Ultrasonic probe and ultrasonic imaging apparatus

Abstract

The utility model relates to an ultrasonic probe and an ultrasonic imaging apparatus. An ultrasonic probe, the ultrasonic probe comprising: a piezoelectric layer; the backing layer and the piezoelectric layer are arranged in a stacked mode; the flexible circuit board is used for being connected with a connector, the flexible circuit board comprises a main body part and an extension part, and the main body part is at least partially located between the piezoelectric layer and the backing layer and electrically connected with the piezoelectric layer; the extension part extends from the main body part to the side, away from the piezoelectric layer, of the backing layer along the outer wall of the backing layer, and is in a multi-layer stacking shape on the side, away from the piezoelectric layer, of the backing layer. The ultrasonic probe and the ultrasonic imaging equipment can meet the signal transmission requirement when the number of channels is larger.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of medical devices, in particular to an ultrasonic probe and an ultrasonic imaging device. BACKGROUND

[0002] With the increasing popularity of minimally invasive surgery, it has become one of the common diagnosis and treatment methods to detect the lesion site by inserting an ultrasonic probe into the patient's body. For example, an intracardiac ultrasonic probe is often used to assist in the diagnosis and treatment of heart disease. Such an ultrasonic probe usually includes a piezoelectric layer, an application-specific integrated circuit (ASIC), an adapter plate, and a cable, etc. During detection, the ultrasonic probe is sent into the patient's body through a catheter, emits and receives ultrasonic signals through the piezoelectric layer, the received signals are transmitted to the adapter plate through the ASIC, and then transmitted to the cable through the adapter plate. The cable transmits the signals to the outside of the body, and then transmits them to the host computer through the connector on the handle for imaging display. However, in such a structure, the number of cables is greatly limited due to the small inner diameter of the catheter, which cannot meet the transmission requirements of multiple channels of signals. SUMMARY

[0003] Therefore, it is necessary to provide an ultrasonic probe and an ultrasonic imaging device which can meet the signal transmission requirements of a larger number of channels.

[0004] An ultrasonic probe, comprising:

[0005] a piezoelectric layer;

[0006] a backing layer, and the piezoelectric layer is stacked with the backing layer; and

[0007] a flexible circuit board for connecting with a connector, the flexible circuit board comprises a main body part and an extension part, the main body part is at least partially located between the piezoelectric layer and the backing layer and electrically connected with the piezoelectric layer, the extension part extends from the main body part along the outer wall of the backing layer to the side of the backing layer away from the piezoelectric layer, and the extension part is stacked in multiple layers on the side of the backing layer away from the piezoelectric layer.

[0008] In some embodiments, the extension part comprises a fitting subpart and a stacking subpart, the stacking subpart is stacked in multiple layers on the side of the backing layer away from the piezoelectric layer, and the main body part and the stacking subpart are connected through the fitting subpart fitted to the outer wall of the backing layer.

[0009] In some embodiments, in the unfolded state of the flexible circuit board, a notch is formed on the region of the main body part and the fitting subpart away from the piezoelectric layer in a first direction, wherein the first direction is the length direction of the flexible circuit board.

[0010] In some embodiments, the connection between two adjacent layers in the stack sub-part has a cut in a partial position in a first direction, wherein the first direction is a length direction of the flexible circuit board.

[0011] In some embodiments, a plurality of the cuts are arranged in a third direction close to one end of the piezoelectric layer, and projections of the plurality of the cuts in the third direction are arranged in sequence in the first direction, wherein the third direction is a stacking direction of the piezoelectric layer and the backing layer.

[0012] In some embodiments, the flexible circuit board includes two extension parts, and the two extension parts respectively extend from the main part to a side of the backing layer away from the piezoelectric layer along an outer wall of the backing layer at two ends of the main part in a second direction, and are stacked in a plurality of layers at the side of the backing layer away from the piezoelectric layer, wherein the second direction is perpendicular to a length direction of the flexible circuit board and perpendicular to the stacking direction of the piezoelectric layer and the backing layer.

[0013] In some embodiments, one of the extension parts is stacked at the side of the backing layer away from the piezoelectric layer to form a first stack sub-part, and the other extension part is stacked at the side of the backing layer away from the piezoelectric layer to form a second stack sub-part, and the first stack sub-part and the second stack sub-part are stacked in sequence in the stacking direction.

[0014] In some embodiments, the ultrasonic probe includes a catheter, the flexible circuit board includes a probe head connecting segment and a lead-out segment arranged in a first direction, the probe head connecting segment and the lead-out segment each include the extension part, and at least the probe head connecting segment includes the main part, the piezoelectric layer is arranged in the probe head connecting segment, and the lead-out segment passes through the catheter, wherein the first direction is a length direction of the flexible circuit board.

[0015] The probe head connecting segment and the lead-out segment are integrally formed, or the probe head connecting segment and the lead-out segment are separately arranged and fixedly connected.

[0016] In some embodiments, each layer of the multi-layer stacked structure in the probe head connecting segment has a connection area connected to a corresponding layer of the multi-layer stacked structure in the lead-out segment, and projections of the connection areas of the layers of the multi-layer stacked structure in the probe head connecting segment in a third direction are arranged in sequence in the first direction, wherein the third direction is the stacking direction of the piezoelectric layer and the backing layer.

[0017] In some embodiments, the projection of the connection area in the third direction is located within the range of the piezoelectric layer.

[0018] In some embodiments, one layer of the multi-layer stacked structure in the acoustic head connecting section has a connecting area connected with a corresponding layer of the multi-layer stacked structure in the lead-out section, and a plurality of the connecting areas are arranged along the first direction.

[0019] In some embodiments, each of the connecting areas includes a plurality of connecting sites arranged along the first direction.

[0020] Alternatively, each of the connecting areas includes a plurality of connecting sites arranged along a second direction, which is perpendicular to the first direction and perpendicular to the stacking direction of the piezoelectric layer and the backing layer.

[0021] In some embodiments, in the unfolded state of the flexible circuit board, the acoustic head connecting section is connected with the lead-out section on both sides along a third direction, wherein the third direction is the stacking direction of the piezoelectric layer and the backing layer.

[0022] In some embodiments, the lead-out section includes a plurality of lead-out sub-sections arranged in sequence along the first direction, and any adjacent lead-out sub-sections are connected.

[0023] In some embodiments, each layer of the multi-layer stacked structure in the lead-out section is disconnected from each other.

[0024] Alternatively, each layer of the multi-layer stacked structure in the lead-out section is connected as a whole at one end close to the connector along the first direction, and is disconnected or connected as a whole at the other end.

[0025] In some embodiments, one end of the lead-out section away from the acoustic head connecting section is used to directly connect with the connector.

[0026] Alternatively, one end of the lead-out section away from the acoustic head connecting section is used to connect with the connector through a cable.

[0027] An ultrasonic imaging device, the ultrasonic imaging device includes the ultrasonic probe described above, and further includes the connector and a host, and the ultrasonic probe and the host are connected through the connector.

[0028] The ultrasonic probe and the ultrasonic imaging device, the piezoelectric layer can emit and receive ultrasonic signals, which is electrically connected to the main body part of the flexible circuit board, so that the received signals can be transmitted to the connector through the flexible circuit board. Due to the highly integrated characteristics of the flexible circuit board, under the condition of the same size, it can meet the signal transmission of more channels compared with the cable. And the extension part extends from the main body part along the outer wall of the backing layer to the side of the backing layer away from the piezoelectric layer, and is in a multi-layer stacked shape on the side of the backing layer away from the piezoelectric layer. In the prior art, under the premise that the size of the catheter lumen is constant, the number of cables that can be arranged in the catheter lumen is also limited. Since only one transmission channel can be arranged in each cable, the total number of transmission channels that can be arranged is extremely limited when using a cable for transmission. In this application, the flexible circuit board is used to transmit signals. Due to the highly integrated characteristics of the flexible circuit board, under the condition of the same size, a single-layer flexible circuit board can already arrange more number of transmission channels. On this basis, the flexible circuit board is also in a multi-layer stacked shape on the side of the backing layer away from the piezoelectric layer, and each layer can set a transmission channel, so as to further increase the total number of transmission channels to meet the transmission demand of more channel signals. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components).

[0030] Figure 2 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components). Figure 1 It is a schematic view of the flexible circuit board in the unfolded state and the piezoelectric layer in the ultrasonic probe shown.

[0031] Figure 3 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components).

[0032] Figure 4 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components). Figure 3 It is a schematic view of the flexible circuit board in the unfolded state and the piezoelectric layer in the ultrasonic probe shown.

[0033] Figure 5 It is a schematic view of the flexible circuit board in the folded state in the ultrasonic probe shown. Figure 3

[0034] Figure 6 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components). Figure 3

[0035] Figure 7 It is a schematic view of the end surface of the ultrasonic probe in an embodiment of the application (omitting the piezoelectric layer and other components).

[0036] Figure 8 ​​FIG. 6 is a schematic view of the acoustic head connection section and the piezoelectric layer when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0037] Figure 9 FIG. 7 is a schematic view of the acoustic head connection section when the flexible circuit board is in the folded state, according to another embodiment of the present application. Figure 8

[0038] Figure 10 FIG. 8 is a side view of the acoustic head connection section and the lead-out section, according to another embodiment of the present application.

[0039] Figure 11 FIG. 9 is a schematic view of the lead-out section when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0040] Figure 12 FIG. 10 is a schematic view of the acoustic head connection section, the lead-out section, and the piezoelectric layer when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0041] Figure 13 FIG. 11 is a schematic view of the acoustic head connection section, the lead-out section, and the piezoelectric layer when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0042] Figure 14 FIG. 12 is a schematic view of the lead-out section and the connector connection when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0043] Figure 15 FIG. 13 is a schematic view of the acoustic head connection section, the lead-out section, and the piezoelectric layer when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0044] Figure 16 FIG. 14 is a schematic view of the acoustic head connection section, the lead-out section, and the piezoelectric layer when the flexible circuit board is in the unfolded state, according to another embodiment of the present application.

[0045] Figure 17 FIG. 15 is a schematic view of the ultrasonic probe when the flexible circuit board is in the folded state (catheter omitted), according to another embodiment of the present application.

[0046] REFERENCE NUMERALS:

[0047] 100 piezoelectric layer

[0048] 200 backing layer

[0049] 300 flexible circuit board 310 main body portion 320 extension portion 321 adhesion sub-portion 322 stacking sub-portion 3221 first stacking sub-portion 3222 second stacking sub-portion 330 notch 340 slit 350 acoustic head connection section 351 first land group 360 lead-out section 361 second land group 362 lead-out sub-section

[0050] ​400, conduit;

[0051] 500, cable;

[0052] 600, connector. DETAILED DESCRIPTION

[0053] In order to make the above objectives, features and advantages of the present application more clear and easily understood, the specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a variety of ways beyond the specific embodiments described herein without departing from the scope of the present application, and it is understood that similar changes in form and substitution of equivalent ones can be made by those skilled in the art without departing from the spirit and scope of the present application, therefore the present application is not limited to the specific embodiments disclosed below.

[0054] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0055] In addition, if the terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implying the number of the technical features indicated. Therefore, the features limited by "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0056] In the present application, unless otherwise specifically defined and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0057] In the present application, unless specifically defined and limited otherwise, if there is a description of a first feature on or above or below a second feature, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature can be above or above or above the second feature, or it can only mean that the first feature is higher in height than the second feature. The first feature can be below or below or below the second feature, or it can only mean that the first feature is lower in height than the second feature.

[0058] It should be noted that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or there can be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0059] Referring to Figure 1 , Figure 3 , Figure 6 and Figure 14 , an embodiment of the present application provides an ultrasonic probe, which includes a piezoelectric layer 100, a backing layer 200 and a flexible circuit board 300. The backing layer 200 and the piezoelectric layer 100 are stacked, and the flexible circuit board 300 is used to connect with a connector 600. The flexible circuit board 300 includes a main body part 310 and an extension part 320. The main body part 310 is at least partially located between the piezoelectric layer 100 and the backing layer 200 and is electrically connected to the piezoelectric layer 100. The extension part 320 extends from the main body part 310 along the outer wall of the backing layer 200 to the side of the backing layer 200 away from the piezoelectric layer 100, and is in a multi-layer stacked form on the side of the backing layer 200 away from the piezoelectric layer 100.

[0060] The ultrasonic probe in the above embodiments, the piezoelectric layer 100 can transmit and receive ultrasonic signals, which is electrically connected to the main body part 310 of the flexible circuit board 300, so that the received signals can be transmitted to the connector 600 through the flexible circuit board 300. Because the flexible circuit board 300 has the characteristics of high integration, under the condition of the same size, it can satisfy more number of signal transmission channels compared with the cable 500. Moreover, the extension part 320 extends from the main body part 310 along the outer wall of the backing layer 200 to the side of the backing layer 200 away from the piezoelectric layer 100, and is in a multi-layer stacked form on the side of the backing layer 200 away from the piezoelectric layer 100. In the prior art, under the premise that the size of the inner cavity of the catheter 400 is constant, the number of cables that can be arranged in the inner cavity is also limited. Because only one transmission channel can be arranged in each cable, the total number of transmission channels that can be arranged is extremely limited when the cable is used for transmission. In the present application, the flexible circuit board 300 is used for signal transmission, and because of the characteristics of high integration of the flexible circuit board 300, under the condition of the same size, a single flexible circuit board 300 can already arrange more number of transmission channels. On this basis, the flexible circuit board 300 is in a multi-layer stacked form on the side of the backing layer 200 away from the piezoelectric layer 100, and each layer can arrange transmission channels, so that the total number of transmission channels can be further increased to meet the transmission demand of more channels.

[0061] The length direction of the flexible circuit board 300 is defined as the first direction, the width direction of the piezoelectric layer 100 (i.e. the width direction of the flexible circuit board 300 in the unfolded state) is defined as the second direction, and the stacking direction of the piezoelectric layer 100 and the backing layer 200 is defined as the third direction. Any two of the first direction, the second direction and the third direction are perpendicular. The extension direction of the extension part 320 on the outer wall of the backing layer 200 is the third direction. In the third direction, the main body part 310 is at least partially located between the piezoelectric layer 100 and the backing layer 200.

[0062] In the embodiments of the present application, the flexible circuit board 300 includes a base material (PI or PET), a metal conductor layer (such as a copper foil), an insulating film, and a cover film, which are bonded by an adhesive. The metal conductor layer is used to transmit electrical signals, i.e. the transmission channels are arranged in the metal conductor layer. When the flexible circuit board 300 is folded, the microstructure of each layer in the multi-layer stacked structure also includes the above-mentioned film layers.

[0063] Referring to Figures 1 to 4 In some embodiments, the extension part 320 includes a fitting sub-part 321 and a stacked sub-part 322, the stacked sub-part 322 is in a multi-layer stacked form on the side of the backing layer 200 away from the piezoelectric layer 100, and the main body part 310 and the stacked sub-part 322 are connected through the fitting sub-part 321 fitted to the outer wall of the backing layer 200.

[0064] Specifically, one end of the adhering sub-portion 321 is connected to the end of the main body portion 310 along the second direction, and the other end is connected to the stacking sub-portion 322. The stacking sub-portion 322 is formed into a multi-layer stacking shape by repeated bending on the side of the backing layer 200 away from the piezoelectric layer 100.

[0065] The adhering sub-portion 321 and the stacking sub-portion 322 are integrally formed, and the extension portion 320 and the main body portion 310 are integrally formed. In assembly, the main body portion 310 is first fixed between the piezoelectric layer 100 and the backing layer 200, and then the extension portion 320 is bent relative to the main body portion 310, so that the extension portion 320 adheres to the outer wall of the backing layer 200 and extends along the third direction to the side away from the piezoelectric layer 100 on the outer wall of the backing layer 200, and then the stacking sub-portion 322 is formed into a multi-layer stacking shape by repeated bending on the side away from the piezoelectric layer 100.

[0066] It can be understood that the number of layers of the stacking sub-portion 322 formed is related to the size of the inner cavity of the conduit 400. The larger the size of the inner cavity of the conduit 400, the more layers of stacking can be accommodated, so that the number of layers of stacking can be increased as much as possible during manufacturing, thereby increasing the total number of transmission channels.

[0067] In some embodiments, the main body portion 310 is fixed between the piezoelectric layer 100 and the backing layer 200 by welding, binding, or the like.

[0068] Preferably, in some embodiments, the adhering sub-portion 321 in the extension portion 320 is fixed to the outer wall of the backing layer 200 by adhesion or the like, so as to improve the structural strength.

[0069] Preferably, in some embodiments, any two adjacent layers in the stacking sub-portion 322 are fixed by adhesion or the like, so as to further improve the structural strength.

[0070] Referring to Figures 1 to 4 In some embodiments, in the unfolded state of the flexible circuit board 300, a notch 330 is formed in the region on the main body portion 310 and the adhering sub-portion 321 away from the piezoelectric layer 100 along the first direction, wherein the first direction is the length direction of the flexible circuit board 300.

[0071] Referring to Figures 5 to 6 It can be understood that when the notch 330 is arranged in the above manner, the flexible circuit board 300 is folded to present Figure 1 or Figure 3 the state shown, the region of the flexible circuit board 300 where the notch 330 is formed can only form the stacking sub-portion 322, and cannot form the adhering sub-portion 321 and the main body portion 310. That is, in the folded state of the flexible circuit board 300, the adhering sub-portion 321 and the main body portion 310 are formed on the region of the flexible circuit board 300 where the notch 330 is not formed. Figure 5In the perspective view, the left end region has the main body part 310, the fitting sub-part 321 and the stacking sub-part 322, while the right end region only has the stacking sub-part 322, without the main body part 310 and the fitting sub-part 321. The flexible circuit board 300 is away from the piezoelectric layer 100 in the region along the first direction (i.e. Figure 5 The region of the right end region in the perspective view is just the region through which the catheter 400 passes. The signal received by the piezoelectric layer 100 is transmitted to the fitting sub-part 321 through the main body part 310, and then transmitted to the stacking sub-part 322, and then transmitted to the outside of the body through the stacking sub-part 322 and the catheter 400. Referring to Figure 17 In some embodiments, the flexible circuit board 300 can also not be provided with the notch. At this time, the piezoelectric layer 100 and the backing layer 200 only exist in the partial region of the flexible circuit board 300 along the first direction. In Figure 17 In the perspective view, the piezoelectric layer 100 and the backing layer 200 only exist in the left end partial region of the flexible circuit board 300.

[0072] As described above, the main body part 310 is at least partially located between the piezoelectric layer 100 and the backing layer 200. Specifically, since the notch 330 is provided (as shown in Figure 5 At this time, the main body part 310 is entirely located between the piezoelectric layer 100 and the backing layer 200; when the notch 330 is not provided (as shown in Figure 17 At this time, the main body part 310 is entirely located between the piezoelectric layer 100 and the backing layer 200; when the notch 330 is not provided (as shown in

[0073] In the above embodiments, by providing the notch 330 on the main body part 310 and the fitting sub-part 321 in the region away from the piezoelectric layer 100 along the first direction, it can be achieved that only the stacking sub-part 322 passes through the catheter 400 to reach the outside of the body. Compared with the flexible circuit board 300 with a larger cross-sectional size passing through the catheter 400 to reach the outside of the body, the stacking sub-part 322 with a smaller cross-sectional size can better adapt to the narrow inner cavity of the catheter 400. In the case of a certain size of the inner cavity of the catheter 400, the space saved by the main body part 310 and the fitting sub-part 321 can be used to accommodate more stacking sub-parts 322 of the stacking layers, so as to further increase the number of transmission channels and better meet the transmission demand of multi-channel signals.

[0074] Referring to Figures 1 to 4 In some embodiments, the connection between two adjacent layers in the stacking sub-part 322 has a slit 340 at some positions in the first direction, wherein the first direction is the length direction of the flexible circuit board 300.

[0075] Specifically, the flexible circuit board 300 is cut with a slit 340 extending along the first direction in a partial region thereof in the unfolded state. After assembly, the slit 340 is located at the connection between two adjacent layers of the stacked sub-part 322, thereby partially disconnecting the connection between the two adjacent layers of the stacked sub-part 322. Such an arrangement facilitates the bending and stacking of the flexible circuit board 300 during assembly and reduces the difficulty of assembly.

[0076] In some embodiments, the slits can be arranged continuously along the first direction or discontinuously along the first direction.

[0077] Referring to Figures 1 to 4 Preferably, in some embodiments, a plurality of slits 340 are arranged in a stepped manner along the first direction close to one end of the piezoelectric layer 100 in the unfolded state of the flexible circuit board 300. Such an arrangement provides sufficient space for the internal wiring of the flexible circuit board 300, thereby facilitating the wiring.

[0078] It should be noted that the "projection along the third direction" in the embodiments of the present application refers to the projection of a component onto a projection plane perpendicular to the third direction.

[0079] Referring to Figures 3 to 6 In some embodiments, the flexible circuit board 300 includes two extension parts 320, each of which extends from the main part 310 along the second direction to the side of the backing layer 200 away from the piezoelectric layer 100 along the outer wall of the backing layer 200, and is stacked in multiple layers on the side of the backing layer 200 away from the piezoelectric layer 100. The second direction is perpendicular to the length direction of the flexible circuit board 300 and perpendicular to the stacking direction of the piezoelectric layer 100 and the backing layer 200.

[0080] Specifically, the two extension parts 320 are symmetrically connected to the main part 310 along the second direction in the unfolded state of the flexible circuit board 300. By arranging two sets of extension parts 320, the number of stacked layers on the side of the backing layer 200 away from the piezoelectric layer 100 can be increased, thereby further increasing the number of transmission channels and better meeting the transmission requirements of multi-channel signals.

[0081] Referring to Figures 3 to 6 In some embodiments, one of the extension parts 320 is stacked on the side of the backing layer 200 away from the piezoelectric layer 100 to form a first stacked sub-part 3221, and the other extension part 320 is stacked on the side of the backing layer 200 away from the piezoelectric layer 100 to form a second stacked sub-part 3222, and the first stacked sub-part 3221 and the second stacked sub-part 3222 are stacked in sequence along the stacking direction.

[0082] Specifically, two extensions 320 extend from both sides of the backing layer 200 to the side of the backing layer 200 away from the piezoelectric layer 100. One extension 320 is then repeatedly bent to form a first stacked sub-part 3221 stacked on the surface of the backing layer 200. The other extension 320 is then repeatedly bent to form a second stacked sub-part 3222 stacked on the surface of the first stacked sub-part 3221. In other words, the two stacked sub-parts are sequentially stacked on the side of the backing layer 200 away from the piezoelectric layer 100. This sequential stacking of the two sub-parts allows for a higher degree of compression during pressing, thereby reducing the stack thickness and better matching the narrow inner lumen of the conduit 400.

[0083] In other embodiments, the two extensions 320 can be first attached together on the side of the backing layer 200 away from the piezoelectric layer 100, and then the whole can be stacked by repeated bending, that is, the two extensions 320 are stacked crosswise.

[0084] See Figure 1 , Figure 3 and Figure 7 In some embodiments, the ultrasound probe includes a conduit 400, and the flexible circuit board 300 includes a probe connection segment 350 and an exit segment 360 arranged along a first direction. Both the probe connection segment 350 and the exit segment 360 include an extension portion 320, and at least the probe connection segment 350 includes a main body portion 310. A piezoelectric layer 100 is disposed on the probe connection segment 350, and the exit segment 360 passes through the conduit 400. The first direction is the length direction of the flexible circuit board 300. The probe connection segment 350 and the exit segment 360 are integrally formed, or the probe connection segment 350 and the exit segment 360 are separately arranged and fixedly connected.

[0085] Specifically, when the flexible circuit board 300 is configured as a split structure, the acoustic head connecting section 350 and the lead-out section 360 are separately configured and fixedly connected, and the two can be fixed by welding, bonding, binding, or other methods. During assembly, the acoustic head connecting section 350 and the lead-out section 360 can be inserted from both ends of the conduit 400, making assembly more convenient. When a notch 330 is provided on the flexible circuit board 300 (e.g.) Figure 5 As shown), the area on the flexible circuit board 300 with the notch 330 will not form the main body 310. In this case, only the head connector section 350 has the main body 310, while the lead-out section 360 does not. When the flexible circuit board 300 does not have the notch 330 (e.g.) Figure 17 As shown), the sound head connecting section 350 and the lead-out section 360 have the same structure, that is, both include the main body 310.

[0086] In the embodiment shown in the drawings, the acoustic head connecting section 350 and the lead-out section 360 are fixed by welding. Further, after being connected, the acoustic head connecting section 350 and the lead-out section 360 are bent as a whole. That is, after being connected, the extension portions 320 of the two extend together along the outer wall of the backing layer 200 to the side of the backing layer 200 facing away from the piezoelectric layer 100, and form a multilayer stack-like structure on the side of the backing layer 200 facing away from the piezoelectric layer 100.

[0087] After being assembled, the acoustic head connecting section 350 and the lead-out section 360 each include a stack sub-portion 322 in a multilayer stack-like structure, each layer of the stack sub-portion 322 of the acoustic head connecting section 350 includes a first pad group 351, and each layer of the stack sub-portion 322 of the lead-out section 360 includes a second pad group 361, each first pad group 351 and the corresponding second pad group 361 of the layer are welded to realize the connection between the acoustic head connecting section 350 and the lead-out section 360. Among them, the first pad group 351 includes at least one first pad, and the second pad group 361 includes at least one second pad.

[0088] Referring to Figure 1 , Figure 3 and Figure 7 , in some embodiments, each layer of the multilayer stack-like structure in the acoustic head connecting section 350 has a connection area connected to the corresponding layer of the multilayer stack-like structure in the lead-out section 360, and the projections of the connection areas of the layers of the multilayer stack-like structure in the acoustic head connecting section 350 along the third direction are arranged in the first direction in turn.

[0089] Specifically, each layer of the multilayer stack-like structure in the acoustic head connecting section 350, that is, each layer of the stack sub-portion 322 of the acoustic head connecting section 350. When the acoustic head connecting section 350 and the lead-out section 360 are connected by welding, each layer of the multilayer stack-like structure in the acoustic head connecting section 350 has a connection area, that is, the aforementioned first pad group 351. The projection of the connection area of each layer of the multilayer stack-like structure in the acoustic head connecting section 350 along the third direction, that is, the projection of the first pad group 351 on each layer along the third direction. After the projections of the first pad groups 351 on the layers along the third direction are arranged in the first direction in turn, when the flexible circuit board 300 is in the unfolded state shown in the drawings, the first pad groups 351 on the layers are arranged in a stepped manner. In this way, the welding positions of each layer of the stack sub-portion 322 in the acoustic head connecting section 350 and the lead-out section 360 can be staggered in the first direction after assembly, avoiding the fact that they are all concentrated in one area and causing the thickness of the stack in that area to be too large, thereby better matching the narrow inner cavity of the catheter 400. Figure 7

[0090] Referring to Figure 1 , Figure 3 ,​Figure 8 With Figure 9 In some embodiments, the projection of the aforementioned connecting region along the third direction is within the range of the piezoelectric layer 100.

[0091] Specifically, when the sound head connecting section 350 and the lead-out section 360 are connected by welding, that is, the projection of the first pad group 351 along the third direction is within the range of the piezoelectric layer 100. When the flexible circuit board 300 is in the unfolded state as shown, that is, the distribution range of the first pad group 351 along the first direction does not exceed the piezoelectric layer 100. In this way, after assembly is completed, all the welding positions can be located within the range of the piezoelectric layer 100, that is, all the welding positions are below the piezoelectric layer 100 in the perspective view. Then when the piezoelectric layer 100 completes the subsequent packaging process, the welding positions can be packaged inside, thereby improving the connection strength of the welding positions and making them less likely to break. Figure 8 Figure 1 Specifically, when the sound head connecting section 350 and the lead-out section 360 are connected by welding, that is, the projection of the first pad group 351 along the third direction is within the range of the piezoelectric layer 100. When the flexible circuit board 300 is in the unfolded state as shown, that is, the distribution range of the first pad group 351 along the first direction does not exceed the piezoelectric layer 100. In this way, after assembly is completed, all the welding positions can be located within the range of the piezoelectric layer 100, that is, all the welding positions are below the piezoelectric layer 100 in the perspective view. Then when the piezoelectric layer 100 completes the subsequent packaging process, the welding positions can be packaged inside, thereby improving the connection strength of the welding positions and making them less likely to break.

[0092] Referring to Figure 1 , Figure 3 , Figure 15 and Figure 16 In some embodiments, one layer of the multi-layer stacked structure in the sound head connecting section 350 has a connecting region connected to the corresponding layer of the multi-layer stacked structure in the lead-out section 360, and the plurality of connecting regions are arranged along the first direction.

[0093] With Figure 7 the difference between each layer of the multi-layer stacked structure of the sound head connecting section 350 and the lead-out section 360 is that, in this embodiment, only one layer of the multi-layer stacked structure of the sound head connecting section 350 and the lead-out section 360 needs to be connected, and the specific position of this layer in the third direction is not limited, which mainly depends on the stacking method. By connecting only one layer, the connection process of the sound head connecting section 350 and the lead-out section 360 can be simplified, and the operation is more convenient.

[0094] Specifically, when the sound head connecting section 350 and the lead-out section 360 are connected by welding, each connecting region is a first pad group 351. That is, after the sound head connecting section 350 is stacked, the plurality of first pad groups 351 are all located in the same layer, and correspondingly, after the lead-out section 360 is stacked, the plurality of second pad groups 361 are also all located in the corresponding same layer, and each first pad group 351 is welded with the second pad group 361 at the corresponding position in the first direction.

[0095] ​It should be noted that although in the above embodiment, only one layer of the multi-layer stack structure of the acoustic head connecting section 350 and the lead-out section 360 is required to be connected, it does not mean that the transmission channel is only provided in this layer. In fact, each layer of the multi-layer stack structure of the acoustic head connecting section 350 is provided with a transmission channel, and the transmission channels of other layers can be connected to this layer, and then transmitted to the lead-out section 360 through this layer.

[0096] Referring to Figure 1 , Figure 3 and Figure 15 , in some embodiments, each connection region includes a plurality of connection sites arranged along the first direction.

[0097] Specifically, when the acoustic head connecting section 350 and the lead-out section 360 are connected by welding, each connection site is a solder pad. That is, each first solder pad group 351 includes a plurality of first solder pads arranged along the first direction; correspondingly, each second solder pad group 361 includes a plurality of second solder pads arranged along the first direction; each first solder pad and the corresponding second solder pad are welded.

[0098] Alternatively, referring to Figure 1 , Figure 3 and Figure 16 , each connection region includes a plurality of connection sites arranged along the second direction, the second direction being perpendicular to the first direction and perpendicular to the stacking direction of the piezoelectric layer 100 and the backing layer 200.

[0099] Specifically, when the acoustic head connecting section 350 and the lead-out section 360 are connected by welding, each connection site is a solder pad. That is, each first solder pad group 351 includes a plurality of first solder pads arranged along the second direction; correspondingly, each second solder pad group 361 includes a plurality of second solder pads arranged along the second direction; each first solder pad and the corresponding second solder pad are welded. When the solder pads in the two solder pad groups are arranged in this direction, the solder pad group can occupy a smaller size in the first direction, thereby increasing the number of solder pad groups arranged in the first direction to further enhance the connection strength.

[0100] Referring to Figure 1 , Figure 3 , Figure 7 and Figure 10 , in some embodiments, in the unfolded state of the flexible circuit board 300, the acoustic head connecting section 350 is connected to the lead-out section 360 on both sides along the third direction.

[0101] Specifically, the third direction is the thickness direction of the flexible circuit board 300. Figure 10 From the perspective, the two layers of lead-out sections 360 are respectively laid on the upper and lower sides of the acoustic head connecting section 350. Among them, each layer of the lead-out section 360 can be arranged in the same manner as the acoustic head connecting section 350. Figure 7The layers are arranged in the shown shape, one layer is arranged above the sound head connecting section 350, and the other layer is arranged below the sound head connecting section 350, and then the sound head connecting section 350 and the lead-out sections 360 above and below the sound head connecting section 350 are stacked as a whole.

[0102] Further, when the sound head connecting section 350 and the lead-out sections 360 are connected by welding, the upper and lower surfaces of the sound head connecting section 350 are provided with first pad groups 351, and each layer of the lead-out sections 360 is welded by a plurality of second pad groups 361 and corresponding first pad groups 351. In this way, the sound head connecting section 350 can transmit signals on both sides, and the number of stacked layers of the stacked sub-sections 322 in the sound head connecting section 350 can be reduced under the premise of a certain number of channels, thereby facilitating the reduction of the cross-sectional size of the stacked sub-sections 322 in the sound head connecting section 350, making it easier to extend into a narrower detection position.

[0103] Referring to Figure 1 , Figure 3 , Figure 7 and Figure 11 , in some embodiments, the lead-out section 360 includes a plurality of lead-out sub-sections 362 arranged in sequence along the first direction, and any adjacent lead-out sub-sections 362 are connected.

[0104] Specifically, the plurality of lead-out sub-sections 362 can be connected by welding, bonding, binding, or the like.

[0105] Referring to Figure 1 , Figure 3 , Figure 7 and Figure 12 , in some embodiments, each layer of the multi-layer stacked structure in the lead-out section 360 is connected at one end close to the connector 600 and disconnected or connected at the other end.

[0106] Specifically, each layer of the multi-layer stacked structure in the lead-out section 360 is disconnected at the end connected to the sound head connecting section 350 and connected at the end connected to the connector 600. In Figure 12 the perspective view, that is, each layer of the multi-layer stacked structure in the lead-out section 360 is connected at the right end region and disconnected at the left end region, that is, each layer of the left end region is provided with a slit 340. In this way, it is not only convenient to fold and assemble through the slit 340, but also convenient to connect the right end region as a whole to the connector. Of course, each layer of the multi-layer stacked structure in the lead-out section 360 can also be connected at the end connected to the sound head connecting section 350.

[0107] Alternatively, referring to Figure 1 , Figure 3 , Figure 7 and Figure 13In some embodiments, each layer of the multi-layer stacked structure in the lead-out section 360 is disconnected from each other.

[0108] When the sound head connecting section 350 and the lead-out section 360 are connected by welding, that is, each layer of the multi-layer stacked structure in the lead-out section 360 is separately arranged and welded to the corresponding first solder pad group 351 through the second solder pad group 361.

[0109] Referring to Figure 1 , Figure 3 , Figure 7 and Figure 14 In some embodiments, the end of the lead-out section 360 away from the sound head connecting section 350 is used to be connected to the connector 600 through the cable 500.

[0110] Alternatively, in some embodiments, the end of the lead-out section 360 away from the sound head connecting section 350 is used to be directly connected to the connector 600. For example, the end of the lead-out section 360 away from the sound head connecting section 350 is inserted into the connector 600.

[0111] Referring to Figure 1 , Figure 3 and Figure 14 An embodiment of the present application provides an ultrasonic imaging device, including the ultrasonic probe in any one of the above embodiments, and further including a connector 600 and a host computer, wherein the ultrasonic probe and the host computer are connected through the connector 600.

[0112] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as the scope of the present application.

[0113] The above embodiments only express several implementation manners of the present application, and the description is specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. An ultrasonic probe, characterized in that, The ultrasonic probe includes: Piezoelectric layer (100); A backing layer (200) and the piezoelectric layer (100) are stacked together; and A flexible circuit board (300) for connection with a connector (600) includes a main body (310) and an extension (320). The main body (310) is at least partially located between the piezoelectric layer (100) and the backing layer (200) and is electrically connected to the piezoelectric layer (100). The extension (320) extends from the main body (310) along the outer wall of the backing layer (200) to the side of the backing layer (200) away from the piezoelectric layer (100) and is multi-layered on the side of the backing layer (200) away from the piezoelectric layer (100).

2. The ultrasonic probe according to claim 1, characterized in that, The extension (320) includes a bonding sub-part (321) and a stacking sub-part (322). The stacking sub-part (322) is stacked in multiple layers on the side of the backing layer (200) away from the piezoelectric layer (100). The main body (310) and the stacking sub-part (322) are connected by the bonding sub-part (321) which is bonded to the outer wall of the backing layer (200).

3. The ultrasonic probe according to claim 2, characterized in that, In the unfolded state, the flexible circuit board (300) has notches (330) in the areas of the main body (310) and the bonding sub-part (321) that are away from the piezoelectric layer (100) along a first direction, wherein the first direction is the length direction of the flexible circuit board (300).

4. The ultrasonic probe according to claim 2, characterized in that, The connection between two adjacent layers in the stacked sub-section (322) has a slit (340) at a partial location in a first direction, wherein the first direction is the length direction of the flexible circuit board (300).

5. The ultrasonic probe according to claim 4, characterized in that, Multiple slits (340) are arranged in a staggered manner along the first direction near one end of the piezoelectric layer (100), and their projections along a third direction are arranged in the first direction, wherein the third direction is the stacking direction of the piezoelectric layer (100) and the backing layer (200).

6. The ultrasonic probe according to any one of claims 1 to 5, characterized in that, The flexible circuit board (300) includes two extensions (320), which extend from the main body (310) along the outer wall of the backing layer (200) at both ends in a second direction to the side of the backing layer (200) away from the piezoelectric layer (100). Both extensions (320) are stacked in multiple layers on the side of the backing layer (200) away from the piezoelectric layer (100). The second direction is perpendicular to the length direction of the flexible circuit board (300) and perpendicular to the stacking direction of the piezoelectric layer (100) and the backing layer (200).

7. The ultrasonic probe according to claim 6, characterized in that, One of the extensions (320) is stacked on the side of the backing layer (200) away from the piezoelectric layer (100) to form a first stacked sub-part (3221), and the other extension (320) is stacked on the side of the backing layer (200) away from the piezoelectric layer (100) to form a second stacked sub-part (3222). The first stacked sub-part (3221) and the second stacked sub-part (3222) are stacked sequentially along the stacking direction.

8. The ultrasonic probe according to any one of claims 1 to 5, characterized in that, The ultrasound probe includes a conduit (400), and the flexible circuit board (300) includes a head connection section (350) and an outlet section (360) arranged along a first direction. Both the head connection section (350) and the outlet section (360) include the extension portion (320), and at least the head connection section (350) includes the main body portion (310). The piezoelectric layer (100) is disposed on the head connection section (350), and the outlet section (360) passes through the conduit (400). The first direction is the length direction of the flexible circuit board (300). The acoustic head connecting section (350) and the lead-out section (360) are integrally formed, or the acoustic head connecting section (350) and the lead-out section (360) are separately set and fixedly connected.

9. The ultrasonic probe according to claim 8, characterized in that, Each layer of the multi-layered stacked structure in the acoustic head connection section (350) has a connection area that connects to the corresponding layer of the multi-layered stacked structure in the lead-out section (360). The connection areas of each layer of the multi-layered stacked structure in the acoustic head connection section (350) are sequentially staggered along the projection of a third direction in the first direction, wherein the third direction is the stacking direction of the piezoelectric layer (100) and the backing layer (200).

10. The ultrasonic probe according to claim 9, characterized in that, The projection of the connection region along the third direction lies within the piezoelectric layer (100).

11. The ultrasonic probe according to claim 8, characterized in that, One layer of the multi-layered stacked structure in the sound head connection section (350) has multiple connection areas that are connected to the corresponding layer of the multi-layered stacked structure in the lead-out section (360), and the multiple connection areas are arranged along the first direction.

12. The ultrasonic probe according to claim 11, characterized in that, Each of the connection regions includes a plurality of connection points arranged along the first direction; Alternatively, each of the connection regions may include a plurality of connection sites arranged along a second direction perpendicular to the first direction and perpendicular to the stacking direction of the piezoelectric layer (100) and the backing layer (200).

13. The ultrasonic probe according to claim 8, characterized in that, In the unfolded state, the flexible circuit board (300) has lead-out sections (360) connected to both sides of the head connection section (350) along a third direction, wherein the third direction is the stacking direction of the piezoelectric layer (100) and the backing layer (200).

14. The ultrasonic probe according to claim 8, characterized in that, The lead-out segment (360) includes a plurality of lead-out sub-segments (362) arranged sequentially along the first direction, and any adjacent lead-out sub-segments (362) are connected.

15. The ultrasonic probe according to claim 8, characterized in that, The multi-layered stacked structure in the lead-out section (360) is disconnected from each other; Alternatively, each layer of the multi-layered stacked structure in the lead-out section (360) may be connected together at one end near the connector (600) along the first direction, and disconnected or connected together at the other end.

16. The ultrasonic probe according to claim 8, characterized in that, The end of the lead-out section (360) facing away from the sound head connection section (350) is used to directly connect to the connector (600); Alternatively, the end of the lead-out section (360) opposite to the head connector section (350) is used to connect to the connector (600) via a cable (500).

17. An ultrasonic imaging device, characterized in that, The ultrasound imaging device includes an ultrasound probe according to any one of claims 1 to 16, and further includes the connector (600) and a host, wherein the ultrasound probe and the host are connected via the connector (600).

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