Heat dissipation structure of magnetron sputtering coating machine

Abstract

The utility model relates to the technical field of coating machines, in particular to a heat dissipation structure of a magnetron sputtering coating machine, which comprises a casing, an end plate is fixed at one end of the casing, a plurality of magnetron sputtering target mechanisms are arranged on the casing, and through holes are formed in positions, corresponding to the magnetron sputtering target mechanisms, of the end plate. A machine base and a partition plate are arranged between every two adjacent magnetron sputtering target mechanisms, the machine bases are fixed to the ends of the partition plates, and the heat dissipation mechanism is used for conducting heat dissipation and cooling on the magnetron sputtering target mechanisms. Water flows into the capillary tubes to absorb heat, the whole heat absorption area is enlarged through the multiple capillary tubes, meanwhile, the water enters the backflow base to wash the impeller so that the air sweeping plate can rotate along with the backflow base, and therefore the whole heat dissipation and cooling speed is increased.

Description

TECHNICAL FIELD

[0001] The utility model relates to a coating machine technical field especially relates to a kind of heat dissipation structure of magnetron sputtering coating machine. BACKGROUND

[0002] According to the patent file with the announcement No.CN 218969350 U, the cooling liquid pipe is arranged in each sputtering target, the cooling liquid is introduced into the cooling liquid pipe, the cooling liquid flows through the cooling liquid pipe, and the heat in the hollow cavity is removed, so that the internal sputtering target is directly cooled.

[0003] In the cooling process of the above-mentioned patent file, the cooling area of a single cooling liquid pipe is relatively small, and the heat dissipation effect is limited, and the single cooling liquid pipe cannot be closer to the sputtering target, and the distance between the sputtering target and the cooling liquid pipe is moved, so that the heat exchange efficiency is relatively low. UTILITY MODEL CONTENT

[0004] The utility model discloses a kind of heat dissipation structure of magnetron sputtering coating machine.

[0005] The utility model realizes the above-mentioned purpose by the following technical solutions:

[0006] A kind of heat dissipation structure of magnetron sputtering coating machine, including shell, one end of shell is fixed with end plate, multiple magnetron sputtering target mechanisms are equipped on shell, through hole is set in the corresponding position of end plate and magnetron sputtering target mechanism, machine base and baffle are equipped between adjacent two magnetron sputtering target mechanisms, machine base is fixed at the end of baffle, and it further includes the heat dissipation mechanism for cooling the magnetron sputtering target mechanism.

[0007] The heat dissipation mechanism includes water inlet pipe, the end of water inlet pipe away from end plate is equipped with water inlet, the side of water inlet pipe away from water inlet is equipped with backflow seat, multiple annularly distributed capillary tubes are equipped between backflow seat and water inlet pipe, the end of capillary tube that extends into magnetron sputtering target mechanism is fixed in tangent direction of backflow seat, backflow pipe is rotatably connected to the side of backflow seat close to water inlet pipe, the end of backflow pipe away from backflow seat penetrates water inlet pipe, impeller is fixed to the end of backflow pipe that extends into backflow seat, two symmetrical air sweeping plates are arranged between backflow seat and water inlet pipe.

[0008] Preferably, the magnetron sputtering target mechanism includes a sputtering target, and the end of the sputtering target away from the end plate is provided with a positioning seat.

[0009] Preferably, the positioning seat corresponds to the through hole of the end plate.

[0010] Preferably, the end of the backflow pipe extending out of the water inlet pipe is provided with a water outlet.

[0011] Preferably, the capillary and the backflow seat are located inside the sputtering target.

[0012] Preferably, the backflow pipe is provided with a heat shield at a position inside the water inlet pipe, and the heat shield and the backflow pipe form an annular hollow cavity.

[0013] Compared with the prior art, the beneficial effects are as follows: heat is absorbed by water flowing into the capillary, the entire heat absorption area is expanded by the plurality of capillaries, and the water entering the backflow seat washes the impeller to make the air sweeping plate rotate with the backflow pipe, thereby accelerating the entire heat dissipation and cooling speed. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0015] Figure 1 is a structural schematic view of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0016] Figure 2 is a sectional view of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0017] Figure 3 is a liquid flow diagram of the water inlet pipe and the backflow pipe of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0018] Figure 4 is a partial sectional view of the heat shield of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0019] Figure 5 is a structural schematic view of the air sweeping plate of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0020] Figure 6 is a partial parts diagram of the capillary of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0021] Figure 7 is a cooperation diagram of the air sweeping plate and the capillary of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0022] Figure 8 is a partial sectional view of the backflow seat of the heat dissipation structure of the magnetron sputtering coating machine according to the present application;

[0023] Figure 9Is the partial parts drawing of the impeller of the heat dissipation structure of the magnetron sputtering coating machine of the utility model;

[0024] Figure 10 Is the partial section view of the backflow seat and the impeller of the heat dissipation structure of the magnetron sputtering coating machine of the utility model.

[0025] The sign of the drawing is explained as follows:

[0026] 1, the casing;2, magnetron sputtering target mechanism;3, end plate;4, heat dissipation mechanism;5, branch cylinder;6, machine base;7, partition;21, positioning seat;22, sputtering target;41, water inlet pipe;42, capillary;43, backflow seat;44, backflow pipe;45, heat shield;46, air-sweeping plate;47, impeller. Specific implementation

[0027] In the description of the utility model, it is explained that, unless another explicit provision and limitation, the term "installation", "connection", "connect" should be broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;It can be directly connected, also can be indirectly connected through intermediate medium, can be the intercommunication of two elements inside.For the ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood through specific circumstances.

[0028] The utility model is further explained as follows in combination with the drawings:

[0029] As Figures 1-10 The heat dissipation structure of a magnetron sputtering coating machine, including casing 1, the end of casing 1 is fixed with end plate 3, is equipped with a plurality of magnetron sputtering target mechanism 2 on casing 1, the through hole is set up in the corresponding position of end plate 3 and magnetron sputtering target mechanism 2, is equipped with machine base 6 and partition 7 between adjacent two magnetron sputtering target mechanism 2, machine base 6 is fixed in the end part of partition 7, still include the heat dissipation mechanism 4 for the heat dissipation cooling of magnetron sputtering target mechanism 2;

[0030] In the embodiment, the heat dissipation mechanism 4 comprises a water inlet pipe 41, the water inlet pipe 41 is provided with a water inlet at one end away from the end plate 3, the side of the water inlet pipe 41 away from the water inlet is provided with a backflow seat 43, a plurality of annularly distributed capillary tubes 42 are arranged between the backflow seat 43 and the water inlet pipe 41, one end of the capillary tube 42 extending into the interior of the magnetron sputtering target mechanism 2 is fixed in the tangential direction of the backflow seat 43, the side of the backflow seat 43 close to the water inlet pipe 41 is rotatably connected with a backflow pipe 44, one end of the backflow pipe 44 away from the backflow seat 43 penetrates the water inlet pipe 41, the backflow pipe 44 is fixed with an impeller 47 at the end extending into the backflow seat 43, the backflow pipe 44 is provided with two symmetrical air sweeping plates 46 between the backflow seat 43 and the water inlet pipe 41, the backflow pipe 44 is provided with a heat shield 45 at the position inside the water inlet pipe 41, the heat shield 45 and the backflow pipe 44 form an annular hollow cavity, water is supplied into the interior of the water inlet pipe 41 through the water inlet of the water inlet pipe 41, the water in the water inlet pipe 41 enters the capillary tube 42, and the heat absorption effect of heat dissipation is achieved through the flow in the capillary tube 42. In addition, when the water after heat absorption flows into the backflow seat 43 from the capillary tube 42, the flow direction of the water is into the backflow seat 43 in the tangential direction of the backflow seat 43. In this process, the water flow will hit the impeller 47, the backflow pipe 44 is driven to rotate by the impeller 47, and in the process of the backflow pipe 44, the water collected in the backflow seat 43 will flow into the interior of the backflow pipe 44 and flow out from the water outlet of the backflow pipe 44. In addition, in the process of rotation of the backflow pipe 44, the backflow seat 43 is rotated by the air sweeping plate 46 to speed up the whole heat exchange process.

[0031] In the embodiment, the magnetron sputtering target mechanism 2 comprises a sputtering target 22, the sputtering target 22 is provided with a positioning seat 21 at one end away from the end plate 3, the sputtering target 22 is provided with a support cylinder 5 at one end away from the positioning seat 21, the support cylinder 5 corresponds to the through hole of the end plate 3, the backflow pipe 44 is provided with a water outlet at the end extending out of the water inlet pipe 41, the capillary tube 42 and the backflow seat 43 are located inside the sputtering target 22, and the sputtering target 22 is supported by the positioning seat 21.

[0032] Working principle: when the magnetron sputtering target mechanism 2 performs magnetron sputtering coating, the sputtering target 22 is supported by the positioning seat 21, water is introduced through the water inlet of the water inlet pipe 41, the water flows into the capillary tube 42 from the water inlet pipe 41, and then flows into the backflow seat 43, the water collected in the backflow seat 43 flows into the interior of the backflow pipe 44 through the end of the backflow pipe 44 provided with the impeller 47, and then flows out from the water outlet of the backflow pipe 44, thereby completing the water circulation for cooling and heat dissipation.

[0033] When the water flows into the capillary tube 42 through the water inlet pipe 41, the water will lower the temperature of the capillary tube 42, and the heat absorption area is expanded through the plurality of capillary tubes 42, and then the sputtering target 22 is heat-absorbed and cooled by the capillary tube 42, and the water after heat absorption will enter the interior of the backflow seat 43.

[0034] In addition, when the water flows into the backflow seat 43 from the capillary tube 42, the water flows into the backflow seat 43 in a tangential direction outside the backflow seat 43, and then enters the backflow pipe 44 at the center of the backflow seat 43, and then the water flows in the form of a vortex in the process. When the water flows into the backflow seat 43 from the capillary tube 42, the water flow also drives the impeller 47 and the backflow pipe 44 to rotate, and the rotation of the backflow pipe 44 drives the air sweeping plate 46 to rotate, thereby accelerating the heat exchange process around the capillary tube 42 and improving the heat dissipation effect.

[0035] In addition, when the water flows out of the backflow pipe 44 at the center of the water inlet pipe 41 after absorbing heat, the hollow structure composed of the heat shield 45 and the backflow pipe 44 is used to prevent the water entering the water inlet pipe 41 from exchanging heat with the water sent out of the backflow pipe 44, and the entire hollow structure is effectively insulated from heat transfer by being vacuumized.

[0036] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application.

Claims

1. A heat dissipation structure for a magnetron sputtering coating machine, comprising a housing (1), an end plate (3) fixed to one end of the housing (1), a plurality of magnetron sputtering target mechanisms (2) provided on the housing (1), through holes provided on the end plate (3) at positions corresponding to the magnetron sputtering target mechanisms (2), a base (6) and a partition plate (7) provided between two adjacent magnetron sputtering target mechanisms (2), the base (6) being fixed to the end of the partition plate (7), characterized in that: It also includes a heat dissipation mechanism (4) for cooling the magnetron sputtering target mechanism (2); The heat dissipation mechanism (4) includes a water inlet pipe (41), with an inlet at one end of the water inlet pipe (41) away from the end plate (3). A return seat (43) is provided on the side of the water inlet pipe (41) away from the inlet. A plurality of annularly distributed capillaries (42) are provided between the return seat (43) and the water inlet pipe (41). One end of the capillaries (42) extending into the magnetron sputtering target mechanism (2) is fixed to the tangent of the return seat (43). In the direction, the return seat (43) is rotatably connected to the side of the water inlet pipe (41) with a return pipe (44). The end of the return pipe (44) away from the return seat (43) passes through the water inlet pipe (41). An impeller (47) is fixed to the end of the return pipe (44) that extends into the return seat (43). Two symmetrical air sweeping plates (46) are provided between the return pipe (44) and the water inlet pipe (41).

2. The heat dissipation structure of a magnetron sputtering coating machine according to claim 1, characterized in that: The magnetron sputtering target mechanism (2) includes a sputtering target (22), a positioning seat (21) is provided at one end of the sputtering target (22) away from the end plate (3), and a support cylinder (5) is provided at one end of the sputtering target (22) away from the positioning seat (21).

3. The heat dissipation structure of a magnetron sputtering coating machine according to claim 2, characterized in that: The support cylinder (5) corresponds to the through hole of the end plate (3).

4. The heat dissipation structure of a magnetron sputtering coating machine according to claim 2, characterized in that: The return pipe (44) has an outlet at one end extending from the inlet pipe (41).

5. The heat dissipation structure of a magnetron sputtering coating machine according to claim 2, characterized in that: The capillary tube (42) and the reflux seat (43) are located inside the sputtering target (22).

6. The heat dissipation structure of a magnetron sputtering coating machine according to claim 1, characterized in that: The return pipe (44) is located inside the water inlet pipe (41) and is equipped with a heat insulation cover (45). The heat insulation cover (45) and the return pipe (44) form an annular hollow cavity.

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