3D printing light source equipment

Abstract

The utility model relates to the technical field of 3D printing, and provides 3D printing light source equipment. The equipment comprises a central control module which is used for obtaining a 3D printing instruction and analyzing the 3D printing instruction to generate a light source control instruction; the integrated circuit module is connected with the central control module and is used for receiving the light source control instruction and generating light-emitting current according to the light source control instruction; the light source module comprises a substrate, a plurality of light-emitting packaging pieces and a plurality of lens layers, the light-emitting packaging pieces are arranged on the substrate to form a light-emitting packaging piece array, the lens layers are connected to the substrate and seal and wrap the corresponding light-emitting packaging pieces, the light-emitting packaging pieces are connected with the integrated circuit module, and the integrated circuit module is connected with the integrated circuit module. The at least one light-emitting package is used for receiving the light-emitting current and generating a 3D printing light beam. The problem that in the prior art, the curing precision is not high in the 3D printing process is solved, the 3D printing quality and efficiency are improved, and the light energy utilization rate and the printing precision are improved.

Description

Technical Field

[0001] This application relates to the field of 3D printing technology, and more particularly to a 3D printing light source device. Background Technology

[0002] 3D printing involves outputting solid raw materials (such as metals, ceramics, plastics, sand, etc.) as thin layers and repeatedly stacking them to eventually create a physical object. LCD 3D printing is a type of 3D printing technology that uses a Liquid Crystal Display (LCD) as the light control layer. Based on the fact that the pixels of the LCD screen can be independently switched on and off, ultraviolet light is controlled by these pixels to precisely illuminate the liquid photosensitive resin, causing the resin to undergo a photopolymerization reaction and solidify. After each layer is solidified, the printing platform lowers a certain height, and a new resin layer flows over the solidified layer, undergoing another light curing process until the entire model is complete. In the LCD 3D printing process, although each pixel can theoretically be completely switched off to block light, in reality, due to the physical structure and manufacturing process of the LCD panel, especially in the boundary areas between pixels, slight light leakage occurs. This causes slight solidification at the edges of the resin, which should remain liquid, resulting in less clear boundaries and lower curing precision. Utility Model Content

[0003] In view of this, the present application provides a 3D printing light source device to solve the problem of low curing accuracy in the 3D printing process in the prior art.

[0004] This application provides a 3D printing light source device, including: a central control module, which acquires 3D printing instructions, parses the 3D printing instructions, and generates light source control instructions; an integrated circuit module, connected to the central control module, which receives the light source control instructions and generates luminous current according to the light source control instructions; and a light source module, including a substrate, multiple light-emitting packages, and multiple lens layers. The multiple light-emitting packages are disposed on the substrate to form a light-emitting package array, and the multiple lens layers are connected to the substrate and seal and cover the corresponding light-emitting packages. The light-emitting packages are connected to the integrated circuit module, and at least one light-emitting package is used to receive luminous current and generate a 3D printing beam.

[0005] Optionally, the light-emitting package includes: a light-emitting chip disposed on a substrate and connected to an integrated circuit module for generating a 3D-printed beam, wherein the light-emitting chip is a Mini LED; and an encapsulation layer covering the front and sides of the light-emitting chip.

[0006] Optionally, the encapsulation layer includes a scattering layer, which is made of silicone and contains diffuse particles. The scattering layer covers the light-emitting front side of the light-emitting chip.

[0007] Optionally, the encapsulation layer includes a reflective layer made of silicone, with reflective particles disposed inside the reflective layer. The proportion of reflective particles in the reflective layer is greater than the proportion of diffuse particles in the scattering layer, and the reflective layer covers the scattering layer.

[0008] Optionally, the light-emitting chip is an ultraviolet light chip.

[0009] Optionally, the individual light-emitting packages are arranged on the substrate at a vertical angle.

[0010] Optionally, the interfaces between the light-emitting chip, the scattering layer, and the reflective layer are all planar.

[0011] Optionally, the 3D printing light source device also includes a second reflective layer disposed between the substrate and the light-emitting chip.

[0012] Optionally, the 3D printing light source device also includes multiple barrier films, all of which are fixedly connected to the substrate, and each light-emitting package is surrounded by a barrier film.

[0013] Optionally, the 3D printing light source device also includes a heat sink, which is disposed on the side of the substrate away from the light-emitting package, and is used to dissipate heat from multiple light-emitting packages.

[0014] The beneficial effects of this application embodiment compared with the prior art are as follows: The central control module receives 3D printing instructions sent from the outside, parses the 3D printing instructions, understands the key parameters such as printing path, layer thickness, and exposure time, and generates specific light source control instructions. The integrated circuit module is directly connected to the central control module, receives the light source control instructions issued by the central control module, and converts these light source control instructions into the light-emitting current required to precisely control the light-emitting package of the light source module. The light source module includes a substrate, multiple light-emitting packages, and multiple lens layers. The substrate provides physical support and serves as a mounting platform for the light-emitting packages and lens layers. The multiple light-emitting packages can be light-emitting diodes, which directly respond to the light-emitting current issued by the integrated circuit module, converting electrical energy into light energy and generating a corresponding 3D printing beam. The light-emitting packages are arranged in an array on the substrate to cover the required printing area. Each lens layer is connected to the substrate and seals the corresponding light-emitting package, which can be used to focus and guide the light, optimize the direction and intensity of the beam, reduce scattering, and improve the utilization efficiency of light energy and printing accuracy. After receiving the luminescent current, the light-emitting package of the light source module generates a light beam for 3D printing. This beam precisely cures resin or other photosensitive materials, building a solid model layer by layer. These three modules work together to achieve a complete process from command reception and processing to precise light source control. Multiple light-emitting packages on the substrate can achieve a dense light source layout, with each package acting as an independent light source control point. This allows for precise control of the illuminated area during 3D printing, reducing unnecessary light spillage and improving light energy utilization and printing accuracy. Each package acts as a separate control point, allowing for adjustment of the light beam intensity generated by each package during printing based on the actual conditions of each layer. This achieves directionality and precision, addressing the problem of low curing accuracy in existing 3D printing technologies, improving the quality and efficiency of 3D printing, and enhancing light energy utilization and printing accuracy. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a 3D printing light source device provided in an embodiment of this application;

[0017] Figure 2 This is a schematic diagram of the structure of a light source module provided in an embodiment of this application;

[0018] Figure 3 This is a schematic diagram of the structure of a light-emitting package provided in an embodiment of this application;

[0019] Figure 4 This is a schematic diagram of the structure of an encapsulation layer provided in an embodiment of this application;

[0020] Figure 5 This is a schematic diagram of another light source module provided in an embodiment of this application;

[0021] Figure 6 This is a schematic diagram of another light source module provided in an embodiment of this application. Detailed Implementation

[0022] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0023] The following is a detailed description of a schematic diagram of a 3D printing light source device according to an embodiment of this application, with reference to the accompanying drawings.

[0024] In some embodiments, reference Figure 1 and Figure 2 A 3D printing light source device includes: a central control module 101, which acquires 3D printing instructions, parses the 3D printing instructions, and generates light source control instructions; an integrated circuit module 102, connected to the central control module, which receives the light source control instructions and generates a light-emitting current according to the light source control instructions; and a light source module 103, including a substrate 201, multiple light-emitting packages 202, and multiple lens layers 203. The multiple light-emitting packages are disposed on the substrate to form a light-emitting package array, and the multiple lens layers are connected to the substrate and seal and cover the corresponding light-emitting packages. The light-emitting packages are connected to the integrated circuit module, and at least one light-emitting package is used to receive the light-emitting current and generate a 3D printing beam.

[0025] In some embodiments, the 3D printing light source device is a highly integrated system used to precisely control the photopolymerization process, serving as a key component of photopolymerization 3D printing technology. The central control module receives 3D printing instructions, which may include parameters such as the three-dimensional geometry of the model to be printed, layer thickness, exposure time, and printing speed. The central control module parses these instructions, converting them into a series of easily executable control signals, thus transforming complex 3D model data into guidance information for actual printing operations and generating light source control instructions. The central control module can calculate how the light source should operate based on the geometric features of the model to be printed and the requirements of the current printing layer, including when to turn it on, off, adjust brightness, or change the light path direction, to adapt to different curing needs and precision requirements. Precise control of the light source is crucial for the quality of the printed model during photopolymerization 3D printing. The central control module not only generates light source control instructions but also coordinates these instructions with the actions of other printing subsystems (such as nozzle movement, resin supply, and platform lifting) to achieve efficient and high-quality printing output.

[0026] In some embodiments, the integrated circuit module acts as a bridge between the central control module and the light source module. The light source control command is a digital signal and may contain control information such as light source brightness, on / off timing, and pulse width modulation. After receiving the light source control command from the central control module, the integrated circuit module converts it into a precise electrical signal, i.e., a luminous current. The integrated circuit module may contain a decoding circuit to convert the received light source control command into a signal form that it can internally recognize and process. Based on the decoded control command, the integrated circuit module generates a corresponding current control signal, i.e., the luminous current. In photopolymer 3D printing, precise control of the luminous current is crucial for the curing effect. By controlling the light source to emit light in a predetermined pattern through the luminous current, the required light intensity and illumination time are achieved to precisely cure the resin. The integrated circuit module's receipt of the light source control command and generation of the luminous current involves precise current regulation, ensuring that the required light-emitting package can emit a 3D printing beam of the correct intensity and duration as needed, which contributes to the precise curing of materials during the photopolymerization process.

[0027] In some embodiments, the light source module includes a substrate, multiple light-emitting packages, and multiple lens layers. The substrate, as a physical support structure, supports the multiple light-emitting packages and lens layers. The substrate can be made of metal or ceramic material, providing mechanical support and serving as a platform for electrical connections. Circuit patterns are present on the substrate to connect the light-emitting packages and the integrated circuit module, enabling current conduction. The light-emitting packages are the actual light-generating elements, and multiple packages are arranged in a predetermined array on the substrate. Each package may contain one or more light-emitting diodes (LEDs) or other types of light sources, such as laser diodes. After receiving the luminous current from the integrated circuit module, the light-emitting package generates a spectrum suitable for photopolymerization, i.e., a 3D-printed beam, which can be ultraviolet light. Each lens layer seals and encapsulates the corresponding light-emitting package, which can be used to focus and guide the light, helping the beam to uniformly and accurately illuminate the resin surface. The lens layers also protect the light-emitting packages from external environmental influences and improve the stability and lifespan of the module through the sealed design. The integrated circuit module receives light source control commands from the central control module and generates luminous currents for each corresponding light-emitting package according to these commands. By precisely controlling the magnitude and timing of the luminous current, the intensity, on / off state, and frequency of the 3D printing beam can be adjusted, thus meeting the precise light control requirements during 3D printing. Multiple light-emitting packages on the substrate can achieve a dense light source layout, with each package acting as an independent light source control point. This allows for precise control of the illuminated area during 3D printing, reducing unnecessary light leakage and improving light energy utilization efficiency and printing accuracy. Each package acts as an independent control point, allowing for adjustment of the beam intensity generated by each package during printing based on the actual conditions of each layer of the model, achieving light directionality and precision. By controlling each package, precise control of the photocuring area is indirectly achieved. High-intensity illumination is enhanced where needed, while areas without illumination can be completely shut off. This not only reduces light leakage but also enables more accurate curing in areas requiring high precision, improving 3D printing quality.

[0028] The 3D printing light source device of this application allows the central control module to receive 3D printing instructions from external sources, parse these instructions, understand key parameters such as printing path, layer thickness, and exposure time, and generate specific light source control instructions. The integrated circuit module is directly connected to the central control module, receiving the light source control instructions and converting them into the luminous current required to precisely control the light-emitting packages of the light source module. The light source module includes a substrate, multiple light-emitting packages, and multiple lens layers. The substrate provides physical support and serves as a mounting platform for the light-emitting packages and lens layers. The multiple light-emitting packages can be light-emitting diodes (LEDs), directly responding to the luminous current emitted by the integrated circuit module, converting electrical energy into light energy and generating a corresponding 3D printing beam. The light-emitting packages are arranged in an array on the substrate to cover the required printing area. Each lens layer is connected to the substrate and seals the corresponding light-emitting package, which can be used to focus and guide the light, optimize the beam direction and intensity, reduce scattering, and improve light energy utilization efficiency and printing accuracy. After receiving the luminescent current, the light-emitting package of the light source module generates a light beam for 3D printing. This beam precisely cures resin or other photosensitive materials, building a solid model layer by layer. These three modules work together to achieve a complete process from command reception and processing to precise light source control. Multiple light-emitting packages on the substrate can achieve a dense light source layout, with each package acting as an independent light source control point. This allows for precise control of the illuminated area during 3D printing, reducing unnecessary light spillage and improving light energy utilization and printing accuracy. Each package acts as a separate control point, allowing for adjustment of the light beam intensity generated by each package during printing based on the actual conditions of each layer. This achieves directionality and precision, addressing the problem of low curing accuracy in existing 3D printing technologies, improving the quality and efficiency of 3D printing, and enhancing light energy utilization and printing accuracy.

[0029] In some embodiments, reference Figure 3 The light-emitting package 202 includes: a light-emitting chip 301 disposed on a substrate and connected to an integrated circuit module for generating a 3D printing beam, wherein the light-emitting chip is a sub-millimeter-level light-emitting diode (Mini LED); and a package layer 302 covering the front and sides of the light-emitting chip.

[0030] In some embodiments, the light-emitting package is a component that integrates the light-emitting chip, i.e., the Mini LED, with other necessary components, i.e., the encapsulation layer, to achieve stable light emission and provide protection. Mini LED is an advanced LED technology. Compared to traditional LEDs, Mini LEDs use smaller chips (typically less than 100 micrometers), thereby achieving higher pixel density, better brightness control, and contrast. In 3D printing light source equipment, Mini LEDs can provide concentrated and efficient light output, suitable for precisely controlled photocuring processes, ensuring rapid and uniform curing of the printed layer. During 3D printing, each Mini LED can be precisely turned on or off according to the needs of the model being printed, thereby reducing unnecessary light leakage and improving light energy utilization and printing accuracy. The encapsulation layer, typically made of transparent epoxy resin or other optical materials, covers the front and sides of the Mini LED, protecting the fragile light-emitting chip from physical damage and environmental corrosion and optimizing light emission efficiency. The front encapsulation layer helps with uniform light scattering, while the side encapsulation layers protect the chip edges, preventing side light leakage and also aiding in thermal management. The encapsulation layer covering the light-emitting chip enhances the reliability and durability of the light-emitting package.

[0031] In some embodiments, reference Figure 4 The encapsulation layer 302 includes a scattering layer 401, which is made of silicone and contains diffuse particles. The scattering layer 401 covers the front side of the light-emitting chip. The encapsulation layer also includes a reflective layer 402, which is made of silicone and contains reflective particles. The proportion of reflective particles in the reflective layer 402 is greater than the proportion of diffuse particles in the scattering layer 401. The reflective layer 402 covers the scattering layer 401.

[0032] In some embodiments, the scattering layer is made of silicone, a commonly used encapsulation material known for its high transparency, stability, and ease of processing, which allows it to effectively contain other functional additives. The scattering layer contains diffusing particles that scatter the passing 3D printed light beam, making the previously concentrated beam more uniformly dispersed, expanding the beam's radiation area, and resulting in a softer and more uniform beam distribution.

[0033] In some embodiments, the reflective layer uses silicone as the base material, with a higher proportion of reflective particles added. Compared to the scattering layer, the reflective layer has a higher proportion of reflective particles, which can be used to reflect light that has not been absorbed or scattered by the underlying components back to its original path, reducing light loss and improving overall light extraction and utilization efficiency. The reflective particles can effectively redirect downward or laterally propagating light, allowing it to be output more effectively in the desired direction, increasing light utilization. The reflective layer covers the scattering layer. A portion of the light emitted from the front of the light-emitting chip is refracted, passing through the scattering layer and the reflective layer in sequence, and exiting from the front of the light-emitting chip; while another portion of the light is refracted back to the scattering layer by the reflective layer. The scattering and reflective layers then reflect and refract this refracted portion of light again, thus preventing the light emitted from the front of the light-emitting chip from being repeatedly reflected and absorbed inside the package after vertical reflection, reducing light loss.

[0034] In some embodiments, the light-emitting chip is an ultraviolet light chip.

[0035] In some embodiments, ultraviolet (UV) light chips are used as the core of the light source device in 3D printing technology. UV light can trigger the polymerization reaction of specific photosensitive resins, thereby building objects layer by layer. UV light chips emit UV light of specific wavelengths, which are typically absorbed by the photosensitive resin. When UV light irradiates the resin surface, it can rapidly induce cross-linking of monomer molecules within the resin, achieving a precise photocuring process. Precisely controlled photocuring using UV light is crucial for achieving high-resolution and complex structure printing. Compared to other light sources, UV light chips can provide more concentrated and efficient curing energy, helping to shorten the curing time of each layer, thereby accelerating the entire printing process and improving printing efficiency. Furthermore, UV-cured resin can form a denser and more uniform printed model, directly affecting the mechanical strength and quality of the printed model. High-quality UV light chips ensure that each layer is fully cured, reducing interlayer voids and microscopic defects, resulting in printed models with better detail and overall mechanical properties.

[0036] In some embodiments, the light-emitting packages are arranged on the substrate at a vertical angle.

[0037] In some embodiments, in a 3D printing light source device, the light-emitting packages are arranged closely on the substrate at a vertical angle, allowing the light beam to directly and uniformly illuminate the resin layer at a near-vertical angle. This reduces light scattering and loss during propagation, further improving the concentration and utilization efficiency of light energy. It also helps reduce incomplete curing caused by shadow areas and uneven illumination, ensuring consistent light intensity across each layer of the model and improving the surface quality and structural integrity of the printed part. Vertical arrangement reduces light beam reflection and refraction before reaching the resin surface, facilitating precise control of the curing area, avoiding unnecessary light leakage and overlapping light spots, and improving the surface quality and detail of the printed model. Compared to horizontal or inclined arrangements, vertical arrangement allows for more light-emitting packages to be accommodated within a limited substrate space, increasing the density of the light source and enabling higher light power output within the same volume.

[0038] In some embodiments, the interfaces between the light-emitting chip, the scattering layer, and the reflective layer are all planar.

[0039] In some embodiments, the planar interfaces between the light-emitting chip, the scattering layer, and the reflective layer facilitate the regular and predictable transmission and transformation of light between the layers. This is particularly useful for 3D printing processes that require precise control of the direction and distribution of light, enabling the light beam emitted by the light-emitting chip to efficiently and uniformly irradiate the resin, thus promoting the precise curing of the resin.

[0040] In some embodiments, the 3D printing light source device further includes a second reflective layer disposed between the substrate and the light-emitting chip.

[0041] In some embodiments, the second reflective layer can capture light emitted from the light-emitting chip that shines directly downwards onto the substrate and reflects it back upwards, directing it back to the printing area. This significantly reduces light energy loss, allowing more light to be effectively utilized in the resin curing process, thus improving 3D printing efficiency and energy efficiency. The second reflective layer also provides some heat dissipation by reflecting unabsorbed light, reducing the heat directly hitting the substrate and helping to maintain the temperature balance of the entire light source module, protecting the substrate and underlying electronic components from overheating. Adding a second reflective layer between the substrate and the light-emitting chip in a 3D printing light source device optimizes light path management and energy utilization, promoting high efficiency and precision in the printing process.

[0042] In some embodiments, reference Figure 5 The 3D printing light source device also includes multiple barrier films 501, which are all fixedly connected to the substrate 201. Each light-emitting package 202 is surrounded by a barrier film 501.

[0043] In some embodiments, the barrier film ensures the directionality of the light beam. By limiting the divergence angle of the beam, most of the beam is emitted parallel to and perpendicular to the substrate, reducing scattered light. This allows the beam to be more concentrated, efficient, and uniformly applied to the resin material, promoting uniform curing and improving the surface quality and detail of the printed model. The parallel and perpendicular beam to the substrate also reduces layering and stair-step effects in the printed model, resulting in smoother sides and sharper edges.

[0044] In some embodiments, the 3D printing light source device further includes a heat sink 601, which is disposed on the side of the substrate 201 away from the light-emitting package 202, and the heat sink 601 is used to dissipate heat for the multiple light-emitting packages.

[0045] In some embodiments, a heat sink is located on the side of the substrate away from the light-emitting package. The light-emitting package generates a significant amount of heat during operation; if this heat is not dissipated promptly, it can lead to overheating, affecting luminous efficiency, shortening lifespan, and even damaging the package. The heat sink absorbs and conducts this heat, helping to maintain the 3D printing light source within a safe operating temperature range. In high-temperature environments, the performance of the light source degrades, resulting in problems such as color deviation and uneven curing of the printed parts. Effective heat dissipation through a heat sink ensures the stability of the light intensity and wavelength output from the 3D printing light source, improving 3D printing quality and reliability. The heat sink can be made of high thermal conductivity materials such as aluminum alloy or copper.

[0046] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A 3D printing light source apparatus, characterized by, The 3D printing light source device comprises: a central control module for obtaining 3D printing instructions and analyzing the 3D printing instructions to generate light source control instructions; an integrated circuit module connected to the central control module for receiving the light source control instructions and generating light-emitting current according to the light source control instructions; a light source module comprising a substrate, a plurality of light-emitting packages and a plurality of lens layers, the plurality of light-emitting packages being arranged on the substrate to form an array of light-emitting packages, and the plurality of lens layers being connected to the substrate and sealingly covering the corresponding light-emitting packages, the light-emitting packages being connected to the integrated circuit module, and at least one of the light-emitting packages being configured to receive the light-emitting current and generate a 3D printing light beam.

2. The 3D printing light source apparatus according to claim 1, wherein, The light-emitting package comprises: a light-emitting chip arranged on the substrate and connected to the integrated circuit module, configured to generate a 3D printing light beam, the light-emitting chip being a Mini LED; a packaging layer covering the front and side surfaces of the light-emitting chip.

3. The 3D printing light source apparatus according to claim 2, characterized in that, The packaging layer comprises a scattering layer made of silica gel, the scattering layer having diffusion particles arranged therein, and the scattering layer covering the light-emitting surface of the light-emitting chip.

4. The 3D printing light source apparatus according to claim 3, characterized in that, The packaging layer comprises a reflective layer made of silica gel, the reflective layer having reflective particles arranged therein, the proportion of the reflective particles in the reflective layer being greater than the proportion of the diffusion particles in the scattering layer, and the reflective layer covering the scattering layer.

5. The 3D printing light source apparatus according to claim 2, wherein, The light-emitting chip is an ultraviolet light chip.

6. The 3D printing light source apparatus according to claim 1, wherein, Each of the light-emitting packages is arranged on the substrate at a perpendicular angle.

7. The 3D printing light source apparatus according to claim 4, wherein, The interfaces between the light-emitting chip, the scattering layer and the reflective layer are all planar.

8. The 3D printing light source apparatus according to claim 2, wherein, The 3D printing light source device further comprises a second reflective layer arranged between the substrate and the light-emitting chip.

9. The 3D printing light source apparatus of claim 1, wherein, The 3D printing light source device further comprises a plurality of barrier films, each of which is fixedly connected to the substrate, and each of the light-emitting packages is surrounded by the barrier films.

10. The 3D printing light source apparatus of claim 1, wherein, The 3D printing light source device further comprises a heat sink arranged on the side of the substrate away from the light-emitting packages, the heat sink being configured to dissipate heat for the plurality of light-emitting packages.

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