Optical module

Abstract

The optical module provided by the utility model comprises a circuit board; the light emitting component is electrically connected with the circuit board; the light emitting component comprises a light emitting assembly which is electrically connected with the circuit board and is used for generating multiple beams of light signals; the optical coupling assembly is located on an output light path of the light emitting assembly, and the optical coupling assembly is connected with an optical fiber; the optical coupling assembly comprises a first optical fiber supporting plate which supports and is connected with the optical fiber; the first optical fiber cover plate is connected with the first optical fiber supporting plate in a covering manner; the first light beam adjusting piece comprises a first base body and a first transmission waveguide located in the first base body, and the refractive index of the first base body is smaller than that of the first transmission waveguide; the first transmission waveguide extends from one end of the first substrate to the other end of the first substrate; one end of the first transmission waveguide is in optical coupling connection with the optical fiber, and the other end of the first transmission waveguide is used for inputting an optical signal. The optical module provided by the utility model is convenient to adapt to the high-speed development requirement of the optical module.

Description

Technical Field

[0001] This disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve.

[0003] To meet the demands of optical communication technology development, the transmission rate of optical modules is constantly increasing, especially in recent years, with 800G optical modules gradually being introduced to the market. To achieve the transmission rate of 800G optical modules, it is necessary to integrate 8 optical transmitters and 8 optical receivers in a QSFP-DD or OSFP package. Achieving the required functions in such a small space poses a significant challenge in terms of high-frequency performance, optical performance, heat dissipation characteristics, structural complexity, manufacturability, and more. Utility Model Content

[0004] Some embodiments provide an optical module that is easy to adapt to the high-speed development needs of optical modules.

[0005] Some embodiments provide an optical module, including:

[0006] Circuit board;

[0007] The light emitting component is electrically connected to the circuit board;

[0008] The light emitting component includes:

[0009] A light-emitting component, electrically connected to the circuit board, is used to generate multiple light signals;

[0010] An optical coupling component is located in the output optical path of the light-emitting component, and the optical coupling component is connected to an optical fiber;

[0011] The optical coupling component includes:

[0012] The first fiber optic support plate supports the connection of the optical fiber;

[0013] The first optical fiber cover plate covers and connects to the first optical fiber support plate;

[0014] The first beam adjustment component includes a first substrate and a first transmission waveguide located in the first substrate. The refractive index of the first substrate is less than the refractive index of the first transmission waveguide. The first transmission waveguide extends from one end of the first substrate to the other end of the first substrate. One end of the first substrate is connected to the first optical fiber support plate, one end of the first transmission waveguide is optically coupled to the optical fiber, and the other end of the first transmission waveguide is optically connected to the light-emitting component.

[0015] One of the above technical solutions has the following advantages or beneficial effects: the optical fiber coupling component is located on the output optical path of the light-emitting component. The optical coupling component includes a first optical fiber support plate, a first optical fiber cover plate, and a first beam adjustment component. The first optical fiber support plate covers and connects to the first optical fiber cover plate to facilitate the fixed connection of the optical fiber to the optical coupling component. The first beam adjustment component includes a first substrate and a first transmission waveguide, with the first transmission waveguide extending from one end of the first substrate to the other end. One end of the first substrate is connected to the first optical fiber support plate, allowing the optical fiber to be coupled to the first transmission waveguide, while the other end of the first substrate is close to the light-emitting component. The refractive index of the first substrate is less than that of the first transmission waveguide. When the optical signal is coupled and transmitted into the first transmission waveguide, it is easier to confine the optical signal within the first transmission waveguide, allowing the optical signal to transmit along the extension direction of the first transmission waveguide. Therefore, the optical signal generated by the light-emitting component is transmitted to the other end of the optical coupling component, coupled to the first transmission waveguide via the other end, and then transmitted along the first transmission waveguide to one end, where it is coupled into the optical fiber.

[0016] Compared to using a traditional fiber optic array to couple the optical signal generated by the light-emitting component into the optical fiber, the present invention allows the optical fiber to be connected to the first fiber optic support plate in the form of a fiber optic ribbon, which facilitates the reduction of the size of the first fiber optic support plate and the first fiber optic cover plate, thereby reducing the volume of the light-emitting component. In addition, the first transmission waveguide in the first beam adjustment component can be adjusted for bending as needed, which can replace the bending of the optical fiber and adapt to light-emitting components of different specifications.

[0017] In some embodiments, an optical module is provided, wherein the optical coupling component connects multiple optical fibers; a first substrate is provided with multiple first transmission waveguides; the spacing between adjacent first transmission waveguides at one end of the first substrate is smaller than the spacing between adjacent first transmission waveguides at the other end of the first substrate.

[0018] Another technical solution described above has the following advantages or beneficial effects: the optical coupling component connects multiple optical fibers, allowing the first optical fiber support plate to support and connect the multiple optical fibers. Multiple first transmission waveguides are disposed in the first substrate, enabling the first transmission waveguides to correspond to the optical fibers. The spacing between adjacent first transmission waveguides at one end of the first substrate is smaller than the spacing between adjacent first transmission waveguides at the other end of the first substrate, making the spacing between adjacent first transmission waveguides closer to the optical fiber smaller than that at the end farther from the optical fiber. This allows the first transmission waveguides to adapt to the spacing of the beam generated by the light-emitting component, ensuring that the optical signal can be coupled and transmitted into the optical fiber. Furthermore, the multiple optical fibers can be connected to the optical coupling component in the form of a side-by-side optical fiber ribbon, which helps reduce fiber damage, ensures the service life of the optical fibers, and simplifies the formation of multiple optical fibers.

[0019] Some embodiments provide an optical module, further comprising an optical receiving component, the optical receiving component including:

[0020] A photodetector assembly for receiving optical signals;

[0021] A beam expander is located on the receiving optical path of the optical detection component; one end of the beam expander is connected to an optical fiber, and the other end of the beam expander is located above the optical detection component.

[0022] The beam expander assembly includes:

[0023] The second fiber optic support plate supports the connection of the fiber optic cable;

[0024] The second optical fiber cover plate covers and connects to the second optical fiber support plate;

[0025] The second beam adjustment component includes a second substrate and a second transmission waveguide located in the second substrate, wherein the refractive index of the second substrate is less than the refractive index of the second transmission waveguide; the second transmission waveguide extends from one end of the second substrate to the other end of the second substrate; one end of the second transmission waveguide is optically coupled to the optical fiber, and the other end of the second transmission waveguide is located above the photodetector assembly.

[0026] Another technical solution described above has the following advantages or beneficial effects: the beam expander is located on the receiving optical path of the optical detector, so as to transmit the optical signal input through the optical fiber to the corresponding optical detector in the optical detector through the beam expander. The beam expander includes a second optical fiber support plate, a second optical fiber cover plate, and a second beam adjustment component. The second optical fiber cover plate and the second optical fiber support plate are closed together to facilitate the fixed connection of the optical fiber to the beam expander. The second beam adjustment component includes a second substrate and a second transmission waveguide, with the second transmission waveguide extending from one end of the second substrate to the other end. One end of the second substrate is connected to the second optical fiber support plate, so that the optical fiber is coupled to the second transmission waveguide, and the other end of the second substrate is located above the optical detector. The refractive index of the second substrate is less than that of the second transmission waveguide. When the optical signal is coupled and transmitted into the second transmission waveguide, it is convenient to confine the optical signal in the second transmission waveguide, so that the optical signal is transmitted along the extension direction of the second transmission waveguide. Therefore, the optical signal input through the optical fiber is transmitted to one end of the second beam adjustment component, coupled into the second transmission waveguide through one end, and transmitted along the second transmission waveguide to the other end of the second transmission waveguide. Finally, it is reflected by the other end of the second transmission waveguide and transmitted to the photodetector component.

[0027] Compared to using traditional fiber optic arrays to transmit optical signals input through optical fibers to the photodetector, the solution provided in this disclosure allows the optical fiber to be connected to the second fiber optic support in the form of a fiber ribbon, which facilitates the reduction of the size of the second fiber optic support and the second fiber optic cover, thereby reducing the volume of the optical receiving component. Furthermore, the second transmission waveguide in the second beam adjustment component can be adjusted in bending as needed, facilitating the replacement of fiber optic bending and adapting to photodetector components of different specifications.

[0028] In some embodiments, an optical module is provided, wherein the circuit board has mounting holes, and the optical emitting component further includes an emitting base, the emitting base supporting and connecting the light-emitting component and the optical coupling component, such that the light-emitting component and the optical coupling component are located within the mounting holes;

[0029] The light receiving component is located on the front side of the circuit board; a first heat dissipation part is formed on the transmitting base, the first heat dissipation part is located on the back side of the circuit board, and the projection of the first heat dissipation part on the front side of the circuit board covers the light detection component.

[0030] Another technical solution described above has the following advantages or beneficial effects: The light emitting component includes an emitting base, which supports and connects the light-emitting component and the optical coupling component, facilitating the assembly of the light emitting component. Mounting holes are provided on the circuit board, and the emitting base is assembled and connected to these holes. The light-emitting component and the optical coupling component are located within the mounting holes, facilitating the assembly and connection of the light emitting component to the circuit board. A first heat dissipation part is formed on the emitting base. The light receiving component is located on the front side of the circuit board, and the first heat dissipation part is located on the back side of the circuit board. The projection of the first heat dissipation part on the front side of the circuit board covers the light detection component. The heat generated by the light receiving component is transferred to the first heat dissipation part through the circuit board, thereby accelerating the heat transfer on the light receiving component.

[0031] In some embodiments, an optical module is provided, wherein the light emitting component further includes a collimating lens group and an isolator group; the collimating lens group is located in the output optical path of the light emitting component, and the isolator group is located in the optical path from the collimating lens group to the first beam adjustment member.

[0032] Another technical solution described above has the following advantages or beneficial effects: the light emitting component includes a collimating lens group and an isolator group. The collimating lens group is located in the output optical path of the light-emitting component and is used to collimate the light signal generated by the light-emitting component. The isolator group is located in the output optical path of the collimating lens group and is used to pass light signals incident from one side of the isolator group and isolate light signals incident from the other side of the isolator group.

[0033] In some embodiments, an optical module is provided, wherein the optical emitting component includes a first optical coupling component and a second optical coupling component; one end of the emitting base is formed with a first support portion and a second support portion, and a gap is formed between the first support portion and the second support portion;

[0034] The first support portion supports and connects to the first optical coupling component, and the second support portion supports and connects to the second optical coupling component.

[0035] Another technical solution described above has the following advantages or beneficial effects: the optical emitting component includes a first optical coupling component and a second optical coupling component. A first support portion and a second support portion are formed at one end of the emitting base, with a gap between the first support portion and the second support portion. The first support portion supports and connects to the first optical coupling component, and the second support portion supports and connects to the second optical coupling component. The gap between the first support portion and the second support portion facilitates a reduction in the support area of ​​the emitting base, thereby facilitating a reduction in the volume of the optical emitting component.

[0036] In some embodiments, an optical module is provided, wherein the first substrate is silicon dioxide and the first transmission waveguide is silicon;

[0037] The optical fiber is located on the central axis of the first substrate, and one end of the first transmission waveguide is closer to the central axis of the first substrate than the other end of the first transmission waveguide.

[0038] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: the first substrate is made of silicon dioxide, and the first transmission waveguide is made of silicon, which facilitates the transmission of optical signals by the first transmission waveguide. The optical fiber is located on the central axis of the first substrate, and one end of the first transmission waveguide is closer to the central axis of the first substrate than the other end of the first transmission waveguide, so that the first transmission waveguide extends in a direction away from the central axis of the first substrate, which facilitates the transition transmission of the optical signal generated by the light-emitting component to the optical fiber.

[0039] Some embodiments provide an optical module, including:

[0040] Circuit board;

[0041] A light receiving component is electrically connected to the circuit board; wherein the light receiving component includes:

[0042] A photodetector assembly for receiving optical signals;

[0043] A beam expander is located on the receiving optical path of the optical detection component; one end of the beam expander is connected to an optical fiber, and the other end of the beam expander is located above the optical detection component.

[0044] The beam expander assembly includes:

[0045] The second fiber optic support plate supports the connection of the fiber optic cable;

[0046] The second optical fiber cover plate covers and connects to the second optical fiber support plate;

[0047] The second beam adjustment component has one end connected to the second fiber support plate and the other end forming a reflective surface, which is located above the photodetector assembly. The second beam adjustment component includes a second substrate and a second transmission waveguide located in the second substrate. The refractive index of the second substrate is less than that of the second transmission waveguide. The second transmission waveguide extends from one end of the second substrate to the other end of the second substrate. One end of the second transmission waveguide is optically coupled to the optical fiber, and the other end of the second transmission waveguide is located above the photodetector assembly.

[0048] Another technical solution in the above-mentioned technical solution has the following advantages or beneficial effects: The beam expander is located on the receiving optical path of the optical detector component, so as to transmit the optical signal input through the optical fiber to the corresponding optical detector in the optical detector component. The beam expander includes a second optical fiber support plate, a second optical fiber cover plate, and a second beam adjustment component. The second optical fiber cover plate and the second optical fiber support plate are closed together to facilitate the fixed connection of the optical fiber to the beam expander component. One end of the second beam adjustment component is connected to the second optical fiber support plate, and the other end of the second beam adjustment component forms a reflective surface. The second beam adjustment component includes a second substrate and a second transmission waveguide, with the second transmission waveguide extending from one end of the second substrate to the other end. One end of the second substrate is connected to the second optical fiber support plate, so that the optical fiber is coupled to the second transmission waveguide, and the other end of the second substrate is located above the optical detector component, reflecting the optical signal based on the reflective surface of the second beam adjustment component. The refractive index of the second substrate is less than that of the second transmission waveguide. When the optical signal is coupled and transmitted into the second transmission waveguide, it is convenient to confine the optical signal in the second transmission waveguide, so that the optical signal is transmitted along the extension direction of the second transmission waveguide. Therefore, the optical signal input through the optical fiber is transmitted to one end of the second beam adjustment component, coupled into the second transmission waveguide through one end, and transmitted along the second transmission waveguide to the other end. Finally, it is reflected by the reflective surface at the other end of the second transmission waveguide and transmitted to the photodetector component.

[0049] Compared to using traditional fiber optic arrays to transmit optical signals input through optical fibers to the photodetector, the solution provided in this disclosure allows the optical fiber to be connected to the second fiber optic support in the form of a fiber ribbon, which facilitates the reduction of the size of the second fiber optic support and the second fiber optic cover, thereby reducing the volume of the optical receiving component. Furthermore, the second transmission waveguide in the second beam adjustment component can be adjusted in bending as needed, facilitating the replacement of fiber optic bending and adapting to photodetector components of different specifications.

[0050] In some embodiments, an optical module is provided, wherein the beam expander is connected to multiple optical fibers; multiple second transmission waveguides are disposed in the second substrate; the spacing between adjacent second transmission waveguides at one end of the second substrate is smaller than the spacing between adjacent second transmission waveguides at the other end of the second substrate.

[0051] Another technical solution described above has the following advantages or beneficial effects: the beam expander connects multiple optical fibers, allowing the second optical fiber support plate to support and connect these fibers. Multiple second transmission waveguides are disposed in the second substrate, enabling the second transmission waveguides to correspond to the optical fibers. The spacing between adjacent second transmission waveguides at one end of the second substrate is smaller than the spacing between adjacent second transmission waveguides at the other end, ensuring that the spacing between adjacent second transmission waveguides closer to the optical fiber is smaller than that at the end farther from the optical fiber. This allows the second transmission waveguides to adapt to the spacing of the photodetector, ensuring that the optical signal input through the optical fiber can be transmitted to the photodetector. Furthermore, the multiple optical fibers can be connected to the beam expander in the form of a side-by-side fiber ribbon, which helps reduce fiber damage, ensures the service life of the optical fibers, and simplifies the formation of multiple optical fibers.

[0052] In some embodiments, an optical module is provided, wherein the optical receiving component is located on the front side of the circuit board; the optical module further includes an optical emitting component, the optical emitting component including an emitting base, and a first heat dissipation portion is formed on the emitting base;

[0053] The first heat sink is located on the back of the circuit board, and the projection of the first heat sink in the front direction of the circuit board covers the photodetector component.

[0054] Another technical solution described above has the following advantages or beneficial effects: the light emitting component includes an emitting base, which facilitates the assembly and connection of the light emitting component to the circuit board. A first heat dissipation part is formed on the emitting base. The light receiving component is located on the front side of the circuit board, and the first heat dissipation part is located on the back side of the circuit board. The projection of the first heat dissipation part on the front side of the circuit board covers the photodetector component. The heat generated by the light receiving component is transferred to the first heat dissipation part through the circuit board, thereby accelerating the heat transfer on the light receiving component. Attached Figure Description

[0055] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly introduced below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0056] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0057] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0058] Figure 3This is a structural diagram of an optical module according to some embodiments;

[0059] Figure 4 An exploded view of an optical module according to some embodiments;

[0060] Figure 5 This is an internal structural diagram of another optical module according to some embodiments;

[0061] Figure 6 This is an internal structural diagram of another optical module according to some embodiments;

[0062] Figure 7A This is an exploded view of a light emitting component and a circuit board according to some embodiments;

[0063] Figure 7B This is a structural diagram of a light emitting component according to some embodiments;

[0064] Figure 8A This is an internal structural diagram of another optical module according to some embodiments;

[0065] Figure 8B This is an exploded view of another light emitting component and circuit board according to some embodiments;

[0066] Figure 8C This is a structural diagram of another light-emitting component according to some embodiments;

[0067] Figure 8D This is a structural diagram of a launch base according to some embodiments;

[0068] Figure 9A Structure of an optical coupling component according to some embodiments Figure 1 ;

[0069] Figure 9B Structure of an optical coupling component according to some embodiments Figure 2 ;

[0070] Figure 9C An exploded view of an optical coupling component according to some embodiments;

[0071] Figure 9D This is a structural diagram of a first beam adjustment member according to some embodiments;

[0072] Figure 9E This is a cross-sectional view of an optical coupling assembly according to some embodiments;

[0073] Figure 10 This is an assembly diagram of an optical receiving component and a circuit board according to some embodiments;

[0074] Figure 11AStructure of a beam expander according to some embodiments Figure 1 ;

[0075] Figure 11B Structure of a beam expander according to some embodiments Figure 2 ;

[0076] Figure 11C This is an exploded schematic diagram of a beam expander assembly according to some embodiments;

[0077] Figure 11D This is a structural diagram of a second beam adjustment member according to some embodiments;

[0078] Figure 11E This is a cross-sectional view of a beam expander assembly according to some embodiments. Detailed Implementation

[0079] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0080] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0081] In optical communication technology, to establish information transmission between information processing devices, information needs to be loaded onto light, and the propagation of light is used to transmit the information. Here, the light carrying the information is called an optical signal. When optical signals are transmitted in information transmission equipment, optical power loss can be reduced, thus enabling high-speed, long-distance, and low-cost information transmission. Information processing devices can recognize and process electrical signals. Information processing devices typically include optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while information transmission equipment typically includes optical fibers and optical waveguides.

[0082] An optical module enables the conversion between optical and electrical signals between information processing and transmission devices. For example, at least one of the optical signal input or output ports of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ports is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts it into a first electrical signal and transmits it to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts it into a second optical signal and transmits it back to the optical fiber. Since multiple information processing devices can transmit information via electrical signals, at least one of the devices needs to be directly connected to the optical module, rather than all devices. Here, the information processing device directly connected to the optical module is referred to as the host computer of the optical module. Furthermore, the optical signal input or output port of the optical module can be referred to as an optical port, and the electrical signal input or output port can be referred to as an electrical port.

[0083] Figure 1 This is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0084] One end of optical fiber 101 extends toward the remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. The optical signal can undergo total internal reflection in optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to optical module 200, or to transmit the optical signal from optical module 200 to remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0085] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0086] The host computer 100 includes a generally rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 can establish a one-way or two-way electrical signal connection.

[0087] The host computer 100 also includes an external power interface that can connect to an electrical signal network. For example, this external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, which is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, thereby establishing an electrical signal connection between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. This second electrical signal from the host computer 100 is transmitted to the optical module 200, which converts the second electrical signal into a second optical signal and transmits it to the optical fiber 101. The second optical signal is then transmitted in the optical fiber 101 to the remote information processing device 1000. Alternatively, a first optical signal from the remote information processing device 1000 propagates through the optical fiber 101 and is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal and transmits it to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that an optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information itself does not change, but the encoding and decoding methods can change.

[0088] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0089] Figure 2 This is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has fins and other protruding structures to increase the heat dissipation area.

[0090] The optical module 200 is inserted into the cage 106 of the host computer 100, where it is secured. Heat generated by the optical module 200 is conducted to the cage 106 and then dissipated through the heat sink 107. After insertion into the cage 106, the optical module 200's electrical port connects to the electrical connector inside the cage 106, establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0091] Figure 3 This is a structural diagram of an optical module provided according to some embodiments of the present disclosure. Figure 4 This is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed within the shell, a light emitting component 400, and a light receiving component 500. However, this disclosure is not limited thereto; in some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0092] The housing includes an upper housing 201 and a lower housing 202, with the upper housing 201 covering the lower housing 202 to form the aforementioned housing having two openings 203 and 204; the outer contour of the housing is generally square.

[0093] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes an upper cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0094] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021. The upper housing 201 includes an upper cover plate 2011 and two upper side plates 2012 located on both sides of the upper cover plate 2011 and perpendicular to the upper cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to cover the lower housing 202 with the upper housing 201.

[0095] The direction of the line connecting the two openings 203 and 204 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200. Figure 3 The opening 204 is located at the end of the optical module 200 (left end). Figure 3 (The right end). Alternatively, opening 203 is located at the end of optical module 200, while opening 204 is located on the side of optical module 200. Opening 203 is an electrical port, from which the end of circuit board 300 extends and is inserted into the electrical connector of host computer 100; opening 204 is an optical port, configured to connect to external optical fiber 101 so that optical fiber 101 connects optical emitting component 400 and optical receiving component 500 in optical module 200.

[0096] The assembly method using an upper housing 201 and a lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc., into the aforementioned housings. The upper housing 201 and the lower housing 202 can encapsulate and protect these devices. Furthermore, when assembling the circuit board 300, the light emitting component 400, the light receiving component 500, etc., the assembly method using the upper housing 201 and the lower housing 202 facilitates the deployment of positioning components, heat dissipation components, and electromagnetic shielding components for these devices, which is beneficial for automated production.

[0097] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0098] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer 100, or to release the fixed connection between the optical module 200 and the host computer 100.

[0099] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0100] Circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0101] Circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also perform a load-bearing function. For example, the rigid circuit board can stably support the aforementioned electronic components and chips. The rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0102] The circuit board 300 also includes gold fingers 301 formed on its end surface, the gold fingers 301 consisting of a plurality of independent pins. The circuit board 300 is inserted into the cage 106 and is connected to an electrical connector within the cage 106 by the gold fingers 301. The gold fingers 301 may be provided only on one side of the surface of the circuit board 300 (e.g., Figure 4The upper surface shown can also be positioned on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications with high pin count requirements. The gold fingers 301 are configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards as a supplement to rigid circuit boards.

[0103] The light emitting component 400 is used to receive electrical signals transmitted from the circuit board 300, so that the light emitting component 400 generates light signals; the light receiving component 500 is used to receive light signals input from outside the optical module and convert them into electrical signals. At least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0104] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0105] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0106] In some embodiments, the optical module 200 further includes an optical transmission component 700 disposed within the housing. The optical transmission component 700 is used to establish an optical connection between the optical transmitting component 400, the optical receiving component 500 and the external optical fiber 101 (hereinafter referred to as the external optical fiber), so that the optical signal generated by the optical transmitting component 400 can be coupled to the external optical fiber, and the optical signal input from the external optical fiber can be coupled to the optical receiving component.

[0107] In some embodiments, the optical transmission component 700 includes an optical fiber adapter and an optical fiber, which may also be referred to as an internal optical fiber relative to an external optical fiber. One end of the optical fiber is connected to the optical fiber adapter, and the other end is connected to the optical transmitting component 400 or the optical receiving component 500. Exemplarily, the optical transmission component 700 includes multiple optical fiber adapters and multiple optical fibers. The optical transmitting component 400 can be connected to one or more optical fiber adapters via multiple optical fibers, and the optical receiving component 500 can be connected to multiple optical fiber adapters via multiple optical fibers. Of course, in this embodiment, the structure of the optical fiber adapter is not limited to one type; it can also be an LC connector, where the optical fiber adapter connects to one optical fiber.

[0108] In some embodiments, the optical transmission component 700 may include two optical fiber adapters and multiple optical fibers, each optical fiber adapter being connected to the optical transmitting component 400 and the optical receiving component 500 via the multiple optical fibers.

[0109] In some embodiments, a mounting hole 302 is provided on the circuit board 300, and the light emitting component 400 is assembled and connected to the mounting hole 302. For example, the light emitting component 400 is embedded in the mounting hole 302.

[0110] In some embodiments, the mounting hole 302 is a through hole, such that the top of the light emitting component 400 is above the mounting hole 302 and the bottom of the light emitting component 400 is below the mounting hole 302.

[0111] In some embodiments, a DSP chip 303 is disposed on the front side of the circuit board 300; the DSP chip 303 is used to transmit high-frequency signals to the light emitting component 400, etc. The light emitting component 400 receives the high-frequency signals transmitted by the DSP chip 303 to generate light signals. Two opposing surfaces on the circuit board 300 are the main bearing surfaces of the circuit board 300; one of these surfaces is called the front surface of the circuit board 300, facing the upper cover plate 2011; the other surface is the back surface of the circuit board 300, facing the bottom plate 2021. The front and back surfaces of the circuit board 300 are opposing surfaces.

[0112] In some embodiments, the light receiving component 500 is disposed on the back side of the circuit board 300. Of course, in this embodiment, the light receiving component 500 is not limited to being disposed on the back side of the circuit board 300, but may also be disposed on the front side of the circuit board 300.

[0113] Figure 5 This is an internal structural diagram of another optical module according to some embodiments. For example... Figure 5 As shown, in some embodiments, the optical transmission assembly 700 includes an optical fiber adapter 710, multiple optical fibers 720, and multiple optical fibers 730. The optical transmitting component 400 and the optical receiving component 500 are respectively connected to the optical fiber adapter via the multiple optical fibers.

[0114] Figure 6 This is an internal structural diagram of another optical module according to some embodiments. For example... Figure 6 As shown, in some embodiments, the optical module 200 includes a first light receiving component 500a and a second light receiving component 500b, which are disposed on the front side of the circuit board 300. The first light receiving component 500a is located on one side of the light emitting component 400, and the second light receiving component 500b is located on the other side of the light emitting component 400. Of course, in some embodiments, the first light receiving component 500a and the second light receiving component 500b may be located on the same side of the light emitting component 400.

[0115] In some embodiments, the first light receiving component 500a and the second light receiving component 500b may be disposed on different sides of the circuit board 300. For example, the first light receiving component 500a may be located on the front side of the circuit board 300, and the second light receiving component 500b may be located on the back side of the circuit board 300.

[0116] Figure 7A This is an exploded view of a light emitting component and a circuit board according to some embodiments. Figure 7B This is a structural diagram of a light-emitting component according to some embodiments. Figure 7A and Figure 7B As shown, in some embodiments, the light emitting component 400 includes a light-emitting element 410 for generating light signals. The light-emitting element 410 may include multiple lasers, enabling it to generate multiple light signals. For example, the light-emitting element 410 may include four lasers or eight lasers, etc.

[0117] In some embodiments, the light emitting component 400 may include a collimating lens group 420 located in the output optical path of the light-emitting component 410. The collimating lens group 420 is used to collimate the optical signal generated by the light-emitting component 410. The collimating lens group 420 includes a plurality of collimating lenses, which are correspondingly disposed in the output optical path of the laser. Exemplarily, the collimating lens group 420 may include 4 collimating lenses or 8 collimating lenses, etc.

[0118] In some embodiments, the light emitting component 400 may include an isolator group 430 located in the output optical path of the light emitting component 410. The isolator group 430 is used to pass light signals incident from one side of the isolator group 430 and isolate light signals incident from the other side of the isolator group. The isolator group 430 includes a plurality of isolators, which may be correspondingly arranged in the output optical path of the collimating lens. Exemplarily, the isolator group 430 may include 4 isolators or 8 isolators, etc.

[0119] In some embodiments, the light emitting component 400 may include an optical coupling component 440 located in the output optical path of the light-emitting component 410. The optical coupling component 440 is connected to the optical transmission component 700 to couple the optical signal generated by the light-emitting component 410 into the optical transmission component. The optical coupling component 440 can adjust the spacing between multiple optical signals generated by the light-emitting component 410. Exemplarily, the optical coupling component 440 can reduce the spacing between the light beams generated by the light-emitting component 410. The optical coupling component 440 is connected to an optical fiber to facilitate reducing the spacing between the optical fibers, allowing the optical fibers to be connected to the fiber optic adapter and the optical coupling component 440 in a ribbon-like manner. The input end of the optical coupling component 440 is close to the isolator group 430, and the output end of the optical coupling component 440 is close to the fiber optic adapter. The width of the output end of the optical coupling component 440 is smaller than the width of the input end of the optical coupling component 440.

[0120] In some embodiments, the light emitting component 400 may include an emitting base 450, which is mounted on and connected to the circuit board 300. Exemplarily, the emitting base 450 is connected to a mounting hole. The top of the emitting base 450 may support the light-emitting component 410, the collimating lens group 420, the isolator group 430, and / or the optical coupling component 440, etc., so that the light-emitting component 410, the collimating lens group 420, the isolator group 430, etc., can be located within the mounting hole 302. The bottom of the emitting base 450 may contact and connect to a base plate 2021 to facilitate the transfer of heat generated by the light-emitting component 410 during operation to the base plate 2021, thereby facilitating rapid heat dissipation for the light-emitting component 410.

[0121] In some embodiments, a first heat dissipation portion 451 may be formed on the transmitting base 450, and the first heat dissipation portion 451 is located at the edge of one end of the transmitting base 450. The first heat dissipation portion 451 is located on the back side of the circuit board 300, and the projection of the first heat dissipation portion 451 on the front side of the circuit board 300 covers the first light receiving component 500a. The heat generated by the first light receiving component 500a during operation is transferred through the circuit board 300 to the first heat dissipation portion 451, and then through the first heat dissipation portion 451 to the base plate 2021, so as to facilitate rapid heat dissipation for the first light receiving component 500a.

[0122] In some embodiments, a second heat dissipation portion 452 may be formed on the transmitting base 450, and the second heat dissipation portion 452 is located at the edge of one end of the transmitting base 450. The second heat dissipation portion 452 is located on the back side of the circuit board 300, and the projection of the first heat dissipation portion 451 on the front side of the circuit board 300 covers the second light receiving component 500b. The heat generated by the second light receiving component 500b during operation is transferred through the circuit board 300 to the second heat dissipation portion 452, and then through the second heat dissipation portion 452 to the base plate 2021, so as to facilitate rapid heat dissipation for the second light receiving component 500b.

[0123] In some embodiments, a first limiting post 453 may be formed on the top of the transmitter base 450, and the first limiting post 453 limits the sidewall of the connecting mounting hole 302. The first limiting post 453 is used to facilitate the positioning and connection of the transmitter base 450 and the circuit board 300.

[0124] In some embodiments, a second limiting post 454 may be formed on the top of the transmitter base 450, and the second limiting post 454 limits the sidewall of the mounting hole 302. The second limiting post 454 may be combined with the first limiting post 453 for more convenient positioning and connection of the transmitter base 450 and the circuit board 300.

[0125] In some embodiments, the first limiting post 453 and the second limiting post 454 are located on the side of the output end of the optical coupling component 440.

[0126] In some embodiments, the light emitting component 400 may include an emitting cover that can be closed over the emitting base 450. Exemplarily, the bottom of the emitting cover may be connected to a circuit board 300.

[0127] In some embodiments, the optical emitting component 400 may include a first optical coupling component 440a and a second optical coupling component 440b. The first optical coupling component 440a is disposed on the output optical path of a portion of the isolators in the isolator group 430, and the second optical coupling component 440b is disposed on the output optical path of another portion of the isolators in the isolator group 430. The first optical coupling component 440a and the second optical coupling component 440b are respectively connected to an optical fiber adapter via multiple optical fibers.

[0128] Figure 8A This is an internal structural diagram of another optical module according to some embodiments. Figure 8B This is an exploded view of another light-emitting component and circuit board according to some embodiments. Figure 8C This is a structural diagram of another light-emitting component according to some embodiments. Figure 8D This is a structural diagram of a launch base according to some embodiments. For example... Figures 8A-8D As shown, compared to Figure 6 In some embodiments of the structure shown, the relatively small width of the output end of the optical coupling component 440 allows for a smaller mounting hole 302 area, thereby reducing the area occupied by the light emitting component 400 on the circuit board 300.

[0129] In some embodiments, a first support portion 455 is formed at the other end of the transmitter base 450, which supports the other end connected to the first optical coupling assembly 440a. The first support portion 455 has a small width, which facilitates reducing the width of the other end of the transmitter base 450.

[0130] In some embodiments, a second support portion 456 is formed at the other end of the transmitter base 450, which supports the other end connected to the second optical coupling assembly 440b. The second support portion 456 has a small width, which facilitates reducing the width of the other end of the transmitter base 450.

[0131] In some embodiments, a gap 457 is formed between the first support portion 455 and the second support portion 456. The gap 457 facilitates reducing the area at the other end of the emitting base 450, thereby facilitating a reduction in the area occupied by the light emitting component 400 on the circuit board 300.

[0132] Figure 9A Structure of an optical coupling component according to some embodiments Figure 1 , Figure 9B Structure of an optical coupling component according to some embodiments Figure 2 , Figure 9C This is an exploded view of an optical coupling component according to some embodiments. Figures 9A-9C As shown, in some embodiments, the optical coupling component 440 connects multiple optical fibers 720.

[0133] In some embodiments, the optical coupling assembly 440 may include a first fiber optic support plate 441, which supports connecting optical fibers 720. For example, the first fiber optic support plate 441 may support connecting four or eight optical fibers 720.

[0134] In some embodiments, a fiber optic groove 4411 is formed on the first fiber optic support plate 441, and the end of the fiber optic cable 720 is disposed in the fiber optic groove 4411. The fiber optic groove 4411 facilitates the connection of the fiber optic cable 720 to the first fiber optic support plate 441. Exemplarily, the fiber optic groove 4411 may be a V-shaped groove. The coating layer can be removed from the end of the fiber optic cable 720 to reduce the volume of the end of the fiber optic cable 720, thereby reducing the volume of the first fiber optic support plate 441.

[0135] In some embodiments, the optical coupling assembly 440 may include a first fiber optic cover plate 442, which covers the first fiber optic support plate 441 to facilitate the fixed connection of the optical coupling assembly 440 to the optical fiber 720. Exemplarily, the length of the first fiber optic cover plate 442 is less than the length of the first fiber optic support plate 441.

[0136] In some embodiments, the optical coupling assembly 440 may include a first connector 443, which connects one end of a first fiber optic support 441, one end of a first fiber optic cover 442, and the optical fiber 720. Exemplarily, the first connector 443 may be formed by the curing of adhesive.

[0137] In some embodiments, the optical coupling assembly 440 may include a first beam adjuster 444, which is located at the other end of the first fiber optic support 441. Exemplarily, one end of the first beam adjuster 444 is connected to the other end of the first fiber optic support 441, and the other end of the first beam adjuster 444 is close to the light-emitting assembly 410. The first beam adjuster 444 is used to adjust the spacing of the beam generated by the light-emitting assembly 410 and to couple the optical signal into the core of the optical fiber 720.

[0138] In some embodiments, one end of the first beam adjustment member 444 can be connected to the other end of the first fiber support plate 441 via a matching adhesive. The refractive index of the matching adhesive can be 1.4-1.6, which is similar to the refractive index of the fiber core in the fiber 720.

[0139] Figure 9D This is a structural diagram of a first beam adjustment member according to some embodiments. For example... Figure 9D As shown, in some embodiments, the first beam adjustment member 444 includes a first substrate 4441 and a first transmission waveguide 4442 located within the first substrate 4441. The first transmission waveguide 4442 extends from one end of the first substrate 4441 to the other end. One end of the first substrate 4441 is connected to a first fiber optic support plate 441, and the other end of the first substrate 4441 is close to the light-emitting component 410, such that one end of the first transmission waveguide 4442 is optically coupled to the core of the optical fiber 720, and the other end of the first transmission waveguide 4442 is used to couple the optical signal generated by the light-emitting component 410. Along the extension direction of the first transmission waveguide 4442, the optical signal generated by the light-emitting component 410 is transmitted from the other end of the first beam adjustment member 444 to the end of the core of the optical fiber 720 and coupled to the corresponding core.

[0140] In some embodiments, one end of the first substrate 4441 can be connected to the other end of the first optical fiber support plate 441 by a matching adhesive, and the optical fiber core end face of the optical fiber 720 and the first transmission waveguide 4442 are filled with matching adhesive to improve the coupling efficiency of the optical signal from the first transmission waveguide 4442 to the optical fiber 720.

[0141] In some embodiments, the diameter of the fiber core in the optical fiber 720 is 9 μm, and the diameter of the first transmission waveguide 4442 is 9 μm. Thus, the use of the first beam adjustment element 444 in the optical coupling assembly 440 facilitates the matching of the optical coupling assembly 440 with different mode fields.

[0142] In some embodiments, the refractive index of the first substrate 4441 is less than the refractive index of the first transmission waveguide 4442. For example, the first substrate 4441 may be made of silicon dioxide, and the first transmission waveguide 4442 may be made of silicon. Silicon has a refractive index of 3.48, while silicon dioxide has a refractive index of 1.44. The refractive index contrast between the first substrate 4441 and the first transmission waveguide 4442 is 0.41, which facilitates confining the optical signal within the first transmission waveguide 4442, thereby facilitating the coupling of the optical signal to the optical fiber 720.

[0143] In some embodiments, a plurality of first transmission waveguides 4442 are disposed in the first substrate 4441. The spacing between adjacent first transmission waveguides 4442 at one end of the first beam adjuster 444 is smaller than the spacing between adjacent first transmission waveguides 4442 at the other end of the first beam adjuster 444, such that the first beam adjuster 444 can adjust the spacing between beams. Exemplarily, the optical fiber 720 is located on the central axis of the first substrate 4441, and one end of the first transmission waveguide 4442 is closer to the central axis of the first substrate 4441 than the other end of the first transmission waveguide 4442.

[0144] In some embodiments, the bending radius of the first transmission waveguide 4442 is greater than 10 μm, which helps to reduce the loss of optical signals caused by bending on the first transmission waveguide 4442.

[0145] Figure 9E This is a cross-sectional view of an optical coupling assembly according to some embodiments. Figure 9E As shown, in some embodiments, the other end of the first fiber optic support plate 441 is an inclined surface, such that the end face of the fiber core in the fiber 720 and the end face of one end of the first transmission waveguide 4442 are both inclined surfaces. This is to reduce the amount of optical signal reflected by the fiber core end face and re-entering the first transmission waveguide 4442 during the coupling process from the first transmission waveguide 4442 to the fiber core. The inclination angle of the inclined surface at the other end of the first fiber optic support plate 441 is less than 10°. For example, the inclination angle of this inclined surface is 4-8°, such as 4°, 5°, or 8°.

[0146] In some embodiments, the other end of the first beam adjuster 444 is an inclined surface, making the other end of the first transmission waveguide 4442 also an inclined surface. This reduces the amount of optical signal reflected by the end face of the first transmission waveguide 4442 and re-entering the incident optical path during the coupling process of the optical signal to the first transmission waveguide 4442. The inclination angle of the inclined surface at the other end of the first beam adjuster 444 is less than 10°. Exemplarily, the inclination angle of this inclined surface is 4-8°, such as 4°, 5°, or 8°.

[0147] Figure 10 This is an assembly diagram of a light receiving component and a circuit board according to some embodiments. Figure 10As shown, in some embodiments, the light receiving component 500 may include a light detection component 510. The light detection component 510 is disposed on the circuit board 300 and is used to convert the received optical signal into an electrical signal. The light detection component 510 may include multiple photodetectors, enabling it to receive multiple light signals. Exemplarily, the light detection component 510 may include four or eight photodetectors, etc.

[0148] In some embodiments, the optical receiving component 500 may include a beam expander 520 connected to the optical fiber 730 and located in the input optical path of the photodetector component 510. The beam expander 520 is used to transmit the optical signal input through the optical fiber 730 to a corresponding photodetector in the photodetector component 510. Furthermore, the beam expander 520 can change the transmission direction of the optical signal from parallel to the surface of the circuit board 300 to perpendicular or approximately perpendicular to the surface of the circuit board 300.

[0149] In some embodiments, the beam expander 520 can be connected to multiple optical fibers 730, and the beam expander 520 can expand the beam spacing so that the spacing between adjacent beams output from the output end of the beam expander 520 is greater than the spacing between beams in adjacent optical fibers 730.

[0150] Figure 11A Structure of a beam expander according to some embodiments Figure 1 , Figure 11B Structure of a beam expander according to some embodiments Figure 2 , Figure 11C This is an exploded schematic diagram of a beam expander assembly according to some embodiments. Figure 11A and Figure 11C As shown, in some embodiments, the beam expander 520 may include a second fiber optic support plate 521, which supports connecting optical fibers 730. For example, the second fiber optic support plate 521 may support connecting four equal optical fibers 730.

[0151] In some embodiments, the second fiber optic support plate 521 has a fiber optic groove 5211, and the end of the fiber optic cable 730 is disposed in the fiber optic groove 5211. The fiber optic groove 5211 may be a V-shaped groove.

[0152] In some embodiments, the beam expander 520 may include a second fiber optic cover plate 522, which covers and connects to the first fiber optic support plate 521 to facilitate the fixed connection of the beam expander 520 to the fiber optic cable 730. Exemplarily, the length of the second fiber optic cover plate 522 is less than the length of the second fiber optic support plate 521.

[0153] In some embodiments, the beam expander assembly 520 may include a second connector 523, which connects one end of the second fiber optic support plate 521, one end of the second fiber optic cover plate 522, and the fiber optic cable 730. The second connector 523 may be formed by adhesive curing.

[0154] In some embodiments, the beam expander 520 may include a second beam adjuster 524 located at the other end of the second fiber optic support 521. Exemplarily, one end of the second beam adjuster 524 is connected to the other end of the second fiber optic support 521, and the other end of the second beam adjuster 524 is located above the photodetector 510. The second beam adjuster 524 is used to transmit the optical signal transmitted through the optical fiber 730 to the photodetector in the photodetector 510.

[0155] In some embodiments, one end of the second beam adjustment member 524 can be connected to the other end of the second fiber support plate 521 via a matching adhesive. The refractive index of the matching adhesive can be 1.4-1.6, which is similar to the refractive index of the fiber core in the fiber 730.

[0156] Figure 11D This is a structural diagram of a second beam adjustment member according to some embodiments. For example... Figure 11D As shown, in some embodiments, the second beam adjustment member 524 includes a second substrate 5241 and a second transmission waveguide 5242 located within the second substrate 5241. The second transmission waveguide 5242 extends from one end of the second substrate 5241 to the other end. One end of the second substrate 5241 is connected to the other end of the second fiber optic support 521, and the other end of the second substrate 5241 is located above the photodetector assembly 510. One end of the second transmission waveguide 5242 is optically connected to the core of the fiber optic cable 730, and the other end of the second transmission waveguide 5242 is located above the corresponding photodetector in the photodetector assembly 510. The optical signal output from the fiber optic cable 730 is coupled to the second transmission waveguide 5242 and transmitted along the second transmission waveguide 5242, and finally transmitted to the corresponding photodetector via reflection from the end face of the other end of the second transmission waveguide 5242.

[0157] In some embodiments, one end of the second substrate 5241 can be connected to the other end of the second optical fiber support plate 521 by a matching adhesive, and the optical fiber core end face of the optical fiber 730 and the second transmission waveguide 5242 are filled with matching adhesive to improve the coupling efficiency of the optical signal from the optical fiber 730 to the second transmission waveguide 5242.

[0158] In some embodiments, the diameter of the fiber core in the optical fiber 730 is 9 μm, and the diameter of the second transmission waveguide 5242 is 9 μm, which facilitates ensuring the coupling efficiency of the output optical signal from the optical fiber 730 to the second transmission waveguide 5242. The second beam adjustment element 524 facilitates the beam expander assembly 520 to be matched with different mode fields.

[0159] In some embodiments, the refractive index of the second substrate 5241 is less than the refractive index of the second transmission waveguide 5242. For example, the second substrate 5241 may be made of silicon dioxide, and the second transmission waveguide 5242 may be made of silicon. Silicon has a refractive index of 3.48, while silicon dioxide has a refractive index of 1.44. The refractive index contrast between the second substrate 5241 and the second transmission waveguide 5242 is 0.41. This facilitates confining the optical signal output from the optical fiber 730 within the second transmission waveguide 5242, thereby transmitting the optical signal to the photodetector via the second transmission waveguide 5242.

[0160] In some embodiments, a plurality of second transmission waveguides 5242 are disposed in the second substrate 5241. The spacing between adjacent second transmission waveguides 5242 at one end of the second beam adjuster 524 is smaller than the spacing between adjacent second transmission waveguides 5242 at the other end of the second beam adjuster 524. Exemplarily, the optical fiber 730 is located on the central axis of the second substrate 5241, and one end of the second transmission waveguide 5242 is closer to the central axis of the second substrate 5241 than the other end of the second transmission waveguide 5242.

[0161] In some embodiments, the bending boundary of the second transmission waveguide 5242 is greater than 10 μm, which helps to reduce the loss of optical signal caused by bending on the second transmission waveguide 5242.

[0162] Figure 11E This is a cross-sectional view of a beam expander assembly according to some embodiments. Figure 11E As shown, in some embodiments, the other end of the second fiber optic support 521 is an inclined surface, the end face of the fiber in the fiber 730 is an inclined surface, and one end of the second transmission waveguide 5242 is an inclined surface. This is to reduce the reflection of the optical signal back into the fiber 730 core by the end face of the second transmission waveguide 5242 during the coupling process from the fiber core of the fiber 730 to the second transmission waveguide 5242. The tilt angle of one end of the second transmission waveguide 5242 is less than 10°. For example, the tilt angle of one end of the second transmission waveguide 5242 can be 4-8°, such as 4°, 5°, or 8°.

[0163] In some embodiments, the other end of the second beam adjuster 524 is an inclined surface, and the other end of the second transmission waveguide 5242 is also an inclined surface, so as to form a reflective surface 5243 at the other end of the second beam adjuster 524, thereby reflecting the optical signal transmitted by the second transmission waveguide 5242 to the corresponding photodetector. For example, the tilt angle of the reflective surface 5243 is less than 45°, which helps to reduce the amount of optical signal reflected back by the photodetector entering the second transmission waveguide 5242. For instance, the tilt angle of the reflective surface 5243 is 40-44°.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this disclosure, and are not intended to limit them. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure.

Claims

1. An optical module characterized by comprising: The application relates to a light emitting and receiving device. The device comprises: a circuit board; a light emitting component electrically connected to the circuit board; wherein the light emitting component comprises: a light emitting assembly electrically connected to the circuit board, for generating a plurality of light signals; a light coupling assembly located on an output light path of the light emitting assembly, the light coupling assembly being connected to an optical fiber; the light coupling assembly comprises: a first optical fiber support plate for supporting the optical fiber; a first optical fiber cover plate for covering the first optical fiber support plate; 2. The optical module according to claim 1, characterized by a first light beam adjusting member comprising a first base body and a first transmission waveguide located in the first base body, the refractive index of the first base body being smaller than that of the first transmission waveguide; the first transmission waveguide extends from one end of the first base body to the other end of the first base body; one end of the first base body is connected to the first optical fiber support plate, one end of the first transmission waveguide is optically coupled to the optical fiber, and the other end of the first transmission waveguide is optically connected to the light emitting assembly.

3. The optical module according to claim 1, characterized by The light coupling assembly is connected to a plurality of optical fibers; a plurality of first transmission waveguides are arranged in the first base body; the spacing between adjacent first transmission waveguides at one end of the first base body is smaller than the spacing between adjacent first transmission waveguides at the other end of the first base body. The device further comprises a light receiving component, which comprises: a light detection assembly for receiving light signals; a beam expanding assembly located on a receiving light path of the light detection assembly; one end of the beam expanding assembly is connected to an optical fiber, and the other end of the beam expanding assembly is located above the light detection assembly; wherein the beam expanding assembly comprises: a second optical fiber support plate for supporting the optical fiber; a second optical fiber cover plate for covering the second optical fiber support plate; 4. The optical module according to claim 3, characterized by a second light beam adjusting member comprising a second base body and a second transmission waveguide located in the second base body, the refractive index of the second base body being smaller than that of the second transmission waveguide; the second transmission waveguide extends from one end of the second base body to the other end of the second base body; one end of the second transmission waveguide is optically coupled to the optical fiber, and the other end of the second transmission waveguide is located above the light detection assembly. A mounting hole is formed in the circuit board, and the light emitting component further comprises an emitting base, which supports and connects the light emitting assembly and the light coupling assembly, so that the light emitting assembly and the light coupling assembly are located in the mounting hole.

5. The optical module according to claim 1, characterized by The light receiving component is located on the front surface of the circuit board; a first heat dissipation part is formed on the emitting base, the first heat dissipation part is located on the back surface of the circuit board, and the projection of the first heat dissipation part in the direction of the front surface of the circuit board covers the light detection assembly.

6. The optical module according to claim 4, characterized by The light emitting component further comprises a collimating lens group and an isolator group; the collimating lens group is located on the output light path of the light emitting assembly, and the isolator group is located on the light path from the collimating lens group to the first light beam adjusting member. The light emitting component comprises a first light coupling assembly and a second light coupling assembly; one end of the emitting base is provided with a first support part and a second support part, and a spacing is formed between the first support part and the second support part; the first support part supports and connects the first light coupling assembly, and the second support part supports and connects the second light coupling assembly.

7. The optical module of claim 1, wherein, The first base is silica, and the first transmission waveguide is silicon; The optical fiber is located on a central axis of the first base, and one end of the first transmission waveguide is closer to the central axis of the first base than the other end of the first transmission waveguide.

8. An optical module characterized by comprising: Comprise: A circuit board; An optical receiving component electrically connected to the circuit board; wherein the optical receiving component comprises: An optical detection assembly for receiving an optical signal; A beam expanding assembly located on a receiving light path of the optical detection assembly; one end of the beam expanding assembly is connected to an optical fiber, and the other end of the beam expanding assembly is located above the optical detection assembly; The beam expanding assembly comprises: A second optical fiber support plate supporting the optical fiber; A second optical fiber cover plate covering the second optical fiber support plate; A second optical beam adjusting component, one end of which is connected to the second optical fiber support plate, and the other end of which forms a reflecting surface, the reflecting surface being located above the optical detection assembly; the second optical beam adjusting component comprises a second base and a second transmission waveguide located in the second base, the refractive index of the second base being less than the refractive index of the second transmission waveguide; the second transmission waveguide extends from one end of the second base to the other end of the second base; one end of the second transmission waveguide is optically coupled to the optical fiber, and the other end of the second transmission waveguide is located above the optical detection assembly.

9. The optical module according to claim 8, characterized by The beam expanding assembly is connected to a plurality of optical fibers; a plurality of second transmission waveguides are provided in the second base; the spacing between adjacent second transmission waveguides in one end of the second base is less than the spacing between adjacent second transmission waveguides in the other end of the second base.

10. The optical module of claim 8, wherein, The optical receiving component is located on the front surface of the circuit board; the optical module further comprises an optical emitting component, the optical emitting component comprising an emitting base, a first heat dissipation portion being formed on the emitting base; The first heat dissipation portion is located on the back surface of the circuit board, and the projection of the first heat dissipation portion in the direction of the front surface of the circuit board covers the optical detection assembly.

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