are not limited.
[0047] Similarly, the second signal transceiver module 201a and the second power transceiver module 201b on the test platform 20 side can be arranged on the second circuit board 203 respectively, the second circuit board 203 can have the same number of the second signal transceiver module 201a and the second power transceiver module 201b arranged thereon, and the second circuit board 203 is arranged in one-to-one correspondence with the second signal transceiver module 201a and the second power transceiver module 201b; for example but not limited to, the second signal transceiver module 201a and the second power transceiver module 201b can be surface-mounted on the corresponding second circuit board 203. Specifically, the second circuit board 203 is connected with the management control unit 202 to construct a test loop.
[0048] In other specific implementations, the second signal transceiver module 201a and the second power transceiver module 201b can also be connected with a second circuit board 203, and a corresponding test loop can also be constructed. In other possible implementation manners, the second signal transceiver module 201a and the second power transceiver module 201b on the test platform 20 side can also be connected with the second circuit board 203 through a cable, instead of being limited to the surface mounting connection mode. The selection can be made according to product design requirements, and the embodiments of the present application are not limited.
[0049] Furthermore, regarding the management control unit 202 on the test platform 20 side, in a specific implementation, the management control unit 202 can be integrated and installed on the motherboard of the test platform 20. The specific implementation needs to be determined, and this application embodiment does not impose any limitations.
[0050] It should be noted that the first wireless transceiver module 101 on the test fixture 10 side and the second wireless transceiver module 201 on the test platform 20 side are positioned opposite each other to achieve wireless signal transmission and reception. To improve operability, the first wireless transceiver module 101 can be located at the bottom of the test fixture 10, and correspondingly, the second wireless transceiver module 201 can be located at the top of the test platform 20. Thus, when the test fixture 10 is placed on the mounting surface of the test platform 20, the first wireless transceiver module 101 at the bottom of the test fixture 10 is positioned opposite the second wireless transceiver module 201 at the top of the mounting surface.
[0051] Please see also Figure 3 and Figure 4 ,in, Figure 3 An exploded view of the assembly relationship of a test system provided in an embodiment of this application. Figure 4 for Figure 3 The diagram shows a bottom view of the test fixture 10. To clearly illustrate the differences and connections between this embodiment and the previous embodiments, configurations or structures with the same functions are shown with the same reference numerals in the diagram.
[0052] The test fixture 10 of the test system 100 is used in conjunction with the test platform 20.
[0053] like Figure 3 As shown, the test platform 20 includes a cabinet 204, and the second wireless transceiver module 201 is disposed on the top of the cabinet 204; for example, but not limited to, located at... Figure 3 The management control unit 202 and the second circuit board 203, along with other functional components, are located within the cabinet 204. The specific implementation can be achieved using existing technologies, and will not be elaborated upon here.
[0054] Combination Figure 4 As shown, the test fixture 10 includes a base 107, and a first wireless transceiver module 101 is disposed at the bottom of the base 107; for example, but not limited to, located at... Figure 4 Within area B shown. Other functional components, such as the mounting part 102 and the first circuit board 103, are disposed on the base 107. The specific implementation method can be achieved using existing technology, which will not be described in detail here.
[0055] In a specific implementation, the transceiver end of the second wireless transceiver module 201 can be exposed on the top surface of the cabinet 204, or flush with the top surface of the cabinet 204 (not shown in the figure). Similarly, the transceiver end of the first wireless transceiver module 101 can be exposed on the bottom surface of the base 107, or flush with the bottom surface of the base 107 (not shown in the figure). In this way, wireless zero-distance transmission and reception can be achieved between the test fixture 10 and the test platform.
[0056] To prevent the transceiver modules from being exposed and getting dirty or damaged, in a specific implementation, the transceiver end of the second wireless transceiver module 201 can be installed inside the cabinet 204, and the transceiver end of the first wireless transceiver module 101 can be installed inside the base 107.
[0057] Please see also Figure 5 and Figure 6 ,in, Figure 5 for Figure 3 The diagram shows the assembly relationship between the first wireless transceiver module of the test fixture and the bottom of the base. Figure 6 for Figure 5 CC partial section view in the image.
[0058] like Figure 5 and Figure 6 As shown, the first wireless transceiver module 101 is embedded in the bottom 1071 of the base 107. Corresponding to the first signal transceiver module 101a and the first power transceiver module 101b, the inner wall surface of the bottom 1071 of the base 107 is provided with a first mounting recess 1072 and a second mounting recess 1073. The first signal transceiver module 101a is embedded in the first mounting recess 1072, and the first power transceiver module 101b is embedded in the second mounting recess 1073.
[0059] For example, the figure shows nine first signal transceiver modules 101a and three first power transceiver modules 101b. It should be understood that the actual number of first signal transceiver modules 101a and first power transceiver modules 101b can be designed according to the test circuit requirements of the product under test. In other words, there can be N1 first signal transceiver modules 101a and M1 second signal transceiver modules 101b, where N1 < M1; the N1 first signal transceiver modules 101a correspond one-to-one with a portion of the M1 second signal transceiver modules 101b. The specific number can be determined according to the overall product design requirements, and this embodiment does not limit the number.
[0060] Please see also Figure 7 and Figure 8 ,in, Figure 7 for Figure 3 The diagram shows the assembly relationship between the second wireless transceiver module of the test platform and the top of the rack.Figure 8 For Figure 7 D-D partial sectional view in
[0061] As Figure 7 and Figure 8 The second wireless transceiver module 201 is embedded in the top 2041 of the cabinet 204. The inner wall surface of the top 2041 of the cabinet 204 is provided with a third mounting recess 2042 and a fourth mounting recess 2043 corresponding to the second signal transceiver module 201a and the second power transceiver module 201b. The second signal transceiver module 201a is embedded in the third mounting recess 2042, and the second power transceiver module 201b is embedded in the fourth mounting recess 2043.
[0062] Exemplarily, the second signal transceiver module 201a shown in the figure is provided as nine, and the second power transceiver module 201b is provided as three. It should be understood that the actual number of the second signal transceiver module 201a and the second power transceiver module 201b can be designed according to the test loop needs of the product to be tested, in other words, the first power transceiver module 201a is provided as N2, and the second power transceiver module 201b is provided as M2, N2
[0063] It can be understood that the thinner the penetrating wall surface of each wireless transceiver module (the first wireless transceiver module 101 and the second wireless transceiver module 201) is, the better the signal quality is, so that the penetrating ability of the wireless signal transceiver of each wireless transceiver module can be ensured.
[0064] Exemplarily, the wall thickness L1 of the bottom 1071 of the corresponding base 107 at the first mounting recess 1072 can be not greater than 2cm, and similarly, the wall thickness L3 of the top 2041 of the corresponding cabinet 204 at the third mounting recess 2042 can also be not greater than 2cm. In addition, the wall thickness L2 of the bottom 1071 of the corresponding base 107 at the second mounting recess 1073 can be not greater than 8mm, and similarly, the wall thickness L4 of the top 2041 of the corresponding cabinet 204 at the fourth mounting recess 2043 can also be not greater than 8cm. Of course, the wall thickness of the corresponding structure at each mounting recess can be determined according to the implementation, as long as the penetrating physical thickness of each wireless transceiver module is met, and the embodiments of the present application are not limited.
[0065] In other possible implementation manners, the first signal transceiver module 101a and the second signal transceiver module 201a also adopt wireless transmission modes based on the 5th Generation Mobile Communication Technology (5G) and Wireless Fidelity (WIFI) rather than the aforementioned short-distance wireless transmission mode.
[0066] To further improve the operation reliability, a positioning structure can be arranged between the test fixture 10 and the test platform 20. For example, Figure 3 As shown in the figure, a plurality of positioning portions 2044 are arranged on the top surface of the test platform 20, that is, the positioning portions 2044 are arranged on the upper surface of the top portion 2041. The plurality of positioning portions 2044 can be adapted to the outer peripheral surface of the test fixture 10 to limit the relative position of the test fixture 10 on the top surface of the test platform 20. Thus, when the test fixture 10 needs to be connected with the test platform 20, the test fixture 10 can be placed on the test platform to automatically realize the connection, and the first wireless transceiver module 101 on the side of the test fixture 10 and the second wireless transceiver module 201 on the side of the test platform 20 can be accurately aligned, thereby ensuring the wireless transmission efficiency.
[0067] In a specific implementation, corresponding to the rectangular bottom of the test fixture 10, the positioning portions 2044 are arranged in four and have a right-angle bending shape. The four positioning portions 2044 are adapted to the four corners of the rectangular bottom of the test fixture 10, respectively.
[0068] In other specific implementations, the number and specific shape of the positioning portions 2044 can be selected according to the structure of the mating side. In addition, the positioning portions can also be arranged on the side of the test fixture 10, as long as the function of quickly and accurately aligning can be met. The embodiments of the present application are not limited.
[0069] In addition, for example, Figure 5 As shown in the figure, the test system 100 can also include a display 205, which can be used for man-machine interactive display of test related data. The specific implementation can be realized by using the existing technology, which will not be described here.
[0070] In the foregoing embodiments, the number of wireless transceiver modules on the side of the test fixture 10 is the same as the number of wireless transceiver modules on the side of the test platform 20. In other specific implementations, the number of wireless transceiver modules on the side of the test fixture 10 can also be selectively configured. Please refer to Figure 9 , which is a schematic diagram of the arrangement relationship of the first wireless transceiver module on the side of another test fixture provided by the embodiments of the present application.
[0071] For example, Figure 9As shown in the region B in the middle, four first signal transceiver modules 101a and two first power transceiver modules 101b are arranged. The four first signal transceiver modules 101a and the two first power transceiver modules 101b here are respectively one-to-one corresponding to four of the nine second signal transceiver modules 201a and two of the three second power transceiver modules 201b on the side of the test platform 20. It should be noted that the first wireless transceiver module 101 on the side of the test fixture 10 can be determined according to the product to be tested, as long as part of the second power transceiver modules in the region A of the test platform side is correspondingly arranged, so that the test platform can meet the adaptation needs of different test fixtures, such as but not limited to, functional testing of server hanging ear plates and different back plates and circuit boards, and the like. The embodiments of the present application are not limited.
[0072] It should be understood that the test system provided by the embodiments of the present application can also be applied to the performance testing of other electronic products, and other functional configurations of the corresponding test fixture and test platform can be realized by using the prior art, and therefore, the present application will not be described here.
[0073] The above is only the preferred embodiment of the present application, and it should be pointed out that for ordinary skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can be made, and these improvements and refinements should be considered as the protection scope of the present application.
Claims
1. A test system, characterized by, The test system comprises a test fixture and a test platform which are matched with each other; The test fixture comprises a first wireless transceiver module and a mounting portion, the first wireless transceiver module is connected with the mounting portion, the mounting portion is used for mounting an electronic product to be tested, and the first wireless transceiver module is used for wireless interconnection with the test platform side; The test platform comprises a second wireless transceiver module and a management control unit, the second wireless transceiver module is connected with the management control unit, and the second wireless transceiver module is used for wireless interconnection with the test fixture side.
2. The test system of claim 1, wherein, The first wireless transceiver module comprises a first signal transceiver module, and the second wireless transceiver module comprises a second signal transceiver module; the first signal transceiver module and the second signal transceiver module are matched with each other and are used for transmitting control signals and / or data signals.
3. The test system of claim 2, wherein, The first signal transceiver module is provided in a plurality of forms, the second signal transceiver module is provided in a plurality of forms, and the first signal transceiver module and the second signal transceiver module are arranged in a one-to-one correspondence.
4. The test system of claim 2, wherein, The first signal transceiver module is provided in N1 forms, the second signal transceiver module is provided in M1 forms, N1 < M1; and N1 first signal transceiver modules are arranged in a one-to-one correspondence with part of the second signal transceiver modules in the M1 second signal transceiver modules.
5. The test system of any one of claims 2 to 4, wherein, The first wireless transceiver module further comprises a first power transceiver module, and the second wireless transceiver module further comprises a second power transceiver module; the first power transceiver module and the second power transceiver module are matched with each other and are used for transmitting power signals.
6. The test system of claim 5, wherein, The first power transceiver module is provided in a plurality of forms, the second power transceiver module is provided in a plurality of forms, and the first power transceiver module and the second power transceiver module are arranged in a one-to-one correspondence.
7. The test system of claim 5, wherein, The first power transceiver module is provided in N2 forms, the second power transceiver module is provided in M2 forms, N2 < M2; and N2 first power transceiver modules are arranged in a one-to-one correspondence with part of the second power transceiver modules in the M2 second power transceiver modules.
8. The test system of claim 5, wherein, The test fixture comprises a base, and the first power transceiver module is embedded in the bottom of the base; the test platform comprises a cabinet, and the second wireless transceiver module is embedded in the top of the cabinet.
9. The test system of claim 8, wherein, First and second mounting recesses are formed in the inner wall surface of the bottom of the base, the first signal transceiver module is embedded in the first mounting recess, and the first power transceiver module is embedded in the second mounting recess; third and fourth mounting recesses are formed in the inner wall surface of the top of the cabinet, the second signal transceiver module is embedded in the third mounting recess, and the second power transceiver module is embedded in the fourth mounting recess.
10. The test system of claim 5, wherein, The test fixture further comprises a first circuit board, the first signal transceiver module and the first power transceiver module are arranged on the first circuit board, and the first circuit board is connected with the mounting portion; the test platform further comprises a second circuit board, the second signal transceiver module and the second power transceiver module are arranged on the second circuit board, and the second circuit board is connected with the management control unit.