Diverter detection equipment

Abstract

The utility model discloses shunt detection equipment, and relates to the technical field of chip detection.The shunt detection equipment comprises a workbench and a mechanical arm, the workbench comprises a feeding and discharging area, a burr detection area and a plane detection area, and the feeding and discharging area is provided with an automatic feeding assembly and a defective product tray; the burr detection area is provided with a burr detection assembly and a transfer assembly, the burr detection assembly is used for detecting the upper surface of a to-be-detected chip, the transfer assembly is used for transferring the to-be-detected chip from the burr detection area to the plane detection area, the plane detection area is provided with a plane detection assembly, and the plane detection assembly is used for detecting the surface of the to-be-detected chip; the working end of the mechanical arm is located above the workbench, and the mechanical arm is used for transferring a chip to be detected between the feeding and discharging area and the burr detection area or between the feeding and discharging area and the plane detection area. According to the shunt detection equipment provided by the invention, the detection precision and the detection efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the chip detection technical field, and in particular to a shunt detection device. BACKGROUND

[0002] The battery management system is a bridge connecting the battery, a core component of the new energy vehicle, and the whole vehicle. Benefiting from the development of the new energy vehicle, the battery management system as the core component has also developed rapidly. The total current detection is essential, and the current detection of the battery management system is divided into the traditional Hall sensor detection mode and the shunt detection mode. The shunt detection mode is applied to the battery management system due to its high measurement accuracy and relatively low cost, as well as the simple measurement method, the use of less equipment, and the convenient and fast application. The measurement principle of the shunt detection mode is to directly measure the voltage across the shunt, and then to obtain the current value in the circuit by dividing the measured voltage by the resistance value of the shunt according to Ohm's law for current detection.

[0003] In order to ensure the appearance quality of the shunt, the appearance of the shunt needs to be detected after the shunt is manufactured. The appearance defects such as poor connection of the PCB, appearance bump, burr and the like will affect the current detection result of the detector. In the prior art, manual detection is adopted. The poor products and good products are confused or misjudged due to different understandings of the judgment standards during manual detection, and the manual detection takes a lot of time. CONTENT OF THE UTILITY MODEL

[0004] The purpose of the present application is to provide a shunt detection device which can improve the detection accuracy and detection efficiency.

[0005] The embodiment of the present application provides a shunt detection device. The shunt detection device comprises a workbench and a mechanical arm. The workbench comprises a feeding and discharging area, a burr detection area and a plane detection area. The feeding and discharging area is provided with an automatic feeding assembly and a poor product tray. The burr detection area is provided with a burr detection assembly and a transfer assembly. The burr detection assembly is used for detecting the upper surface of a to-be-detected chip. The transfer assembly is used for transferring the to-be-detected chip from the burr detection area to the plane detection area. The plane detection area is provided with a plane detection assembly. The plane detection assembly is used for detecting the surface of the to-be-detected chip. The working end of the mechanical arm is located above the workbench and is used for transferring the to-be-detected chip between the feeding and discharging area and the burr detection area or between the feeding and discharging area and the plane detection area.

[0006] As an implementable mode, the burr detection assembly comprises a clamping piece and a first image acquisition piece and a first light source arranged on opposite sides of the clamping piece. The clamping piece clamps the side edge of the to-be-detected chip to expose the upper surface of the to-be-detected chip. The light emitting direction of the first light source is parallel to the upper surface of the to-be-detected chip. The first image acquisition piece acquires the image of the to-be-detected chip from the side surface of the to-be-detected chip.

[0007] As an implementable mode, the clamping member is arranged on a moving platform, the moving platform is arranged on a guide rail, and the moving platform is driven to move along the guide rail to adjust the distance between the chip to be tested and the first image acquisition member.

[0008] As an implementable mode, the burr detection assembly further comprises a trigger member, and the trigger member is configured to trigger the first light source and the first image acquisition member to act when the chip to be tested is located in the clamping member.

[0009] As an implementable mode, the transferring assembly comprises a driving member and a suction disc rod connected to the driving member, an end of the suction disc rod is provided with a suction disc, the suction disc is used to suck the chip to be tested from the clamping member, and the suction disc rod is driven to rotate by the driving member so that the suction disc is rotated to the planar detection area.

[0010] As an implementable mode, the planar detection assembly comprises a second image acquisition member, a light source assembly, a moving cylinder, and a supporting plate arranged on the moving cylinder, the chip to be tested is placed on the supporting plate and is moved to the lower side of the light source assembly under the action of the moving cylinder.

[0011] As an implementable mode, the light source assembly comprises a bowl light source and a ring light source, the ring light source, the bowl light source, and the second image acquisition member are sequentially arranged in a direction away from the workbench, and the chip to be tested is located below the orthographic projection of the enclosed space of the ring light source during detection.

[0012] As an implementable mode, the automatic feeding assembly comprises an automatic unstacking tray machine, the automatic unstacking tray machine is provided with a working position, a mechanical arm is used to suck the chip to be tested from the tray on the working position and transfer the chip to the burr detection area, the mechanical arm is further used to transfer the good product from the planar detection area to the working position and transfer the defective product from the planar detection area to a defective product tray.

[0013] As an implementable mode, the defective product tray is arranged on the workbench by a material returning cylinder, so that the material returning cylinder pushes the defective product tray to extend out of the workbench when the defective product tray is full.

[0014] As an implementable mode, the mechanical arm is a seven-axis mechanical arm, and a suction disc is arranged at an end of the seven-axis mechanical arm to adsorb the chip to be tested.

[0015] The beneficial effects of the embodiments of the present application include:

[0016] The shunt detector detection equipment provided by the application comprises a workbench and a mechanical arm, the workbench comprises a feeding and discharging area, a burr detection area and a plane detection area, and the shunt detector detection equipment provided by the embodiment of the application automatically feeds the tray to the feeding position when working, wherein the tray has a plurality of placement positions for placing the to-be-tested chips, that is, a plurality of to-be-tested chips are placed on the tray at the feeding position, after starting detection, the working end of the mechanical arm picks up one to-be-tested chip at the tray and transfers the to-be-tested chip to the burr detection assembly of the burr detection area, at this time, the burr detection assembly detects the burr condition of the to-be-tested chip, after the burr condition detection is completed, the transfer assembly transfers the to-be-tested chip to the plane detection area, then the plane detection assembly detects the surface condition of the to-be-tested chip, after the surface condition detection is completed, the mechanical arm transfers the good products and the defective products in the to-be-tested chip to the corresponding areas according to the detection results of the burr detection assembly and the plane detection assembly, and thus the testing process of one to-be-tested chip is completed. The shunt detector detection equipment provided by the embodiment of the application realizes automatic detection of the shunt detector chip, thereby improving the detection efficiency and the detection accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 A structural schematic diagram of a shunt detector detection equipment provided by the embodiment of the application;

[0019] Figure 2 A structural schematic diagram of a burr detection assembly provided by the embodiment of the application;

[0020] Figure 3 A structural schematic diagram of a plane detection assembly provided by the embodiment of the application;

[0021] Figure 4 A structural schematic diagram of a feeding assembly provided by the embodiment of the application;

[0022] Figure 5 A structural schematic diagram of a mechanical arm provided by the embodiment of the application;

[0023] Figure 6 A structural schematic diagram of a defective product tray provided by the embodiment of the application.

[0024] Icons: 100-Diverter testing equipment; 110-Workbench; 120-Robotic arm; 130-Automatic feeding assembly; 131-Working station; 140-Defective product tray; 141-Unloading cylinder; 150-Burst detection assembly; 151-Clamping component; 152-First image acquisition component; 153-First light source; 154-Guide rail; 155-Moving platform; 156-Trigger component; 160-Transfer assembly; 161-Driver component; 162-Suction cup rod; 163-Suction cup; 170-Plane detection assembly; 171-Second image acquisition component; 172-Light source assembly; 173-Moving cylinder; 174-Panel; 175-Bowl light source; 176-Ring light source. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0026] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0027] This application provides a shunt detector 100, such as... Figure 1 As shown, the system includes a worktable 110 and a robotic arm 120. The worktable 110 includes a loading / unloading area, a burr detection area, and a flat surface detection area. The loading / unloading area is equipped with an automatic feeding component 130 and a defective product tray 140. The burr detection area is equipped with a burr detection component 150 and a transfer component 160. The burr detection area is used to detect the upper surface of the chip under test. The transfer component 160 is used to transfer the chip under test from the burr detection area to the flat surface detection area. The flat surface detection area is equipped with a flat surface detection component 170, which is used to detect the surface of the chip under test. The working end of the robotic arm 120 is located above the worktable 110 and is used to transfer the chip under test between the loading / unloading area and the burr detection area, or between the loading / unloading area and the flat surface detection area.

[0028] The shunt detection device 100 provided by the embodiment of the present application is used for detecting the appearance of the shunt, and specifically, is used for detecting burrs and appearance of the shunt. The shunt detection device 100 of the embodiment of the present application comprises a workbench 110 used for working, and a mechanical arm arranged on the workbench 110. Specifically, a plurality of areas are arranged on the workbench 110 and are respectively used for feeding and discharging the shunt and detecting the shunt. Specifically, the plurality of areas comprise a feeding and discharging area, the feeding and discharging area is provided with an automatic feeding assembly 130 and a defective product tray 140, and is used for feeding and discharging. The shunt detection device 100 further comprises a burr detection area, the burr detection area is provided with a burr detection assembly 150 and a transfer assembly 160, wherein the burr detection assembly 150 is used for detecting burr conditions on the upper surface of the to-be-detected chip, and the transfer assembly 160 is used for transferring the to-be-detected chip after burr detection to a plane detection area. The shunt detection device 100 further comprises a plane detection area, the plane detection area is provided with a plane detection assembly 170, and the plane detection assembly 170 is used for detecting surface conditions of the to-be-detected chip. The to-be-detected chip passing through the burr detection assembly 150 and the plane detection assembly 170 includes two cases, one is a good product, and the other is a defective product. The mechanical arm transfers the good product to the tray at the feeding and discharging assembly and transfers the defective product to the defective product tray 140, thereby realizing detection of the shunt chip.

[0029] Specifically, when the shunt detection device 100 of the embodiment of the present application works, the automatic feeding assembly 130 transports the tray to a feeding position, wherein the tray has a plurality of placement positions for placing the to-be-detected chip, that is, a plurality of to-be-detected chips are placed on the tray at the feeding position. After starting detection, the working end of the mechanical arm 120 picks up one to-be-detected chip at the tray and transfers the to-be-detected chip to the burr detection assembly 150 in the burr detection area. At this time, the burr detection assembly 150 detects the burr conditions of the to-be-detected chip. After the burr condition detection is completed, the transfer assembly 160 transfers the to-be-detected chip to the plane detection area, and then the plane detection assembly 170 detects the surface conditions of the to-be-detected chip. After the surface condition detection is completed, the mechanical arm transfers the good product and the defective product in the to-be-detected chip to the corresponding area according to the detection results of the burr detection assembly 150 and the plane detection assembly 170. Thus, the test process of one to-be-detected chip is completed.

[0030] It can be understood that when the shunt detection device 100 works, the detection results of the detection assemblies need to be judged, and the to-be-detected chip is divided into a good product and a defective product according to the judgment result. Therefore, a controller is needed. The controller can compare the detection results with preset conditions to judge whether the to-be-detected chip is a good product or a defective product, and control the mechanical arm 120 to place the to-be-detected chip after detection on the tray or the defective product tray 140 of the feeding and discharging assembly according to the judgment result.

[0031] The shunt detector detection device 100 provided in the application comprises a workbench 110 and a mechanical arm 120. The workbench 110 comprises a feeding and discharging area, a burr detection area and a plane detection area. When the shunt detector detection device 100 provided in the application is in operation, the automatic feeding assembly 130 transports the tray to the feeding position, the working end of the mechanical arm 120 picks up one of the chips to be detected on the tray at the feeding position, and then transfers the chip to be detected to the burr detection assembly 150 in the burr detection area. The burr detection assembly 150 detects the burr condition of the chip to be detected. After the burr condition detection is completed, the transfer assembly 160 transfers the chip to be detected to the plane detection area, and then the plane detection assembly 170 detects the surface condition of the chip to be detected. After the surface condition detection is completed, the mechanical hand transfers the good and bad products in the chip to be detected to the corresponding area according to the detection results of the burr detection assembly 150 and the plane detection assembly 170, and thus the testing process of one chip to be detected is completed. The shunt detector detection device 100 provided in the application realizes automatic detection of the shunt detector chip, thereby improving the efficiency and accuracy of the detection.

[0032] Optionally, as shown in Figure 2 The burr detection assembly 150 comprises a clamping piece 151 and a first image acquisition piece 152 and a first light source 153 arranged on the opposite sides of the clamping piece 151. The clamping piece 151 clamps the side edge of the chip to be detected to expose the upper surface of the chip to be detected. The light emitting direction of the first light source 153 is parallel to the upper surface of the chip to be detected. The first image acquisition piece 152 acquires the image of the chip to be detected from the side surface of the chip to be detected.

[0033] The burr detection assembly 150 is used for detecting whether the surface of the chip to be detected has burrs. Specifically, the burr detection assembly 150 comprises a clamping piece 151 for clamping the chip to be detected. The first image acquisition piece 152 and the first light source 153 are arranged on the opposite sides of the clamping piece 151. In this way, when the light beam emitted by the first light source 153 irradiates the side surface of the chip, the first image acquisition piece 152 acquires the light signal of the first light source 153, and the controller acquires the burr condition of the chip to be detected according to the light signal. Specifically, the light emitting direction of the first light source 153 is parallel to the upper surface of the chip to be detected. When the upper surface of the chip has burrs, the burrs will block the light to a certain extent, so that the image obtained by the first image acquisition piece 152 has a certain shadow, so as to determine whether the upper surface of the chip has burrs.

[0034] The first light source 153 and the first image acquisition piece 152 are used to detect the burr condition of the upper surface of the chip to be detected in the embodiment of the application, so as to realize automatic detection of the burrs, thereby avoiding detection errors caused by manual detection and improving the detection accuracy.

[0035] The first image acquisition member 152 can be a camera. In addition, it can be understood that the clamping member 151 clamps the side of the chip to be tested, so that the upper surface of the chip to be tested is exposed to the light beam emitted by the first light source 153. The clamping member 151 can be a clamping jaw, which is clamped or released by a clamping cylinder to achieve clamping of the chip to be tested.

[0036] In an implementable manner of the embodiment of the present application, as shown in Figure 2 The clamping member 151 is arranged on the moving platform 155, the moving platform 155 is arranged on the guide rail 154, and the moving platform 155 is driven to move along the guide rail 154 to adjust the distance between the chip to be tested and the first image acquisition member 152.

[0037] In order to enable the first image acquisition member 152 to acquire a clearer image, the clamping member 151 is arranged on the movable moving platform 155 in the embodiment of the present application. Specifically, the guide rail 154 is arranged between the first image acquisition member 152 and the first light source 153, the moving platform 155 is arranged on the guide rail 154, the moving platform 155 is connected with a servo motor, the servo motor drives the moving platform 155 to move on the guide rail 154, so that the chip to be tested located on the moving platform 155 can be clearly imaged at the first image acquisition member 152, thereby improving the detection accuracy.

[0038] Optionally, as shown in Figure 2 The burr detection assembly 150 further includes a trigger member 156, which is used to trigger the first light source 153 and the first image acquisition member 152 to act when the chip to be tested is located in the clamping member 151.

[0039] In order to avoid resource waste caused by the first light source 153 and the first image acquisition member 152 being in a working state all the time, the trigger member 156 is arranged in the embodiment of the present application. When the clamping member 151 clamps the chip to be tested and is located at a preset position on the guide rail 154, the trigger member 156 is triggered, so that the first light source 153 and the first image acquisition member 152 act to acquire an image.

[0040] Specifically, the trigger member 156 includes a servo motor and a right-angle speed reducer, the servo motor drives the right-angle speed reducer to rotate, and the right-angle speed reducer rotates to trigger the first light source 153 and the first image acquisition member 152 to act. In addition, those skilled in the art can also arrange the specific structure of the trigger member 156 according to the actual situation, as long as the trigger member 156 can trigger the first light source 153 and the first image acquisition member 152 to act at the appropriate time.

[0041] In an implementable manner of the embodiment of the present application, as shown in Figure 2As shown, the transfer assembly 160 comprises a driving member 161 and a suction rod 162 connected with the driving member 161, and a suction disc 163 is arranged at the end of the suction rod 162, the suction disc 163 sucks the chip to be tested at the clamping member 151, and the suction rod 162 rotates under the driving of the driving member 161 to rotate the suction disc 163 to the planar detection area.

[0042] As described above, the transfer assembly 160 is used to transfer the chip to be tested from the burr detection area to the planar detection area, specifically, the transfer assembly 160 comprises the driving member 161, the suction rod 162 and the suction disc 163, the driving member 161 drives the suction rod 162 to rotate to the clamping member 151, the suction disc 163 sucks the chip to be tested at the clamping member 151, the driving member 161 drives the suction rod 162 to rotate again, so that the suction disc 163 rotates to the planar detection area, and then the chip to be tested is released, so that the chip to be tested is transferred from the burr detection area to the planar detection area.

[0043] Optionally, as shown in Figure 3 As shown, the planar detection assembly 170 comprises a second image acquisition member 171, a light source assembly 172, a moving cylinder 173 and a supporting plate 174 arranged on the moving cylinder 173, and the chip to be tested is placed on the supporting plate 174 and moves to the lower side of the light source assembly 172 under the action of the moving cylinder 173.

[0044] When the planar detection assembly 170 works, the transfer assembly 160 transfers the chip to be tested after burr detection to the supporting plate 174, the supporting plate 174 drives the chip to be tested to the lower side of the light source assembly 172 under the action of the moving cylinder 173, the light beam emitted by the light source assembly 172 irradiates to the upper surface of the chip to be tested, the second image acquisition member 171 acquires the light beam reflected by the upper surface of the chip to be tested, and the condition of the upper surface of the chip to be tested is acquired according to the condition of the reflected light beam.

[0045] In an implementable manner of the embodiment of the application, as shown in Figure 3 As shown, the light source assembly 172 comprises a bowl light source 175 and a ring light source 176, the ring light source 176, the bowl light source 175 and the second image acquisition member 171 are sequentially arranged in the direction away from the workbench 110, and the chip to be tested is located below the orthographic projection of the enclosed space of the ring light source 176 during detection.

[0046] The light source assembly 172 comprises the bowl light source 175 and the ring light source 176, so that the light source assembly 172 can sufficiently irradiate to the upper surface of the chip to be tested, thereby enabling the second image acquisition member 171 to acquire a clearer image and improving the detection precision.

[0047] Optionally, as shown in Figure 4As shown, the automatic feeding assembly 130 comprises an automatic tray unstacking machine, and the working position 131 is arranged on the automatic tray unstacking machine. The mechanical arm 120 sucks the to-be-tested chips from the tray at the working position 131 and transfers the to-be-tested chips to the burr detection area. The mechanical arm 120 is also used for transferring the good products from the planar detection area to the working position 131 and transferring the defective products from the planar detection area to the defective product tray.

[0048] Specifically, the automatic tray unstacking machine comprises an unstacking working position, a conveying track and the working position 131. The automatic tray unstacking machine automatically unstacks the trays into single layers at the unstacking working position, and conveys the trays to the working position 131 through the conveying track. When the shunt detector sets the detection to start, the mechanical arm 120 sucks the to-be-tested chips from the tray at the working position 131 to start the detection of the to-be-tested chips.

[0049] In addition, two sets of automatic tray unstacking machines can be arranged on the workbench 110. When one automatic tray unstacking machine is unstacking the trays, the mechanical arm 120 can suck the to-be-tested chips from the other automatic tray unstacking machine, so as to ensure the continuous operation of the detection assembly and improve the detection efficiency.

[0050] In an implementable manner of the embodiment of the present application, as shown in Figure 1 and Figure 6 The defective product tray is arranged on the workbench 110 by the material returning cylinder 141. When the defective product tray is full, the material returning cylinder 141 pushes the defective product tray to extend out of the workbench 110.

[0051] In order to facilitate reminding the staff that the defective product tray is full, the defective product tray is arranged on the workbench 110 by the material returning cylinder 141. When the defective product tray is full, the material returning cylinder 141 pushes the defective product tray to extend out of the workbench 110, so as to remind the staff to replace the defective product tray.

[0052] Optionally, as shown in Figure 1 and Figure 5 The mechanical arm 120 is a seven-axis mechanical arm 120, and the end of the seven-axis mechanical arm 120 is provided with a suction cup 163 for sucking the to-be-tested chips.

[0053] The mechanical arm 120 is a seven-axis mechanical arm 120, and the seven-axis mechanical arm 120 has seven degrees of freedom, which can provide higher flexibility and a larger motion range, so that the mechanical arm 120 can better pick up the to-be-tested chips. In addition, the end of the seven-axis mechanical arm 120 is provided with a suction cup 163 for sucking the to-be-tested chips, and the suction mode will not damage the surface of the chips.

[0054] The above descriptions are only the preferred embodiments of the present application, and are not intended to limit the present application. The present application can have various modifications and changes for those skilled in the art. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A shunt detection device, characterized by, The workbench comprises a loading and unloading area, a burr detection area and a plane detection area, the loading and unloading area is provided with an automatic loading assembly and a defective product tray, the burr detection area is provided with a burr detection assembly and a transfer assembly, the burr detection assembly is used for detecting the upper surface of a chip to be detected, the transfer assembly is used for transferring the chip to be detected from the burr detection area to the plane detection area, the plane detection area is provided with a plane detection assembly, the plane detection assembly is used for detecting the surface of the chip to be detected, and the working end of the mechanical arm is located above the workbench and is used for transferring the chip to be detected between the loading and unloading area and the burr detection area or between the loading and unloading area and the plane detection area.

2. The shunt detection device of claim 1, wherein, The burr detection assembly comprises a clamping piece, a first image acquisition piece and a first light source arranged on opposite sides of the clamping piece, the clamping piece clamps the side edge of the chip to be detected to expose the upper surface of the chip to be detected, the light emitting direction of the first light source is parallel to the upper surface of the chip to be detected, and the first image acquisition piece acquires the image of the chip to be detected from the side surface of the chip to be detected.

3. The shunt detection device of claim 2, wherein, The clamping piece is arranged on a moving platform, the moving platform is arranged on a guide rail, and the moving platform is driven to move along the guide rail to adjust the distance between the chip to be detected and the first image acquisition piece.

4. The shunt detection device of claim 2, wherein, The burr detection assembly further comprises a trigger, which is used to trigger the first light source and the first image acquisition piece when the chip to be detected is located in the clamping piece.

5. The shunt detection device of claim 2, wherein, The transfer assembly comprises a driving piece and a suction disc rod connected with the driving piece, the end of the suction disc rod is provided with a suction disc, the suction disc sucks the chip to be detected from the clamping piece, and the suction disc rod rotates under the driving of the driving piece to rotate the suction disc to the plane detection area.

6. The shunt detection device of claim 1, wherein, The plane detection assembly comprises a second image acquisition piece, a light source assembly, a moving cylinder and a supporting plate arranged on the moving cylinder, the chip to be detected is placed on the supporting plate and moves to the lower side of the light source assembly under the action of the moving cylinder.

7. The shunt detection device of claim 6, wherein, The light source assembly comprises a bowl light source and a ring light source, the ring light source, the bowl light source and the second image acquisition piece are sequentially arranged in a direction away from the workbench, and the chip to be detected is located below the orthographic projection of the enclosing space of the ring light source during detection.

8. The shunt detection device of claim 1, wherein, The automatic loading assembly comprises an automatic unstacking tray machine, the automatic unstacking tray machine has a working position, the mechanical arm sucks the chip to be detected from the tray on the working position and transfers it to the burr detection area, and the mechanical arm is also used for transferring good products from the plane detection area to the working position and transferring defective products from the plane detection area to the defective product tray.

9. The shunt detection device of claim 1, wherein, The defective product tray is arranged on the workbench by means of a material returning cylinder, so that the material returning cylinder pushes the defective product tray to extend out of the workbench when the defective product tray is full.

10. The shunt detection device of claim 1, wherein, The mechanical arm is a seven-axis mechanical arm, and the end of the seven-axis mechanical arm is provided with a suction disc for sucking the chip to be detected.

Images