Dual-mode satellite data link terminal machine

Abstract

The utility model discloses a dual-mode satellite data link terminal machine, which relates to the technical field of satellite communication and comprises a shell assembly, a communication assembly and a heat dissipation assembly are arranged in the shell assembly, the communication assembly comprises a communication circuit board and a power supply circuit board, and the heat dissipation assembly comprises a heat absorption plate. The communication circuit board and the power circuit board are arranged on the two sides of the heat absorption plate respectively, the heat dissipation plates are fixedly installed at the two ends of the heat absorption plate, the shell assembly comprises a first shell and a second shell, the first shell and the second shell are each of a C-shaped structure, through grooves are formed in the two sides of the first shell, and the heat dissipation plates are arranged on the outer side of the first shell. The heat absorption plate and the heat dissipation plate are filled with phase change liquid, capillary layers are arranged on the inner side of the heat absorption plate and the inner side of the heat dissipation plate, and heat dissipation fins are fixedly installed on the outer side of the heat dissipation plate. According to the utility model, heat dissipation can be carried out efficiently, external dust can be effectively prevented from entering the interior to affect use, and the practical value is high.

Description

Technical Field

[0001] This utility model relates to the field of satellite communication technology, specifically a dual-mode satellite data link terminal. Background Technology

[0002] A dual-mode satellite data link terminal is a terminal device that supports two different satellite communication modes, primarily used for data transmission, navigation and positioning, and beyond-line-of-sight communication in military or civilian fields. Its core feature is the integration of the technological advantages of different satellite systems to meet multifunctional needs in complex environments.

[0003] For example, Chinese patent CN214480614U discloses a dual-mode satellite data link end-machine structure. The signal processor is connected to the upper end of the power amplifier. One end of the signal processor is connected to a Beidou satellite receiving port and a relay satellite receiving port. One side wall of the signal processor is provided with an opening slot for installing a side door. The two side walls of the opening slot are respectively provided with sliding devices. One end of the sliding device is connected to a stabilizing device. A mounting plate is connected between the two sliding devices. Several sets of miniature cooling fans are installed at equal intervals on the mounting plate. Several sets of through holes are provided at equal intervals on the mounting plate. Several sets of limiting rods are also connected at equal intervals on one side of the mounting plate.

[0004] The technical solution described herein effectively extends the service life of internal components by adding a heat dissipation structure to dissipate heat inside, avoids damage caused by poor heat dissipation, reduces usage costs, and is easy to connect and disassemble. However, the technical solution has heat dissipation slots on the side, which allow external dust to easily enter the interior. Dust can easily interfere with signals and cause short circuits, making it inconvenient to use.

[0005] Therefore, in view of this, we will study and improve the existing structure and its shortcomings, and provide a dual-mode satellite data link terminal to achieve a more practical purpose. Utility Model Content

[0006] The purpose of this invention is to provide a dual-mode satellite data link terminal to solve the problems mentioned in the background art.

[0007] A dual-mode satellite data link end unit includes a housing assembly. Inside the housing assembly are a communication component and a heat dissipation component. The communication component includes a communication circuit board and a power circuit board. The heat dissipation component includes a heat-absorbing plate. The communication circuit board and the power circuit board are respectively disposed on both sides of the heat-absorbing plate. Heat dissipation plates are fixedly installed at both ends of the heat-absorbing plate. The housing assembly includes a first housing and a second housing, both of which are C-shaped structures. Through slots are formed on both sides of the first housing, through which the heat-absorbing plate passes. The heat dissipation plate is disposed on the outside of the first housing. The heat-absorbing plate and the heat dissipation plate are filled with a phase change liquid, and a capillary layer is provided on the inner side of the heat-absorbing plate and the heat dissipation plate. Heat dissipation fins are fixedly installed on the outer side of the heat dissipation plate.

[0008] By adopting the above technical solution, the outer casing assembly houses a communication component and a heat dissipation component, which provides protection for the internal communication component. The heat dissipation component dissipates the heat generated by the communication component. The communication circuit board and power circuit board are respectively located on both sides of the heat absorption plate, allowing the heat absorption plate to absorb the heat generated by these circuit boards. Heat dissipation plates are fixedly installed at both ends of the heat absorption plate, allowing the heat dissipation plates to dissipate the heat absorbed by the heat absorption plate. The first and second outer casings are both C-shaped structures, facilitating the combination of the first and second outer casings to form a sealed cavity, providing sealing protection for the internal communication component and preventing dust from entering and affecting its operation. The through-slot design allows the heat dissipation plate to be placed on the outside of the cavity formed by the first and second outer casings. The phase change liquid and capillary layer facilitate the liquid phase change liquid absorbing heat and vaporizing inside the heat absorption plate, flowing into the heat dissipation plate. The phase change liquid gas inside the heat dissipation plate liquefies and is drawn into the heat absorption plate by the capillary action of the capillary layer, achieving efficient heat dissipation of the internal components of the outer casing assembly. Heat dissipation fins are fixedly installed on the outside of the heat dissipation plate, increasing the heat dissipation area and improving the heat dissipation effect of the device.

[0009] Furthermore, cross-flow fan housings are fixedly installed on both sides of the bottom of the first outer shell. Cross-flow fan housings are rotatably connected inside the cross-flow fan housings. A motor is fixedly installed at one end of the cross-flow fan housings, and the output end of the motor is fixedly connected to the cross-flow fan housings.

[0010] By adopting the above technical solution, the motor output end is fixedly connected to the cross-flow blades, which facilitates the operation of the motor to drive the cross-flow blades to rotate and generate airflow, thereby increasing the airflow speed on the surface of the heat dissipation fins and further improving the heat dissipation effect.

[0011] Furthermore, an air guide shell is fixedly installed on the top of the cross-flow fan casing, and the air guide shell is sleeved on the outside of the heat dissipation fins.

[0012] By adopting the above technical solution, the air guide shell can effectively protect the heat dissipation fins and guide the airflow passing over them.

[0013] Furthermore, the first outer shell has inserts at both the top and bottom of its inner side, and the second outer shell has slots on both sides, with the inserts slidably connected to the slots.

[0014] By adopting the above technical solution, the first and second outer shells can be easily connected by inserts and slots.

[0015] Furthermore, the first housing is provided with a screw seat at one end, and the second housing is provided with a fixing screw on the outer side of one end, the fixing screw being threadedly connected to the screw seat.

[0016] By adopting the above technical solution, the first outer shell and the second outer shell are easily fixedly connected by the screw and screw seat threaded connection.

[0017] Furthermore, the heat-absorbing plate has reinforcing grooves at both the top and bottom, and a reinforcing strip is fixedly installed inside the first outer shell, with the reinforcing strip located inside the reinforcing groove.

[0018] By adopting the above technical solution and setting the reinforcing strip, the installation stability of the heat absorption plate can be improved.

[0019] Furthermore, both the reinforcing strip and the reinforcing groove have through holes, and the communication circuit board and the power circuit board are electrically connected.

[0020] By adopting the above technical solution, the through-hole design facilitates the electrical connection between the communication circuit board and the power circuit board.

[0021] Furthermore, a communication module is fixedly mounted on the top of the communication circuit board, and one end of the communication module is provided with a communication interface.

[0022] By adopting the above technical solution, and with a communication interface on one end of the communication module, it is easy to integrate the two modes of Beidou satellite and relay satellite into a single data link terminal structure, allowing the device to choose between the two modes arbitrarily.

[0023] Furthermore, one end of the power circuit board is provided with a power interface, and one end of the first housing is provided with an interface hole, which is located on the outside of the power interface and the communication interface.

[0024] By adopting the above technical solution and setting the interface hole, it is convenient to make electrical connections between external line connectors and the device.

[0025] Compared with the prior art, the beneficial effects of this utility model are as follows: The housing assembly houses a communication component and a heat dissipation component, facilitating protection of the internal communication component. The heat dissipation component dissipates heat generated by the communication component. The communication circuit board and power circuit board are respectively positioned on both sides of the heat-absorbing plate, allowing the heat-absorbing plate to absorb the heat generated by these circuit boards. Heat dissipation plates are fixedly installed at both ends of the heat-absorbing plate, facilitating the outward dissipation of the absorbed heat. Furthermore, both the first and second housings are C-shaped structures, facilitating their assembly. The sealed cavity provides convenient sealing protection for the internal communication components, preventing dust from entering and affecting their operation. The through-slot design facilitates the placement of the heat sink on the outside of the cavity formed by the first and second outer shells. The phase change liquid and capillary layer facilitate the absorption of heat and vaporization of the liquid phase change liquid inside the heat absorber, which then flows into the heat sink. The phase change liquid gas inside the heat sink liquefies and dissipates heat, and is drawn into the heat absorber by the capillary action of the capillary layer, achieving efficient heat dissipation of the internal components. Heat dissipation fins are fixedly installed on the outside of the heat sink to increase its heat dissipation area, thereby improving the device's heat dissipation effect. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of a dual-mode satellite data link end unit according to the present invention;

[0027] Figure 2 This is an exploded view of a dual-mode satellite data link terminal of this utility model;

[0028] Figure 3 This is an exploded view of the outer shell assembly of this utility model;

[0029] Figure 4 This is a cross-sectional view of the heat dissipation component of this utility model;

[0030] Figure 5 This is a front view of the first outer shell of this utility model.

[0031] In the diagram: 101, outer casing assembly; 10101, first outer casing; 10102, second outer casing; 10103, screw seat; 10104, insert strip; 10105, reinforcing strip; 10106, through slot; 10107, cross-flow fan casing; 10108, motor; 10109, cross-flow blades; 10110, air guide casing; 10111, interface hole; 10112, fixing screw; 10113, slot; 102, communication assembly; 10201, communication circuit board; 10202, power circuit board; 10203, communication module; 10204, communication interface; 10205, power interface; 103, heat dissipation assembly; 10301, heat absorption plate; 10302, heat dissipation plate; 10303, heat dissipation fins; 10304, reinforcing slot; 10305, through hole; 10306, capillary layer. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1-5This utility model provides a technical solution: a dual-mode satellite data link end unit, including a housing assembly 101. The housing assembly 101 houses a communication component 102 and a heat dissipation component 103. The housing assembly 101 provides protection for the internal communication component 102, and the heat dissipation component 103 dissipates the heat generated by the communication component 102 during operation. The communication component 102 includes a communication circuit board 10201 and a power circuit board 10202. The heat dissipation component 103 includes a heat absorption plate 10301. The communication circuit board 10201 and the power circuit board 10202 are respectively disposed on both sides of the heat absorption plate 10301. The communication circuit board 10201 and the power circuit board 10202 are respectively disposed on both sides of the heat absorption plate 10301, so that the heat absorption plate 10301 can absorb the heat generated by the communication circuit board 10201 and the power circuit board 10202 during operation. Heat dissipation plates 10302 are fixedly installed at both ends of the heat absorption plate 10301, so that the heat dissipation plates 10302 can dissipate the heat absorbed by the heat absorption plate 10301. The outer casing assembly 101 includes a first outer casing 10101 and a second outer casing 10102. Both the first outer casing 10101 and the second outer casing 10102 are C-shaped structures. Both the second outer shell 10102 and the first outer shell 10101 have a C-shaped structure, which facilitates the combination of the first outer shell 10101 and the second outer shell 10102 to form a sealed cavity. This provides sealing protection for the internal communication component 102 and prevents dust from entering and affecting its operation. The first outer shell 10101 has through slots 10106 on both sides, through which the heat-absorbing plate 10301 passes. The through slots 10106 facilitate the placement of the heat-dissipating plate 10302 on the outside of the cavity formed by the first and second outer shells 10101 and 10102. The heat-dissipating plate 10302 is located on the outside of the first outer shell 10101. Both the heat-absorbing plate 10301 and the heat-dissipating plate 10302 are filled with a phase change liquid and absorb heat. A capillary layer 10306 is provided on the inner side of plate 10301 and heat dissipation plate 10302. With the provision of phase change liquid and capillary layer 10306, the liquid phase change liquid can absorb heat and vaporize inside the heat absorption plate 10301 and flow into the heat dissipation plate 10302. The phase change liquid gas inside the heat dissipation plate 10302 is liquefied and drawn into the heat absorption plate 10301 by the capillary action of capillary layer 10306, so as to achieve efficient heat dissipation of the inside of the outer shell assembly 101. Heat dissipation fins 10303 are fixedly installed on the outer side of heat dissipation plate 10302. The heat dissipation fins 10303 fixedly installed on the outer side of heat dissipation plate 10302 can increase the heat dissipation area of ​​heat dissipation plate 10302, thereby improving the heat dissipation effect of the device.

[0034] The first outer casing 10101 has cross-flow fan housings 10107 fixedly installed on both sides of the bottom. Cross-flow fan housings 10107 have cross-flow blades 10109 rotatably connected inside. A motor 10108 is fixedly installed at one end of the cross-flow fan housing 10107. The output end of the motor 10108 is fixedly connected to the cross-flow blades 10109. The fixed connection between the output end of the motor 10108 and the cross-flow blades 10109 facilitates the operation of the motor 10108 to drive the cross-flow blades 10109 to rotate and generate airflow, thereby increasing the airflow speed on the surface of the heat dissipation fins 10303 and further improving the heat dissipation effect.

[0035] Among them, the top of the cross-flow fan housing 10107 is fixedly installed with an air guide housing 10110. The air guide housing 10110 is sleeved on the outside of the heat dissipation fin 10303. The air guide housing 10110 provides protection for the heat dissipation fin 10303 and guides the airflow that blows over the heat dissipation fin 10303.

[0036] The first outer shell 10101 has inserts 10104 at both the top and bottom of its inner side, and the second outer shell 10102 has slots 10113 on both sides. The inserts 10104 are slidably connected to the slots 10113. The inserts 10104 and slots 10113 facilitate the combination and connection of the first outer shell 10101 and the second outer shell 10102.

[0037] The first outer shell 10101 is provided with a screw seat 10103 at one end, and the second outer shell 10102 is provided with a fixing screw 10112 on the outer side of one end. The fixing screw 10112 is threadedly connected to the screw seat 10103. The threaded connection between the fixing screw 10112 and the screw seat 10103 facilitates the fixed connection between the first outer shell 10101 and the second outer shell 10102.

[0038] The heat absorber plate 10301 has reinforcing grooves 10304 at both the top and bottom. A reinforcing strip 10105 is fixedly installed inside the first outer shell 10101. The reinforcing strip 10105 is set inside the reinforcing groove 10304. The installation stability of the heat absorber plate 10301 is improved by setting the reinforcing strip 10105.

[0039] The reinforcing strip 10105 and the reinforcing groove 10304 are both provided with through holes 10305, and the communication circuit board 10201 and the power circuit board 10202 are electrically connected. The through holes 10305 facilitate the electrical connection between the communication circuit board 10201 and the power circuit board 10202.

[0040] The communication circuit board 10201 has a communication module 10203 fixedly installed on its top. One end of the communication module 10203 is provided with a communication interface 10204. The communication interface 10204 at one end of the communication module 10203 facilitates the integration of Beidou satellite and relay satellite modes into a single data link terminal structure, allowing the device to select arbitrarily between the two modes.

[0041] The power circuit board 10202 has a power interface 10205 at one end, and the first housing 10101 has an interface hole 10111 at one end. The interface hole 10111 is located outside the power interface 10205 and the communication interface 10204. The interface hole 10111 facilitates the electrical connection between the external line connector and the device.

[0042] Specifically, the working principle of this dual-mode satellite data link terminal is as follows: During use, the interface hole 10111 facilitates electrical connection between the external line connector and the device. The communication module 10203 has a communication interface 10204 at one end, allowing integration of both BeiDou satellite and relay satellite modes into a single data link terminal structure, enabling the device to select either mode. The insertion strip 10104 and slot 10113 facilitate the combination and connection of the first outer shell 10101 and the second outer shell 10102. The connection is secured by the fixing screw 10112. The screw seat 10103 is threaded, facilitating the fixed connection between the first outer shell 10101 and the second outer shell 10102. Heat dissipation plates 10302 are fixedly installed at both ends of the heat absorption plate 10301, allowing the heat dissipation plates 10302 to dissipate the heat absorbed by the heat absorption plate 10301. Since both the first outer shell 10101 and the second outer shell 10102 are C-shaped, they can be combined to form a sealed cavity, providing sealing protection for the internal communication component 102 and preventing dust from entering and affecting it. 02. In operation, the through-slot 10106 facilitates the placement of the heat sink 10302 on the outside of the cavity formed by the first housing 10101 and the second housing 10102. The phase change liquid and capillary layer 10306 facilitate the absorption of heat and vaporization of the liquid phase change liquid within the heat absorber 10301, which then flows into the heat sink 10302. The phase change liquid gas inside the heat sink 10302 dissipates heat and liquefies, then is drawn into the heat absorber 10301 by the capillary action of the capillary layer 10306, achieving efficient heat dissipation from the interior of the housing assembly 101. Heat dissipation fins 10303 are fixedly installed on the outside of 302 to increase the heat dissipation area of ​​heat dissipation plate 10302, thereby improving the heat dissipation effect of the device. The output end of motor 10108 is fixedly connected to cross-flow blades 10109, so that motor 10108 can drive cross-flow blades 10109 to rotate and generate airflow, thereby increasing the airflow speed on the surface of heat dissipation fins 10303 and further improving the heat dissipation effect. The air guide shell 10110 is set to protect heat dissipation fins 10303 and guide the airflow blowing over heat dissipation fins 10303.

[0043] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A dual-mode satellite data link end unit, characterized in that, The system includes a housing assembly (101), inside which a communication assembly (102) and a heat dissipation assembly (103) are provided. The communication assembly (102) includes a communication circuit board (10201) and a power circuit board (10202). The heat dissipation assembly (103) includes a heat absorption plate (10301). The communication circuit board (10201) and the power circuit board (10202) are respectively disposed on both sides of the heat absorption plate (10301). Heat dissipation plates (10302) are fixedly installed at both ends of the heat absorption plate (10301). The housing assembly (101) includes a first housing (10101) and a second housing (10102). 02), the first shell (10101) and the second shell (10102) are both C-shaped structures. The first shell (10101) has through slots (10106) on both sides. The heat absorption plate (10301) passes through the through slots (10106). The heat dissipation plate (10302) is disposed on the outside of the first shell (10101). The heat absorption plate (10301) and the heat dissipation plate (10302) are filled with phase change liquid. The heat absorption plate (10301) and the heat dissipation plate (10302) have capillary layers (10306) on their inner sides. The heat dissipation fins (10303) are fixedly installed on the outside of the heat dissipation plate (10302).

2. The dual-mode satellite data link end unit according to claim 1, characterized in that, A cross-flow fan housing (10107) is fixedly installed on both sides of the bottom of the first outer shell (10101). A cross-flow blade (10109) is rotatably connected inside the cross-flow fan housing (10107). A motor (10108) is fixedly installed at one end of the cross-flow fan housing (10107). The output end of the motor (10108) is fixedly connected to the cross-flow blade (10109).

3. A dual-mode satellite data link end-user according to claim 2, characterized in that, The top of the cross-flow fan housing (10107) is fixedly installed with an air guide housing (10110), which is sleeved on the outside of the heat dissipation fins (10303).

4. A dual-mode satellite data link end-user according to claim 1, characterized in that, The first outer shell (10101) has inserts (10104) at both the top and bottom of its inner side, and the second outer shell (10102) has slots (10113) on both sides. The inserts (10104) are slidably connected to the slots (10113).

5. A dual-mode satellite data link end-user according to claim 4, characterized in that, The first housing (10101) has a screw seat (10103) at one end, and the second housing (10102) has a fixing screw (10112) on the outer side of one end, and the fixing screw (10112) is threadedly connected to the screw seat (10103).

6. A dual-mode satellite data link end unit according to claim 1, characterized in that, The heat absorption plate (10301) has reinforcing grooves (10304) at both the top and bottom. A reinforcing strip (10105) is fixedly installed inside the first outer shell (10101), and the reinforcing strip (10105) is located inside the reinforcing groove (10304).

7. A dual-mode satellite data link end-user according to claim 6, characterized in that, Both the reinforcing strip (10105) and the reinforcing groove (10304) have through holes (10305) inside, and the communication circuit board (10201) and the power circuit board (10202) are electrically connected.

8. A dual-mode satellite data link end unit according to claim 1, characterized in that, A communication module (10203) is fixedly installed on the top of the communication circuit board (10201), and a communication interface (10204) is provided at one end of the communication module (10203).

9. A dual-mode satellite data link end-user according to claim 1, characterized in that, The power circuit board (10202) has a power interface (10205) at one end, and the first housing (10101) has an interface hole (10111) at one end. The interface hole (10111) is located outside the power interface (10205) and the communication interface (10204).

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