Surface acoustic wave filter module packaging structure
By adopting a ceramic shell ear plate and lifting hole design in the surface acoustic wave (SAW) filter module packaging structure, combined with a limiting strip and roller electrode, the problem of metal cap misalignment was solved, the accuracy and convenience of the packaging process were achieved, and the sealing quality and efficiency were improved.
Patent Information
- Application Number
- CN202520141736.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-01-21
AI Technical Summary
The metal cap in the existing surface acoustic wave (SAW) filter module package lacks limiting, which can easily cause sealing defects due to displacement, and the package shell is difficult to remove due to heat.
The ceramic housing design is used, and the ear plate and lifting hole are used with the lifting tool to remove the encapsulation module. The metal cover is embedded and matched with the inner wall of the ceramic housing through the limiting strip. The roller electrode forms an airtight filling weld. The chip is adhered with epoxy resin adhesive and encapsulated through parallel sealing steps.
It enables precise installation of the metal cap during the packaging process, prevents positional displacement, ensures the quality of the sealing and soldering, and facilitates the removal of the packaging module after vacuum baking, thereby improving the reliability and efficiency of packaging.
Smart Images
Figure CN223744694U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a technical field of semiconductor, concretely is a kind of surface acoustic wave filter module package structure. BACKGROUND
[0002] Surface acoustic wave device is made using the planar technology of semiconductor integrated circuit, first interdigital transducer is prepared on piezoelectric substrate by photoetching, plating, stripping or etching process, then after subsequent packaging processes such as dicing, sticking, pressing wire, sealing welding, the final device is obtained.
[0003] In order to ensure that the device can be used for a long time, even in harsh environment, it is necessary to effectively package the device, the packaging of surface acoustic wave filter module in the prior art usually uses parallel sealing technology, which requires the device to be heated in a vacuum oven to remove water vapor and air first, and the packaging shell is difficult to take out during this process, in addition, the metal cover needs to be preliminarily fixed on the ceramic base, but the metal cover lacks limiting in the prior art, which is easy to cause defects in the subsequent sealing process due to deviation.
[0004] Therefore, in view of the above problems, the present utility model is improved in view of the existing structure, and a surface acoustic wave filter module packaging structure is provided. UTILITY MODEL CONTENTS
[0005] The utility model aims at providing a surface acoustic wave filter module packaging structure to solve the problems in the background art.
[0006] To achieve the above object, the utility model provides the following technical scheme: a surface acoustic wave filter module packaging structure, comprising a ceramic shell, the ceramic shell opening outer edge is fixed with ear plate, and the ceramic shell opening is covered with metal cover, and the bottom of metal cover is provided with limiting strip embedded in the inner wall of ceramic shell opening.
[0007] Further, the ear plate is symmetrically distributed at four corners of the opening outer edge of the ceramic shell, and a lifting hole is formed in the middle of the ear plate to cooperate with the lifting tool.
[0008] Further, the metal cover is provided with a roller electrode at the joint with the ceramic shell opening, and the roller electrode generates heat through high current to form an airtight filling weld at the joint.
[0009] Further, the ceramic shell is provided with a dicing tape adhesive at the bottom, and the dicing tape adhesive is made of epoxy resin material.
[0010] Further, the dicing tape adhesive is bonded with a piezoelectric substrate, and the piezoelectric substrate is provided with bus bars on both sides.
[0011] Further, the bus bar is externally connected with a lead wire, and an electrode sheet is connected to one end of the lead wire away from the bus bar.
[0012] Compared with the prior art, the utility model has the following beneficial effects:
[0013] 1、The utility model discloses in using, the surface filter adopts metal sealing cover, and the opening surface of ceramic shell is attached the pipe shell, is suitable to adopt parallel seal welding mode and is packed, and parallel seal welding is divided into vacuum baking, prewelding and seal welding three steps, and in the vacuum baking process, the device to be sealed is heated and baked in the vacuum oven to remove water vapor and air, the design of the four ear plates of the opening outer edge of the ceramic shell makes the user can take the relatively hot packaging module from the vacuum oven through the cooperation of the relevant lifting appliance and the lifting hole, and in the subsequent prewelding process, the metal sealing cover is embedded with the inner wall of the opening of the ceramic shell through the bottom limiting strip, guarantees the precision of the installation position of the metal sealing cover, prevents the subsequent seal welding defects caused by the position deviation of the metal sealing cover.
[0014] 2、The utility model discloses in using, uses the die -attaching adhesive and adheres the chip in the chip mounting area of the packaging pipe base, then uses the lead wire and carries out electrical conduction to the inside end point of the pressure welding point on the chip and the packaging pipe base pin, and after ultrasonic pressure welding, it is packed. BRIEF DESCRIPTION OF DRAWINGS
[0015] Fig. 1 It is whole structure schematic diagram of the utility model device;
[0016] Fig. 2 It is split structure schematic diagram of the utility model device;
[0017] Fig. 3 It is whole cross section structure schematic diagram of the utility model.
[0018] In the drawing: 1, ceramic shell;2, ear plate;3, lifting hole;4, metal sealing cover;5, limiting strip;6, roller electrode;7, die -attaching adhesive;8, piezoelectric substrate;9, bus bar;10, lead wire;11, electrode sheet. DETAILED DESCRIPTION
[0019] The embodiments of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but cannot be used to limit the scope of the utility model.
[0020] As Figs. 1-3As shown, a surface acoustic wave filter module packaging structure includes a ceramic shell 1, the ceramic shell 1 is fixed with an ear plate 2 at the opening outer edge, and the ceramic shell 1 is covered with a metal cover 4 at the opening, and the bottom of the metal cover 4 is provided with a limiting strip 5 embedded in cooperation with the inner wall of the opening of the ceramic shell 1, the ear plate 2 is symmetrically distributed at four corners of the opening outer edge of the ceramic shell 1, and the ear plate 2 is provided with a lifting hole 3 in the middle for cooperation with a lifting tool, the metal cover 4 is provided with a roller electrode 6 at the joint with the opening of the ceramic shell 1, and the roller electrode 6 generates heat through high current to form an airtight filling weld at the joint.
[0021] The specific operation is as follows: in the vacuum baking process, the device to be sealed is heated and baked in the vacuum oven to remove water vapor and air, the design of the four ear plates 2 at the opening outer edge of the ceramic shell 1 enables the user to take out the hot packaging module from the vacuum oven through the cooperation of the related lifting tool and the lifting hole 3, and in the subsequent pre-welding process, the embedded cooperation of the bottom limiting strip 5 of the metal cover 4 with the inner wall of the opening of the ceramic shell 1 ensures the accuracy of the installation position of the metal cover 4, preventing subsequent sealing and welding defects caused by the positional deviation of the metal cover 4.
[0022] As shown, Figs. 2-3 The ceramic shell 1 is provided with a die-attaching adhesive 7 at the inside bottom end, the die-attaching adhesive 7 is made of epoxy resin material, a piezoelectric substrate 8 is attached above the die-attaching adhesive 7, bus bars 9 are arranged on both sides of the piezoelectric substrate 8, lead wires 10 are connected to the bus bars 9, and electrode pieces 11 are connected to one end of the lead wires 10 away from the bus bars 9.
[0023] The specific operation is as follows: use the die-attaching adhesive 7 to adhere the chip to the chip mounting area of the packaging tube seat, then use the lead wire 10 to electrically conduct the pressure welding points on the chip and the internal end points of the packaging tube seat pins, and perform packaging after ultrasonic pressure welding.
[0024] Working principle: when using the surface acoustic wave filter module packaging structure, use the die-attaching adhesive 7 to adhere the chip to the chip mounting area of the packaging tube seat, then use the lead wire 10 to electrically conduct the pressure welding points on the chip and the internal end points of the packaging tube seat pins, and perform packaging after ultrasonic pressure welding, the surface acoustic wave filter adopts the metal cover 4, the opening surface of the ceramic shell 1 is attached with a tube shell, and parallel sealing and welding is suitable for packaging, which includes three steps of vacuum baking, pre-welding and sealing and welding, in the vacuum baking process, the device to be sealed is heated and baked in the vacuum oven to remove water vapor and air, the design of the four ear plates 2 at the opening outer edge of the ceramic shell 1 enables the user to take out the hot packaging module from the vacuum oven through the cooperation of the related lifting tool and the lifting hole 3, and in the subsequent pre-welding process, the embedded cooperation of the bottom limiting strip 5 of the metal cover 4 with the inner wall of the opening of the ceramic shell 1 ensures the accuracy of the installation position of the metal cover 4, preventing subsequent sealing and welding defects caused by the positional deviation of the metal cover 4.
[0025] The embodiments of the present application are given for the purpose of illustration and description, and are not intended to be exhaustive or to limit the application to the forms disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. Embodiments were chosen and described in order to best explain the principles of the application and its practical application, and to thereby enable others skilled in the art to best utilize the application with various modifications as are suited to the particular use contemplated.
Claims
1. A structure of a surface acoustic wave filter module package comprising a ceramic housing (1), characterized in that, The ceramic shell (1) is fixed with an ear plate (2) on the opening edge, and the opening of the ceramic shell (1) is covered with a metal cover (4), and the bottom of the metal cover (4) is provided with a limiting strip (5) embedded in cooperation with the inner wall of the opening of the ceramic shell (1).
2. The structure of claim 1, wherein, The ear plate (2) is symmetrically distributed at four corners of the opening edge of the ceramic shell (1), and a lifting hole (3) is formed in the middle of the ear plate (2) to cooperate with the lifting appliance.
3. The structure of claim 2, wherein the structure is a surface acoustic wave filter module package structure. The metal cover (4) is provided with a roller electrode (6) at the joint with the opening of the ceramic shell (1), and the roller electrode (6) generates heat through high current to form a gas-tight filling weld at the joint.
4. The structure of claim 3, wherein the structure is a surface acoustic wave filter module package structure. The ceramic shell (1) is provided with a die-attaching adhesive (7) at the bottom inside, and the die-attaching adhesive (7) is made of epoxy resin material.
5. The structure of claim 4, wherein the structure is a surface acoustic wave filter module package structure. The die-attaching adhesive (7) is bonded with a piezoelectric substrate (8) above, and the piezoelectric substrate (8) is provided with a bus bar (9) on both sides.
6. The structure of claim 5, wherein, The bus bar (9) is connected with a lead (10) away from the bus bar (9), and the end of the lead (10) is connected with an electrode sheet (11).