Substrate and optical sensor

Abstract

The utility model relates to the technical field of optical sensors, in particular to a substrate and an optical sensor, the substrate is used for being connected to a notch end of a packaging shell, the packaging shell is provided with a first containing groove used for containing a light projector and a second containing groove used for containing a light receptor, and the substrate and the groove wall of the first containing groove define a first containing cavity. A second accommodating cavity is defined by the base plate and the groove wall of the second accommodating groove; a first ventilation groove and a second ventilation groove are formed in the end, facing the packaging shell, of the substrate, the first ventilation groove is communicated with the outside and the first containing cavity, and the second ventilation groove is communicated with the outside and the second containing cavity. Therefore, the lens in the light hole can be prevented from being polluted.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical sensor technical field, in particular to an optical sensor. BACKGROUND

[0002] Optical sensors such as ambient light sensors, spectral light sensors, proximity sensors, time-of-flight sensors are widely used in consumer electronics, industrial automation, automotive electronics and medical electronics fields, and the optical sensor mainly comprises light-throwing chips and light-receiving chips and other working components mounted on a substrate, and a packaging shell connected to the substrate for packaging the above working components. The packaging shell has two accommodating grooves, and when the packaging shell is connected to the substrate, the substrate closes the openings of the two accommodating grooves, so that two accommodating cavities are enclosed between the substrate and the packaging shell, the light-throwing chips and the light-receiving chips are respectively located in one of the two accommodating cavities, and the cavity wall at the end opposite to the substrate of the two accommodating cavities is provided with a light-transmitting hole, and a lens is mounted in the light-transmitting hole. If the two mounting cavities are completely sealed, the temperature rise of the light-throwing chips and the light-receiving chips during the working process will cause the gas in the accommodating cavities to expand, causing the packaging structure to crack. Therefore, the packaging structure needs to be provided with an exhaust structure to communicate the two accommodating cavities with the outside.

[0003] The existing packaging structure sets the exhaust groove on the hole wall of the light-transmitting hole, which easily causes the lens mounted in the light-transmitting hole to be contaminated, and the lens cannot be protected clean for a long time. SUMMARY

[0004] The technical problem to be solved by the utility model is that the existing packaging structure sets the exhaust groove on the hole wall of the light-transmitting hole, which easily causes the lens mounted in the light-transmitting hole to be contaminated, and the lens cannot be protected clean for a long time.

[0005] In order to solve the above technical problem, the utility model aims at providing a substrate for connecting to the slot end of a packaging shell, the packaging shell has a first accommodating groove for accommodating a light-throwing device and a second accommodating groove for accommodating a light-receiving device, the substrate and the groove wall of the first accommodating groove enclose a first accommodating cavity, the substrate and the groove wall of the second accommodating groove enclose a second accommodating cavity, one end of the substrate towards the packaging shell has a first air-permeable groove and a second air-permeable groove, the first air-permeable groove communicates the outside with the first accommodating cavity, and the second air-permeable groove communicates the outside with the second accommodating cavity.

[0006] As a preferred scheme, the substrate comprises a first insulating ink layer, a first circuit layer, an insulating base layer, a second circuit layer and a second insulating ink layer arranged in turn from the direction away from the packaging shell to the direction close to the packaging shell along the thickness direction of the substrate, and the first air-permeable groove and the second air-permeable groove penetrate through the second insulating ink layer and the second circuit layer.

[0007] As a preferred solution, the first air-permeable groove and the second air-permeable groove each have a groove depth greater than or equal to 45 microns and less than or equal to 60 microns.

[0008] As a preferred solution, the first air-permeable groove and the second air-permeable groove each have a groove width greater than or equal to 100 microns and less than or equal to 200 microns.

[0009] As a preferred solution, the substrate has a first direction, a second direction, and a third direction arranged perpendicularly two by two, the first accommodating cavity and the second accommodating cavity are arranged spaced apart along the first direction, the substrate and the package shell are arranged sequentially in the third direction, the substrate has a first end and a second end in the first direction, and has a third end and a fourth end in the third direction, the third end is opposite to the package shell, the first air-permeable groove and the second air-permeable groove are arranged at the third end, the first air-permeable groove has a first air-permeable end and a second air-permeable end in the first direction, the first air-permeable end is through the first end, and the second air-permeable end is communicated with the first accommodating cavity, the second air-permeable groove has a third air-permeable end and a fourth air-permeable end in the first direction, the third air-permeable end is through the second end, and the fourth air-permeable end is through the second accommodating cavity.

[0010] As a preferred solution, in the first direction, the first accommodating cavity has a first side wall arranged opposite to the first air-permeable groove, and the first air-permeable groove has a first groove wall; in the first direction, the first groove wall is arranged spaced apart parallel to the first side wall, and the distance between the first groove wall and the first side wall is greater than or equal to 0.15 millimeters and less than or equal to 0.20 millimeters.

[0011] As a preferred solution, in the first direction, the second accommodating cavity has a second side wall arranged opposite to the second air-permeable groove, and the second air-permeable groove has a second groove wall; in the first direction, the second groove wall is arranged spaced apart parallel to the second side wall, and the distance between the second groove wall and the second side wall is greater than or equal to 0.15 millimeters and less than or equal to 0.20 millimeters.

[0012] An optical sensor comprising the substrate described above, the substrate is connected to the slot end of the package shell.

[0013] Compared with the prior art, the optical sensor has the beneficial effects that:

[0014] The utility model discloses a substrate for connecting in the slot end of the package shell, and the package shell has a first accommodating groove for accommodating the light projector and a second accommodating groove for accommodating the light receiver, the substrate and the groove wall of the first accommodating groove form a first accommodating cavity, and the substrate and the groove wall of the second accommodating groove form a second accommodating cavity; one end of the substrate towards the package shell has a first air permeable groove and a second air permeable groove, the first air permeable groove is communicated with the outside and the first accommodating cavity, and the second air permeable groove is communicated with the outside and the second accommodating cavity, since the first air permeable groove and the second air permeable groove are arranged on the substrate and are far away from the light transmission hole of the package shell, the lens in the light transmission hole can be prevented from being polluted. BRIEF DESCRIPTION OF DRAWINGS

[0015] Fig. 1 It is the structure schematic diagram of optical sensor of the utility model;

[0016] Fig. 2 It is the sectional view of optical sensor of the utility model;

[0017] Fig. 3 It is the sectional view of substrate of the utility model;

[0018] In the drawing, X, first direction, Y, second direction, Z, third direction, 100, package shell, 101, first accommodating cavity, 1011, first side wall, 102, second accommodating cavity, 103, light transmission hole, 1, substrate, 11, first air permeable groove, 111, first air permeable end, 112, second air permeable end, 113, first groove wall, 12, second air permeable groove, 13, first insulating ink layer, 14, first circuit layer, 15, insulating base layer, 16, second circuit layer, 17, second insulating ink layer, 181, first end, 182, second end, 183, third end, 184, fourth end. DETAILED DESCRIPTION

[0019] The specific embodiment of the utility model is described in further detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but are not used to limit the scope of the utility model.

[0020] In the description of the utility model, need understanding is, the orientation or position relation indicated by the terms "upper", "lower", "left", "right", "top", "bottom" and the like is based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and is not indicative or suggestive of the device or element indicated must have a particular orientation, with a particular orientation structure and operation, therefore can not be understood as the restriction of the utility model. It should be understood that the utility model adopts the terms "first", "second" and the like to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the utility model, "first" information can also be called "second" information, and similarly, "second" information can also be called "first" information.

[0021] As Figs. 1 to 3 The utility model discloses a substrate for connecting in the slot end of the package shell 100, the package shell 100 has the first accommodating groove for accommodating the light projector and the second accommodating groove for accommodating the light receiver, and the substrate 1 and the slot wall of the first accommodating groove form the first accommodating cavity 101, and the substrate 1 and the slot wall of the second accommodating groove form the second accommodating cavity 102. The end of the substrate 1 towards the package shell 100 has the first air -permeable groove 11 and the second air -permeable groove 12, and the first air -permeable groove 11 is communicated with the first accommodating cavity 101 and the outside, and the second air -permeable groove 12 is communicated with the second accommodating cavity 102 and the outside. Since the first air -permeable groove 11 and the second air -permeable groove 12 are arranged on the substrate 1, and are far away from the light transmission hole 103 of the package shell 100, the lens in the light transmission hole 103 can be prevented from being contaminated.

[0022] The substrate 1 comprises, in sequence from the direction away from the package shell 100 to the direction close to the package shell 100 along the thickness direction of the substrate 1, a first insulating ink layer 13, a first circuit layer 14, an insulating base layer 15, a second circuit layer 16 and a second insulating ink layer 17, and the first air-permeable groove 11 and the second air-permeable groove 12 penetrate the second insulating ink layer 17 and the second circuit layer 16. Specifically, the first insulating ink layer 13 and the first circuit layer 14 form a bottom circuit structure, the second circuit layer 16 and the second insulating ink layer 17 form a top circuit structure, the first air-permeable groove 11 and the second air-permeable groove 12 are arranged in the top circuit structure, when the second circuit layer 16 is formed, a dry film is first attached to the upper end of the insulating base layer 15, then the second circuit layer 16 is formed on the dry film through exposure and development, and the bottom of the first air-permeable groove 11 and the second air-permeable groove 12 is simultaneously formed, and the second insulating ink layer 17 can be formed by printing or exposure and development, when the second insulating ink layer 17 is formed, the top of the first air-permeable groove 11 and the top of the second air-permeable groove 12 are formed on the second insulating ink layer 17, and the first air-permeable groove 11 and the second air-permeable groove 12 are arranged in the second circuit layer 16 and the second insulating ink layer 17, so that the first air-permeable groove 11 and the second air-permeable groove 12 can be simultaneously formed when the second circuit layer 16 is formed, without the need for additional processing procedures, and the packaging efficiency of the optical sensor is greatly improved.

[0023] Specifically, the groove depth of the first air-permeable groove 11 and the second air-permeable groove 12 is greater than or equal to 45 microns and less than or equal to 60 microns, and the thickness of the second circuit layer 16 and the second insulating ink layer 17 is 20 microns to 30 microns, and the depth of the first air-permeable groove 11 and the second air-permeable groove 12 in the embodiment is the same as the thickness of the second circuit layer 16 and the second insulating ink layer 17, which not only ensures the air permeability, but also ensures the packaging efficiency of the optical sensor. In other embodiments of the utility model, the thickness of the second insulating ink layer 17 can be thickened, and the first air-permeable groove 11 and the second air-permeable groove 12 can be arranged in the insulating ink layer.

[0024] In order to ensure the air permeability of the first air-permeable groove 11 and the second air-permeable groove 12, the groove width of the first air-permeable groove 11 and the second air-permeable groove 12 is greater than or equal to 100 microns in the embodiment, and in order to avoid the first air-permeable groove 11 and the second air-permeable groove 12 being arranged too large to affect the effective utilization rate of the substrate 1, the groove width of the first air-permeable groove 11 and the second air-permeable groove 12 is less than or equal to 200 microns in the embodiment.

[0025] In the embodiment, the substrate 1 has a first direction X, a second direction Y and a third direction Z arranged perpendicularly two by two, the first accommodating cavity 101 and the second accommodating cavity 102 are arranged in the first direction X, the substrate 1 and the package shell 100 are arranged in the third direction Z in sequence, the substrate 1 has a first end 181 and a second end 182 in the first direction X, and has a third end 183 and a fourth end 184 in the third direction Z, the third end 183 is opposite to the package shell 100, and the fourth end 184 is away from the package shell 100, the first gas permeable groove 11 and the second gas permeable groove 12 are arranged at the third end 183. The first gas permeable groove 11 has a first gas permeable end 111 and a second gas permeable end 112 in the first direction X, the first gas permeable end 111 penetrates through the first end 181, and the second gas permeable end 112 communicates with the first accommodating cavity 101, and the second gas permeable groove 12 has a third gas permeable end and a fourth gas permeable end in the first direction X, the third gas permeable end penetrates through the second end 182, and the fourth gas permeable end penetrates through the second accommodating cavity 102.

[0026] Specifically, in the first direction X, the first accommodating cavity 101 has a first side wall 1011 arranged opposite to the first gas permeable groove 11, and the first gas permeable groove 11 has a first groove wall 113; in the first direction X, the first groove wall 113 is arranged in parallel and spaced apart from the first side wall 1011, and the distance between the first groove wall 113 and the first side wall 1011 is greater than or equal to 0.15 millimeters and less than or equal to 0.20 millimeters, so as to ensure that the distance between the first side wall 1011 and the first groove wall 113 is sufficient to meet the gas permeability requirement of the first gas permeable groove 11. In the first direction X, the second accommodating cavity 102 has a second side wall arranged opposite to the second gas permeable groove 12, and the second gas permeable groove 12 has a second groove wall; in the first direction X, the second groove wall is arranged in parallel and spaced apart from the second side wall, and the distance between the second groove wall and the second side wall is greater than or equal to 0.15 millimeters and less than or equal to 0.20 millimeters, so as to ensure that the distance between the second side wall and the second groove wall is sufficient to meet the gas permeability requirement of the second gas permeable groove 12.

[0027] An embodiment of an optical sensor includes a package shell 100 and the above-mentioned substrate 1, and the substrate 1 is connected to the slot end of the package shell 100.

[0028] In conclusion, the substrate 1 is used for being connected at the slot end of the packaging shell 100, the packaging shell 100 has a first accommodating groove for accommodating a light projector and a second accommodating groove for accommodating a light receiver, the substrate 1 and the groove wall of the first accommodating groove form a first accommodating cavity 101, the substrate 1 and the groove wall of the second accommodating groove form a second accommodating cavity 102; the substrate 1 has a first air permeable groove 11 and a second air permeable groove 12 at one end of the substrate 1, the first air permeable groove 11 is communicated with the first accommodating cavity 101 and the outside, the second air permeable groove 12 is communicated with the second accommodating cavity 102 and the outside, since the first air permeable groove 11 and the second air permeable groove 12 are arranged on the substrate 1 and are far away from the light transmission hole 103 of the packaging shell 100, therefore, the lens in the light transmission hole 103 can be prevented from being polluted; furthermore, the first air permeable groove 11 and the second air permeable groove 12 are arranged in the top circuit structure of the substrate 1, the first air permeable groove 11 and the second air permeable groove 12 can be formed at the same time when the second circuit layer 16 and the second insulating ink layer 17 are formed, and the first air permeable groove 11 and the second air permeable groove 12 do not need to be additionally machined, and the packaging efficiency of the optical sensor is greatly improved.

[0029] The above only describes the preferred embodiments of the present application, and it should be pointed out that, for the ordinary skilled in the art, without departing from the technical principles of the present application, a number of improvements and replacements can be made, and these improvements and replacements should be considered as the protection scope of the present application.

Claims

1. A substrate, characterized in that, For connection to the slot end of the encapsulation shell (100), the encapsulation shell (100) has a first receiving slot for accommodating a light projector and a second receiving slot for accommodating a light receiver. The substrate and the slot wall of the first receiving slot form a first receiving cavity (101), and the substrate and the slot wall of the second receiving slot form a second receiving cavity (102). The end of the substrate facing the encapsulation shell (100) has a first venting groove (11) and a second venting groove (12). The first venting groove (11) communicates with the outside and the first receiving cavity (101), and the second venting groove (12) communicates with the outside and the second receiving cavity (102).

2. The substrate according to claim 1, characterized in that, The substrate includes a first insulating ink layer (13), a first circuit layer (14), an insulating base layer (15), a second circuit layer (16), and a second insulating ink layer (17) arranged sequentially along the thickness direction of the substrate from the direction away from the package shell (100) to the direction close to the package shell (100). The first venting groove (11) and the second venting groove (12) penetrate the second insulating ink layer (17) and the second circuit layer (16).

3. The substrate according to claim 1, characterized in that, The groove depths of the first ventilating groove (11) and the second ventilating groove (12) are both greater than or equal to 45 micrometers and less than or equal to 60 micrometers.

4. The substrate according to claim 1, characterized in that, The width of the first ventilating groove (11) and the second ventilating groove (12) is greater than or equal to 100 micrometers and less than or equal to 200 micrometers.

5. The substrate according to claim 1, characterized in that, The substrate has a first direction (X), a second direction (Y), and a third direction (Z) arranged perpendicularly in pairs. The first receiving cavity (101) and the second receiving cavity (102) are arranged at intervals along the first direction (X). The substrate and the encapsulation shell (100) are arranged sequentially along the third direction (Z). The substrate has a first end (181) and a second end (182) in the first direction (X), and a third end (183) and a fourth end (184) in the third direction (Z). The third end (183) is opposite to the encapsulation shell (100). The first venting groove (11) Both the first ventilated groove (11) and the second ventilated groove (12) are arranged at the third end (183). The first ventilated groove (11) has a first ventilated end (111) and a second ventilated end (112) in the first direction (X). The first ventilated end (111) communicates with the first end (181), and the second ventilated end (112) communicates with the first receiving cavity (101). The second ventilated groove (12) has a third ventilated end and a fourth ventilated end in the first direction (X). The third ventilated end communicates with the second end (182), and the fourth ventilated end communicates with the second receiving cavity (102).

6. The substrate according to claim 5, characterized in that, In the first direction (X), the first receiving cavity (101) has a first sidewall (1011) arranged opposite to the first venting groove (11), and the first venting groove (11) has a first groove wall (113); in the first direction (X), the first groove wall (113) and the first sidewall (1011) are arranged parallel to each other and spaced apart, and the distance between the first groove wall (113) and the first sidewall (1011) is greater than or equal to 0.15 mm and less than or equal to 0.20 mm.

7. The substrate according to claim 5, characterized in that, In the first direction (X), the second receiving cavity (102) has a second sidewall arranged opposite to the second venting groove (12), and the second venting groove (12) has a second groove wall; in the first direction (X), the second groove wall and the second sidewall are arranged parallel to each other and spaced apart, and the distance between the second groove wall and the second sidewall is greater than or equal to 0.15 mm and less than or equal to 0.20 mm.

8. An optical sensor, characterized in that, It includes a package housing (100) and a substrate as described in any one of claims 1 to 7, the substrate being connected to the slot end of the package housing (100).

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