High-luminous-efficiency LED packaging structure

Abstract

The utility model discloses a high luminous efficiency LED packaging structure comprising a pedestal, a heat conduction base plate is fixedly connected in the pedestal, the upper end of the heat conduction base plate is provided with a heat sink and two pins, the upper end of the heat sink is provided with an LED filament and fluorescent powder, the upper end of the pedestal is fixedly connected with a lens, and the upper end of the lens is fixedly connected with an LED light source. Epoxy resin filling glue is filled between the lens and the fluorescent powder, a heat dissipation mechanism is fixedly connected to the lower end of the heat conduction bottom plate, a plurality of heat dissipation fins are fixedly connected to the outer side end of the heat dissipation mechanism at equal intervals, and a plurality of heat dissipation holes are symmetrically formed in the outer side end of the base. The heat dissipation mechanism is composed of a plurality of first heat dissipation plates and a circular second heat dissipation plate. According to the LED packaging structure, heat generated by the LED is transmitted to the cooling fins through the heat conduction bottom plate and the heat dissipation mechanism, the cooling fins are cooled by external air, the external air enters the base through the heat dissipation holes to dissipate heat of the heat dissipation heat sink and the heat dissipation mechanism, the heat dissipation efficiency of the LED packaging structure is improved, and therefore the LED lighting effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to LED packaging technical field, concretely is a kind of high luminous efficiency LED packaging structure. BACKGROUND

[0002] LED (semiconductor light emitting diode) packaging refers to the packaging of light emitting chip, and there is greater difference compared with integrated circuit packaging. Generally speaking, the function of packaging is to provide sufficient protection for chip, prevent chip from failure due to long-term exposure in air or mechanical damage, to improve the stability of chip;For LED packaging, it also needs to have good light extraction efficiency and good heat dissipation, good packaging can make LED have better luminous efficiency and heat dissipation environment, and then improve the life of LED.

[0003] LED lamp has LED filament packaging and traditional PLCC type single LED packaging, LED filament packaging is different from traditional PLCC type single LED packaging form, adopts glass silk with size about 40mm (L) *1.0mm (W) *0.5mm (T) as substrate, and tens of 0.02W LED chips are connected in series, and are packaged by mixing organic silicone glue mixed with fluorescent powder. One bulb usually has two-four such filaments, like the light emitting tungsten filament of traditional incandescent lamp, is fixed in the center of bulb, can realize 360 degree full circle light emission, but the temperature rising speed in LED filament packaging LED lamp is also faster, which leads to the temperature rise of LED filament when working for a long time reduces luminous efficiency. Utility model content

[0004] The utility model discloses a kind of high luminous efficiency LED packaging structure, can improve the contact area of heat dissipation mechanism and air in LED packaging, improve the heat dissipation efficiency of LED filament, improve the luminous efficiency of LED filament when working for a long time.

[0005] In order to achieve the above object, a high light efficiency LED packaging structure is provided, which comprises a base, a heat-conducting bottom plate fixedly connected in the base, a heat sink and two pins mounted on the upper end of the heat-conducting bottom plate, the heat sink being located at the middle of the heat-conducting bottom plate, the heat sink being located between the two pins, the opposite ends of the two pins penetrating the base respectively, an LED filament and a fluorescent powder being mounted on the upper end of the heat sink, the LED filament being covered by the fluorescent powder and located at the middle of the fluorescent powder, a lens being fixedly connected to the upper end of the base, epoxy resin filling glue being filled between the lens and the fluorescent powder, a heat dissipation mechanism being fixedly connected to the lower end of the heat-conducting bottom plate, a plurality of heat dissipation fins being fixedly connected to the outer side end of the heat dissipation mechanism at equal intervals, the heat dissipation fins penetrating the base, a plurality of heat dissipation holes being symmetrically arranged on the outer side end of the base and located below the heat dissipation fins, the heat dissipation mechanism being composed of a plurality of first heat dissipation plates and a circular second heat dissipation plate, the plurality of first heat dissipation plates being fixedly connected to the outer side end of the second heat dissipation plate, the second heat dissipation plate being located at the middle of the lower end of the heat-conducting bottom plate, and the end of the first heat dissipation plate away from the second heat dissipation plate being fixedly connected to the middle of the side end of the heat dissipation fin. The contact area between the heat dissipation mechanism and air in the LED packaging can be increased, the heat dissipation efficiency of the LED filament can be improved, and the light efficiency of the LED filament during long-time work can be improved.

[0006] According to the high light efficiency LED packaging structure, the inner wall of the base is fixedly connected with a PC material reflector, the opening of the reflector is upward, the heat sink penetrates the middle of the reflector, the reflector is located at the upper end of the heat sink, and the epoxy resin filling glue is located between the reflector and the lens. The light emitted by the LED filament is reflected to the lens, and the light efficiency is improved.

[0007] According to the high light efficiency LED packaging structure, the upper end of the heat-conducting bottom plate is fixedly connected with a limiting column, the limiting column penetrates the pin and the reflector, and the limiting column in the pin is provided with two. The reflector and the pin are prevented from moving, and the reflector and the pin are facilitated to be installed.

[0008] According to the high light efficiency LED packaging structure, the outer side end of the reflector is provided with an adhesive, and the inner wall of the reflector and the lens are fixedly connected through the adhesive. The reflector is fixed to ensure the reflection direction of the light.

[0009] According to the high light efficiency LED packaging structure, a metal heat dissipation net is fixedly connected between the plurality of first heat dissipation plates, and the first heat dissipation plates penetrate the metal heat dissipation net. The heat dissipation area of the heat dissipation mechanism is increased, and the heat dissipation efficiency is improved.

[0010] According to the high light efficiency LED packaging structure, the first heat dissipation plate and the heat dissipation fin are filled with heat-conducting glue, and the first heat dissipation plate and the heat dissipation fin are fixedly connected through the heat-conducting glue. The first heat dissipation plate and the heat dissipation fin are connected, the gap between them is reduced, and the heat transfer efficiency is ensured.

[0011] Compared with the prior art, the high light efficiency LED packaging structure has the advantages that the heat generated by the LED is transferred to the radiating fins through the heat-conducting bottom plate and the radiating mechanism, the radiating fins are cooled by the external air, the external air enters the base through the radiating holes to radiate the radiating heat sink and the radiating mechanism, the radiating efficiency of the LED packaging structure is improved, and the light efficiency of the LED is improved.

[0012] The additional aspects and advantages of the present application will be given in part in the following description, and will become apparent from the following description, or will be learned by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0013] The present application will be further described below in conjunction with the drawings and embodiments.

[0014] Figure 1 It is a perspective view of the high light efficiency LED packaging structure of the present application;

[0015] Figure 2 It is a sectional view of the high light efficiency LED packaging structure of the present application;

[0016] Figure 3 It is a perspective view of the radiating mechanism and the radiating net of the high light efficiency LED packaging structure of the present application;

[0017] Figure 4 It is a perspective view of the radiating mechanism and the radiating net of the high light efficiency LED packaging structure of the present application;

[0018] In the figure: 1, lens; 2, base; 3, radiating hole; 4, pin; 5, radiating fin; 6, reflector; 7, heat sink; 8, LED filament; 9, fluorescent powder; 10, radiating mechanism; 11, metal radiating net; 12, heat-conducting bottom plate; 13, limiting column; 14, epoxy resin filling glue; 15, first radiating plate; 16, second radiating plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0020] Please refer to Figures 1-4The utility model provides a technical scheme: a high light efficiency LED package structure, including base 2, base 2 is fixedly connected with heat conduction bottom plate 12 in, the upper end of heat conduction bottom plate 12 is installed with heat sink 7 and two pins 4, and heat sink 7 is located in the middle part of heat conduction bottom plate 12, heat sink 7 is located between two pins 4, and the opposite end of two pins 4 is respectively penetrated through base 2, the upper end of heat sink 7 is installed with LED filament 8 and fluorescent powder 9, and LED filament 8 is covered with fluorescent powder 9 and is located in the middle part of fluorescent powder 9, the upper end of base 2 is fixedly connected with lens 1, and lens 1 is filled with epoxy resin filling adhesive 14 between fluorescent powder 9, the inner wall of base 2 is fixedly connected with PC material reflector 6, and the opening of reflector 6 is upward, the outside end of reflector 6 is equipped with adhesive, and reflector 6 and lens 1 inner wall are fixedly connected through adhesive, are used for the fixed reflector 6, guarantee the reflection direction of light. Heat sink 7 penetrates the middle part of reflector 6, and reflector 6 is located at the upper end of heat sink 7, the upper end of heat conduction bottom plate 12 is fixedly connected with limit post 13, and limit post 13 penetrates pin 4 and reflector 6, limit post 13 in pin 4 is equipped with two, is used to avoid reflector 6 and pin 4 move, facilitate the installation of reflector 6 and pin 4. Epoxy resin filling adhesive 14 is located between reflector 6 and lens 1. It is used to reflect the light of LED filament 8 to lens 1, improves light efficiency. The lower end of heat conduction bottom plate 12 is fixedly connected with heat dissipation mechanism 10, the outside end of heat dissipation mechanism 10 is equidistantly fixedly connected with a plurality of radiating fins 5, and the radiating fin 5 penetrates the base 2, the outside end of base 2 is symmetrically equipped with a plurality of heat dissipation holes 3, and the heat dissipation hole 3 is located below the radiating fin 5, and the heat dissipation mechanism 10 is composed of a plurality of first radiating plates 15 and circular second radiating plates 16, and a plurality of first radiating plates 15 are fixedly connected to the outside end of second radiating plate 16, a plurality of first radiating plates 15 are fixedly connected with metal heat dissipation net 11 between, and first radiating plate 15 penetrates metal heat dissipation net 11, is used to increase the heat dissipation area of heat dissipation mechanism 10, improves the heat dissipation efficiency. Second radiating plate 16 is located in the lower end middle part of heat conduction bottom plate 12, the end of first radiating plate 15 away from second radiating plate 16 is fixedly connected with the middle part of the side end of radiating fin 5, and the first radiating plate 15 and the radiating fin 5 are filled with heat-conducting glue, and the first radiating plate 15 and the radiating fin 5 are fixedly connected through the heat-conducting glue, connect the first radiating plate 15 and the radiating fin 5, and reduce the gap between them, guarantee the transmission efficiency of heat.

[0021] Working principle: when using, the light emitted by the LED filament 8 is irradiated to the outside through the fluorescent powder 9, the epoxy resin filling glue 14 and the lens 1, meanwhile the light reflected by the reflector 6 to other directions is reflected to the direction of the lens 1, the light efficiency is improved, the heat on the surface of the LED filament 8 is transmitted to the heat dissipation mechanism 10 through the heat sink 7 and the heat conduction bottom plate 12, the heat dissipation mechanism 10 transmits the heat to the metal heat dissipation net 11 and the heat dissipation fin 5, the air in the outside environment enters the space below the heat conduction bottom plate 12 in the base 2 through the heat dissipation hole 3, the air in the outside environment cools the heat dissipation fin 5, the air entering the base 2 cools the heat conduction bottom plate 12, the heat dissipation mechanism 10 and the metal heat dissipation net 11, the heat dissipation efficiency of the LED filament 8 is improved, and then the light efficiency is improved.

[0022] The above-mentioned embodiments of the present application are described in detail in combination with the drawings, but the present application is not limited to the above-mentioned embodiments, and various changes can be made within the knowledge range of ordinary skilled in the art without departing from the purpose of the present application.

Claims

1. A high light efficiency LED package structure comprising a base (2), characterized in that, The base (2) is fixedly connected with a heat-conducting bottom plate (12), the upper end of the heat-conducting bottom plate (12) is provided with a heat sink (7) and two pins (4), the heat sink (7) is located in the middle of the heat-conducting bottom plate (12), the heat sink (7) is located between the two pins (4), and the opposite ends of the two pins (4) penetrate the base (2) respectively, the upper end of the heat sink (7) is provided with an LED filament (8) and fluorescent powder (9), the LED filament (8) is covered by the fluorescent powder (9) and located in the middle of the fluorescent powder (9), the upper end of the base (2) is fixedly connected with a lens (1), the lens (1) and the fluorescent powder (9) are filled with an epoxy resin filling glue (14) therebetween, the lower end of the heat-conducting bottom plate (12) is fixedly connected with a heat dissipation mechanism (10), the outer side end of the heat dissipation mechanism (10) is fixedly connected with a plurality of heat dissipation fins (5) at equal intervals, and the heat dissipation fins (5) penetrate the base (2), the outer side end of the base (2) is symmetrically provided with a plurality of heat dissipation holes (3), and the heat dissipation holes (3) are located below the heat dissipation fins (5), the heat dissipation mechanism (10) is composed of a plurality of first heat dissipation plates (15) and a circular second heat dissipation plate (16), and the plurality of first heat dissipation plates (15) are fixedly connected to the outer side end of the second heat dissipation plate (16), the second heat dissipation plate (16) is located in the middle of the lower end of the heat-conducting bottom plate (12), and the end of the first heat dissipation plate (15) away from the second heat dissipation plate (16) is fixedly connected to the middle of the side end of the heat dissipation fin (5).

2. The high-eficiency LED package structure of claim 1, wherein: The inner wall of the base (2) is fixedly connected with a PC material light shield (6), and the opening of the light shield (6) faces upward, the heat sink (7) penetrates the middle of the light shield (6), and the light shield (6) is located at the upper end of the heat sink (7), and the epoxy resin filling glue (14) is located between the light shield (6) and the lens (1).

3. The high-efficiency LED packaging structure as described in claim 2, characterized in that: The upper end of the heat-conducting bottom plate (12) is fixedly connected with a limiting column (13), and the limiting column (13) penetrates the pin (4) and the light shield (6), and the limiting column (13) in the pin (4) is provided with two.

4. The high-eficiency LED package structure of claim 2, wherein: The outer side end of the light shield (6) is provided with an adhesive, and the light shield (6) and the lens (1) are fixedly connected by the adhesive.

5. The high-efficiency LED packaging structure as described in claim 1, characterized in that: A metal heat dissipation net (11) is fixedly connected between the plurality of first heat dissipation plates (15), and the first heat dissipation plate (15) penetrates the metal heat dissipation net (11).

6. The high-efficiency LED packaging structure as described in claim 1, characterized in that: The first heat dissipation plate (15) and the heat dissipation fin (5) are filled with heat-conducting glue, and the first heat dissipation plate (15) and the heat dissipation fin (5) are fixedly connected by the heat-conducting glue.

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