Optical module

Abstract

The optical module provided by the utility model comprises a circuit board, a laser chip and a substrate. The substrate is used for bearing the laser chip. The surface of the substrate is provided with a first differential signal transmission line and a second differential signal transmission line, and the first differential signal transmission line and the second differential signal transmission line transmit a first differential modulation signal and a second differential modulation signal to the laser chip respectively. The second differential signal transmission line is far away from the laser chip relative to the first differential signal transmission line. The first differential signal transmission line comprises a first guiding part and a first bending part. And in the transmission direction of the first differential modulation signal, the first guide part is gradually far away from the laser chip to guide the first differential signal transmission line to extend towards the direction far away from the laser chip so as to provide a bending space for the first bending part. The second differential signal transmission line comprises a second guiding part and a second bending part, and the second guiding part is gradually close to the laser chip, so that the differential impedance discontinuity is reduced. The curvature radius of the first bending part is larger than that of the second bending part, thereby counteracting the path length difference of the transmission line, reducing the phase difference, and improving the high-frequency performance.

Description

Technical Field

[0001] This disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Technology

[0002] With the development of new business and application models such as cloud computing, mobile internet, and video, advancements in optical communication technology have become increasingly important. In optical communication technology, the optical module, as one of the key components in optical communication equipment, enables photoelectric signal conversion; and in the development of optical communication technology, the data transmission rate of optical modules is required to continuously improve. Utility Model Content

[0003] Some embodiments provide an optical module to improve high-frequency transmission performance.

[0004] In some embodiments, an optical module is provided, comprising:

[0005] Circuit board;

[0006] The laser chip is electrically connected to the circuit board;

[0007] A substrate is used to support the laser chip and electrically connect the circuit board and the laser chip respectively. The surface of the substrate is provided with:

[0008] A first differential signal transmission line is used to transmit a first differential modulation signal to the laser chip; the first differential signal transmission line is disposed close to the laser chip; the first differential signal transmission line includes:

[0009] The first wide section is electrically connected to the circuit board;

[0010] A first guide portion is connected to the first wide area portion; along the first differential modulation signal transmission direction, the first guide portion gradually moves away from the laser chip to guide the first differential signal transmission line to a region away from the laser chip;

[0011] The first narrow section is connected to the first guide section;

[0012] A first curved portion is connected to the first narrow portion, and the first curved portion bends toward the laser chip to be electrically connected to the laser chip;

[0013] A second differential signal transmission line is used to transmit a second differential modulation signal to the laser chip; the second differential signal transmission line is located away from the laser chip relative to the first differential signal transmission line; the second differential signal transmission line includes:

[0014] The second wide section is electrically connected to the circuit board;

[0015] The second guide portion is connected to the second wide area portion; along the second differential modulation signal transmission direction, the second guide portion gradually approaches the laser chip to guide the second differential signal transmission line to the area close to the laser chip;

[0016] The second narrow section is connected to the second guide section;

[0017] The second curved portion is connected to the second narrow portion, and the second curved portion bends toward the laser chip to be electrically connected to the laser chip; the radius of curvature of the second curved portion is smaller than the radius of curvature of the first curved portion.

[0018] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board, a laser chip, and a substrate. The substrate is used to support the laser chip. The substrate is electrically connected to the circuit board and the laser chip respectively, thereby outputting signals to the laser chip. A first differential signal transmission line and a second differential signal transmission line are provided on the surface of the substrate. The first differential signal transmission line transmits a first differential modulation signal to the laser chip, and the second differential signal transmission line transmits a second differential modulation signal to the laser chip. The first differential signal transmission line is located close to the laser chip, and the second differential signal transmission line is located away from the laser chip relative to the first differential signal transmission line. By arranging the routing of the first differential signal transmission line and the second differential signal transmission line, the path length difference between the two differential signal transmission lines is offset, thereby reducing the phase delay difference and ensuring signal integrity. At the same time, differential impedance discontinuity is reduced. The first differential signal transmission line includes a first wide region located at the end of the first differential signal transmission line facing the circuit board. The second differential signal transmission line includes a second wide region located at the end of the second differential signal transmission line facing the circuit board. The first differential signal transmission line includes a first guide portion and a first bend portion. The first guide portion is connected to the first wide section. Along the first differential modulation signal transmission direction, the first guide portion gradually moves away from the laser chip, thereby guiding the first differential signal transmission line to extend away from the laser chip, providing bending space for the first curved section to achieve a specific radius of curvature. The second differential signal transmission line includes a second guide portion and a second curved section. The second guide portion is connected to the second wide section. Along the second differential modulation signal transmission direction, the second guide portion gradually approaches the laser chip, guiding the second differential signal transmission line to extend closer to the laser chip, ensuring sufficient spacing with the first differential signal transmission line and reducing differential impedance discontinuities. The first differential signal transmission line includes a first narrow section. The first narrow section is connected to the first guide portion. The first guide portion connects the first wide section and the first narrow section, achieving a transition connection from the first wide section to the first narrow section. The second differential signal transmission line may include a second narrow section. The second narrow section is connected to the second guide portion. The second guide portion connects the second wide section and the second narrow section, achieving a transition connection from the second wide section to the second narrow section. The first bending portion bends the first differential signal transmission line toward the laser chip, shortening the wire bonding length between them. The second bending portion bends the second differential signal transmission line toward the laser chip, shortening the wire bonding length between them as well. The second bending portion is positioned close to the first bending portion to ensure sufficient spacing between them and impedance matching. Since the first differential signal transmission line is closer to the laser chip than the second differential signal transmission line, the radius of curvature of the first bending portion is greater than that of the second bending portion.The use of a larger radius of curvature in the bend of the first differential signal transmission line and a smaller radius of curvature in the bend of the second differential signal transmission line can offset the difference in path length between the two differential signal transmission lines, thereby reducing the phase delay difference, ensuring signal integrity, and improving high-frequency transmission performance.

[0019] In some embodiments, the first differential signal transmission line includes:

[0020] A first extension portion has one end connected to the first bent portion and the other end electrically connected to the laser chip; the line width of the first end of the first extension portion is greater than the line width of the second end, wherein the first end is electrically connected to the laser chip and the second end is connected to the first bent portion;

[0021] The second differential signal transmission line includes:

[0022] The second extension has one end connected to the second bending portion and the other end electrically connected to the laser chip; the line width of the first end of the second extension is greater than the line width of the second end, wherein the first end is electrically connected to the laser chip and the second end is connected to the second bending portion.

[0023] The above technical solution has the following advantages or beneficial effects: The first differential signal transmission line is connected to the laser chip via two wire bonding connections at its end, and the second differential signal transmission line is also connected to the laser chip via two wire bonding connections, thereby reducing the parasitic inductance generated by the wire bonding. Based on this, the first differential signal transmission line includes a first extension portion. The first extension portion is connected to a first bend portion and is formed at the tail of the first differential signal transmission line. The first extension portion is wire bonded to the laser chip. The linewidth at the first end of the first extension portion is greater than the linewidth at its second end, facilitating sufficient wiring space for the wire bonding. Specifically, the first end is connected to the first RF electrode via two wire bonding connections, and the second end is connected to the first bend portion via two wire bonding connections. By widening the tail of the signal transmission line connected to the laser chip, accommodating the direction of the two wire bonding connections, the total parasitic inductance is reduced, and high-speed performance is improved. The second differential signal transmission line may include a second extension portion. The second extension portion is connected to the second bend portion and is formed at the tail of the second differential signal transmission line. The second extension portion is wire bonded to the second RF electrode. The line width at the first end of the second extension is greater than that at the second end, which also facilitates providing sufficient wiring components for wire bonding. Specifically, the first end is connected to the laser chip via a double-wire bonding connection, and the second end is connected to the second bend via a double-wire bonding connection. By widening the tail of the signal transmission line connected to the laser chip, accommodating the double-wire bonding direction, the total parasitic inductance is reduced, and high-speed performance is improved.

[0024] In some embodiments, the first differential signal transmission line includes:

[0025] The first shifting part has one end connected to the first wide area and the other end electrically connected to the circuit board; the first shifting part is shifted relative to the first wide area in a direction closer to the laser chip;

[0026] The second differential signal transmission line includes:

[0027] The second shifting part is connected at one end to the second wide area and at the other end to the circuit board; the second shifting part is shifted away from the laser chip relative to the second wide area.

[0028] The above technical solution has the following advantages or beneficial effects: the first differential signal transmission line includes a first shifting section, and the second differential signal transmission line includes a second shifting section. The first shifting section is shifted relative to the first wide area section towards the laser chip, and the second shifting section is shifted relative to the second wide area section away from the laser chip, so as to increase the spacing between the bonding areas of the two differential signal transmission lines, increase or decrease the bonding area capacitance, and partially offset the parasitic inductance generated by bonding.

[0029] In some embodiments, the line width of the first narrow region is smaller than the line width of the first wide region, and the line width of the second narrow region is smaller than the line width of the second wide region; wherein the distance between the first narrow region and the second narrow region is smaller than the distance between the first wide region and the second wide region.

[0030] The above technical solution has the following advantages or beneficial effects: the line width of the first narrow section is smaller than that of the first wide section, which allows for more bending space for the first bend, improving the gentleness of the bend. The line width of the second narrow section can be the same as that of the first narrow section to facilitate impedance matching; therefore, the line width of the second narrow section is smaller than that of the second wide section. Since the line widths of the first and second narrow sections are both smaller, by adjusting the spacing between them to be smaller than the spacing between them, the impedance at the first narrow section is matched with the impedance at the first wide section, and similarly, the impedance at the second narrow section is matched with the impedance at the second wide section, reducing differential impedance discontinuities and ensuring differential impedance continuity.

[0031] In some embodiments, the linewidth of the first guide portion gradually decreases along the first differential modulation signal transmission direction; the linewidth of the second guide portion gradually decreases along the second differential modulation signal transmission direction; and the distance between the first guide portion and the second guide portion gradually decreases along the first differential modulation signal transmission direction.

[0032] The above technical solution has the following advantages or beneficial effects: Since the line width of the first narrow region is smaller than the line width of the first wide region, the line width of the first guide portion gradually decreases along the first differential modulation signal transmission direction. Since the line width of the second narrow region is smaller than the line width of the second wide region, the line width of the second guide portion gradually decreases along the second differential modulation signal transmission direction. By adjusting the spacing between the two differential signal lines to maintain differential impedance continuity, the spacing between the first guide portion and the second guide portion gradually decreases along the first differential modulation signal transmission direction to reduce differential impedance discontinuity, thereby maintaining differential impedance continuity in the differential signal transmission direction.

[0033] In some embodiments, an optical module is provided, comprising:

[0034] Circuit board;

[0035] A light-emitting component, electrically connected to the circuit board, includes:

[0036] A laser chip, comprising a first radio frequency electrode, a second radio frequency electrode, a first DC electrode, and a second DC electrode;

[0037] A substrate having a first pad on its surface, the substrate surface being provided with:

[0038] The first differential signal transmission line is electrically connected to the first radio frequency electrode and the circuit board respectively; the first differential signal transmission line has a first guiding portion and a first bending portion, the first guiding portion is used to guide the first differential signal transmission line to a region away from the laser chip, so that the first bending portion bends toward the laser chip with a first radius of curvature;

[0039] The second differential signal transmission line is electrically connected to the second radio frequency electrode and the circuit board respectively; the second differential signal transmission line is farther away from the laser chip relative to the first differential signal transmission line; the second differential signal transmission line has a second guiding portion and a second bending portion, the second guiding portion is used to guide the second differential signal transmission line to a region close to the laser chip, so that the second bending portion bends towards the laser chip with a second radius of curvature; wherein, the second radius of curvature is smaller than the first radius of curvature;

[0040] The coupling capacitor has its positive terminal electrically connected to the first pad and its negative terminal electrically connected to the substrate surface; the positive terminal of the coupling capacitor is electrically connected to the first DC electrode, and the negative terminal of the coupling capacitor is electrically connected to the second DC electrode.

[0041] The above technical solution has the following advantages or beneficial effects: The optical module includes a circuit board and an optical emitting component. The optical emitting component includes a laser chip and a substrate. The substrate is used to carry the laser chip and is electrically connected to both the laser chip and the circuit board, thereby transmitting the signal output from the circuit board to the laser chip through the substrate. The laser chip includes a first radio frequency electrode, a second radio frequency electrode, a first DC electrode, and a second DC electrode. The first and second radio frequency electrodes are used to input a first differential modulation signal and a second differential modulation signal to the laser chip, respectively. The first and second DC electrodes are used to input a differential reverse bias voltage to the laser chip. Under the action of the differential reverse bias voltage, the intensity of the light emitted by the light-emitting area in the laser chip changes according to the modulation current signal, thereby modulating the intensity and generating an optical signal carrying information. A coupling capacitor is provided on the surface of the substrate. The positive terminal of the first DC electrode is electrically connected to the positive terminal of the coupling capacitor, and the negative terminal of the first DC electrode is electrically connected to the negative terminal of the coupling capacitor. Thus, a coupling capacitor is connected in series between the positive and negative terminals of the first DC electrode, which facilitates DC isolation between the first and second DC electrodes. A first pad is provided on the substrate surface. The positive terminal of a coupling capacitor is electrically connected to the first pad, and the negative terminal is electrically connected to the substrate surface. To transmit a first differential modulation signal and a second differential modulation signal, a first differential signal transmission line and a second differential signal transmission line are provided on the substrate surface. By arranging the traces of the first and second differential signal transmission lines, the path length difference between the two differential signal transmission lines is offset, thereby reducing phase delay differences and ensuring signal integrity. Simultaneously, differential impedance discontinuities are reduced. The first differential signal transmission line includes a first guiding portion and a first bending portion. Along the transmission direction of the first differential modulation signal, the first guiding portion gradually moves away from the laser chip, guiding the first differential signal transmission line to extend away from the laser chip, providing bending space for the first bending portion, giving the first bending portion a specific first radius of curvature. The second differential signal transmission line includes a second guiding portion and a second bending portion. Along the transmission direction of the second differential modulation signal, the second guiding portion gradually moves closer to the laser chip, guiding the second differential signal transmission line to extend closer to the laser chip, ensuring sufficient spacing with the first differential signal transmission line and reducing differential impedance discontinuities. The first bend bends the first differential signal transmission line toward the laser chip with a first radius of curvature, shortening the wire bonding length between the two. The second bend bends the second differential signal transmission line toward the laser chip with a second radius of curvature, also shortening the wire bonding length. The second bend is positioned close to the first bend to ensure sufficient spacing between them for impedance matching. Since the first differential signal transmission line is closer to the laser chip than the second differential signal transmission line, the radius of curvature of the first bend is greater than that of the second bend; that is, the first radius of curvature is greater than the second radius of curvature.The use of a larger radius of curvature in the bend of the first differential signal transmission line and a smaller radius of curvature in the bend of the second differential signal transmission line can offset the difference in path length between the two differential signal transmission lines, thereby reducing the phase delay difference, ensuring signal integrity, and improving high-frequency transmission performance.

[0042] In some embodiments, the laser chip includes a first bias electrode and a second bias electrode;

[0043] The substrate surface is provided with a second pad and a third pad. The first bias electrode is electrically connected to the circuit board through the second pad, and the second bias electrode is electrically connected to the circuit board through the third pad.

[0044] The above technical solution has the following advantages or beneficial effects: the first bias electrode is electrically connected to the circuit board through the second pad, and the second bias electrode is electrically connected to the circuit board through the third pad, thereby inputting bias current into the light-emitting area in the laser chip, so that the light-emitting area emits light.

[0045] In some embodiments, the first differential signal transmission line includes:

[0046] The first wide section has one end electrically connected to the circuit board and the other end electrically connected to the first guide section;

[0047] The first narrow section has one end connected to the first guide section and the other end electrically connected to the first curved section. The line width of the first narrow section is smaller than the line width of the first wide section.

[0048] The second differential signal transmission line includes:

[0049] The second wide section has one end electrically connected to the circuit board and the other end connected to the second guide section;

[0050] The second narrow section has one end connected to the second guide section and the other end electrically connected to the second bending section. The line width of the second narrow section is smaller than the line width of the second wide section.

[0051] The above technical solution has the following advantages or beneficial effects: The first differential signal transmission line includes a first wide section, which is located at the end of the first differential signal transmission line facing the circuit board. The second differential signal transmission line includes a second wide section, which is located at the end of the second differential signal transmission line facing the circuit board. The first differential signal transmission line includes a first narrow section, which is connected to a first guide section. The first guide section is used to connect the first wide section and the first narrow section, realizing a transition connection from the first wide section to the first narrow section. The second differential signal transmission line may include a second narrow section, which is connected to a second guide section. The second guide section is used to connect the second wide section and the second narrow section, realizing a transition connection from the second wide section to the second narrow section. The line width of the first narrow section is smaller than that of the first wide section, which facilitates more bending space for the first bending section and improves the bending smoothness of the first bending section. The line width of the second narrow section can be the same as that of the first narrow section to facilitate impedance matching, thus the line width of the second narrow section is smaller than that of the second wide section.

[0052] In some embodiments, the first differential signal transmission line includes:

[0053] The first extension has one end connected to the first bending portion and the other end electrically connected to the laser chip; the line width of the first end of the first extension is greater than the line width of the second end, the first end is electrically connected to the laser chip, and the second end is connected to the first bending portion.

[0054] The second differential signal transmission line includes:

[0055] The second extension has one end connected to the second bending portion and the other end electrically connected to the laser chip; the line width of the first end of the second extension is greater than the line width of the second end, the first end is electrically connected to the laser chip, and the second end is connected to the second bending portion.

[0056] The above technical solution has the following advantages or beneficial effects: The first differential signal transmission line is connected to the laser chip via two wire bonding connections at its end, and the second differential signal transmission line is also connected to the laser chip via two wire bonding connections, thereby reducing the parasitic inductance generated by the wire bonding. Based on this, the first differential signal transmission line includes a first extension portion. The first extension portion is connected to a first bend portion and is formed at the tail of the first differential signal transmission line. The first extension portion is wire bonded to the laser chip. The linewidth at the first end of the first extension portion is greater than the linewidth at its second end, facilitating sufficient wiring space for the wire bonding. Specifically, the first end is connected to the first RF electrode via two wire bonding connections, and the second end is connected to the first bend portion via two wire bonding connections. By widening the tail of the signal transmission line connected to the laser chip, accommodating the direction of the two wire bonding connections, the total parasitic inductance is reduced, and high-speed performance is improved. The second differential signal transmission line may include a second extension portion. The second extension portion is connected to the second bend portion and is formed at the tail of the second differential signal transmission line. The second extension portion is wire bonded to the second RF electrode. The line width at the first end of the second extension is greater than that at the second end, which also facilitates providing sufficient wiring components for wire bonding. Specifically, the first end is connected to the laser chip via a double-wire bonding connection, and the second end is connected to the second bend via a double-wire bonding connection. By widening the tail of the signal transmission line connected to the laser chip, accommodating the double-wire bonding direction, the total parasitic inductance is reduced, and high-speed performance is improved.

[0057] In some embodiments, the first differential signal transmission line includes:

[0058] The first shifting part is connected to the first wide area part and shifted relative to the first wide area part in a direction closer to the laser chip;

[0059] The second differential signal transmission line includes:

[0060] The second shifting section is connected to the second wide area section and shifted relative to the second wide area section in a direction away from the laser chip.

[0061] The above technical solution has the following advantages or beneficial effects: the first differential signal transmission line includes a first shifting section, and the second differential signal transmission line includes a second shifting section. The first shifting section is shifted relative to the first wide area section towards the laser chip, and the second shifting section is shifted relative to the second wide area section away from the laser chip, so as to increase the spacing between the bonding areas of the two differential signal transmission lines, reduce the bonding area capacitance, and partially offset the parasitic inductance generated by bonding. Attached Figure Description

[0062] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are merely drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. Furthermore, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0063] Figure 1 This is a partial architecture diagram of an optical communication system according to some embodiments;

[0064] Figure 2 This is a partial structural diagram of a host computer according to some embodiments;

[0065] Figure 3 This is a structural diagram of an optical module according to some embodiments;

[0066] Figure 4 An exploded view of an optical module according to some embodiments;

[0067] Figure 5 This is a cross-sectional structural diagram of a light-emitting region according to some embodiments;

[0068] Figure 6 A cross-sectional structure of an electroabsorption modulation region according to some embodiments. Figure 1 ;

[0069] Figure 7 A cross-sectional structure of an electroabsorption modulation region according to some embodiments. Figure 2 ;

[0070] Figure 8 This is a structural diagram of a laser component according to some embodiments;

[0071] Figure 9 This is an exploded structural diagram of a laser component according to some embodiments;

[0072] Figure 10 This is a top view of a laser assembly according to some embodiments;

[0073] Figure 11 This is an exploded top view of a laser assembly according to some embodiments;

[0074] Figure 12 This is a schematic diagram of a first differential signal transmission line and a second differential signal transmission line according to some embodiments;

[0075] Figure 13 This is a partially enlarged view of a first differential signal transmission line and a second differential signal transmission line according to some embodiments. Detailed Implementation

[0076] The embodiments of this disclosure will now be described clearly and in detail with reference to the accompanying drawings. However, the described embodiments are merely some, and not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0077] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as open and inclusive, meaning "including, but not limited to"; the terms "first" and "second" should not be construed as indicating or implying relative importance or indicating an upper limit on the number; the term "multiple" means two or more; the term "connection" should be interpreted broadly, for example, "connection" can be a fixed connection, a detachable connection, or an integral part, and can be a direct connection or an indirect connection through an intermediate medium; the use of the terms "applicable to" or "configured to" implies open and inclusive language, which does not exclude applicability to or configuration to devices performing additional tasks or steps; descriptions such as "parallel," "perpendicular," "identical," "consistent," and "aligned" are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges arising in practice, and differences based on the same design concept but due to manufacturing reasons.

[0078] In optical communication technology, to establish information transmission between information processing devices, information is loaded onto light, and the speed of light propagation is used to transmit the information. This light carrying information is called an optical signal. When optical signals are transmitted in optical information transmission equipment, optical power loss can be reduced, enabling long-distance transmission of optical signals. At the same time, the cost of optical information transmission equipment such as optical fibers is lower than that of electrical information transmission equipment such as copper wires. Therefore, optical communication technology can achieve high-speed, long-distance, and low-cost information transmission.

[0079] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., while optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can only recognize and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert between optical and electrical signals.

[0080] An optical module enables the conversion between optical signals and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output terminals of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output terminals of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0081] Since multiple information processing devices can transmit information via electrical signals, at least one of these devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the host computer of the optical module. Furthermore, the optical signal input or output terminal of the optical module is called the optical port, and the electrical signal input or output terminal is called the electrical port.

[0082] Figure 1 This is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100 for optical modules, an optical module 200, an optical fiber 101, and a network cable 103. Among them, the optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0083] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total internal reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total internal reflection can almost maintain the original optical power. The optical signal undergoes multiple total internal reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance information transmission based on low power loss.

[0084] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fiber 101 is detachably connected to the optical module 200; in some embodiments, the optical fiber 101 is non-detachably connected to the optical module 200.

[0085] The host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor or control the working status of the optical module 200.

[0086] The host computer 100 includes a housing for accommodating the optical module 200, and an optical module interface 102 disposed on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0087] The host computer 100 also includes an external power interface that can connect to an electrical signal network. In some embodiments, the external power interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0088] One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted in the optical fiber 101 to the remote information processing device 1000.

[0089] In some embodiments, a first optical signal from a remote information processing device 1000 is transmitted through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to an optical module 200. The optical module 200 converts the first optical signal into a first electrical signal, and transmits the first electrical signal to a host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to a local information processing device 2000.

[0090] In some embodiments, the optical module is a tool for converting optical signals to electrical signals. During the conversion process, the information does not change, but the encoding or decoding method of the information changes.

[0091] In addition to optical network terminals, the host computer 100 also includes optical line terminals (OLTs), optical network equipment (ONTs), or data center servers.

[0092] Figure 2This is a partial structural diagram of a host computer according to some embodiments. To clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. For example... Figure 2 As shown, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed in the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and fixed by the cage 106.

[0093] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0094] In some embodiments, an electrical connector is provided inside the cage 106, which is configured to connect to the electrical port of the optical module 200.

[0095] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is conducted to the cage 106 and then diffused through the heat sink 107.

[0096] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100, and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, thereby establishing an electrical signal connection between the optical module 200 and the host computer 100.

[0097] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101, thereby enabling the optical module 200 to establish an optical signal connection with the optical fiber 101.

[0098] Figure 3 This is a structural diagram of an optical module according to some embodiments. Figure 4 This is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, in some embodiments, the optical module 200 includes a shell, which comprises an upper shell 201 and a lower shell 202. The upper shell 201 covers the lower shell 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the shell forms an opening that serves as both an electrical port and an optical port.

[0099] In some embodiments, the upper housing 201 and the lower housing 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0100] The assembly method of combining the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the housing. The upper housing 201 and the lower housing 202 can encapsulate and protect the above-mentioned devices.

[0101] The direction of the line connecting the two openings 204 and 205 can be consistent with or inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200. Figure 3 The opening 205 is also located at the end of the optical module 200 (right end). Figure 3 (The left end). Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200.

[0102] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011, which covers the two lower side plates 2022 of the lower housing 202 to form the aforementioned housing.

[0103] In some embodiments, the lower housing 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and perpendicular to the base plate 2021; the upper housing 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011. The two upper side plates and the two lower side plates 2022 are combined to realize that the upper housing 201 covers the lower housing 202.

[0104] like Figure 3 and Figure 4As shown, in some embodiments, the optical module includes a circuit board 300 disposed within a housing. The circuit board 300 includes circuit traces, electronic components, and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0105] In some embodiments, the circuit board includes a rigid circuit board, which, due to its relatively rigid material, can also serve a load-bearing function, such as being able to stably support the aforementioned electronic components and chips; the rigid circuit board can also be inserted into an electrical connector in the cage 106 of the host computer 100.

[0106] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0107] In some embodiments, the circuit board further includes gold fingers formed on its end surface, the gold fingers consisting of a plurality of independent pins.

[0108] In some implementations, the gold fingers 301 are disposed on one side of the surface of the circuit board 300 (e.g., Figure 4 (as shown on the upper surface); In some implementations, the gold fingers 301 are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where the number of pins is required.

[0109] In some implementations, the gold fingers of the circuit board extend from the opening 204 and are inserted into the electrical connector of the host computer 100; the circuit board is inserted into the cage 106, and the gold fingers 301 are connected to the electrical connector inside the cage 106. The gold fingers 301 are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, and data signal transmission.

[0110] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to establish a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0111] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a locking component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the locking component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the locking component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the locking component and the host computer, so as to release the fixation between the optical module 200 and the host computer, thereby allowing the optical module 200 to be pulled out of the cage 106.

[0112] In some embodiments, the optical module includes a light emitting component 400. In some embodiments, the optical module includes a light receiving component 500. In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on the side of the circuit board 300 away from the gold finger 301.

[0113] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0114] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on the surface of the circuit board 300 or the side of the circuit board 300.

[0115] In some embodiments, the optical emitting component 400 and the optical receiving component 500 are both disposed on the round-square tube body. The optical emitting component 400 is used to generate and output signal light, and the optical receiving component 500 is used to receive signal light from outside the optical module. An optical fiber adapter is disposed on the round-square tube body, which is used to connect the optical module to an external optical fiber.

[0116] Figure 5 This is a cross-sectional structural diagram of a light-emitting region according to some embodiments. For example... Figure 5 As shown, in some embodiments, in the light-emitting region 910, the first end and the second end, which are arranged opposite to each other, emit light respectively. The emitted light does not carry information and is to be modulated.

[0117] In some embodiments, a bias current is provided to the light-emitting region 910, and the light-emitting region 910 emits light under the action of the bias current.

[0118] In some embodiments, the light-emitting region 910 may include a substrate 911.

[0119] In some embodiments, the light-emitting region 910 may include an N-InP layer 912. The N-InP layer 912 is located above the substrate 911. The N-InP layer 912 is an N-type doped InP layer. The N-InP layer 912 primarily outputs N-type carriers.

[0120] In some embodiments, the light-emitting region 910 may include a first active layer 913. The first active layer 913 is located above the N-InP layer 912. The first active layer 913 employs a multi-quantum-well structure. The first active layer 913 is configured to generate photons by recombination of P-type carriers and N-type carriers. The N-type carriers originate from the N-InP layer 912.

[0121] In some embodiments, the light-emitting region 910 may include a grating layer 914. The grating layer 914 is located above the first active layer 913.

[0122] In some embodiments, the light-emitting region 910 may include a P-InP layer 915. The P-InP layer 915 is located above the grating layer 914. The P-InP layer 915 is a P-type doped InP layer. The P-InP layer 915 primarily outputs P-type carriers. The P-InP layer 915 inputs P-type carriers to the first active layer 913.

[0123] In some embodiments, within the first active layer 913, stimulated emission causes discrete P-type and N-type carrier pairs to recombine and generate photons, thereby converting injected carriers into photons. These photons are reflected by the resonant cavity or distributed feedback grating to form positive feedback, generating laser light. By changing the current injected into the grating layer 914, the effective refractive index of the grating layer 914 can be altered, thereby changing the laser resonant lasing wavelength and achieving output at a specific wavelength. Light without signal carrying is output from both ends of the first active layer 913.

[0124] In some embodiments, to ensure that the light output power of the two ends of the first active layer 913 is consistent, the grating layer 914 can be a phase-shift grating or a CPM grating, etc.

[0125] In some embodiments, the light-emitting region 910 may include a P-type electrode 916 and an N-type electrode 917. Both are coplanar electrodes. The P-type electrode 916 and the N-type electrode 917 are electrically connected to a forward bias current source for power supply.

[0126] Figure 6 A cross-sectional structure of an electroabsorption modulation region according to some embodiments. Figure 1 .like Figure 6 As shown, in some embodiments, the electroabsorption modulation region 920 employs a differential drive mode.

[0127] In some embodiments, the electroabsorption modulation region 920 includes a substrate 921.

[0128] In some embodiments, the electroabsorption modulation region 920 includes an N-InP layer 922. The N-InP layer 922 is located above the substrate 921. The N-InP layer 922 is an N-type doped InP layer. The N-InP layer 922 primarily outputs N-type carriers.

[0129] In some embodiments, the electroabsorption modulation region 920 includes a second active layer 923. The second active layer 923 is located above the N-InP layer 922. The second active layer 923 employs a multi-quantum-well structure.

[0130] In some embodiments, the electroabsorption modulation region 920 includes a P-InP layer 924. The P-InP layer 924 is located above the second active layer 923. The P-InP layer 924 is a P-type doped InP layer. The P-InP layer 924 primarily outputs P-type carriers. The P-InP layer 924 inputs P-type carriers to the second active layer 923, and the N-InP layer 922 inputs N-type carriers to the second active layer 923, thereby inputting a signal to the electroabsorption modulation region 920.

[0131] In some embodiments, the electroabsorption modulation region 920 includes a first electrode portion 925. The first electrode portion 925 is located above the P-InP layer 924. Exemplarily, the first electrode portion 925 is a P-type electrode.

[0132] In some embodiments, the electroabsorption modulation region 920 includes a second electrode portion 926. The second electrode portion 926 and the first electrode portion 925 are coplanar electrodes. Exemplarily, the second electrode portion 926 is an N-type electrode.

[0133] In some embodiments, the first electrode portion 925 and the second electrode portion 926 are respectively electrically connected to a reverse bias electric field.

[0134] In some embodiments, the electroabsorption modulation region 920 includes a first radio frequency electrode 9271. The first radio frequency electrode 9271 is electrically connected to the first electrode portion 925 to input a first differential modulation signal to the second active layer 923.

[0135] In some embodiments, a trench is provided between the first radio frequency electrode 9271 and the waveguide structure of the electroabsorption modulation region 920 to achieve electrical isolation and ensure the quality of radio frequency signal transmission. A first electrical connection bridge 9281 is electrically connected between the first radio frequency electrode 9271 and the first electrode portion 925 to establish an electrical connection between the first radio frequency electrode 9271 and the first electrode portion 925.

[0136] Figure 7 A cross-sectional structure of an electroabsorption modulation region according to some embodiments. Figure 2 .like Figure 7 As shown, in some embodiments, the electroabsorption modulation region 920 employs a differential drive mode.

[0137] In some embodiments, the electroabsorption modulation region 920 includes a second radio frequency electrode 9272. The second radio frequency electrode 9272 is electrically connected to the second electrode portion 926 to input a second differential modulation signal to the second active layer 923.

[0138] In some embodiments, a trench is provided between the second RF electrode 9272 and the waveguide structure of the electroabsorption modulation region 920 to achieve electrical isolation and ensure the quality of RF signal transmission. A second electrical connection bridge 9282 is electrically connected between the second RF electrode 9272 and the second electrode portion 926 to establish an electrical connection between the second RF electrode 9272 and the second electrode portion 926.

[0139] In some embodiments, the first electrical connection bridge 9281 and the second electrical connection bridge 9282 may each be an air bridge. An air bridge utilizes air, which has a low dielectric constant, as the dielectric, reducing parasitic capacitance. Due to the low dielectric constant of air, signal transmission speed in an air bridge is relatively fast, with less loss. The structural design of an air bridge can optimize the signal transmission path, reduce signal reflection and scattering during transmission, thereby improving signal transmission efficiency and quality.

[0140] In some embodiments, the first electrical connection bridge 9281 and the second electrical connection bridge 9282 are integrated inside the chip, and since they are chip-level structures, they are different from the gold wire bonding method.

[0141] Figure 8 This is a structural diagram of a laser component according to some embodiments. Figure 8 As shown, in some embodiments, the laser component 410 employs a differential drive mode to improve signal anti-interference capability and reduce power consumption.

[0142] In some embodiments, the laser assembly 410 may include a substrate 420. The substrate 420 is electrically connected to the circuit board 300. The substrate 420 is used to support and fix the laser chip 900. The substrate 420 has high thermal conductivity, which is beneficial for heat conduction of the laser chip 900. Circuit patterns are etched on the surface of the substrate 420 to achieve electrical connections with the circuit board 300 and the laser chip 900, respectively.

[0143] In some embodiments, the laser component 410 may include a laser chip 900. The laser chip 900 is electrically connected to the circuit board 300. The laser chip 900 is disposed on a substrate 420. Exemplarily, the surface of the laser chip 900 has a height difference from the surface of the substrate 420. Exemplarily, the laser chip 900 is embedded in the substrate 420 such that the surface of the laser chip 900 is flush with the surface of the substrate 420.

[0144] In some embodiments, the laser chip 900 includes a light-emitting region 910 and an electro-absorption modulation region 920.

[0145] In some embodiments, the light-emitting region 910 emits light without carrying a signal. An electro-absorption modulation region 920 is disposed in the light-emitting path of the light-emitting region 910 to modulate the signal-free light emitted by the light-emitting region 910, thereby generating an optical signal.

[0146] In some embodiments, a bias current circuit is provided on the surface of the circuit board 300. The output terminal of the bias current circuit is electrically connected to the surface of the substrate 420, and the surface of the substrate 420 is electrically connected to the light-emitting area, thereby establishing an electrical connection between the bias current circuit and the light-emitting area to apply a forward bias current to the light-emitting area. When the forward bias current is greater than a threshold, the light-emitting area emits light.

[0147] In some embodiments, a bias voltage circuit is provided on the surface of the circuit board 300. The output terminal of the bias voltage circuit is electrically connected to the substrate 420, and the surface of the substrate 420 is electrically connected to the electroabsorption modulation region, thereby establishing an electrical connection between the bias voltage circuit and the electroabsorption modulation region to apply a reverse bias voltage to the electroabsorption modulation region.

[0148] In some embodiments, a driving circuit is provided on the surface of the circuit board 300. The output terminal of the driving circuit is electrically connected to the substrate 420, and the surface of the substrate 420 is electrically connected to the electroabsorption modulation region, thereby establishing an electrical connection between the driving circuit and the electroabsorption modulation region to input a modulation signal to the electroabsorption modulation region.

[0149] In some embodiments, a reverse bias voltage and a modulation current signal are provided to the electroabsorption modulation region. Under the action of the reverse bias voltage, the intensity of the light emitted by the light-emitting region changes with the modulation current signal, thereby modulating the intensity and generating an optical signal carrying information.

[0150] In some embodiments, the electroabsorption modulation region is a PIN device that alters the light transmittance using the electroabsorption effect, wherein the I layer is composed of multiple quantum well waveguides. Modulation of the optical signal can be achieved through its quantum confinement effect. When a reverse electric field is applied to the active region of the electroabsorption modulation region, the PIN is reverse-biased, causing a shift in the electron-hole pair energy levels of the multiple quantum wells, thereby shifting the absorption peak position and ultimately modulating and generating an optical signal.

[0151] Figure 9 This is an exploded structural diagram of a laser component according to some embodiments. Figure 10 This is a top view of a laser assembly according to some embodiments. Figure 9 and Figure 10 As shown, in some embodiments, the laser component 410 includes a substrate 420 and a laser chip 900.

[0152] In some embodiments, a first radio frequency electrode 9271 is formed on the surface of the laser chip 900. The first radio frequency electrode 9271 is electrically connected to the first electrode portion 925 to input a first differential modulation signal to the second active layer 923 corresponding to the electroabsorption modulation region 920.

[0153] In some embodiments, a first differential signal transmission line 421 is formed on the surface of the substrate 420. One end of the first differential signal transmission line 421 is electrically connected to the circuit board 300, and the other end is electrically connected to the first radio frequency electrode 9271, thereby achieving electrical connection between the circuit board 300 and the first radio frequency electrode 9271. Then, the first differential modulation signal is transmitted along the circuit board 300 to the first radio frequency electrode 9271. Exemplarily, the first differential modulation signal travels along the surface of the circuit board 300, is transmitted to the first differential signal transmission line 421, and finally to the first radio frequency electrode 9271.

[0154] In some embodiments, a second radio frequency electrode 9272 is formed on the surface of the laser chip 900. The second radio frequency electrode 9272 is electrically connected to the second electrode portion 926 to input a second differential modulation signal to the second active layer 923.

[0155] In some embodiments, a second differential signal transmission line 422 is formed on the surface of the substrate 420. The second differential signal transmission line 422 and the first differential signal transmission line 421 form a differential pair to transmit the modulated signal in a differential manner. One end of the second differential signal transmission line 422 is electrically connected to the circuit board 300, and the other end is electrically connected to the second radio frequency electrode 9272, so that the circuit board 300 and the second radio frequency electrode 9272 are electrically connected, and the second differential modulation signal is transmitted along the circuit board 300 to the second radio frequency electrode 9272. Exemplarily, the second differential modulation signal is routed along the surface of the circuit board 300, transmitted to the second differential signal transmission line 422, and then transmitted to the first radio frequency electrode 9271.

[0156] In some embodiments, the two ends of the first differential signal transmission line 421 are electrically connected to the first radio frequency electrode 9271 and the circuit board 300 respectively via wire bonding. The two ends of the second differential signal transmission line 422 are electrically connected to the second radio frequency electrode 9272 and the circuit board 300 respectively via wire bonding.

[0157] In some embodiments, a coupling capacitor 450 is provided on the surface of the substrate 420. The coupling capacitor 450 has the characteristic of passing AC and blocking DC. In some embodiments, a first pad 425 is provided on the surface of the substrate 420.

[0158] In some embodiments, the positive terminal of the coupling capacitor 450 is electrically connected to the first pad 425 via wire bonding. The negative terminal of the coupling capacitor 450 is electrically connected to the ground metal layer on the surface of the substrate 420.

[0159] In some embodiments, a first DC electrode 9273 is formed on the surface of the laser chip 900. One end of the first DC electrode 9273 is electrically connected to the first radio frequency electrode 9271, and then to the first electrode portion 925, so as to input a first differential reverse bias voltage to the second active layer 923 corresponding to the electroabsorption modulation region 920. The other end of the first DC electrode 9273 is electrically connected to the positive terminal of the coupling capacitor 450.

[0160] In some embodiments, a second DC electrode 9274 is formed on the surface of the laser chip 900. One end of the second DC electrode 9274 is electrically connected to the second radio frequency electrode 9272, and then to the second electrode portion 926, so as to input a second differential reverse bias voltage to the second active layer 923 corresponding to the electroabsorption modulation region 920. The other end of the second DC electrode 9274 is electrically connected to the negative terminal of the coupling capacitor 450.

[0161] In some embodiments, one end of the first DC electrode 9273 is electrically connected to the first RF electrode 9271 via a connecting resistor. The other end of the first DC electrode 9273 is electrically connected to the positive terminal of the coupling capacitor 450 via wire bonding. In some embodiments, one end of the second DC electrode 9274 is electrically connected to the second RF electrode 9272 via a connecting resistor. The other end of the second DC electrode 9274 is electrically connected to the negative terminal of the coupling capacitor 450 via wire bonding. The connecting resistor can be an on-chip thin-film resistor, which can be implemented using semiconductor materials such as TaN or TiN. The sheet resistance is adjusted by the thickness, and the required resistance value is adjusted by the length and width. On-chip integrated resistors can reduce wire bonding length and reduce the impact of parasitic parameters on the high-speed performance of the chip.

[0162] In some embodiments, the first DC electrode 9273 is electrically connected to the positive terminal of the coupling capacitor 450 via the first bonding wire 4261, and the positive terminal of the coupling capacitor 450 is then electrically connected to the first pad 425 via the second bonding wire 4262.

[0163] In some embodiments, a first bias electrode 918 and a second bias electrode 919 are formed on the surface of the laser chip 900. The first bias electrode 918 and the second bias electrode 919 correspond to the light-emitting area 910. One end of the first bias electrode 918 is electrically connected to the circuit board 300, and the other end is electrically connected to a P-type electrode 916. One end of the second bias electrode 919 is electrically connected to the circuit board 300, and the other end is electrically connected to an N-type electrode 917, thereby inputting a bias current to the light-emitting area 910, causing the light-emitting area 910 to emit light.

[0164] In some embodiments, the substrate 420 surface has a second pad 423 and a third pad 424. A first bias electrode 918 is electrically connected to the circuit board 300 via the second pad 423. A second bias electrode 919 is electrically connected to the circuit board 300 via the third pad 424. Exemplarily, one end of the second pad 423 is wire-connected to the circuit board 300, and the other end is wire-connected to the first bias electrode 918. One end of the third pad 424 is wire-connected to the circuit board 300, and the other end is wire-connected to the second bias electrode 919.

[0165] In some embodiments, multiple bonding wires connect the second pad 423 to the circuit board 300, and multiple bonding wires also connect the third pad 424 to the circuit board 300. Multiple bonding wire connections increase the number of contact points between the circuit board and the second pad 423 or the third pad 424, increasing the current and signal transmission paths, thereby reducing resistance and impedance during transmission, minimizing signal attenuation and distortion, and ensuring signal integrity. Figure 13 As shown, three bonding wires connect the second pad 423 to the circuit board 300, and three bonding wires connect the third pad 424 to the circuit board 300.

[0166] Figure 11 This is an exploded top view of a laser assembly according to some embodiments. Figure 12 This is a schematic diagram of a first differential signal transmission line and a second differential signal transmission line according to some embodiments. Figure 13 This is a partially enlarged view of a first differential signal transmission line and a second differential signal transmission line according to some embodiments. Figures 11-13 As shown, in some embodiments, the substrate 420 surface is provided with a first differential signal transmission line 421 and a second differential signal transmission line 422 to transmit modulated signals to the laser chip 900 in the form of differential signals. The first differential signal transmission line 421 and the second differential signal transmission line 422 transmit differential pair signals with the same amplitude but opposite phase. External interference is superimposed in the form of common mode. The receiving end eliminates noise through difference operation, effectively suppressing common mode noise and improving signal integrity.

[0167] In some embodiments, a first differential signal transmission line 421 is used to transmit a first differential modulation signal to the laser chip 900. One end of the first differential signal transmission line 421 is electrically connected to the circuit board 300, and the other end is electrically connected to the laser chip 900. A second differential signal transmission line 422 is used to transmit a second differential modulation signal to the laser chip 900. One end of the second differential signal transmission line 422 is electrically connected to the circuit board 300, and the other end is electrically connected to the laser chip 900.

[0168] In some embodiments, the first differential signal transmission line 421 is positioned close to the laser chip 900 to facilitate signal transmission. The second differential signal transmission line 422 is positioned close to the first differential signal transmission line 421 to facilitate maintaining differential impedance.

[0169] In some embodiments, the transmission characteristics of differential signals require that the electrical characteristics of the first differential signal transmission line 421 and the second differential signal transmission line 422 be as consistent as possible. These electrical characteristics include the line length, line width, dielectric constant, and other properties of the signal lines. During the routing layout, the line lengths of the differential pairs should be matched as much as possible to avoid time delay differences during signal transmission and ensure signal integrity. For example, longer signal lines tend to have greater signal delays.

[0170] In some embodiments, the first differential signal transmission line 421 is closer to the laser chip 900 than the second differential signal transmission line 422, that is, the second differential signal transmission line 422 is farther away from the laser chip 900 than the first differential signal transmission line 421. The second differential signal transmission line 422 is positioned close to the first differential signal transmission line 421.

[0171] In some embodiments, the first differential signal transmission line 421 may include a first wide region 4212, located at the end of the first differential signal transmission line 421 facing the circuit board 300. The first wide region 4212 is electrically connected to the circuit board 300. The second differential signal transmission line 422 may include a second wide region 4222, located at the end of the second differential signal transmission line 422 facing the circuit board 300. The second wide region 4222 is electrically connected to the circuit board 300.

[0172] In some embodiments, the linewidths of the first wide region 4212 and the second wide region 4222, and the spacing between them, depend on the impedance of the transmission lines on the surface of the circuit board 300. The linewidth and spacing settings are designed to match the impedance of the transmission lines on the surface of the circuit board 300 to reduce impedance discontinuities and ensure signal integrity.

[0173] In some embodiments, the first wide region 4212 and the second wide region 4222 have the same linewidth to match the impedance between the two differential signal transmission lines, reduce signal loss during transmission, and improve signal transmission performance. For example, the linewidths of the first wide region 4212 and the second wide region 4222 are w2 and the spacing is d2.

[0174] In some embodiments, the end of the first differential signal transmission line 421 is wire-connected to the circuit board 300. The end of the second differential signal transmission line 422 is also wire-connected to the circuit board 300. The parasitic inductance generated by the wire connection reduces the high-frequency response and introduces high-frequency noise.

[0175] In some embodiments, the first differential signal transmission line 421 may include a first shifting portion 4211. The first shifting portion 4211 is connected to a first wide area portion 4212, and the first shifting portion 4211 is located at the end of the first differential signal transmission line 421 facing the circuit board 300. The first shifting portion 4211 is a wire bonding area of ​​the first differential signal transmission line 421. One end of the first shifting portion 4211 is wire bonded to the circuit board 300, and the other end is connected to the first wide area portion 4212.

[0176] In some embodiments, the second differential signal transmission line 422 may include a second shifting portion 4221. The second shifting portion 4221 is connected to a second wide area portion 4222 and is located at the end of the second differential signal transmission line 422 facing the circuit board 300. The second shifting portion 4221 is a wire bonding area of ​​the second differential signal transmission line 422. One end of the second shifting portion 4221 is wire bonded to the circuit board 300, and the other end is connected to the second wide area portion 4222. The second shifting portion 4221 and the first shifting portion 4211 have the same linewidth to match impedance. For example, the linewidths of the second shifting portion 4221 and the first shifting portion 4211 are w1, respectively.

[0177] In some embodiments, the first shifting portion 4211 is shifted relative to the first wide area portion 4212 in a direction closer to the laser chip 900. The second shifting portion 4221 is shifted relative to the second wide area portion 4222 in a direction farther away from the laser chip 900.

[0178] In some embodiments, the first shifting portion 4211 is shifted to one side relative to the first wide area portion 4212, and the second shifting portion 4221 is shifted to the other side relative to the second wide area portion 4222, to increase the spacing between the bonding areas of the two differential signal transmission lines, increase the bonding area capacitance, and reduce the parasitic inductance generated by bonding. Exemplarily, the first shifting portion 4211 is shifted towards the laser chip 900 relative to the first wide area portion 4212, and the second shifting portion 4221 is shifted away from the laser chip 900 relative to the second wide area portion 4222. For example, the first shifting portion 4211 is shifted to the left, and the second shifting portion 4221 is shifted to the right.

[0179] In some embodiments, the distance between the first shifting portion 4211 and the second shifting portion 4221 is d1, and the distance between the first wide area portion 4212 and the second wide area portion 4222 is d2. d1 is greater than d2, which increases the spacing between the bonding areas, increases the capacitance of the bonding areas, and reduces the parasitic inductance.

[0180] In some embodiments, a double-wire connection is provided between the first shifting part 4211 and the circuit board 300, and a double-wire connection is provided between the second shifting part 4221 and the circuit board 300 to achieve electrical connection. The double-wire connection reduces parasitic inductance and resistance in the signal transmission path, thus reducing signal loss. The double-wire connection also allows for better control of impedance matching, reducing signal reflection.

[0181] In some embodiments, the line width of the first shifting portion 4211 is greater than the line width of the first wide area portion 4212, which facilitates providing sufficient wiring space for the two-wire bonding and is compatible with the two-wire bonding scheme. Similarly, the line width of the second shifting portion 4221 is greater than the line width of the second wide area portion 4222, which facilitates providing sufficient wiring space for the two-wire bonding and is compatible with the two-wire bonding scheme.

[0182] In some embodiments, the outer displacement distance L2 of the first shifting portion 4211 is greater than the inner displacement distance L1, so that the line width of the first shifting portion 4211 is greater than the line width of the first wide area portion 4212. For example, the outer leftward shift distance L2 of the first shifting portion 4211 is greater than the inner leftward shift distance L1. Similarly, the outer rightward shift distance of the second shifting portion 4221 is greater than the inner rightward shift distance.

[0183] In some embodiments, the first differential signal transmission line 421 may include a first guide portion 4213. The first guide portion 4213 is connected to the first wide area portion 4212. Along the first differential modulation signal transmission direction, the first guide portion 4213 gradually moves away from the laser chip 900, thereby guiding the first differential signal transmission line 421 to extend in a direction away from the laser chip 900, guiding the first differential signal transmission line 421 to a region away from the laser chip 900. The extension direction of the first guide portion 4213 is not consistent with the extension direction of the first wide area portion 4212, and there is an angle between them. Herein, the first differential modulation signal transmission direction refers to transmission from the circuit board 300 to the laser chip 900.

[0184] In some embodiments, the second differential signal transmission line 422 may include a second guide portion 4223. The second guide portion 4223 is connected to the second wide area portion 4222. Along the second differential modulation signal transmission direction, the second guide portion 4223 gradually approaches the laser chip 900, guiding the second differential signal transmission line 422 to extend towards the laser chip 900, guiding the second differential signal transmission line 422 to a region close to the laser chip 900, thereby ensuring the spacing between it and the first differential signal transmission line 421 and reducing differential impedance discontinuities. The first guide portion 4213 and the second guide portion 4223 are symmetrically arranged to reduce differential impedance discontinuities.

[0185] In some embodiments, the first differential signal transmission line 421 may include a first narrow section 4214. The first narrow section 4214 is connected to a first guide section 4213. The first guide section 4213 is used to connect the first wide section 4212 and the first narrow section 4214, realizing a transition connection from the first wide section 4212 to the first narrow section 4214.

[0186] In some embodiments, the second differential signal transmission line 422 may include a second narrow section 4224. The second narrow section 4224 is connected to a second guide section 4223. The second guide section 4223 is used between the second wide section 4222 and the second narrow section 4224 to realize a transition connection from the second wide section 4222 to the second narrow section 4224.

[0187] In some embodiments, the first differential signal transmission line 421 may include a first bend 4215 to bend the first differential signal transmission line 421 toward the laser chip 900, shortening the wire bonding length between the first differential signal transmission line 421 and the laser chip 900. The first bend 4215 bends toward the laser chip 900 with a first radius of curvature.

[0188] In some embodiments, the second differential signal transmission line 422 may include a second bend 4225 to bend the second differential signal transmission line 422 toward the laser chip 900, shortening the wire bonding length between the second differential signal transmission line 422 and the laser chip 900. The second bend 4225 is disposed close to the first bend 4215 to ensure the spacing between them and to ensure impedance matching. The second bend 4225 bends toward the laser chip 900 with a second radius of curvature.

[0189] In some embodiments, if the first differential signal transmission line 421 is closer to the laser chip 900 than the second differential signal transmission line 422, then the radius of curvature of the first bend 4215 is greater than the radius of curvature of the second bend 4225, i.e., the second radius of curvature is smaller than the first radius of curvature. Using a larger radius of curvature for the bend of the first differential signal transmission line 421 and a smaller radius of curvature for the bend of the second differential signal transmission line 422 can offset the path length difference between the two differential signal transmission lines, thereby reducing phase delay differences and ensuring signal integrity.

[0190] In some embodiments, the end of the first differential signal transmission line 421 is wire-connected to the first radio frequency electrode 9271. The end of the second differential signal transmission line 422 is wire-connected to the second radio frequency electrode 9272. Exemplarily, two wires are connected between the end of the first differential signal transmission line 421 and the first radio frequency electrode 9271, and two wires are connected between the end of the second differential signal transmission line 422 and the second radio frequency electrode 9272, to reduce the parasitic inductance generated by the wire bonding.

[0191] In some embodiments, the first differential signal transmission line 421 may include a first extension 4216. One end of the first extension 4216 is connected to the first bend 4215, and the other end is electrically connected to the laser chip 900. The first extension 4216 is formed at the tail of the first differential signal transmission line 421. The first extension 4216 is wire-connected to the first radio frequency electrode 9271.

[0192] In some embodiments, the line width at the first end of the first extension 4216 is greater than the line width at its second end, facilitating sufficient wiring space for wire bonding. Specifically, the first end is connected to the first RF electrode 9271 via a double-wire connection, and the second end is connected to the first bend 4215 via a double-wire connection. By widening the tail of the signal transmission line connected to the laser chip 900, the double-wire connection direction is compatible, thereby reducing the total parasitic inductance and improving high-speed performance.

[0193] In some embodiments, the linewidth of the first extension 4216 gradually transitions from the second end to the first end to avoid sharp transition areas and ensure impedance continuity. For example, the first extension 4216 is right-angled, with its hypotenuse facing the first narrow region 4214, and gradually moving away from the first narrow region 4214 along the direction from the signal transmission end of the differential signal transmission line towards the source end, to avoid crosstalk with the first narrow region 4214.

[0194] In some embodiments, the second differential signal transmission line 422 may include a second extension 4226. One end of the second extension 4226 is connected to the second bend 4225, and the other end is electrically connected to the laser chip 900. The second extension 4226 is formed at the tail of the second differential signal transmission line. The second extension 4226 is wire-connected to the second radio frequency electrode 9272.

[0195] In some embodiments, the line width at the first end of the second extension 4226 is greater than the line width at its second end, which also facilitates providing sufficient wiring components for wire bonding. The first end is connected to the second RF electrode 9272 via a double-wire connection, and the second end is connected to the second bend 4225 via a double-wire connection.

[0196] In some embodiments, the second extension 4226 and the first extension 4216 are symmetrically distributed to reduce differential impedance discontinuities and ensure differential impedance continuity. This also avoids conflicts with the first extension 4216.

[0197] In some embodiments, since the first wide area 4212 is located near the laser chip 900 and the space occupied by the first curved portion 4215 and the first extended portion 4216 is large, when the first curved portion 4215 is formed along the extension direction of the first wide area 4212, the first extended portion 4216 will conflict with the laser chip 900, and the first curved portion 4215 may have no bending space.

[0198] In some embodiments, along the first differential modulation signal transmission direction, the first guide portion 4213 gradually moves away from the laser chip 900 to pull the first narrow section portion 4214 away from the laser chip 900, guide the first differential signal transmission line 421 to a region away from the laser chip 900, thereby providing bending space for the first bending portion 4215, so that the first bending portion 4215 presents a specific radius of curvature, i.e., the first radius of curvature; and make way for the first extension portion 4216, avoiding the end of the first differential signal transmission line 421 from interfering with the laser chip 900, while avoiding excessively sharp bends.

[0199] In some embodiments, the line width of the first narrow section 4214 is smaller than the line width of the first wide section 4212, which facilitates more bending space for the first curved section 4215, improves the bending smoothness of the first curved section 4215, and facilitates adjustment of the radius of curvature of the first curved section 4215, so that the first curved section 4215 presents a specific first radius of curvature. The line width w4 of the first narrow section 4214 is smaller than the line width w2 of the first wide section 4212. Since the line width of the first narrow section 4214 is smaller than the line width of the first wide section 4212, the line width of the first guide section 4213 presents a gradual change. The line width of the first guide section 4213 gradually transitions from the line width of the first wide section 4212 to the line width of the first narrow section 4214, realizing a transition connection.

[0200] In some embodiments, the linewidth of the second narrow section 4224 may be the same as the linewidth of the first narrow section 4214 to facilitate impedance matching. In this case, the linewidth of the second narrow section 4224 is smaller than the linewidth of the second wide section 4222. The linewidth of the second guide section 4223 gradually transitions from the linewidth of the second wide section 4222 to the linewidth of the second narrow section 4224. For example, the linewidth values ​​of the first narrow section 4214 and the second narrow section 4224 are w4, respectively.

[0201] In some embodiments, the second narrow section 4224 is disposed adjacent to the first narrow section 4214 to guide the second curved section 4225 to also be curved at this position, while guiding the second curved section 4225 to be disposed adjacent to the first curved section 4215 to ensure the spacing between the two differential signal transmission lines.

[0202] In some embodiments, the linewidth of the differential signal transmission lines and the spacing between the two differential signal transmission lines synchronously affect the differential impedance of the two differential signal lines. The linewidth of the differential signal transmission lines and the spacing between the two differential signal transmission lines are adjusted synchronously to ensure the continuity of the differential impedance.

[0203] In some embodiments, the line width of the first narrow region 4214 is smaller than the line width of the first wide region 4212, and the line width of the second narrow region 4224 is smaller than the line width of the second wide region 4222. Differential impedance continuity is maintained by adjusting the spacing between the two differential signal lines. For example, the spacing between the first narrow region 4214 and the second narrow region 4224 is smaller than the spacing between the first wide region 4212 and the second wide region 4222, so that the impedance at the first narrow region 4214 matches the impedance at the first wide region 4212, and similarly, the impedance at the second narrow region 4224 matches the impedance at the second wide region 4222, reducing differential impedance discontinuities and ensuring differential impedance continuity.

[0204] In some embodiments, the linewidth of the first guide portion 4213 gradually decreases along the first differential modulation signal transmission direction. Similarly, the linewidth of the second guide portion 4223 gradually decreases along the second differential modulation signal transmission direction, thereby maintaining differential impedance continuity by adjusting the spacing between the two differential signal lines. For example, the spacing between the first guide portion 4213 and the second guide portion 4223 gradually decreases along the first differential modulation signal transmission direction to reduce differential impedance discontinuities, thereby maintaining differential impedance continuity in the first differential modulation signal transmission direction. Based on this, the first guide portion 4213 and the second guide portion 4223 are symmetrically arranged: along the first differential modulation signal transmission direction, the first guide portion 4213 gradually moves away from the laser chip 900, and the second guide portion 4223 gradually moves closer to the laser chip 900, with the spacing between them gradually decreasing.

[0205] In some embodiments, the linewidth of the first curved portion 4215 may be the same as the linewidth of the first narrow portion 4214, the linewidth of the second curved portion 4225 may be the same as the linewidth of the second narrow portion 4224, and the spacing between the first curved portion 4215 and the second curved portion 4225 may be the same as the spacing between the first narrow portion 4214 and the second narrow portion 4224, thereby reducing differential impedance discontinuities.

[0206] In some embodiments, in the first differential signal transmission line 421, a first shifting portion 4211, a first wide area portion 4212, a first guiding portion 4213, a first narrow area portion 4214, a first bending portion 4215, and a first extension portion 4216 are sequentially connected. The first shifting portion 4211 is wired to the circuit board 300 for electrical connection. The first extension portion 4216 is wired to the first radio frequency electrode 9271 for electrical connection.

[0207] In some embodiments, in the second differential signal transmission line 422, the second shifting portion 4221, the second wide portion 4222, the second guiding portion 4223, the second narrow portion 4224, the second bending portion 4225, and the second extension portion 4226 are sequentially connected. The second shifting portion 4221 is wired to the circuit board 300 for electrical connection. The second extension portion 4226 is wired to the second radio frequency electrode 9272 for electrical connection.

[0208] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. An optical module, characterized in that, include: Circuit board; The laser chip is electrically connected to the circuit board; A substrate is used to support the laser chip and electrically connect the circuit board and the laser chip respectively. The surface of the substrate is provided with: A first differential signal transmission line is used to transmit a first differential modulation signal to the laser chip; the first differential signal transmission line is disposed close to the laser chip; the first differential signal transmission line includes: The first wide section is electrically connected to the circuit board; A first guide portion is connected to the first wide area portion; along the first differential modulation signal transmission direction, the first guide portion gradually moves away from the laser chip to guide the first differential signal transmission line to a region away from the laser chip; The first narrow section is connected to the first guide section; A first curved portion is connected to the first narrow portion, and the first curved portion bends toward the laser chip to be electrically connected to the laser chip; A second differential signal transmission line is used to transmit a second differential modulation signal to the laser chip; the second differential signal transmission line is located away from the laser chip relative to the first differential signal transmission line; the second differential signal transmission line includes: The second wide section is electrically connected to the circuit board; The second guide portion is connected to the second wide area portion; along the second differential modulation signal transmission direction, the second guide portion gradually approaches the laser chip to guide the second differential signal transmission line to the area close to the laser chip; The second narrow section is connected to the second guide section; The second curved portion is connected to the second narrow portion, and the second curved portion bends toward the laser chip to be electrically connected to the laser chip; the radius of curvature of the second curved portion is smaller than the radius of curvature of the first curved portion.

2. The optical module according to claim 1, characterized in that, The first differential signal transmission line includes: A first extension portion has one end connected to the first bent portion and the other end electrically connected to the laser chip; the line width of the first end of the first extension portion is greater than the line width of the second end, wherein the first end is electrically connected to the laser chip and the second end is connected to the first bent portion; The second differential signal transmission line includes: The second extension has one end connected to the second bending portion and the other end electrically connected to the laser chip; the line width of the first end of the second extension is greater than the line width of the second end, wherein the first end is electrically connected to the laser chip and the second end is connected to the second bending portion.

3. The optical module according to claim 1, characterized in that, The first differential signal transmission line includes: The first shifting part has one end connected to the first wide area and the other end electrically connected to the circuit board; the first shifting part is shifted relative to the first wide area in a direction closer to the laser chip; The second differential signal transmission line includes: The second shifting part is connected at one end to the second wide area and at the other end to the circuit board; the second shifting part is shifted away from the laser chip relative to the second wide area.

4. The optical module according to claim 1, characterized in that, The line width of the first narrow region is smaller than the line width of the first wide region, and the line width of the second narrow region is smaller than the line width of the second wide region; wherein the distance between the first narrow region and the second narrow region is smaller than the distance between the first wide region and the second wide region.

5. The optical module according to claim 1, characterized in that, Along the first differential modulation signal transmission direction, the line width of the first guide portion gradually decreases; along the second differential modulation signal transmission direction, the line width of the second guide portion gradually decreases; along the first differential modulation signal transmission direction, the distance between the first guide portion and the second guide portion gradually decreases.

6. An optical module, characterized in that, include: Circuit board; A light-emitting component, electrically connected to the circuit board, includes: A laser chip, comprising a first radio frequency electrode, a second radio frequency electrode, a first DC electrode, and a second DC electrode; A substrate having a first pad on its surface, the substrate surface being provided with: The first differential signal transmission line is electrically connected to the first radio frequency electrode and the circuit board respectively; the first differential signal transmission line has a first guiding portion and a first bending portion, the first guiding portion is used to guide the first differential signal transmission line to a region away from the laser chip, so that the first bending portion bends toward the laser chip with a first radius of curvature; The second differential signal transmission line is electrically connected to the second radio frequency electrode and the circuit board respectively; the second differential signal transmission line is farther away from the laser chip relative to the first differential signal transmission line; the second differential signal transmission line has a second guiding portion and a second bending portion, the second guiding portion is used to guide the second differential signal transmission line to a region close to the laser chip, so that the second bending portion bends towards the laser chip with a second radius of curvature; wherein, the second radius of curvature is smaller than the first radius of curvature; The coupling capacitor has its positive terminal electrically connected to the first pad and its negative terminal electrically connected to the substrate surface; the positive terminal of the coupling capacitor is electrically connected to the first DC electrode, and the negative terminal of the coupling capacitor is electrically connected to the second DC electrode.

7. The optical module according to claim 6, characterized in that, The laser chip includes a first bias electrode and a second bias electrode; The substrate surface is provided with a second pad and a third pad. The first bias electrode is electrically connected to the circuit board through the second pad, and the second bias electrode is electrically connected to the circuit board through the third pad.

8. The optical module according to claim 6, characterized in that, The first differential signal transmission line includes: The first wide section has one end electrically connected to the circuit board and the other end electrically connected to the first guide section; The first narrow section has one end connected to the first guide section and the other end electrically connected to the first curved section. The line width of the first narrow section is smaller than the line width of the first wide section. The second differential signal transmission line includes: The second wide section has one end electrically connected to the circuit board and the other end connected to the second guide section; The second narrow section has one end connected to the second guide section and the other end electrically connected to the second bending section. The line width of the second narrow section is smaller than the line width of the second wide section.

9. The optical module according to claim 6, characterized in that, The first differential signal transmission line includes: The first extension has one end connected to the first bending portion and the other end electrically connected to the laser chip; the line width of the first end of the first extension is greater than the line width of the second end, the first end is electrically connected to the laser chip, and the second end is connected to the first bending portion. The second differential signal transmission line includes: The second extension has one end connected to the second bending portion and the other end electrically connected to the laser chip; the line width of the first end of the second extension is greater than the line width of the second end, the first end is electrically connected to the laser chip, and the second end is connected to the second bending portion.

10. The optical module according to claim 8, characterized in that, The first differential signal transmission line includes: The first shifting part is connected to the first wide area part and shifted relative to the first wide area part in a direction closer to the laser chip; The second differential signal transmission line includes: The second shifting section is connected to the second wide area section and shifted relative to the second wide area section in a direction away from the laser chip.

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