Package encapsulation sensor chip assembly structure

Abstract

The utility model relates to the technical field of chip assembly, in particular to a packaging rubber coating sensor chip assembly structure, which comprises an assembly body and a plate body, the same side of the plate body is provided with an assembly groove and a rubber injection port, the assembly groove is used for accommodating the assembly body, and the assembly body is in clearance fit with the assembly groove; wherein an annular first glue injection groove is formed in the outer axial surface of the assembly body, an annular second glue injection groove is formed in the inner axial surface of the assembly groove, the first glue injection groove and the second glue injection groove are located on the same plane, and the glue injection opening is communicated with the second glue injection groove. According to the utility model, through the clearance fit design of the assembly body and the assembly groove, the assembly body can be rapidly placed in the assembly groove, a complex alignment process is not needed, and the assembly steps are simplified; by means of the glue injection opening formed in one side of the assembly groove, glue can be directly and evenly injected into the first glue injection groove and the second glue injection groove, the glue overflowing phenomenon is prevented, the uniformity of glue filling is guaranteed, the glue injection operation difficulty is reduced, and the connection stability between the assembly body and the plate body is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip assembly technical field especially relates to a kind of encapsulation rubber-coated sensor chip assembly structure. BACKGROUND

[0002] RFID tag sensor, i.e. radio frequency identification technology, is a kind of non-contact automatic identification technology, which automatically identifies target objects and obtains relevant data through radio frequency signals, has the advantages of reusability, strong penetration, large data memory capacity, strong system security, etc., and is widely used in asset management, intelligent manufacturing, warehouse management and other fields.

[0003] To prevent damage to the tag sensor during use and avoid affecting the normal use of the tag sensor, in the related art, the RFID tag sensor is usually assembled in the form of encapsulation and rubber coating, i.e. the chip or other sensitive components are placed in a protective shell, and then the internal components together with the shell are placed in a pre-processed sink on the end plate, and then a special adhesive material such as epoxy resin is used for sealing to provide mechanical protection and electrical isolation. However, during the glue injection process, the end face of the end plate is flush with the outer surface of the shell, making it inconvenient to perform glue injection operation, and the adhesive is difficult to uniformly enter the gap between the shell and the sink during the glue injection process, making it difficult to ensure the stability of the assembly connection after solidification.

[0004] The information disclosed in this BACKGROUND section is only intended to enhance the understanding of the general background of the present utility model, and should not be construed as recognition or implicit acknowledgment in any form that this information constitutes prior art known to those skilled in the art. SUMMARY

[0005] The technical problem to be solved by the present utility model is to provide an encapsulation rubber-coated sensor chip assembly structure that can quickly and conveniently assemble sensor chips and ensure the stability of the assembly connection of the sensor chips.

[0006] To achieve the above-mentioned purpose, the utility model adopts the technical scheme of: an encapsulation rubber-coated sensor chip assembly structure, comprising: an assembly body and a plate body, the same side of the plate body is provided with an assembly groove and a glue injection port, the assembly groove is used to accommodate the assembly body, and the assembly body and the assembly groove are gap-fitted;

[0007] Among them, the outer shaft surface of the assembly body is provided with an annular first glue injection groove, the inner shaft surface of the assembly groove is provided with an annular second glue injection groove, the first glue injection groove and the second glue injection groove are located on the same plane, and the glue injection port is in communication with the second glue injection groove.

[0008] Further, the cross section of the assembly groove and the assembly body is circular.

[0009] Further, the glue injection channel is arranged between the glue injection port and the second glue injection groove, and an axis of the glue injection channel is arranged parallel to an axis of the assembly groove.

[0010] Further, the exhaust port is arranged on a side of the plate body away from the glue injection port and is arranged in communication with the second glue injection groove.

[0011] Further, the exhaust channel is arranged between the exhaust port and the second glue injection groove, and an axis of the exhaust channel is arranged parallel to the axis of the assembly groove.

[0012] Further, the exhaust channel and the glue injection channel are arranged at two ends of the same diameter of the assembly groove.

[0013] Further, the second glue injection groove comprises an upper end face, a lower end face and a groove face, inner side faces of the glue injection channel and the exhaust channel are arranged in intersection with the groove face, an end face of the glue injection channel away from the glue injection port is arranged on the same plane as the lower end face, and an end face of the exhaust channel away from the exhaust port is arranged on the same plane as the upper end face.

[0014] Further, the assembly body comprises a chip body and a chip shell, the chip shell is arranged to cover an outer portion of the chip body, and the first glue injection groove is arranged on an outer axial face of the chip shell.

[0015] The utility model discloses the gap cooperation design of assembly body and assembly groove makes assembly body can be put into assembly groove quickly, need not complex alignment process, simplifies the assembly step, and through the glue injection port of being arranged at one side of assembly groove, can even inject glue to the first glue injection groove and the second glue injection groove, prevents the overflow phenomenon, guarantees the evenness of colloid filling, reduces the difficulty of glue injection operation, and then guarantees the connection stability between assembly body and plate body after solidification. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawing needed to be used in the embodiment or prior art description, and obviously, the drawing in the following description is only some embodiments in the utility model, and for ordinary skilled in the art, other drawings can also be obtained according to these drawings without creating labor.

[0017] Figure 1 It is the structure schematic view of the encapsulation and glue packing sensor chip assembly structure in the embodiment of the utility model;

[0018] Figure 2 It is the structure schematic view of the assembly body in the embodiment of the utility model.

[0019] Figure 3 It is the structure schematic view of the plate body in the embodiment of the utility model;

[0020] Figure 4 It is the top view of the encapsulation rubber-coated sensor chip assembly structure in the embodiment of the utility model;

[0021] Figure 5 It is Figure 4 The sectional view at A-A.

[0022] Reference signs: 10, assembly body; 11, chip body; 12, chip shell; 12a, first glue injection groove; 20, plate body; 21, glue injection port; 21a, glue injection channel; 22, assembly groove; 23, second glue injection groove; 23a, upper end face; 23b, lower end face; 23c, groove face; 24, exhaust port; 24a, exhaust channel. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0024] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be an intervening element. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right" and similar expressions as used herein are for illustrative purposes only and are not meant to be limiting.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this description, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] As Figures 1 to 5 The encapsulation rubber-coated sensor chip assembly structure shown in the figure comprises an assembly body 10 and a plate body 20, the plate body 20 is provided with an assembly groove 22 and a glue injection port 21 on the same side, the assembly groove 22 is used for accommodating the assembly body 10, and the assembly body 10 is in clearance fit with the assembly groove 22;

[0027] The outer axial surface of the assembly body 10 is provided with a ring-shaped first glue injection groove 12a, the inner axial surface of the assembly groove 22 is provided with a ring-shaped second glue injection groove 23, the first glue injection groove 12a and the second glue injection groove 23 are located on the same plane, and the glue injection port 21 is in communication with the second glue injection groove 23.

[0028] The utility model discloses a gap cooperation design between the assembly body 10 and the assembly groove 22, so that the assembly body 10 can be quickly put into the assembly groove 22 without a complex alignment process, simplifying the assembly steps.

[0029] It is to be noted that by arranging the first glue injection groove 12a and the second glue injection groove 23 on the same plane, the glue can fully cover the contact space between the assembly body 10 and the assembly groove 22, and after solidification, the assembly body 10 is limited, preventing the assembly body 10 from being pulled out due to improper connection, and ensuring the stability of the assembly connection.

[0030] On the basis of the above embodiment, the cross section of the assembly groove 22 and the assembly body 10 is circular; the assembly groove 22 can be obtained by machining, and the assembly body 10 can be obtained by molding, thereby reducing the assembly error, improving the reliability of the assembly, and the circular cross section makes the glue injection process more smooth, avoids the formation of a filling gap at the corner, ensures the uniformity of the glue filling, and enhances the connection strength of the assembly body 10 and the assembly groove 22.

[0031] On the basis of the above embodiment, the glue injection channel 21a is arranged between the glue injection port 21 and the second glue injection groove 23, and the axis of the glue injection channel 21a and the axis of the assembly groove 22 are arranged in parallel; the parallel arrangement of the glue injection channel 21a allows the glue to flow straight, the glue can directly flow into the second glue injection groove 23 and the first glue injection groove 12a, reducing the waste of the glue during flow and the resistance during glue injection, thereby improving the glue injection efficiency; and the glue flows more smoothly, reducing the generation of bubbles during glue injection, thereby reducing the formation of voids after the glue solidifies.

[0032] On the basis of the above embodiment, the plate body 20 is further provided with an exhaust port 24, which is located on the side of the plate body 20 away from the glue injection port 21 and is in communication with the second glue injection groove 23; it is ensured that the air in the first glue injection groove 12a and the second glue injection groove 23 can be discharged in time during the glue injection process, so as to avoid that the air is compressed by the glue and hinders the flow of the glue, thereby improving the glue injection efficiency, and also reducing the formation of bubbles during the glue solidification process, ensuring that the glue is tightly combined with the assembly body 10 and the assembly groove 22, and improving the sealing performance and the connection reliability of the label sensor assembly.

[0033] On the basis of the above embodiment, the exhaust port 24 and the second glue injection groove 23 are provided with an exhaust passage 24a, and the axis of the exhaust passage 24a and the axis of the assembly groove 22 are arranged in parallel with each other; it is ensured that the gas is quickly discharged during the glue injection process, thereby avoiding the accumulation of the gas in the second glue injection groove 23, and improving the exhaust efficiency and the uniformity of the glue injection.

[0034] On the basis of the above embodiment, the exhaust passage 24a and the glue injection passage 21a are arranged at two ends of the assembly groove 22 with the same diameter; it is ensured that the balance of the glue injection and the exhaust process is achieved, the bubbles and the gaps caused by the uneven flow are reduced, the glue is uniformly distributed in the first glue injection groove 12a and the second glue injection groove 23, and the uniformity of the glue filling is improved.

[0035] On the basis of the above embodiment, the second glue injection groove 23 includes an upper end surface 23a, a lower end surface 23b and a groove surface 23c, the inner side surfaces of the glue injection passage 21a and the exhaust passage 24a are arranged in intersection with the groove surface 23c, the glue injection and the exhaust rate are increased, and the overall assembly efficiency is improved; the end surface of the glue injection passage 21a away from the glue injection port 21 is located on the same plane as the lower end surface 23b, and the end surface of the exhaust passage 24a away from the exhaust port 24 is located on the same plane as the upper end surface 23a; the glue in the glue injection passage 21a, the first glue injection groove 12a, the second glue injection groove 23 and the exhaust passage 24a forms a special-shaped integrated structure after the glue solidification, thereby effectively preventing the assembly body 10 from being separated, and ensuring the reliability of the assembly connection.

[0036] On the basis of the above embodiment, the assembly body 10 includes a chip body 11 and a chip shell 12, the chip shell 12 is arranged outside the chip body 11, and the first glue injection groove 12a is arranged on the outer shaft surface of the chip shell 12; it is to be noted that the chip shell 12 and the chip body 11 are formed by integrally packaging and injection molding, thereby forming a closed whole, providing physical protection for the chip body 11, avoiding damage to the chip body 11 caused by impact and wear during use, prolonging the service life, reducing the interference of the external environment on the work of the chip body 11, and improving the stability and reliability of the label sensor.

[0037] The person skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments, the above-mentioned embodiments and the description are only for explaining the principle of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed for protection. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A sensor chip assembly structure with encapsulation and coating, characterized in that, The utility model relates to a kind of chip mounting device, including: Assembly body and plate body, the same side of the plate body is provided with assembly slot and glue injection port, the assembly slot is used to accommodate the assembly body, and the assembly body is clearance fit with the assembly slot; Wherein, the outer axial surface of the assembly body is provided with annular first glue injection groove, the inner axial surface of the assembly slot is provided with annular second glue injection groove, the first glue injection groove and the second glue injection groove are located on the same plane, and the glue injection port is communicated with the second glue injection groove.

2. The encapsulated sensor chip-on-film assembly structure of claim 1, wherein, The cross section of the assembly slot and the assembly body is circular.

3. The encapsulated sensor chip-on-film assembly structure of claim 2, wherein, Glue injection channel is provided between the glue injection port and the second glue injection groove, and the axis of the glue injection channel and the axis of the assembly slot are arranged parallel to each other.

4. The encapsulated sensor chip package assembly of claim 3, wherein, The plate body is further provided with exhaust port, the exhaust port is located on the side of the plate body away from the glue injection port, and is communicated with the second glue injection groove.

5. The encapsulated sensor chip package assembly of claim 4, wherein, Exhaust channel is provided between the exhaust port and the second glue injection groove, and the axis of the exhaust channel and the axis of the assembly slot are arranged parallel to each other.

6. The encapsulated sensor chip package assembly of claim 5, wherein, The exhaust channel and the glue injection channel are respectively arranged at both ends of the assembly slot with the same diameter.

7. The encapsulated sensor chip package assembly of claim 6, wherein, The second glue injection groove includes upper end face, lower end face and groove face, the inner side of the glue injection channel and the exhaust channel is intersected with the groove face, the end face of the glue injection channel away from the glue injection port is located on the same plane with the lower end face, and the end face of the exhaust channel away from the exhaust port is located on the same plane with the upper end face.

8. The encapsulated sensor chip package assembly structure of claim 2, wherein, The assembly body includes chip body and chip shell, the chip shell is wrapped and arranged outside the chip body, and the first glue injection groove is arranged on the outer axial surface of the chip shell.

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