Air-cooled memory bank

Abstract

The utility model provides an air-cooled memory bank. The air-cooled memory bank comprises a memory function assembly, a heat dissipation assembly and a light guide device, the heat dissipation assembly comprises a first heat dissipation plate and a heat dissipation air blower, the first heat dissipation plate is attached to at least part of the memory function assembly, and the first heat dissipation plate is in clearance fit with at least part of the memory function assembly to form a first air channel. A ventilation opening is formed in the light guide device and is opposite to the air outlet of the first air duct. According to the air-cooled memory bank, through the integrated design of the heat dissipation assembly and the light guide device, the heat dissipation efficiency is improved, the visual effect of the memory bank is enhanced, and a practical and attractive computer hardware solution is provided for a user. According to the design, the structure is limited, so that the performance and the attractiveness are ensured, and meanwhile, the expansibility is provided in function so as to adapt to different use requirements.

Description

TECHNICAL FIELD

[0001] The utility model relates to computer hardware technical field, specifically, relate to a air -cooled memory bank. BACKGROUND

[0002] As an indispensable key component in computer systems, memory banks are responsible for storing and transferring data, and their performance directly affects overall computing efficiency. With the rapid development of internet technology and computer hardware, high-performance memory banks are widely used in various high-end computing devices such as game consoles, workstations, and servers. To meet the increasing demand for operating frequency and data throughput, the power consumption and heat generation of modern memory banks continue to increase. However, the heat dissipation problem has become an important bottleneck limiting the performance improvement of memory banks.

[0003] In the prior art, the heat dissipation of memory banks usually relies on the following methods:

[0004] Optimization of overall case heat dissipation, memory bank self-contained heat dissipation components, and active heat dissipation. However, the memory bank self-contained heat dissipation is through the installation of metal heat dissipation fins, but the metal heat dissipation fins are limited by size and weight, and their thickness is relatively thin, with limited heat dissipation capacity. During high-load operation, heat may still accumulate, affecting the stability of the memory bank. While the active heat dissipation design integrates small fans or water cooling components on the memory bank, in this type of solution, the heat dissipation utilization rate of the fan is low, making it difficult to ensure its heat dissipation effect.

[0005] Therefore, there is an urgent need for a memory bank heat dissipation design with high-efficiency heat dissipation performance, stable structure, and convenient assembly to meet the actual needs of modern computing devices for high-performance memory banks. SUMMARY

[0006] The utility model aims at least to solve one of the technical problems existing in the prior art.

[0007] Therefore, the utility model provides a air -cooled memory bank, including memory function component, heat dissipation component and light guide device, heat dissipation component includes first heat dissipation plate and heat dissipation blower, first heat dissipation plate is at least partial adiabatic with the setting of memory function component, and first heat dissipation plate is at least partial gap fit with the setting of memory function component and forms first air duct, and the air outlet of heat dissipation blower is towards the air inlet of first air duct setting;Light guide device and first heat dissipation plate are arranged on memory function component along the longitudinal direction, and a ventilation opening is arranged on the light guide device, and the ventilation opening is arranged opposite to the air outlet of first air duct.

[0008] According to the air -cooled memory bank of the utility model above technical scheme, it can also have the following additional technical features:

[0009] The heat dissipation assembly further comprises a second heat dissipation plate, the second heat dissipation plate is arranged opposite to the air outlet of the first air duct, and at least part of the second heat dissipation plate is arranged in close contact with the memory functional assembly.

[0010] In the above technical solution, the light guide device is designed as a whole, and the ventilation opening is arranged in the light guide device.

[0011] The light guide device is designed as a whole, and the ventilation opening is arranged in the light guide device.

[0012] In the above technical solution, the light guide device is designed as a whole, and the ventilation opening is arranged in the light guide device.

[0013] In the above technical solution, the light guide device is designed as a whole, and the ventilation opening is arranged in the light guide device.

[0014] In the above technical solution, the light guide device is designed as a whole, and the ventilation opening is arranged in the light guide device.

[0015] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0016] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0017] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0018] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0019] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0020] In the above technical solution, the light guide device has a regular shape or an irregular shape, the regular shape includes one of a rectangular shape, a square shape and a circular shape, and the irregular shape includes a streamline shape and a combined shape of regular shapes.

[0021] In the technical scheme, the second heat dissipation plate has a heat dissipation part, at least part of the heat dissipation part is bent or folded and forms a heat dissipation space for gas to pass through, and the heat dissipation space is arranged opposite to the air outlet of the first air duct.

[0022] In the technical scheme, the second heat dissipation plate further has a wind guide part, the wind guide part is transitionally connected with the heat dissipation part, and at least part of the wind guide part is connected with the memory functional component.

[0023] In the technical scheme, the memory functional component comprises a memory stick body, memory particles and a heating element, the memory particles and the heating element are arranged on the memory stick body along a specified direction.

[0024] In the technical scheme, the heating element is arranged in the first air duct.

[0025] In the technical scheme, the heat dissipation blower is electrically connected with the memory functional component.

[0026] In the technical scheme, the heat dissipation blower is electrically connected with the first power supply device.

[0027] In summary, due to the adoption of the above technical features, the air-cooled memory stick has the advantages that: the air-cooled memory stick is designed by integrating the heat dissipation component and the light guide device, the heat dissipation efficiency is improved, the visual effect of the memory stick is enhanced, and a practical and beautiful computer hardware solution is provided for users. The design is limited in structure to ensure performance and beauty, and provides expandability in function to adapt to different use requirements.

[0028] The additional aspects and advantages of the present application will become apparent from the following description, or will be appreciated by practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0029] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, taken in conjunction with the accompanying drawings, in which:

[0030] Figure 1 is a front view of the air-cooled memory stick of one embodiment of the present application;

[0031] Figure 2 is a sectional view of the air-cooled memory stick of one embodiment of the present application;

[0032] Figure 3 is a split schematic view of the air-cooled memory stick of one embodiment of the present application.

[0033] Among them, Figures 1 to 3 The correspondence between the reference signs and the component names in the drawings is as follows:

[0034] 1, heat dissipation blower; 2, second heat dissipation plate; 3, memory stick body; 4, memory particles; 5, heating element; 6, first heat dissipation plate; 7, light guide device; 8, air vent. DETAILED DESCRIPTION

[0035] In order to more clearly understand the above objectives, features and advantages of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0036] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, however, the present application can also be implemented in other different ways from those described herein, therefore, the scope of protection of the present application is not limited by the specific embodiments disclosed below.

[0037] The air-cooled memory stick according to some embodiments of the present application will be described below with reference to Figures 1 to 3

[0038] The present application relates to an air-cooled memory stick, which integrates a memory function component, a heat dissipation component and a light guide device 7, and aims to improve the performance and aesthetics of computer hardware. The following is a specific embodiment of the air-cooled memory stick, which describes its structure and working principle in detail.

[0039] Specifically, please refer to Figure 1 , the heat dissipation component includes a first heat dissipation plate 6 and a heat dissipation blower 1, the first heat dissipation plate 6 is arranged in close contact with the memory function component, and at least part of the first heat dissipation plate 6 is arranged in gap fit with the memory function component to form a first air duct, the air outlet of the heat dissipation blower 1 is arranged towards the air inlet of the first air duct, the light guide device 7 and the first heat dissipation plate 6 are arranged in longitudinal arrangement on the memory function component, and an air vent 8 is arranged on the light guide device 7, the air vent 8 is arranged opposite to the air outlet of the first air duct.

[0040] The heat dissipation component further includes a second heat dissipation plate 2, the second heat dissipation plate 2 is arranged opposite to the air outlet of the first air duct, and at least part of the second heat dissipation plate 2 is arranged in close contact with the memory function component. The second heat dissipation plate 2 is generally in the form of a metal ribbon, which is used to increase the overall heat dissipation area of the memory stick. In the present disclosure, the second heat dissipation plate 2 is located in the air outlet direction of the first air duct, further improving the heat dissipation efficiency of the first air duct.

[0041] ​As can be easily understood, the heat dissipation assembly of the air-cooled memory strip is composed of a first heat dissipation plate 6, a heat dissipation fan 1 and a second heat dissipation plate 2. The memory functional assembly includes a memory strip body 3, memory particles 4 and a heating element 5, and such a layout helps to centrally manage and quickly dissipate heat. Figure 2 As shown, the memory particles 4 and the heating element 5 are arranged in a specified direction on the memory strip body 3, and such a layout helps to centrally manage and quickly dissipate heat. Specifically, the memory particles 4 are IC particles, the first heat dissipation plate 6 is connected to the IC particles through a heat-conducting glue, the heat-conducting glue is a commonly used material for the memory strip and has good heat-conducting performance, and at the same time, the heat-conducting glue has a certain thickness, and the thickness of the heat-conducting glue can further increase the gap between the first heat dissipation plate 6 and the memory strip body 3, which is beneficial to the formation of the first air duct; generally, the heat-conducting glue is in a long strip shape, can completely cover all the memory particles 4, and further can constrain the wind direction in the first air duct, so that the air outlet of the heat dissipation fan is directed to the air vent 8.

[0042] In the embodiment, the first heat dissipation plate 6 is arranged in close contact with the memory functional assembly, and at least part of the first heat dissipation plate 6 and the memory functional assembly are arranged in a gap fit and form a first air duct, and such a design allows air to flow and take away heat. The first heat dissipation plate 6 is in close contact with the memory functional assembly and covers the memory particles 4 above to achieve the best heat conduction effect. The heat generated by the memory particles 4 during high-speed operation is effectively conducted and dissipated through the first heat dissipation plate 6. The heat dissipation fan 1 is located on one side of the first heat dissipation plate 6, and its air outlet is directly aligned with the air inlet of the first air duct to generate air flow and accelerate heat dissipation. The second heat dissipation plate 2 is arranged opposite to the air outlet of the first air duct and forms a closed air duct with the first heat dissipation plate 6 to guide hot air to be quickly discharged and improve the heat dissipation efficiency.

[0043] More specifically, the first heat dissipation plate 6 and the second heat dissipation plate 2 can both be made of metal materials, and metal materials with better heat dissipation effect can be flexibly selected according to actual use requirements.

[0044] The light guide device 7 is arranged in a longitudinal direction on the memory functional assembly, is provided with an air vent 8, and the air vent 8 corresponds to the air outlet of the first air duct, and the air vent 8 can allow air flow to pass through while not affecting the lighting effect.

[0045] More specifically, the light guide device 7 can be a whole piece design, and the ventilation opening 8 is formed in the light guide device 7. Of course, the light guide device 7 can also be a split design, and the light guide device 7 includes at least two light emitting parts that are spliced to form a complete light guide device 7, and the light emitting position can be multi-directional light emission. The two light emitting parts are respectively provided with a notch, and the two notches are spliced to form the ventilation opening 8. Such a design provides flexibility in assembly and use, and different configurations of the light guide device 7 can be selected according to the design production needs.

[0046] Further, the shapes of the light guide device 7, the first heat sink 6, and the second heat sink 2 can be regular, such as one of a rectangular shape, a square shape, and a circular shape, or irregular, such as a streamline shape or a combination of regular shapes. For reference, the first heat sink 6 shown in Figure 1 Figure 1 has a streamlined plate body, which has a smoother appearance and increased aesthetic appeal. The light guide device 7 and the first heat sink 6 are arranged longitudinally, and can also be fitted according to the streamline shape, which not only has a better appearance, but also enhances the heat dissipation effect of the light guide device 7. For reference, Figure 1 Figure 3 The second heat sink 2 has a streamlined shape and is more three-dimensional. Such a design takes into account both aesthetics and aerodynamic performance, and the streamlined shape can guide the wind flow to quickly carry away heat.

[0047] Further, any one of the light guide device 7, the second heat sink 2, and the first heat sink 6 can be uniformly arranged in the length direction of the memory functional component. Of course, the light guide device 7, the second heat sink 2, and the first heat sink 6 can also be arranged as shown in Figure 1 Figure 3 and the width gradually changes and transitions, which helps to maintain the overall aesthetics and structural stability of the memory strip.

[0048] Further, any one of the light guide device 7, the second heat sink 2, and the first heat sink 6 has a streamlined shape, and the streamlined shape gradually changes in the length direction of the memory strip. Such a design not only has an aesthetic appearance, but also optimizes air flow and improves heat dissipation efficiency.

[0049] Specifically, the second heat sink 2 has a heat dissipation part, at least part of which is curved or bent to form a heat dissipation space through which gas can pass, and the heat dissipation space is arranged opposite to the air outlet of the first air duct. Such a design improves heat dissipation efficiency and also increases the aesthetics of the memory strip.

[0050] ​​​More specifically, the second heat sink 2 also has a wind guide part, which is transitionally connected with the heat dissipation part, and at least part of the wind guide part is connected with the memory functional assembly. In actual operation of the air-cooled memory stick, the heat dissipation blower 1 can be opened, and the heat dissipation blower 1 can blow air flow to the first air duct, the air flow carrying the heat emitted from the heating element 5 blows out from the air outlet of the first air duct, and the air flow blows to the heat dissipation part of the second heat sink 2 through the blowing opening of the first air duct, and then overflows through the heat dissipation space of the wind guide part, and part of the air flow can also overflow in different directions under the guidance of the wind guide part, which helps to guide the air flow and improve the heat dissipation efficiency. Moreover, the wind guide part is connected with the memory functional assembly, and the heat emitted from the memory functional assembly can also be dissipated through the contact of the wind guide part.

[0051] More specifically, the heating element 5 in the memory functional assembly is arranged in the first air duct, that is, the heating element 5 is arranged in the gap formed by the first heat sink 6 and the memory stick body 3, which helps to quickly dissipate heat and improve the stability and performance of the memory stick.

[0052] More specifically, the heat dissipation blower 1 is electrically connected with the first power supply device, that is, the heat dissipation blower 1 is powered by a separate power supply system, which provides a flexible power supply solution and ensures the stable operation of the heat dissipation blower 1. Of course, in another preferred embodiment, the heat dissipation blower 1 is electrically connected with the memory functional assembly, which can be understood as that when the air-cooled memory stick is used and installed into the mainboard, the air-cooled memory stick can uniformly supply power to the heat dissipation blower 1 and the memory functional assembly, which is more convenient in design, installation and use.

[0053] In summary, the air-cooled memory stick provided by the present application improves the heat dissipation efficiency through the integrated design of the heat dissipation assembly and the light guide device 7, enhances the visual effect of the memory stick, and provides a computer hardware solution which is not only practical but also beautiful. The design is limited in structure to ensure performance and beauty, and provides expandability in function to adapt to different use requirements.

[0054] In this specification, the illustrative representations of the above-mentioned terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0055] Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A type of air-cooled memory module, characterized in that, Comprise: Memory functional components; Heat dissipation components, including a first heat dissipation plate (6) and a heat dissipation fan (1), the first heat dissipation plate (6) is arranged in close contact with at least part of the memory functional components, and the first heat dissipation plate (6) is arranged in gap fit with at least part of the memory functional components and forms a first air duct, the air outlet of the heat dissipation fan (1) is arranged towards the air inlet of the first air duct; Light guide device (7) is arranged on the memory functional components along the longitudinal direction of the first heat dissipation plate (6), and a ventilation opening (8) is arranged on the light guide device (7), and the ventilation opening (8) is arranged opposite to the air outlet of the first air duct.

2. The air-cooled memory card according to claim 1, wherein: The heat dissipation components further comprise a second heat dissipation plate (2), the second heat dissipation plate (2) is arranged opposite to the air outlet of the first air duct, and at least part of the second heat dissipation plate (2) is arranged in close contact with the memory functional components.

3. The air-cooled memory module of claim 2, wherein: Further comprise: The light guide device (7) is designed as a whole, and the ventilation opening (8) is opened in the light guide device (7); Or, the light guide device (7) is designed as a split type, the light guide device (7) comprises at least two light emitting parts, two said light emitting parts are spliced and connected, and two said light emitting parts are respectively provided with a gap, two said gaps are spliced to form said ventilation opening (8).

4. The air-cooled memory module of claim 3, wherein: The light guide device (7) and / or the second heat dissipation plate (2) and / or the first heat dissipation plate (6) are arranged uniformly in width or transitionally in width along the length direction of the memory functional components.

5. The air-cooled memory card according to claim 3, wherein: The light guide device (7) and / or the second heat dissipation plate (2) and / or the first heat dissipation plate (6) have regular shape or irregular shape, the regular shape includes one of rectangle, square and circle, and the irregular shape includes streamline shape and combination shape of regular shape.

6. The air-cooled memory card according to claim 4 or 5, wherein: The light guide device (7) and / or the second heat dissipation plate (2) and / or the first heat dissipation plate (6) have streamline shape, and the streamline shape of the light guide device (7) and / or the second heat dissipation plate (2) and / or the first heat dissipation plate (6) changes gently along the length direction of the memory card.

7. The air-cooled memory card according to claim 2, wherein: The second heat dissipation plate (2) has a heat dissipation part, at least part of the heat dissipation part is curved or bent to form a heat dissipation space for gas passing through, and the heat dissipation space is arranged opposite to the air outlet of the first air duct.

8. The air-cooled memory card according to claim 7, wherein: The second heat dissipation plate (2) further has a wind guide part, the wind guide part is transitionally connected with the heat dissipation part, and at least part of the wind guide part is connected with the memory functional components.

9. The air-cooled memory card according to claim 1, wherein: The memory functional assembly comprises a memory strip body (3), memory particles (4) and a heating element (5), the memory particles (4) and the heating element (5) are arranged in a specified direction on the memory strip body (3).

10. The air-cooled memory strip according to claim 9, characterized in that: The heating element (5) is arranged in the first air duct. And / or, the heat dissipation air blower (1) is electrically connected with the memory functional assembly; or, the heat dissipation air blower (1) is electrically connected with a first power supply device.

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