Electronic package

Abstract

The utility model relates to an electronic packaging part, which mainly provides a first electronic component, then carries out first packaging operation to form a first coating layer coating the first electronic component, and then carries out second packaging operation to form a second coating layer coating the first coating layer, and the shrinkage direction of the second coating layer is opposite to the warping direction of the first coating layer, so that the problem of structure warping caused by shrinkage of the existing packaging adhesive material is solved.

Description

Technical Field

[0001] This application relates to a semiconductor packaging technology, and more particularly to an electronic package. Background Technology

[0002] With the evolution of semiconductor packaging technology, different packaging types have been developed for semiconductor devices. Among them, in order to improve electrical functions and save packaging space, the industry has developed a packaging type that stacks multiple packaging structures to form a package on package (POP). This packaging type can leverage the heterogeneous integration characteristics of system-in-package (SiP) and integrate electronic components with different functions, such as memory, central processing unit, graphics processor, and image application processor, through stacking design. This makes it suitable for various thin, light, and small electronic products.

[0003] Figure 1 This is a cross-sectional schematic diagram of an existing package stack structure 1. The package stack structure 1 includes a packaging material 15, a semiconductor wafer 11 embedded in the packaging material 15, a circuit structure 10 and a wiring structure 14 disposed on opposite sides of the packaging material 15, and a plurality of conductive pillars 13 embedded in the packaging material 15 to electrically connect the circuit structure 10 and the wiring structure 14. The semiconductor wafer 11 is electrically connected to the circuit structure 10 through a plurality of conductors 112, and a plurality of solder balls 16 are formed on the underside of the circuit structure 10 so that the package stack structure 1 can be bonded to a circuit board through these solder balls 16 (not shown).

[0004] However, during the formation of the encapsulation material, the aforementioned package stack structure often warps due to material shrinkage. Excessive warping can negatively impact subsequent process operability, for example, preventing automated operation and requiring manual or outsourced work, thus posing quality and safety risks. Furthermore, the warping caused by material shrinkage affects the final shape of the package stack structure (smiley or sad face), meaning the edges may bend upwards or downwards, resulting in solder ball non-wetting at the final package stack connections, leading to reliability issues in consumer products.

[0005] Therefore, how to overcome the various shortcomings of existing technologies is a technical problem that all sectors urgently need to solve. Utility Model Content

[0006] In view of the deficiencies in the prior art, this application provides an electronic package, including: a first covering layer; a first electronic component embedded in the first covering layer; and a second covering layer covering the first covering layer, wherein the shrinkage direction of the second covering layer is opposite to the warping direction of the first covering layer.

[0007] This application also provides a method for manufacturing an electronic package, comprising: providing a first electronic component; performing a first packaging operation to form a first covering layer covering the first electronic component; and performing a second packaging operation to form a second covering layer covering the first covering layer, wherein the shrinkage direction of the second covering layer is opposite to the warping direction of the first covering layer.

[0008] The aforementioned electronic package and its manufacturing method further include forming a first circuit structure on one side of the first covering layer.

[0009] The aforementioned electronic package and its manufacturing method further include forming a second circuit structure on the other side of the first covering layer.

[0010] The aforementioned electronic package and its manufacturing method further include forming a plurality of conductive pillars in the first covering layer to electrically connect the first circuit structure and the second circuit structure.

[0011] The aforementioned electronic package and its manufacturing method further include setting a second electronic component on the second circuit structure.

[0012] The aforementioned electronic package and its manufacturing method also include a plurality of conductive elements disposed on the outside of the first circuit structure.

[0013] In the aforementioned electronic package and its manufacturing method, after the first packaging operation, the overall structure presents a smiling face structure with both ends curving upwards, and during the second packaging operation, the second covering layer is made of an adhesive material that shrinks in the opposite direction of the first covering layer.

[0014] In the aforementioned electronic package and its manufacturing method, during the first packaging operation, the overall structure presents a crying face structure with both ends warped downwards. During the second packaging operation, the second covering layer is made of an adhesive material that shrinks in the opposite warping direction to the first covering layer.

[0015] As can be seen from the above, the electronic package of this application mainly determines the warping direction after the first encapsulation layer covering the electronic component is formed in the first encapsulation operation, and selects the second encapsulation layer that shrinks in the opposite direction in the second encapsulation operation to improve the material warping phenomenon and thus solve the problem of structural warping caused by the shrinkage of the existing encapsulation adhesive. Attached Figure Description

[0016] Figure 1 This is a cross-sectional schematic diagram of an existing package stacking structure.

[0017] Figures 2A to 2C This is a cross-sectional schematic diagram of the electronic package and its manufacturing method according to this application.

[0018] Explanation of reference numerals in the attached figures

[0019] 1. Packaging Stack Structure

[0020] 10. Circuit Structure

[0021] 11 Semiconductor wafers

[0022] 112 Conductor

[0023] 13 Conductive pillars

[0024] 14 Wiring Structure

[0025] 15. Encapsulating adhesive

[0026] 16 welding balls

[0027] 2 Electronic Packages

[0028] 21 First Line Structure

[0029] 21a First side

[0030] 21b Second side

[0031] 211,251 Dielectric layer

[0032] 212, 252 Wiring Layer

[0033] 22 conductive pillars

[0034] 23 First Electronic Components

[0035] 23a Working surface

[0036] 23b Non-operating surface

[0037] 24 First coating layer

[0038] 25 Second Line Structure

[0039] 26 Second Coating Layer

[0040] 27 Second electronic component

[0041] 28 Conductive elements

[0042] 9. Support plate. Detailed Implementation

[0043] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0044] It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the scope of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this application, should still fall within the scope of the technical content disclosed herein. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0045] Please see Figures 2A to 2C This is a cross-sectional schematic diagram of the electronic package and its manufacturing method according to this application.

[0046] like Figure 2A As shown, a first circuit structure 21 is formed on a carrier plate 9, a plurality of conductive pillars 22 are formed on the first circuit structure 21, a first electronic component 23 is disposed on the first circuit structure 21, a first covering layer 24 is formed on the first circuit structure 21 to cover the plurality of conductive pillars 22 and the first electronic component 23, and a second circuit structure 25 is formed on the first covering layer 24.

[0047] The carrier plate 9 is, for example, a plate made of semiconductor material (such as silicon or glass).

[0048] The first circuit structure 21 has opposing first sides 21a and second sides 21b, and includes a dielectric layer 211 and a wiring layer 212 bonded to the dielectric layer 211, such that the first circuit structure 21 is disposed on the carrier plate 9 with its second side 21b. For example, the wiring layer 212 is formed of copper, and the dielectric layer 211 is formed of polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or other dielectric materials, and the wiring layer 212 and the dielectric layer 211 can be formed using a redistribution layer (RDL) process.

[0049] The conductive post 22 can be formed on the first side 21a of the first circuit structure 21 by electroplating.

[0050] The first electronic component 23 is an active component, a passive component, or a combination of both, wherein the active component is, for example, a semiconductor wafer, and the passive component is, for example, a resistor, a capacitor, and an inductor.

[0051] In this embodiment, a plurality of first electronic components 23 are disposed on the first circuit structure 21, and the first electronic component 23 is a semiconductor wafer having an opposite active surface 23a and a non-active surface 23b. The first electronic component 23 is connected to the first side 21a of the first circuit structure 21 by combining a plurality of conductors with its active surface 23a.

[0052] The first covering layer 24 can be formed on the first circuit structure 21 through the first encapsulation operation (first molding) to cover the plurality of first electronic components 23 and the plurality of conductive pillars 22. The first covering layer 24 is an insulating material, such as polyimide (PI), dry film, epoxy resin, but not limited to the above.

[0053] The second circuit structure 25 is formed on the first cladding layer 24 and electrically connects the plurality of conductive pillars 22. The second circuit structure 25 includes a dielectric layer 251 and a wiring layer 252 bonded to the dielectric layer 251. For example, the wiring layer 252 is formed of copper, and the dielectric layer 251 is formed of a dielectric material such as poly(p-diazolebenzene), polyimide, prepreg, or others. The wiring layer 252 and the dielectric layer 251 can be formed using a circuit redistribution process. In this case, warping may occur due to thermal stress or material shrinkage during the aforementioned process.

[0054] like Figure 2B As shown, a second encapsulation operation (second molding) is performed to form a second encapsulation layer 26 on the carrier plate 9, which covers the first circuit structure 21, the first encapsulation layer 24 and the second circuit structure 25.

[0055] In this embodiment, the warping direction is determined primarily after the first encapsulation operation (forming the first covering layer 24) so ​​that an adhesive material that shrinks in the opposite direction (the second covering layer 26) is selected during the second encapsulation operation to improve the warping problem. For example, if the overall structure after the first encapsulation operation is a smiley face structure with both ends warped upwards, an adhesive material that shrinks in the opposite warping direction to the first encapsulation operation is selected during the second encapsulation operation; or if the overall structure after the first encapsulation operation is a sad face structure with both ends warped downwards, an adhesive material that shrinks in the opposite warping direction to the first encapsulation operation is selected during the second encapsulation operation to improve the material warping phenomenon.

[0056] like Figure 2C As shown, a portion of the second covering layer 26 covering the second circuit structure 25 is removed so that the upper surface of the second circuit structure 25 is exposed to the second covering layer 26.

[0057] Next, a plurality of second electronic components 27 are disposed on the second circuit structure 25. These second electronic components 27 may be, for example, active components, passive components, or a combination of both. The active components may be, for example, semiconductor wafers, and the passive components may be, for example, resistors, capacitors, and inductors. In this embodiment, the second electronic component 27 is a semiconductor wafer, electrically connected to the second circuit structure 25 via a plurality of conductors using a flip-chip method. The warpage phenomenon can be mitigated by the sequentially formed first cladding layer 24 and second cladding layer 26, allowing the second electronic component 27 to be flatly mounted on the second circuit structure 25.

[0058] Alternatively, multiple conductive elements 28, such as solder bumps or solder balls (of type C4), can be integrated into the second side 21b of the first circuit structure 21, and these multiple conductive elements 28 can be electrically connected to the wiring layer 212. The warpage can be mitigated by the sequentially formed first cover layer 24 and second cover layer 26, allowing the multiple conductive elements 28 to be flatly mounted on the first circuit structure 21, thus obtaining the electronic package 2 of this application. Subsequently, the electronic package 2 can be connected to an external device, such as a circuit board, via the multiple conductive elements 28.

[0059] Through the aforementioned process, this application also discloses an electronic package 2, comprising a first covering layer 24, a first electronic component 23 disposed in the first covering layer 24, and a second covering layer 26 covering the first covering layer 24, wherein the shrinkage direction of the second covering layer 26 is opposite to the warping direction of the first covering layer 24.

[0060] The aforementioned electronic package 2 also includes a first circuit structure 21 disposed on one side of the first covering layer 24, and a second circuit structure 25 disposed on the other side.

[0061] The aforementioned electronic package 2 also includes a plurality of conductive pillars 22 disposed in the first covering layer 24 and electrically connecting the first circuit structure 21 and the second circuit structure 25.

[0062] The aforementioned electronic package 2 also includes a second electronic component 27 disposed on the second circuit structure 25.

[0063] The aforementioned electronic package 2 also includes a plurality of conductive elements 28 disposed on the outside of the first circuit structure 21.

[0064] Therefore, the electronic package of this application mainly determines the warping direction after the first encapsulation layer covering the electronic component is formed in the first encapsulation operation, and selects a second encapsulation layer that shrinks in the opposite direction in the second encapsulation operation to improve the material warping phenomenon and thus solve the problem of structural warping caused by the shrinkage of existing encapsulation adhesive.

[0065] The above embodiments are used to illustrate the principles and effects of this application, and are not intended to limit this application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of this application. Therefore, the scope of protection of this application should be as set forth in the claims.

Claims

1. An electronic package, characterized in that, include: First covering layer; The first electronic component is embedded in the first covering layer; as well as A second covering layer covers the first covering layer, and the shrinkage direction of the second covering layer is opposite to the warping direction of the first covering layer.

2. The electronic package as described in claim 1, characterized in that, The electronic package also includes a first circuit structure located on one side of the first cover layer.

3. The electronic package as described in claim 2, characterized in that, The electronic package also includes a second circuit structure located on the other side of the first covering layer.

4. The electronic package as described in claim 3, characterized in that, The electronic package also includes a plurality of conductive posts disposed in the first covering layer and electrically connecting the first circuit structure and the second circuit structure.

5. The electronic package as described in claim 3, characterized in that, The electronic package also includes a second electronic component disposed on the second circuit structure.

6. The electronic package as described in claim 3, characterized in that, The electronic package also includes a plurality of conductive elements disposed on the outside of the first circuit structure.

7. The electronic package as claimed in claim 1, characterized in that, After the first coating layer is formed, the overall structure presents a smiley face structure with both ends curving upwards.

8. The electronic package as described in claim 7, characterized in that, The second coating layer is made of an adhesive material that shrinks in the opposite warping direction to the first coating layer.

9. The electronic package as claimed in claim 1, characterized in that, After the first coating layer is formed, the overall structure presents a crying face structure with both ends curving downwards.

10. The electronic package as claimed in claim 9, characterized in that, The second coating layer is made of an adhesive material that shrinks in the opposite warp direction to the first coating layer.

Images