Miniaturized radio frequency signal switching network device

Abstract

The utility model relates to the technical field of radar communication electronics, and discloses a miniaturized radio frequency signal switching network device, which comprises superposed PCBs (printed circuit boards), the PCBs comprise signal layers, strip lines and metal ground layers, the strip lines are arranged in each signal layer, the metal ground layers are arranged above and below each signal layer, microstrip pads are arranged on the surfaces of the PCBs, and the microstrip pads are arranged on the surfaces of the PCBs. The metal ground layer is vertically provided with a blind hole in a penetrating mode, the blind hole is used for connecting the strip line with a microstrip line arranged on the surface of the PCB, a multi-layer PCB structure is adopted, in order to avoid transmission line crossing, reduce design complexity and guarantee signal isolation between channels, signal lines in the multi-layer PCB are connected to a microstrip bonding pad on the surface of the PCB in a blind hole mode, and therefore the signal transmission efficiency is improved. The metal ground layer through which the blind holes penetrate is matched with the ground spacing for port standing waves, and the microstrip bonding pad on the surface layer is used for being connected to a branch port of a radio frequency power division network or a radio frequency switch network, so that system integration is facilitated, integrated design with the radio frequency power division network and the radio frequency switch network can be realized, the size is reduced, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to radar communication electronic technical field, concretely relates to a miniaturized radio frequency signal exchange network device. BACKGROUND

[0002] With the rapid development of radio frequency signal communication field, phased array antenna scanning system, automation test system use a large number of " full exchange radio frequency exchange matrix", " full exchange radio frequency exchange matrix" realizes any number of input to any output signal conduction.

[0003] " Full exchange radio frequency exchange matrix " is mainly composed of two parts, radio frequency power division network, radio frequency switch network.For example: " n x m full exchange radio frequency exchange matrix " (n, m all represent natural integer) has n input and m output, is composed of n 1 m radio frequency power divider and m n selected 1 radio frequency switch." Radio frequency power division network and radio frequency switch network branch port number is consistent, and they are connected through radio frequency signal exchange network.

[0004] But in the related art, according to principle diagram port corresponding relationship, through radio frequency cable connection, cost is higher, assembly workload is big, volume and weight are also very big, through radio frequency connector plug, the combination formed is three-dimensional structure, size is larger, not convenient for system integration. UTILITY MODEL CONTENT

[0005] In view of the above problems, the present application provides a miniaturized radio frequency signal exchange network device to solve the problems in the related art.

[0006] The utility model aims to realize the following technical scheme:

[0007] The present application provides a miniaturized radio frequency signal exchange network device, comprising: stacked PCB board, the PCB board includes signal layer, strip line and metal ground layer, the strip line is arranged in each signal layer, the metal ground layer is arranged on and under each signal layer, the PCB board surface is provided with microstrip pad, the metal ground layer is vertically provided with blind hole, and the blind hole is used to connect the strip line with the microstrip line provided on the PCB board surface.

[0008] In some embodiments, the PCB board includes dielectric substrate and prepreg, the dielectric substrate is arranged on and under the prepreg, and the signal layer is arranged between the dielectric substrate and the prepreg.

[0009] In some embodiments, the stacked PCB board includes input and output, and the input and output are on both sides of the stacked PCB board.

[0010] In some embodiments, the stripline connects the microstrip pad through a blind hole.

[0011] In some embodiments, the stripline and the microstrip pad both have an impedance of 50 ohms.

[0012] In some embodiments, the superimposed PCB board is connected with a radio frequency power divider, and each branch signal of the radio frequency power divider is arranged to be transmitted on the signal layer.

[0013] In some embodiments, the microstrip pad is connected with a branch port of a radio frequency power division network or a radio frequency switch network.

[0014] In some embodiments, the stripline and the blind hole have the same electrical length.

[0015] Compared with the prior art, one or more embodiments in the above scheme can have the following advantages or beneficial effects:

[0016] In the miniaturized radio frequency signal exchange network device provided in the application, a superimposed PCB board is included, the PCB board includes signal layers, a stripline and a metal ground layer, the stripline is arranged in each signal layer, the metal ground layer is arranged above and below each signal layer, a microstrip pad is arranged on the surface of the PCB board, a blind hole is vertically arranged in the metal ground layer, and the blind hole is used to connect the stripline with the microstrip pad arranged on the surface of the PCB board. The multi-layer PCB board structure is adopted, the transmission line is prevented from crossing, the design complexity is reduced, the signal isolation degree between channels is ensured, the stripline inside the multi-layer PCB board is connected to the microstrip pad on the surface of the PCB board through the blind hole, the metal ground layer through which the blind hole passes matches the port standing wave with the ground, the microstrip pad on the surface layer is used to connect to a branch port of a radio frequency power division network or a radio frequency switch network, system integration is facilitated, the radio frequency power division network and the radio frequency switch network can be designed integrally, the volume is reduced, and the cost is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 A multi-layer PCB board stack structure schematic diagram is provided for the embodiments of the present application.

[0019] Figure 2 A 4x4 radio frequency signal PCB board stack structure schematic diagram is provided for the embodiments of the present application.

[0020] Figure 3 A microstrip line schematic diagram in each signal layer of the 4x4 radio frequency signal is provided for the embodiment of the utility model.

[0021] Figure 4 A top view of the miniaturized radio frequency signal switching network device is provided for the embodiment of the utility model.

[0022] Figure 5 A three-dimensional schematic diagram of the miniaturized radio frequency signal switching network device is provided for the embodiment of the utility model.

[0023] Figure 6 A blind hole structure schematic diagram in the miniaturized radio frequency signal switching network device is provided for the embodiment of the utility model. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the application will be clearly and completely described in the application combined with the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the application.

[0025] In the application, the applicant finds that the radio frequency signal switching network in the prior art has the following defects.

[0026] The first kind is connected through a radio frequency cable according to the principle diagram port corresponding relationship, and the advantage is simple design, and the disadvantage is high cost, large assembly workload, and large size and weight.

[0027] The second kind is connected through a radio frequency connector, each radio frequency power divider and the branch port of the radio frequency switch are linearly distributed, n radio frequency power dividers are stacked to form a radio frequency power division network, and the branch ports form a matrix surface; m radio frequency switches are stacked in the vertical direction of the radio frequency power divider to form a radio frequency switch network, and the branch ports also form a matrix surface. The matrix surface port spacing is designed to realize one-to-one correspondence of the matrix surface port positions of the radio frequency power division network and the radio frequency switch network, and a radio frequency adapter is used in the middle to communicate, the advantage is convenient assembly, simple operation, and relatively low cost, and the disadvantage is that the formed combination is a three-dimensional structure, the size is large, and the system integration is not convenient.

[0028] The application provides a miniaturized radio frequency signal switching network device to achieve simple structure, easy implementation, low cost and miniaturization.

[0029] Referring to Figure 1 , Figure 1 A multi-layer PCB board stacking structure schematic diagram is provided for the embodiment.

[0030] According to Figure 1、 Figure 4 With Figure 5 As can be seen from the small size of the radio frequency signal exchange network device, including: superimposed PCB board, PCB board includes signal layer, strip line and metal ground layer, each signal layer is provided with strip line, each signal layer is connected with metal ground layer, the surface of the PCB board is provided with microstrip pad, the metal ground layer is vertically provided with blind hole, the blind hole is used for connecting the strip line with the microstrip line provided on the surface of the PCB board.

[0031] Among them, the multi-layer PCB board structure is used to avoid the cross of the transmission line, reduce the design complexity, and ensure the signal isolation degree between channels.

[0032] Referring to Figure 6 , Figure 6 The small size of the radio frequency signal exchange network device provided in the embodiment is a blind hole structure schematic diagram.

[0033] Among them, the surface of the PCB board is provided with microstrip pad, the metal ground layer is vertically provided with blind hole, the radio frequency port is microstrip pad, and the embedded installation mode is convenient for system integration.

[0034] Among them, the strip line is connected with the microstrip pad through the blind hole, and the impedance of the strip line and the microstrip pad is 50 ohms.

[0035] In some embodiments, the superimposed PCB board is connected with a radio frequency power divider, and each branch signal of the radio frequency power divider is arranged on the signal layer.

[0036] The microstrip pad is connected with the branch port of the radio frequency power division network or the radio frequency switch network, and the electrical length of the strip line and the blind hole is the same.

[0037] In the embodiment, the radio frequency signal exchange network realizes the signal transmission between specific two ports, therefore, the transmission line adopts 50 ohm strip line, the multi-layer PCB board structure is used to avoid the cross of the transmission line, reduce the design complexity, and ensure the signal isolation degree between channels, and the m branch signals of each 1 / m radio frequency power divider are transmitted on a signal layer, therefore, the signal layer is n.

[0038] Each signal layer is shielded between signals by metal ground, and the metal ground layer is n+1. The m branch signals in the same layer are isolated by metallized via, the transmission line inside the multi-layer PCB board is connected to the microstrip pad on the surface of the PCB board through the blind hole, the metal ground layer passed by the blind hole matches the port standing wave between the ground, and the microstrip pad on the surface layer is used to connect to the branch port of the radio frequency power division network or the radio frequency switch network.

[0039] The radio frequency signal exchange network in the form of multi-layer PCB board structure is convenient for system integration, can be designed integrally with the radio frequency power division network and the radio frequency switch network, reduces the volume, and reduces the cost.

[0040] Please refer toFigure 2 , Figure 2 A 4x4 RF signal PCB board stack structure schematic diagram is provided for the embodiment.

[0041] Figure 2 In the embodiment, the multilayer PCB board is processed by using a radio frequency medium substrate, and the PCB board is composed of a medium substrate and a prepreg, and the medium substrate is arranged above and below the prepreg, and a signal layer is arranged between the medium substrate and the prepreg.

[0042] In the application, the signal lines inside the multilayer PCB board are connected to the microstrip pads on the surface of the PCB board in the form of blind holes, the blind holes vertically pass through the metal ground layer, and the spacing from the ground and the size of the metal ring at the signal line connection point jointly determine the port standing wave, and simulation matching is performed according to the dielectric constant of the medium substrate, the structure system of the multilayer PCB board, and the size of the via hole.

[0043] Please refer to Figure 3 , Figure 3 A microstrip line schematic diagram in each signal layer of a 4x4 RF signal is provided for the embodiment.

[0044] In the embodiment, the microstrip line in each signal layer can be arranged in different ways.

[0045] Specifically, in the specific embodiment of the application:

[0046] Taking a 4x4 RF signal exchange network design as an example, the RF signal exchange network adopts a RO4350B medium substrate of ROGERS company, the dielectric constant is 3.48, the substrate thickness is 0.254 mm, and the copper metal thickness is 0.035 mm. The prepreg adopts RO4450F, the dielectric constant is 3.5, the thickness is 0.1 mm, and two pieces are bonded. According to the above stack structure, through the calculation of a radio frequency simulation tool, the 50-ohm RF transmission band line width of the signal layer is 0.35 mm, and the surface pad microstrip line width is 1.44 mm, as shown in Figure 4 , Figure 5 .

[0047] According to the above stack structure, the blind hole diameter of the signal layer band line and the surface microstrip line is designed to be 0.3 mm, and the blind holes of each layer are shown in Figure 6 .

[0048] According to the 4x4 RF signal exchange network stack structure, through the calculation of a radio frequency simulation tool, 16 RF signal transmission channels can be realized to have consistent electrical lengths, and the phase and amplitude consistency can be met.

[0049] The above are only preferred embodiments of the present application, but the protection scope of the present application is not limited thereto, and any modification and replacement based on the technical solutions and the application concept provided by the present application should be covered in the protection scope of the present application. It should be noted that the structures or components illustrated in the drawings are not necessarily drawn to scale, and the present application omits the description of the known components and processing technologies and processes to avoid unnecessary limitation of the present application.

[0050] Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the embodiments disclosed herein. It is intended that the present application cover any and all variations of the application that come within the scope of the following claims and their equivalents. It is to be understood that the application is not limited to particular alloys, methods, feature combinations disclosed herein, but is intended to cover all suitable alternatives falling within the scope of the application. It is therefore intended that the application not be limited to the specific illustrative embodiments disclosed, but that claims be provided commensurate with the application as described and claimed.

Claims

1. A miniaturized radio frequency signal switching network device, characterized by The application relates to a superimposed PCB board, which comprises signal layers, strip lines and metal ground layers, the strip lines are arranged in each signal layer, the metal ground layers are arranged above and below each signal layer, microstrip pads are arranged on the surface of the PCB board, and blind holes are vertically arranged in the metal ground layers, which are used for connecting the strip lines with microstrip lines arranged on the surface of the PCB board. The PCB board comprises a dielectric substrate and a prepreg, the dielectric substrate is arranged above and below the prepreg, and the signal layers are arranged between the dielectric substrate and the prepreg.

2. The miniaturized radio frequency signal switching network device of claim 1, wherein, The superimposed PCB board comprises input ends and output ends, and the input ends and the output ends are arranged on two sides of the superimposed PCB board.

3. The miniaturized radio frequency signal switching network device of claim 1, wherein, The strip lines are connected with the microstrip pads through the blind holes.

4. The miniaturized radio frequency signal switching network device of claim 1, wherein, The impedance of the strip lines and the microstrip pads is 50 ohms.

5. A miniaturized radio frequency signal switching network device according to claim 4, characterized in that, The superimposed PCB board is connected with a radio frequency power divider, and each branch signal of the radio frequency power divider is transmitted on the signal layers.

6. The miniaturized radio frequency signal switching network device of claim 1, wherein, The microstrip pads are connected with branch port of a radio frequency power dividing network or a radio frequency switch network.

7. The miniaturized radio frequency signal switching network device of claim 6, wherein, The electric length of the strip lines and the blind holes is the same.

8. The miniaturized radio frequency signal switching network device of claim 7, wherein, ​

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