Circuit board assembly, camera module and electronic equipment

Abstract

The utility model relates to the technical field of circuit boards, and particularly provides a circuit board assembly, which comprises a circuit board provided with a mounting groove and having a top surface and a bottom surface which are oppositely arranged, and the mounting groove penetrates through the top surface and the bottom surface; the reinforcing piece is clamped in the mounting groove; the bonding piece is connected to the reinforcing piece and the side wall of the mounting groove so as to fix the reinforcing piece and the circuit board; the photosensitive chip is connected to the reinforcing piece and electrically connected with the circuit board through a gold wire, and the photosensitive chip and the top surface are located on the same side of the reinforcing piece. According to the circuit board assembly, the reinforcing part and the circuit board are mutually embedded, so that the top surface and the bottom surface of the circuit board are in an open state, double-sided assembly of the circuit board is facilitated, and in addition, the reinforcing part can outwards diffuse heat generated by the photosensitive chip to realize heat dissipation of the circuit board assembly. The utility model further provides a camera module comprising the circuit board assembly, the fixing base and the lens assembly, and electronic equipment comprising the camera module and the shell.

Description

Technical Field

[0001] This application relates to the field of circuit board technology, specifically to a circuit board assembly, a camera module, and an electronic device. Background Technology

[0002] The heat generated during camera module operation is primarily produced by the image sensor, which is mounted on the surface of the circuit board and completely encapsulated within the camera module. Existing circuit board assemblies mainly employ two configuration methods: one involves creating a slot on one surface of the circuit board, with the image sensor housed within the slot, allowing for assembly on both sides of the board. However, this method results in low heat dissipation efficiency for the image sensor. The other method involves mounting the circuit board on a reinforcing member, allowing the heat generated by the image sensor to dissipate outwards through the reinforcing member. However, the reinforcing member adheres to the entire bottom surface of the circuit board, restricting assembly to only one side of the board. Utility Model Content

[0003] In view of the above, it is necessary to provide a circuit board assembly, a camera module, and an electronic device to simultaneously achieve heat dissipation and double-sided assembly of the circuit board.

[0004] This application provides a circuit board assembly, including:

[0005] The circuit board has a top surface and a bottom surface that are disposed opposite to each other and has a mounting groove that penetrates the top surface and the bottom surface;

[0006] The reinforcing member is held in place by the mounting slot;

[0007] An adhesive component, connected to the sidewall of the reinforcing member and the mounting groove, to secure the reinforcing member and the circuit board; and

[0008] A photosensitive chip is connected to the reinforcing member and electrically connected to the circuit board via gold wires, and the photosensitive chip and the top surface are located on the same side of the reinforcing member.

[0009] In the aforementioned circuit board assembly, the reinforcing member is embedded in the circuit board, so that the top and bottom surfaces of the circuit board are open, which is conducive to the double-sided assembly of the circuit board. In addition, the reinforcing member can dissipate the heat generated by the photosensitive chip to the outside, thereby achieving heat dissipation of the circuit board assembly.

[0010] In some embodiments, the upper surface of the reinforcing member is flush with the top surface of the circuit board, and the lower surface of the reinforcing member is flush with the bottom surface of the circuit board.

[0011] Therefore, the above settings can make the reinforcing component and the circuit board flat, which is beneficial to the flattening of the circuit board assembly.

[0012] In some embodiments, the mounting slot includes:

[0013] A first receiving groove is formed on the top surface;

[0014] The second receiving groove is formed in the bottom wall of the first receiving groove and penetrates the bottom surface, so that the mounting groove has a stepped structure;

[0015] The reinforcing member is adapted to the mounting groove.

[0016] Therefore, the stepped mounting groove helps to improve the connection stability between the reinforcement and the circuit board.

[0017] In some embodiments, the mounting slot includes:

[0018] A first receiving groove is formed on the bottom surface;

[0019] The second receiving groove is formed in the bottom wall of the first receiving groove and extends through the top surface, so that the mounting groove has a stepped structure;

[0020] The reinforcing member is adapted to the mounting groove.

[0021] Therefore, the stepped mounting groove helps to improve the connection stability between the reinforcement and the circuit board.

[0022] In some embodiments, the circuit board assembly further includes:

[0023] Electronic components are electrically connected to the circuit board and disposed on the bottom surface.

[0024] Therefore, the electronic components located on the bottom can connect to external electrical devices, enabling the circuit board assembly to perform multiple functions.

[0025] In some embodiments, the reinforcing member includes:

[0026] The main body is housed in the mounting groove and connected to the side wall of the mounting groove via the adhesive, and the upper surface of the main body is flush with the top surface;

[0027] An extension body connects to the lower surface of the main body and protrudes from the bottom surface, with both ends of the extension body respectively attached to the bottom surface.

[0028] Therefore, the above configuration allows the reinforcing member to have an inverted T-shaped structure, which can provide support for the circuit board.

[0029] In some embodiments, the height of the extension relative to the bottom surface is greater than the height of the electronic component relative to the bottom surface.

[0030] Therefore, the above settings can prevent external components from colliding with electronic components, which helps to improve the service life of electronic components.

[0031] In some embodiments, the two ends of the photosensitive chip protrude from the reinforcing member, and the two ends of the photosensitive chip are respectively connected to the top surface.

[0032] Therefore, the above settings help improve the stability of the photosensitive chip's position relative to the circuit board.

[0033] This application embodiment also provides a camera module, including:

[0034] The aforementioned circuit board assembly;

[0035] A mounting base is provided on the circuit board; and

[0036] The lens assembly is mounted on the mounting base and located on the photosensitive side of the photosensitive chip.

[0037] In the aforementioned camera module's circuit board assembly, the reinforcing component is embedded within the circuit board, leaving the top and bottom surfaces of the circuit board open. This facilitates double-sided assembly of the circuit board, reducing the manufacturing difficulty of the camera module. Furthermore, the reinforcing component can dissipate heat generated by the photosensitive chip, thus achieving heat dissipation for the camera module.

[0038] This application also provides an electronic device, including:

[0039] The aforementioned camera module;

[0040] The housing, on which the camera module is mounted.

[0041] The camera module of the aforementioned electronic device is easy to manufacture and can dissipate heat, which helps to reduce the manufacturing cost of the electronic device. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the circuit board structure according to Embodiment 1 of this application.

[0043] Figure 2 for Figure 1 An exploded view of the circuit board assembly shown.

[0044] Figure 3 This is a cross-sectional schematic diagram of the circuit board assembly according to Embodiment 2 of this application.

[0045] Figure 4 This is a cross-sectional schematic diagram of the circuit board assembly according to Embodiment 3 of this application.

[0046] Figure 5 This is a cross-sectional schematic diagram of the circuit board assembly according to Embodiment 4 of this application.

[0047] Figure 6 This is a schematic diagram of the camera module according to Embodiment 5 of this application.

[0048] Figure 7 This is a schematic diagram of the structure of the electronic device according to Embodiment Six of this application.

[0049] Explanation of main component symbols: Circuit board assembly 100, circuit board 110, mounting groove 110a, top surface 110b, bottom surface 110c, first receiving groove 110d, second receiving groove 110e, reinforcing member 120, main body 121, extension body 122, photosensitive chip 130, gold wire 140, electronic component 150, camera module 1000, mounting base 200, lens assembly 300, electronic device 2000, housing 400. Detailed Implementation

[0050] The embodiments of this application are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0051] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "connection" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the two; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two elements or the interaction between two elements. In the description of this application, it should be noted that "multiple" means two or more, unless otherwise expressly and specifically limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] The embodiments of this case will be described in detail below with reference to the accompanying drawings.

[0053] Example 1

[0054] Please see Figure 1 and Figure 2This embodiment provides a circuit board assembly 100, including a circuit board 110, a reinforcing member 120, an adhesive (not shown), and a photosensitive chip 130. The circuit board 110 has a top surface 110b and a bottom surface 110c disposed opposite to each other and has a mounting groove 110a. The mounting groove 110a penetrates the top surface 110b and the bottom surface 110c. The reinforcing member 120 is held in the mounting groove 110a. The adhesive is connected to the sidewalls of the reinforcing member 120 and the mounting groove 110a to fix the reinforcing member 120 and the circuit board 110. The photosensitive chip 130 is connected to the reinforcing member 120 and electrically connected to the circuit board 110 through a gold wire 140. The photosensitive chip 130 and the top surface 110b are located on the same side of the reinforcing member 120.

[0055] For example, the circuit board 110 can be one of a flexible circuit board, a rigid circuit board, or a rigid-flex board. The adhesive can be double-sided tape or a cured adhesive formed by curing with glue, and the reinforcing member 120 can be a metal sheet.

[0056] In the circuit board assembly 100 described above, the reinforcing member 120 is embedded in the circuit board 110, so that the top surface 110b and the bottom surface 110c of the circuit board 110 are in an open state, which is conducive to realizing double-sided assembly of the circuit board 110. In addition, the reinforcing member 120 can dissipate the heat generated by the photosensitive chip 130 to the outside, so as to realize heat dissipation of the circuit board assembly 100.

[0057] In this embodiment, the upper surface of the reinforcing member 120 is flush with the top surface 110b of the circuit board 110, and the lower surface of the reinforcing member 120 is flush with the bottom surface 110c of the circuit board 110.

[0058] Therefore, the above-mentioned arrangement can make the reinforcing member 120 and the circuit board 110 flat, which is beneficial to the flattening of the circuit board assembly 100.

[0059] In this embodiment, the mounting groove 110a includes a first receiving groove 110d and a second receiving groove 110e. The first receiving groove 110d is formed on the top surface 110b, and the second receiving groove 110e is formed on the bottom wall of the first receiving groove 110d and penetrates the bottom surface 110c, so that the mounting groove 110a has a stepped structure. The reinforcing member 120 is adapted to the mounting groove 110a; specifically, the reinforcing member 120 is generally T-shaped.

[0060] Therefore, the stepped mounting groove 120a is beneficial to improving the connection stability between the reinforcing member 120 and the circuit board 110.

[0061] In this embodiment, the circuit board assembly 100 further includes electronic components 150. The electronic components 150 are electrically connected to the circuit board 110 and are disposed on the bottom surface 110c. Specifically, the number of electronic components 150 disposed on the bottom surface 110c can be multiple.

[0062] Therefore, the electronic component 150 located on the bottom surface 110c can be connected to external electrical devices so that the circuit board assembly 100 can perform multiple functions.

[0063] Example 2

[0064] Please see Figure 3 Compared with Embodiment 1, this embodiment also includes a circuit board 110, a reinforcing member 120, an adhesive member (not shown), a photosensitive chip 130, a gold wire 140, and electronic components 150. The difference is that in this embodiment, the first receiving groove 110d is formed on the bottom surface 110c, and the second receiving groove 110e is formed on the bottom wall of the first receiving groove 110d and penetrates through the top surface 110b, so that the mounting groove 110a has a stepped structure. The reinforcing member 120 is adapted to the mounting groove 110a, and specifically, the reinforcing member 120 is roughly inverted T-shaped.

[0065] Therefore, the stepped mounting groove 110a is beneficial to improving the connection stability between the reinforcing member 120 and the circuit board 110.

[0066] Example 3

[0067] Please see Figure 4 Compared with Embodiment 1, this embodiment also includes a circuit board 110, a reinforcing member 120, an adhesive (not shown), a photosensitive chip 130, a gold wire 140, and electronic components 150. The difference is that in this embodiment, the reinforcing member 120 includes a main body 121 and an extension 122. The main body 121 is accommodated in the mounting groove 110a and connected to the side wall of the mounting groove 110a through the adhesive. The upper surface of the main body 121 is flush with the top surface 110b. The extension 122 is connected to the lower surface of the main body 121 and protrudes from the bottom surface 110c. The two ends of the extension 122 are respectively attached to the bottom surface 110c.

[0068] Therefore, the above arrangement allows the reinforcing member 120 to have an inverted T-shaped structure, and the inverted T-shaped reinforcing member 120 can provide support for the circuit board 110.

[0069] In this embodiment, the height of the extension 122 relative to the bottom surface 110c is greater than the height of the electronic component 150 relative to the bottom surface 110c.

[0070] Therefore, the above-mentioned settings can prevent external components from colliding with the electronic component 150, which is beneficial to improving the service life of the electronic component 150.

[0071] Example 4

[0072] Please see Figure 5Compared with Embodiment 1, this embodiment includes a circuit board 110, a reinforcing member 120, an adhesive member (not shown), a photosensitive chip 130, a gold wire 140, and an electronic component 150. The difference is that in this embodiment, the two ends of the photosensitive chip 130 protrude from the reinforcing member 120, and the two ends of the photosensitive chip 130 are respectively connected to the top surface 110b.

[0073] Therefore, the above-mentioned arrangement helps to improve the stability of the position of the photosensitive chip 130 relative to the circuit board 110.

[0074] Example 5

[0075] Please see Figure 6 This application also provides a camera module 1000, including a mounting base 200, a lens assembly 300, and any one of the circuit board assemblies 100 in embodiments one to four. The mounting base 200 is disposed on the circuit board 110, and the lens assembly 300 is disposed on the mounting base 200 and located on the photosensitive side of the photosensitive chip 130.

[0076] In the circuit board assembly 100 of the aforementioned camera module 1000, the reinforcing member 120 is embedded in the circuit board 110, so that the top surface 110b and the bottom surface 110c of the circuit board 110 are open. This facilitates double-sided assembly of the circuit board 110, thereby reducing the manufacturing difficulty of the camera module 1000. In addition, the reinforcing member 120 can dissipate the heat generated by the photosensitive chip 130 to the outside, thereby achieving heat dissipation of the camera module 1000.

[0077] Example 6

[0078] Please see Figure 7 This application also provides an electronic device 2000, including a housing 400 and the aforementioned camera module 1000, wherein the camera module 1000 is mounted on the housing 400. The electronic device 2000 can be a mobile phone, tablet computer, etc.

[0079] The camera module 1000 of the aforementioned electronic device 2000 is easy to manufacture and can dissipate heat, which helps to reduce the manufacturing cost of the electronic device 2000.

[0080] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be embraced within this application.

[0081] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A circuit board assembly, characterized by The circuit board assembly comprises: a circuit board having opposite top and bottom surfaces and a mounting slot extending through the top and bottom surfaces; a reinforcing member clamped in the mounting slot; an adhesive member connected to the reinforcing member and a side wall of the mounting slot to fix the reinforcing member and the circuit board; and a photosensitive chip connected to the reinforcing member and electrically connected to the circuit board by gold wires, and the photosensitive chip is located on the same side of the reinforcing member as the top surface. The upper surface of the reinforcing member is flush with the top surface of the circuit board, and the lower surface of the reinforcing member is flush with the bottom surface of the circuit board.

2. The circuit board assembly of claim 1, wherein, The mounting slot comprises:

3. The circuit board assembly of claim 2, wherein, a first receiving slot formed in the top surface; a second receiving slot formed in the bottom wall of the first receiving slot and extending through the bottom surface, so that the mounting slot has a stepped structure; wherein the reinforcing member is adapted to the mounting slot. The mounting slot comprises:

4. The circuit board assembly of claim 2, wherein, a first receiving slot formed in the bottom surface; a second receiving slot formed in the bottom wall of the first receiving slot and extending through the top surface, so that the mounting slot has a stepped structure; wherein the reinforcing member is adapted to the mounting slot. Further comprising:

5. The circuit board assembly of claim 1, wherein, an electronic component electrically connected to the circuit board and disposed on the bottom surface. The reinforcing member comprises:

6. The circuit board assembly of claim 5, wherein, a main body accommodated in the mounting slot and connected to the side wall of the mounting slot by the adhesive member, and the upper surface of the main body is flush with the top surface; an extension body connected to the lower surface of the main body and protruding from the bottom surface, and the two ends of the extension body are respectively attached to the bottom surface. The height of the extension body relative to the bottom surface is greater than the height of the electronic component relative to the bottom surface.

7. The circuit board assembly of claim 6, wherein, The two ends of the photosensitive chip protrude from the reinforcing member, and the two ends of the photosensitive chip are connected to the top surface.

8. The circuit board assembly of claim 1, wherein, The circuit board assembly comprises:

9. An image capture module, comprising: the circuit board assembly of any one of claims 1 to 8; a fixing seat provided on the circuit board; and a lens assembly provided on the fixing seat and located on the photosensitive side of the photosensitive chip. The camera module comprises: the camera module of claim 9; 10. An electronic device, comprising: a housing, and the camera module is mounted in the housing. ​ ​

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