Semiconductor refrigerator heat preservation device

Abstract

The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigerator heat preservation device which comprises a semiconductor refrigerator shell, a heat preservation layer and a condensation pipe. The semiconductor refrigerator shell is divided into an inner shell and an outer shell, the inner shell is used for containing food, the outer shell is a protective shell, and a heat preservation cavity is formed between the inner shell and the outer shell. A heat preservation cavity is formed in the inner shell, a heat preservation layer is installed in the heat preservation cavity and fixedly installed on the outer wall of the inner shell, condensation pipes are arranged on the heat preservation layer, the condensation pipes are arranged in the heat preservation cavity in a snakelike mode, and the condensation pipes are used for heat exchange of the semiconductor refrigerator. Therefore, the problems of non-uniform refrigeration distribution and low refrigeration efficiency caused by local high temperature are avoided, and the refrigeration uniformity and the refrigeration efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor refrigeration technical field, concretely is a kind of semiconductor refrigerator heat preservation device. BACKGROUND

[0002] ‌Semiconductor refrigerator is a kind of refrigerator using semiconductor material to refrigerate, and semiconductor refrigerator is refrigerated by the Peltier effect of semiconductor material, that is, when electric current passes through the joint of two different materials, one joint will be cold, and the other joint will be hot, and this effect makes semiconductor refrigerator can realize refrigeration without mechanical moving parts.

[0003] Semiconductor refrigerator is mainly composed of shell, thermoelectric module and condenser pipe, and the thermoelectric module is fixedly installed in the shell for heat conduction to realize the refrigeration of refrigerator, the thermoelectric module is composed of thermoelectric material and material column, and the condenser pipe is arranged above the thermoelectric module for heat dissipation of semiconductor refrigerator, to ensure the normal operation of semiconductor refrigerator.

[0004] But in the process of refrigeration of semiconductor refrigerator, the thermoelectric module directly contacts the hot end and the cold end by thermoelectric material, which causes heat to be conducted transversely through thermoelectric material, and the refrigeration efficiency is low, and at the same time, the heat dissipation is uneven due to the high thermal resistance of thermoelectric material, thereby affecting the refrigeration efficiency of semiconductor refrigerator.

[0005] Therefore, the prior art proposes a kind of semiconductor refrigerator, application number: CN202122978052.4, the utility model is communicated with the containing cavity by opening drainage channel on the shell, so that the water droplets generated in the containing cavity of refrigeration part can flow out through the drainage channel, without water accumulation in the containing cavity, thereby improving the use experience of user, but the problem of low refrigeration efficiency of semiconductor refrigerator is not solved.

[0006] Therefore, we propose a kind of semiconductor refrigerator heat preservation device. UTILITY MODEL CONTENT

[0007] The utility model aims at providing a kind of semiconductor refrigerator heat preservation device to solve the problems raised in the above background.

[0008] To achieve the above object, the utility model provides the following technical scheme:

[0009] A kind of semiconductor refrigerator heat preservation device, including semiconductor refrigerator shell, heat preservation layer and condenser pipe;

[0010] The semiconductor refrigerator shell is an inner shell and an outer shell, the inner shell is used for food placement, the food is placed on the placement rack opened on the inner shell to achieve preservation and refrigeration of the food, the outer shell is a protective shell, and the outer shell is used for protection of internal electronic components; a heat preservation cavity is formed between the inner shell and the outer shell; a heat preservation layer is installed in the heat preservation cavity, the heat preservation layer is fixedly installed on the outer wall of the inner shell, the heat preservation layer is used for heat preservation of the temperature in the space of the inner shell, thereby ensuring the temperature of the semiconductor refrigerator for preservation and refrigeration, maintaining the temperature required by the user, ensuring the preservation and refrigeration effect of the food, and improving the uniformity of temperature distribution, so that the preservation and refrigeration temperature is uniformly distributed, and a condenser pipe is arranged on the heat preservation layer, the condenser pipe is arranged in a serpentine shape in the heat preservation cavity, and the condenser pipe is used for heat exchange of the semiconductor refrigerator; the condenser pipe exchanges heat with the temperature in the heat preservation cavity through the refrigerant flowing in the pipe, so that the temperature in the heat preservation cavity is prevented from rising, the working of the internal electronic components is affected, and the refrigeration effect of the semiconductor refrigerator is affected, so that the refrigeration temperature cannot reach the set temperature.

[0011] Preferably, the heat preservation layer comprises an electrode sheet, a heat preservation substrate and a thermoelectric material column; the electrode sheet is fixedly installed on the outer wall of the inner shell, the electrode sheet is connected with an external power supply, so that the electrode sheet is filled with current, the heat preservation substrate is fixedly installed on the electrode sheet, and the heat preservation substrate is used for maintaining the stability of the temperature, thereby preventing internal temperature leakage and causing insufficient refrigeration temperature; the heat preservation substrate is arrayed with mounting holes, the thermoelectric material column is fixedly installed in the mounting hole, the thermoelectric material column is used for realizing the refrigeration effect of the refrigerator, and the thermoelectric material column realizes the refrigeration effect through the Peltier effect.

[0012] The thermoelectric material column comprises a P-type thermoelectric material column and an N-type thermoelectric material column; when the P-type thermoelectric material column is electrified, the temperature gradually increases along the current flow direction of the P-type material column; when the N-type thermoelectric material column is electrified, the temperature gradually decreases along the current flow direction of the N-type thermoelectric material column; the P-type thermoelectric material column and the N-type thermoelectric material column are alternately installed in the mounting hole and are fixedly connected with the electrode sheet; the P-type thermoelectric material column, the N-type thermoelectric material column and the electrode sheet form a closed loop; the electrode sheet, the P-type thermoelectric material column and the N-type thermoelectric material column form a closed circuit loop to realize refrigeration; current is emitted from the electrode sheet to the P-type thermoelectric material column, in the process of flowing, the temperature gradually increases from the electrode sheet to the P-type thermoelectric material column, thereby reducing the temperature in the inner shell to realize refrigeration, and then flowing from the P-type thermoelectric material column to the N-type thermoelectric material column and finally flowing back to the electrode sheet from the N-type thermoelectric material column; in the process of flowing, the temperature gradually decreases from the N-type material column to the electrode sheet, thereby reducing the temperature in the inner shell to realize refrigeration.

[0013] Preferably, the heat preservation substrate is a polyurethane rigid foam or a glass-reinforced aerogel blanket, the polyurethane rigid foam has excellent thermal insulation performance, a thermal conductivity of 0.022-0.033 W, can realize uniform temperature transmission, and thus ensure uniform heat dissipation, realize uniform refrigeration inside the refrigerator, and improve refrigeration effect; meanwhile, the polyurethane rigid foam has good waterproof performance, can effectively isolate condensed water generated inside the refrigerator, and thus protect the thermoelectric material column in the heat preservation substrate.

[0014] The glass-reinforced aerogel blanket has extremely low thermal conductivity and low heat capacity, can effectively prevent heat conduction and transmission, and thus avoid temperature rise inside the refrigerator and ensure refrigeration temperature and efficiency.

[0015] Preferably, the mounting holes are arranged in a hexagonal honeycomb shape, the hexagonal honeycomb shape has extremely high strength rigidity and stability, can ensure uniformity of force received by the heat preservation substrate, and will not cause stress concentration; meanwhile, the mounting holes are arranged in a honeycomb shape, so that air can flow inside the mounting holes, and thus realize heat insulation and transmission, and achieve heat preservation and insulation effects.

[0016] Preferably, the mounting holes have a diameter of 5-10 mm, and the mounting hole spacing is 2-3 times the diameter; the diameter of 5-10 mm limits the volume of the thermoelectric material column, and thus reduces the use of thermoelectric materials while ensuring the refrigeration effect of the thermoelectric material column, saves cost, the mounting hole spacing ensures the refrigeration effect of the thermoelectric material column, so that the refrigeration area of the thermoelectric material column covers the entire heat preservation substrate, and thus ensures the overall refrigeration temperature of the semiconductor refrigerator.

[0017] Preferably, the mounting holes are provided with a metalized coating or a heat-conducting adhesive layer; the metalized coating and the heat-conducting adhesive layer can enhance heat conduction, thus reducing the thermal resistance inside the heat preservation substrate, improving temperature transmission efficiency, making the temperature uniformly distributed inside the heat preservation substrate, and thus making the refrigeration temperature uniformly distributed and improving the refrigeration effect of the refrigerator.

[0018] Preferably, the metalized coating is a chemical copper plating layer or a nano-silver adhesive coating; the metalized coating is provided with a polyimide insulating film.

[0019] The chemical copper plating can uniformly distribute copper in the mounting holes, and thus improve the heat conduction performance under the high heat dissipation performance of copper material, so that the temperature is quickly transmitted inside the heat preservation substrate, the uniformity of the temperature is improved, and the refrigeration effect is ensured.

[0020] The nano-silver adhesive coating has high thermal conductivity, can quickly transmit the temperature to the heat preservation substrate, and thus make the temperature of the heat preservation substrate uniformly distributed, thereby avoiding the problem of uneven refrigeration effect caused by uneven temperature distribution, and improving the refrigeration efficiency.

[0021] Polyimide insulating film is used to form an insulating film. When the polyimide insulating film is bonded to the surface of the thermoelectric material pillar, it isolates the current from the thermoelectric material pillar to form a stable flow circuit and ensure the stable operation of the semiconductor refrigerator.

[0022] Compared with the prior art, the beneficial effects of this utility model are: by reducing the thermal resistivity and improving the thermal conductivity, this utility model enables the temperature inside the semiconductor refrigerator to be evenly distributed, thereby avoiding the problem of uneven cooling distribution and reduced cooling efficiency caused by local high temperature, thus improving the cooling uniformity and cooling efficiency. Attached Figure Description

[0023] Figure 1 This is a half-sectional schematic diagram of the overall structure of this utility model;

[0024] Figure 2 This utility model Figure 1 A magnified view of point A;

[0025] Figure 3 This is an overall structural diagram of the insulation layer of this utility model;

[0026] Figure 4 This is an overall structural diagram of the thermal insulation substrate of this utility model;

[0027] Figure 5 For the present utility model Figure 4 A magnified view of point B;

[0028] Figure 6 This utility model is a Fluent simulation diagram.

[0029] In the picture:

[0030] 1. Semiconductor refrigerator casing; 11. Inner shell; 12. Outer shell; 13. Insulation cavity;

[0031] 2. Insulation layer; 21. Electrode sheet; 22. Insulation substrate; 221. Mounting hole; 2211. Metallized coating; 23. Thermoelectric material pillar; 231. P-type thermoelectric material pillar; 232. N-type thermoelectric material pillar;

[0032] 3. Condenser. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] likeFigures 1 to 6 As shown, a semiconductor refrigerator insulation device includes a semiconductor refrigerator shell 1, an insulation layer 2, and a condenser pipe 3;

[0035] The semiconductor refrigerator casing 1 is divided into an inner shell 11 and an outer shell 12. The inner shell 11 is used for food placement, with food placed on shelves provided on the inner shell 11 to achieve food preservation and refrigeration. The outer shell 12 is a protective casing used to protect internal electronic components. An insulation cavity 13 is formed between the inner shell 11 and the outer shell 12. An insulation layer 2 is installed inside the insulation cavity 13 and is fixedly installed on the outer wall of the inner shell 11. The insulation layer 2 is used to maintain the temperature within the space of the inner shell 11, thereby ensuring the preservation and refrigeration temperature of the semiconductor refrigerator, maintaining it at the temperature required by the user, and ensuring the preservation and refrigeration effect of food. To improve the uniformity of temperature distribution and ensure even distribution of preservation and refrigeration temperatures, the insulation layer 2 is equipped with condenser tubes 3, which are arranged in a serpentine pattern within the insulation cavity 13. The condenser tubes 3 are used for heat exchange in the semiconductor refrigerator. The condenser tubes 3 exchange heat with the temperature inside the insulation cavity 13 through the refrigerant flowing inside the tubes, preventing the temperature inside the insulation cavity 13 from rising and affecting the operation of internal electronic components. At the same time, it also affects the cooling effect of the semiconductor refrigerator, causing the cooling temperature to fail to reach the set temperature. The condenser tubes 3 are arranged on five end faces on the outer wall of the inner shell 11 to achieve heat exchange and cooling, ensuring the uniformity of temperature inside the insulation cavity 13 and limiting the temperature in the insulation cavity 13 by degrees Celsius.

[0036] The electrode plate 21 is fixedly installed on the outer wall of the inner shell 11. The electrode plate 21 is connected to an external power source, thereby filling its interior with current. A heat-insulating substrate 22 is fixedly installed on the electrode plate 21. The heat-insulating substrate 22 is used to maintain temperature stability, thereby preventing internal temperature leakage and insufficient cooling temperature. The heat-insulating substrate 22 is made of rigid polyurethane foam or glass fiber reinforced aerogel felt. Rigid polyurethane foam has excellent thermal insulation properties, with a thermal conductivity of 0.022~0.033W, which can achieve uniform temperature transfer, thereby ensuring uniform heat dissipation, achieving uniform cooling inside the refrigerator, and improving cooling efficiency. In addition, it has good waterproof performance, which can effectively isolate the condensation generated inside the refrigerator, thereby protecting the thermoelectric material pillars 23 inside the insulation substrate 22; the fiber-reinforced aerogel felt has extremely low thermal conductivity and low heat capacity, which can effectively prevent the conduction and transfer of heat, thereby avoiding the temperature rise inside the refrigerator and ensuring the cooling temperature and efficiency; at the same time, the material of the insulation substrate 22 is selected according to the type of semiconductor refrigerator. When the semiconductor refrigerator is a flat refrigerator, rigid polyurethane foam is often used as the insulation substrate 22, and when the semiconductor refrigerator is a crank refrigerator, fiber-reinforced aerogel felt is often used as the insulation substrate 22.

[0037] The insulation substrate 22 has arrayed mounting holes 221, and thermoelectric material pillars 23 are fixedly installed in the mounting holes 221. The thermoelectric material pillars 23 are used to achieve the cooling effect of the refrigerator. The thermoelectric material pillars 23 achieve the cooling effect through the Peltier effect. The Peltier effect refers to the phenomenon that when two different conductor materials are connected to form a closed circuit and a direct current flows through them, one joint will release heat and the other joint will absorb heat. Changing the direction of the current will change the direction of heat release and absorption. The thermoelectric material pillars 23 are divided into P-type thermoelectric material pillars 231 and N-type thermoelectric material pillars 232. When the P-type thermoelectric material pillar 231 is energized, the temperature gradually increases along the current flow direction of the P-type thermoelectric material pillar 231; when the N-type thermoelectric material pillar 232 is energized, the temperature gradually decreases along the current flow direction of the N-type thermoelectric material pillar 232. The P-type thermoelectric material pillars 231 and N-type thermoelectric material pillars 232... Thermoelectric material columns 232 are alternately installed in the mounting holes 221 and are all fixedly connected to the electrode plate 21. The P-type thermoelectric material column 231, N-type thermoelectric material column 232 and electrode plate 21 form a closed circuit. The electrode plate 21, P-type thermoelectric material column 231 and N-type thermoelectric material column 232 form a closed circuit to achieve cooling. Current flows from electrode plate 21 to P-type thermoelectric material column 231. During the flow, the temperature gradually increases from electrode plate 21 to P-type thermoelectric material column 231, thereby reducing the internal temperature of inner shell 11 and achieving cooling. The current then flows from P-type thermoelectric material column 231 to N-type thermoelectric material column 232, and finally flows back from N-type thermoelectric material column 232 to electrode plate 21. During the flow, the temperature gradually decreases from N-type thermoelectric material column 232 to electrode plate 21, reducing the internal temperature of inner shell 11 and achieving cooling.

[0038] The mounting holes 221 are arranged in a hexagonal honeycomb pattern. This hexagonal honeycomb pattern provides extremely high strength, rigidity, and stability, ensuring uniform stress distribution on the insulation substrate 22 and preventing stress concentration. Simultaneously, the honeycomb arrangement allows air to flow within, effectively isolating heat transfer and achieving insulation and heat preservation effects. The diameter of the mounting holes 221 is 5-10 mm, and the spacing between them is 2-3 times the hole diameter. The 5-10 mm hole diameter limits the volume of the thermoelectric material pillars 23, thus reducing the amount of thermoelectric material used while maintaining the cooling effect of the pillars, saving costs. The spacing of the mounting holes 221 ensures the cooling effect of the thermoelectric material pillars 23, allowing the cooling area of ​​the pillars 23 to cover the entire insulation substrate 22, thereby ensuring the overall cooling temperature of the semiconductor refrigerator. A metallized coating 2211 or a thermally conductive adhesive layer is provided within the mounting holes 221. These coatings enhance heat conduction, thereby reducing the heat transfer of the insulation substrate. The internal thermal resistance of plate 22 improves temperature transfer efficiency, resulting in a uniform temperature distribution within the insulation substrate 22, thus ensuring a uniform cooling temperature distribution and improving the refrigerator's cooling effect. The metallized coating 2211 is a chemically plated copper layer or a nano-silver paste coating. A polyimide insulating film is provided on the metallized coating 2211. Chemically plated copper can evenly distribute copper within the mounting holes 221, thereby improving thermal conductivity due to the high heat dissipation performance of copper, resulting in a uniform temperature distribution within the insulation substrate 22, improving temperature uniformity, and ensuring a good cooling effect. The nano-silver paste coating has high thermal conductivity, allowing temperature to be quickly transferred to the insulation substrate 22, resulting in a uniform temperature distribution within the insulation substrate 22, thus avoiding uneven temperature distribution that leads to uneven cooling effect and improving cooling efficiency. The polyimide insulating film is used to form an insulating film. The polyimide insulating film is attached to the surface of the thermoelectric material pillar 23 to isolate the current from the thermoelectric material pillar 23, forming a stable flow circuit and ensuring the stable operation of the semiconductor refrigerator.

[0039] This utility model Figure 6 The image is a Fluent simulation diagram showing the temperature distribution on the inner surface of the inner shell 11 of the semiconductor refrigerator with the insulation layer 2. The darker areas are the areas with lower temperatures. As can be seen from the image, the temperature distribution on the inner surface of the inner shell 11 of the semiconductor refrigerator is uniform and reaches the required cooling temperature, ensuring the cooling effect of the semiconductor refrigerator and achieving uniform cooling.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigerator insulation device, characterized in that: It includes a semiconductor refrigerator shell (1), an insulation layer (2), and a condenser pipe (3); The semiconductor refrigerator housing (1) is divided into an inner shell (11) and an outer shell (12). The inner shell (11) is used for food placement, and the outer shell (12) is a protective shell. The inner shell (11) and the outer shell (12) form a heat preservation cavity (13). A heat preservation layer (2) is installed in the heat preservation cavity (13). The heat preservation layer (2) is fixedly installed on the outer wall of the inner shell (11). A condenser tube (3) is provided on the heat preservation layer (2). The condenser tube (3) is arranged in a serpentine pattern in the heat preservation cavity (13). The condenser tube (3) is used for heat exchange in the semiconductor refrigerator.

2. The heat preservation device according to claim 1, characterized in that: The insulation layer (2) includes an electrode sheet (21), an insulation substrate (22), and a thermoelectric material pillar (23). The electrode sheet (21) is fixedly installed on the outer wall of the inner shell (11), and a heat insulation substrate (22) is fixedly installed on the electrode sheet (21). The heat insulation substrate (22) has an array of mounting holes (221), and a thermoelectric material column (23) is fixedly installed in the mounting holes (221). The thermoelectric material column (23) is divided into a P-type thermoelectric material column (231) and an N-type thermoelectric material column (232). The P-type thermoelectric material column (231) and the N-type thermoelectric material column (232) are alternately installed in the mounting hole (221) and are fixedly connected to the electrode plate (21). The P-type thermoelectric material column (231), the N-type thermoelectric material column (232) and the electrode plate (21) form a closed loop.

3. The heat preservation device according to claim 2, characterized in that: The thermal insulation substrate (22) is a rigid polyurethane foam or a glass fiber reinforced aerogel felt.

4. The heat preservation device according to claim 2, characterized in that: The mounting holes (221) are arranged in a hexagonal honeycomb pattern.

5. The heat preservation device according to claim 4, characterized in that: The diameter of the mounting hole (221) is 5-10mm, and the spacing between the mounting holes (221) is 2-3 times the diameter of the hole.

6. The heat preservation device according to claim 5, characterized in that: The mounting hole (221) is provided with a metallized coating (2211) or a thermally conductive adhesive layer.

7. The heat preservation device according to claim 6, characterized in that: The metallization coating (2211) is a chemically plated copper or nano-silver paste coating; a polyimide insulating film is provided on the metallization coating (2211).

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