Broadband 1GHz-8GHz 8*8 full-switching matrix board card

Abstract

The utility model relates to a broadband 1GHz-8GHz 8 * 8 full-switching matrix board card, which belongs to the technical field of satellite communication, and comprises power division unit groups, switch unit groups and an MCU (Microprogrammed Control Unit), the two power division unit groups are arranged above the switch unit groups, the signal input end of the switching board card is connected with the signal input ends of the power division unit groups through radio frequency cables, and the signal input end of the switching board card is connected with the signal input ends of the switch unit groups through radio frequency cables. The signal output of the power division unit group is connected with the signal input end of the switch unit group through a BMA blind plugging connector, and the output end of the switch unit group is connected with the signal output end of the switching board card through a radio frequency cable; a GaAs power division chip and an SBMA vertical interconnection technology are adopted, so that the size of a board card is optimized to be 242 * 170 * 26 mm, the size is greatly reduced, cascade expansion of a plurality of board cards is facilitated, and a larger-scale signal switching network is formed. And the usability and the control efficiency of the system are improved. And the cascade expansion capability is that a plurality of board cards can be easily cascaded to form a larger-scale full switching matrix.

Description

Technical Field

[0001] This utility model belongs to the field of satellite communication technology, specifically, it relates to the field of satellite ground station radio frequency signal exchange technology. Background Technology

[0002] Radio frequency (RF) signal switching is primarily used in satellite ground station systems. RF signal switching allows multiple terminal devices to share a single antenna, and any single terminal can freely select any antenna. RF signal switching technology, employing matrix equipment, enables point-to-multipoint or multipoint-to-point full switching of signal input and output.

[0003] like Figure 1 The following is a description of the existing technology: Currently, the industry implements 8×8 switching components by combining power divider modules and switch modules. Due to the wide frequency range, the power divider circuit uses an 8th-order microstrip power divider. The entire switching module measures 247×116×135mm, and the switch uses SPI control. The disadvantages of this existing technology are: the switching component is relatively large, which is not conducive to cascading expansion, and since the switch control is SPI-centric, an external main control board is needed for interface conversion before control can be achieved via a computer serial port. Utility Model Content

[0004] This utility model aims to solve the problems of the prior art mentioned above. It proposes a broadband 1GHz~8GHz 8×8 ​​fully switched matrix board. The technical solution of this utility model is as follows:

[0005] A broadband 1GHz~8GHz 8×8 ​​full-switching matrix board includes: power divider units, switching units, and an MCU control unit. Two power divider units are located above the switching units. The signal input terminals of the switching board are connected to the signal input terminals of the power divider units via RF cables. The signal output terminals of the power divider units are connected to the signal input terminals of the switching units via BMA connectors. The output terminals of the switching units are connected to the output signal output terminals of the switching board via RF cables.

[0006] Furthermore, the power distribution unit group and the switch unit group are interconnected using an SBMA vertical interconnection method.

[0007] Furthermore, the board measures 242×170×26mm, facilitating cascading expansion of multiple boards.

[0008] Furthermore, the MCU control unit includes a shift controller for converting serial port control signals into SPI signals, and then controlling the selection of the switch unit group via TTL level signals.

[0009] Furthermore, the signal input terminal of the board is connected to the input terminal of the power divider group via an RF cable, and the output of the power divider group is connected to the input terminal of the switch unit group via a BMA connector.

[0010] Furthermore, the board can realize an 8-input, 8-output full-switching matrix function, where signals from any input port can be selectively directed to any output port, and it supports direct control via computer serial port. The advantages and beneficial effects of this invention are as follows:

[0011] 1. Chip-based design of power divider circuit: Traditional power divider circuits are implemented using complex microstrip lines or hybrid microwave circuits. This invention, however, selects a GaAs (gallium arsenide) power divider chip. This chip-based design not only reduces the circuit size and improves the integration density, but also ensures stable RF performance over a wide bandwidth of 1GHz to 8GHz. Since GaAs has good performance in the high-frequency range, its application in power divider circuits is innovative because it effectively solves the loss and instability problems of traditional power divider circuits at high frequencies.

[0012] 2. SBMA Vertical Interconnect Technology: This invention employs SBMA (Small Blind Mate Aperture) vertical interconnect technology to tightly connect the power divider unit group and the switching unit group. This design significantly reduces the board size, while also reducing signal transmission paths, lowering signal loss, and improving switching efficiency. The application of SBMA technology is not common in RF switching matrices because it requires addressing complex issues such as signal integrity and electromagnetic compatibility, making innovative solutions difficult to conceive.

[0013] 3. Onboard MCU Control Unit: This invention integrates an MCU control unit within the board, which can directly convert external serial port control signals into SPI signals to control the selection of RF switches, eliminating dependence on an external main control board. This integrated design not only simplifies the system's control architecture but also improves the real-time performance and flexibility of control, allowing the computer to directly control the switching matrix without additional control logic.

[0014] The corresponding beneficial effects include:

[0015] 1. Miniaturization and high integration: By adopting GaAs power divider chips and SBMA vertical interconnect technology, the board size is optimized to 242×170×26mm, which greatly reduces the volume and facilitates the cascading expansion of multiple boards to form a larger-scale signal exchange network.

[0016] 2. Direct computer control: The onboard MCU control unit directly supports serial port control, which simplifies the control process and allows users to control the switching matrix more conveniently through a computer, improving the system's ease of use and control efficiency.

[0017] 3. Cascading expansion capability: The miniaturized design and direct control feature allow multiple boards to be easily cascaded to form a larger-scale full-switching matrix, meeting the needs of satellite communication systems for large-scale, highly flexible RF signal switching.

[0018] The reason these innovations are not easy to come up with is that they involve knowledge from multiple interdisciplinary fields such as radio frequency technology, integrated circuit design, and signal processing. They require a deep understanding of the limitations of traditional RF switching matrices and innovative thinking in high-frequency, broadband, and control logic. In addition, the selection of power divider chips, the application of SBMA vertical interconnect technology, and the integration of MCU control units all require balancing and making trade-offs between technical feasibility, cost control, and system performance, which increases the difficulty of innovation. Attached Figure Description

[0019] Figure 1 This is a block diagram of a traditional 8×8 power divider switch.

[0020] Figure 2 This utility model provides a schematic diagram of the 8×8 switching board composition of a preferred embodiment;

[0021] Figure 3 This is a schematic diagram of the structure of an 8×8 switching board;

[0022] Figure 4 This is an exploded view of an 8×8 switching board structure. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and thoroughly described below with reference to the accompanying drawings of the embodiments. The described embodiments are merely some embodiments of the present invention.

[0024] The technical solution of this utility model to solve the above-mentioned technical problems is:

[0025] like Figure 1-4As shown, this device comprises a power divider unit group, a switch unit group, and an MCU control unit. The positions and connections of the components are as follows: two power divider unit groups are located above the switch unit groups. The signal input terminals of the switching board are connected to the signal input terminals of the power divider unit groups via RF cables. The signal output terminals of the power divider unit groups are connected to the signal input terminals of the switch unit groups via BMA connectors. The output terminals of the switch unit groups are connected to the output signal output terminals of the switching board via RF cables. The power divider unit groups are used to evenly distribute the input RF signal power to multiple output ports. These power divider unit groups utilize GaAs power divider chips to achieve broadband power distribution from 1GHz to 8GHz. The switch unit groups are used to select the input signal for output based on the control signal. These switch unit groups are controlled via SPI signals. The MCU control unit is used to convert external serial port control signals into SPI signals, thereby controlling the signal path selection of the switch unit groups. The MCU control unit converts external serial port control signals into SPI signals, and the SPI signals are converted into TTL level signals by a shift controller to control the switch selection. It should be noted that the present utility model seeks protection for the above components and the positional and connection relationships between them. The related computer programs such as the MCU control unit and SPI signal control involved are existing conventional technologies and are not within the scope of protection of the present utility model. Therefore, they are the subject of the utility model protection.

[0026] The following description uses two specific embodiments:

[0027] Example 1: Basic Implementation

[0028] 1. Power Divider Unit Design: First, two GaAs (Gallium Arsenide) power divider chips were designed and integrated. Each chip is responsible for evenly distributing the input RF signal to the four output ports within the 1GHz to 8GHz frequency band. The GaAs chip was chosen based on its excellent RF performance and stability over a wide bandwidth.

[0029] 2. Switch Unit Group Configuration: Next, a switch unit group consisting of 16 high-speed SPI-controlled RF switches is configured. Each switch is responsible for connecting or disconnecting the path between the power divider unit group's output and the board's output port. The switches are controlled via SPI signals to ensure rapid switching of signal paths.

[0030] 3. MCU Control Unit Integration: A microcontroller unit (MCU) is designed and integrated. Its function is to receive external serial port control signals and convert them into SPI signals through an internal shift controller, thereby controlling the selection of the switching unit group. MCU integration avoids dependence on an external main control board and simplifies the control process.

[0031] 4. Circuit Layout and Connection: In terms of circuit layout, the two power divider units are located above the switching unit group and are vertically interconnected via BMA connectors, reducing signal path length and board size. The signal input terminals of the board are connected to the power divider units via RF cables, while the outputs of the power divider units are connected to the output terminals of the board via RF cables, ensuring efficient signal transmission.

[0032] 5. Structural Design and Dimensions: The board adopts a compact structural design with an optimized size of 242×170×26mm, which facilitates the cascading of multiple boards to form a larger-scale full-switching matrix.

[0033] 6. Testing and Verification: Finally, the RF performance of the board was tested to verify its signal switching capability in the broadband range of 1GHz to 8GHz, as well as the feasibility of direct control via computer serial port.

[0034] Example 2: Cascaded Expansion Implementation

[0035] 1. Board Cascading Design: Based on the basic implementation method, a board cascading interface is designed to allow multiple switching boards to be connected in series or parallel to form a larger-scale signal switching network. Each board connects to adjacent boards through a dedicated interface to achieve continuous signal exchange.

[0036] 2. Cascading Expansion of Control Signals: The software of the MCU control unit is optimized to handle control signals from cascaded boards, enabling unified control of multiple boards. Control commands received via the serial port are intelligently distributed by the MCU to each cascaded board, ensuring accurate signal path selection.

[0037] 3. Enhanced RF Performance: In cascaded expansion scenarios, the RF performance of the power divider and switching unit groups is enhanced to address the impact of increased signal attenuation and signal integrity as the signal switching network grows. For example, this involves increasing the dynamic range of the power divider chip and optimizing the switching time and isolation of the switches.

[0038] 4. Architecture Design and Testing: Design an architecture that supports cascading expansion, and build and test the signal switching network to verify the signal switching efficiency and control flexibility when multiple boards are cascaded.

[0039] The systems, devices, modules, or units described in the above embodiments can be implemented by computer chips or entities, or by products with certain functions.

[0040] It should also be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] The above embodiments should be understood as illustrative only and not as limiting the scope of protection of this utility model. After reading the description of this utility model, those skilled in the art can make various alterations or modifications to it, and these equivalent changes and modifications also fall within the scope defined by the claims of this utility model.

Claims

1. A wideband 1GHz-8GHz 8x8 full crossbar board, characterized by, The application relates to a switching board card, which comprises a power division unit group, a switch unit group and an MCU control unit, wherein the two power division unit groups are above the switch unit group, the signal input end of the switching board card is connected with the signal input end of the power division unit group through a radio frequency cable, the signal output of the power division unit group is connected with the signal input end of the switch unit group through a BMA connector, and the output end of the switch unit group is connected with the output signal output end of the switching board card through a radio frequency cable. The power division unit group and the switch unit group are connected in a vertical interconnection mode through an SBMA blind plug-in radio frequency connector.

2. The wideband 1GHz-8GHz 8x8 full crossbar board of claim 1, wherein, The size of the board card is 242*170*26mm, so that multiple board cards can be cascaded and expanded.

3. The wideband 1-8 GHz 8x8 full crossbar board of claim 1, wherein, The MCU control unit comprises a shift controller, which is used for converting a serial port control signal into an SPI signal, and then controlling the selection of the switch unit group through a TTL level signal.

4. The wideband 1-8 GHz 8x8 full cross-connect matrix board card of claim 1, wherein, The signal input end of the board card is connected with the input end of the power division unit group through a radio frequency cable, and the output of the power division unit group is connected with the input end of the switch unit group through a BMA connector.

5. The wideband 1-8 GHz 8x8 full cross-connect matrix board card of claim 1, wherein, The board card can realize the full switching matrix function of 8 inputs and 8 outputs, the signals of any input port can be selectively guided to any output port, and the computer serial port direct control is supported.

6. The wideband 1GHz-8GHz 8x8 full cross-matrix board card according to any one of claims 1-5, wherein, ​

Images