Double-layer heat dissipation device for electronic device

Abstract

The utility model relates to a heat dissipation device, in particular to a double-layer heat dissipation device for an electronic device, which comprises a fixed frame. The mounting frame is fixedly mounted on the fixed frame; a plurality of groups of air inlets are formed in the fixed frame; a plurality of groups of exhaust ports communicated with the air inlet are formed in the mounting frame; a heat conducting plate is fixedly mounted on the fixed frame; a heat dissipation structure is arranged on the mounting frame; the heat dissipation mechanism comprises a plurality of groups of fan blades; a corner structure is arranged on the mounting frame; the corner structure can drive the fan blades to deflect when the heat dissipation structure acts. The fixed frame is provided with a movable contact; a static contact is arranged on the mounting frame; a temperature sensing structure is arranged on the heat conducting plate and can drive the movable contact to be close to or far away from the static contact so as to change the action state of the heat dissipation structure; the temperature sensing structure can monitor the temperature change on the heat conducting plate in real time without delay, and the anti-interference capability is high.

Description

Technical Field

[0001] This utility model relates to a heat dissipation device, specifically a double-layer heat dissipation device for electronic devices. Background Technology

[0002] With the development of technology, electronic devices are being used more and more widely. For example, chips are widely used in various electronic devices. However, electronic devices generate a lot of heat during operation, which affects their operation and thus requires heat dissipation.

[0003] Common heat dissipation devices include heat sinks, cooling fans, and motors. Heat sinks are typically in close contact with electronic components to better and more quickly absorb the heat generated by them. A motor drives a continuously rotating cooling fan to increase airflow around the heat sink, thus carrying away heat and achieving a cooling effect.

[0004] The amount of heat generated varies depending on the operating state of electronic devices (low power or high power). Under high power conditions, electronic devices generate more heat at a faster rate. In this state, using common heat dissipation devices to cool and dissipate heat in a timely and continuous manner can prevent damage from heat buildup. However, under low power conditions, electronic devices generate less heat at a slower rate (i.e., heat dissipation is unnecessary). Using common heat dissipation devices without temperature recognition will increase the heat dissipation power consumption of the devices and reduce their overall lifespan. Utility Model Content

[0005] The purpose of this invention is to provide a double-layer heat dissipation device for electronic devices to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A double-layer heat dissipation device for electronic devices includes a fixed frame and a mounting frame fixedly mounted on the fixed frame.

[0008] The fixed frame has multiple sets of air inlets; the mounting frame has multiple sets of exhaust outlets that communicate with the air inlets.

[0009] A heat-conducting plate is fixedly installed on the fixed frame;

[0010] The mounting frame is equipped with a heat dissipation structure; the heat dissipation mechanism includes multiple sets of fan blades; the multiple sets of fan blades are capable of rotation.

[0011] The mounting frame is provided with a corner structure; the corner structure can drive the fan blades to deflect when the heat dissipation structure is activated.

[0012] The fixed frame is provided with a moving contact; the mounting frame is provided with a stationary contact;

[0013] The heat-conducting plate is provided with a temperature-sensing structure, which can drive the moving contact to move closer to or further away from the stationary contact, thereby changing the operating state of the heat dissipation structure.

[0014] The double-layer heat dissipation device for electronic devices as described above includes: a motor fixedly mounted on the mounting frame; a rotating shaft fixedly mounted on the output end of the motor; a fixing block fixedly mounted on the rotating shaft; a rotating rod rotatably mounted on the fixing block; and the rotating rod fixedly connected to the fan blades.

[0015] The double-layer heat dissipation device for electronic devices as described above includes: a centrifugal disc fixedly mounted on a rotating shaft; multiple sets of centrifugal blocks slidably fitted onto the centrifugal disc; a telescopic sleeve fixedly mounted on each centrifugal block; a sliding sleeve slidably mounted on the rotating shaft; a telescopic column fixedly mounted on the sliding sleeve and slidably fitted onto the telescopic sleeve; a turntable on the rotating shaft; a first protruding column fixedly mounted on the turntable; a first inclined groove on the rotating shaft that slidably fits onto the first protruding column; a third inclined groove on the rotating rod; a slip ring on the rotating rod; a second protruding column fixedly mounted on the slip ring and slidably fitted onto the third inclined groove; multiple sets of second inclined grooves on the turntable; a connecting rod fixedly connected to the slip ring slidably fitted into each of the second inclined grooves; a bracket fixedly mounted on the fixed block and slidably fitted onto the connecting rod; a return spring wrapped around the rotating shaft; and the two ends of the return spring abutting against the turntable and the fixed block, respectively.

[0016] The above-described double-layer heat dissipation device for electronic devices includes a temperature-sensing tank fixedly mounted on the heat-conducting plate, and a piston slidably fitted inside the temperature-sensing tank and fixedly connected to the moving contact.

[0017] The double-layer heat dissipation device for electronic devices as described above: the stationary contact is slidably fitted with the mounting frame, and a buffer spring is provided inside the mounting frame; the two ends of the buffer spring respectively abut against the stationary contact and the mounting frame.

[0018] The double-layer heat dissipation device for electronic devices as described above: multiple sets of heat-conducting fins are fixedly installed on the heat-conducting plate; the heat-conducting fins are evenly distributed along the circumference of the heat-conducting plate.

[0019] As described above, in a dual-layer heat dissipation device for electronic devices, there is an angle between the exhaust port and the plane containing the heat-conducting plate.

[0020] Compared with existing technologies, the beneficial effects of this invention are as follows: Electronic devices generate less heat under low power conditions, so heat dissipation via a heat-conducting plate can prevent heat buildup and malfunctions. Furthermore, the generated heat causes the heat-conducting medium to expand, resulting in a shorter movement distance for the moving contact, preventing it from contacting the stationary contact. In this case, the heat dissipation structure remains inactive, thus reducing the overall power consumption of the heat dissipation device. However, when electronic devices operate for extended periods or at high power, they generate more heat. Therefore, when heat dissipation via the heat-conducting plate alone is insufficient, the heat-conducting plate promptly absorbs the heat generated by the electronic devices and transfers it to the temperature-sensing structure. Upon receiving the heat, the temperature-sensing structure reacts, controlling the operation of the heat dissipation structure, thereby accelerating airflow and improving heat dissipation. The temperature-sensing structure can monitor temperature changes on the heat-conducting plate in real time, with no hysteresis and strong anti-interference capabilities. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a double-layer heat dissipation device used in electronic devices.

[0022] Figure 2 This is a schematic diagram of a double-layer heat dissipation device used in electronic devices from another perspective.

[0023] Figure 3 This is a schematic diagram of the temperature-sensing tank in a double-layer heat dissipation device used in electronic devices.

[0024] Figure 4 This is a schematic diagram of the structure of the rotating shaft in a double-layer heat dissipation device used in electronic devices.

[0025] Figure 5 for Figure 4 A schematic diagram of the structure at point A in the middle.

[0026] Figure 6 This is a schematic diagram of the reset spring in a double-layer heat dissipation device used in electronic devices.

[0027] Figure 7 This is a schematic diagram of the slip ring structure in a double-layer heat dissipation device used in electronic devices.

[0028] Figure 8 This is a schematic diagram of the rotating disk in a double-layer heat dissipation device used in electronic devices.

[0029] In the diagram: 1. Fixed frame; 101. Air inlet;

[0030] 2. Heat-conducting plate; 201. Heat-conducting fins;

[0031] 3. Temperature-sensing tank; 301. Piston;

[0032] 4. Moving contact;

[0033] 5. Mounting frame; 501. Exhaust port;

[0034] 6. Stationary contactor; 7. Buffer spring;

[0035] 8. Electric motor;

[0036] 9. Rotating shaft; 901. First inclined groove;

[0037] 10. Centrifuge tray;

[0038] 11. Centrifuge block; 1101. Telescopic sleeve;

[0039] 12. Sliding sleeve; 1201. Telescopic column;

[0040] 13. Turntable; 1301. First protruding post; 1302. Second inclined groove;

[0041] 14. Fixing block;

[0042] 15. Rotating rod; 1501. Third inclined groove;

[0043] 16. Fan blades;

[0044] 17. Connecting rod;

[0045] 18. Slip ring; 1801. Second protruding post;

[0046] 19. Return spring;

[0047] 20. Bracket. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0049] Please see Figures 1 to 8 As an embodiment of the present utility model, the double-layer heat dissipation device for electronic devices includes a fixed frame 1 and a mounting frame 5 fixedly installed on the fixed frame 1.

[0050] The fixed frame 1 has multiple sets of air inlets 101; the mounting frame 5 has multiple sets of exhaust outlets 501 that are connected to the air inlets 101.

[0051] A heat-conducting plate 2 is fixedly installed on the fixed frame 1;

[0052] The mounting frame 5 is provided with a heat dissipation structure; the heat dissipation mechanism includes multiple sets of fan blades 16; the multiple sets of fan blades 16 are rotatable.

[0053] The mounting frame 5 is provided with a corner structure; the corner structure can drive the fan blades 16 to deflect when the heat dissipation structure is activated.

[0054] The fixed frame 1 is provided with a moving contact 4; the mounting frame 5 is provided with a stationary contact 6;

[0055] The heat-conducting plate 2 is provided with a temperature-sensing structure, which can drive the moving contact 4 to move closer to or further away from the stationary contact 6, thereby changing the operating state of the heat dissipation structure.

[0056] In this embodiment, the fixing frame 1 is fixedly connected to the device by screws; after the fixing frame 1 is fixedly installed, the heat-conducting plate 2 comes into contact with the electronic components to absorb the heat generated by the electronic components during operation. The heat-conducting plate 2 has a high thermal conductivity and can effectively absorb heat.

[0057] The moving contact 4 and the stationary contact 6 are connected to the power supply and the heat dissipation structure. When the moving contact 4 and the stationary contact 6 are in contact, the power supply provides power to the heat dissipation structure.

[0058] When electronic devices operate at low power or for short periods, they generate relatively little heat. Therefore, heat dissipation is achieved through the heat-conducting plate 2, preventing heat buildup and potential malfunctions. In this state, the temperature-sensing structure cannot activate the moving contact 4 against the stationary contact 6, thus the heat dissipation structure remains inactive, reducing the power consumption required for heat dissipation. In this state, the fan blades 16 are parallel to the direction of air convection (air flows from the inlet 101 to the outlet 501), minimizing airflow resistance and preventing slow, hot air flow that could cause a temperature rise on the heat-conducting plate 2, thereby improving its thermal conductivity.

[0059] When electronic devices operate for extended periods or at high power, they generate significant heat, which cannot be adequately dissipated by heat-conducting plate 2 alone.

[0060] In this state, the heat-conducting plate 2 promptly absorbs the heat generated by the electronic components and transfers it to the temperature-sensing structure. Upon receiving the heat, the temperature-sensing structure reacts, causing the moving contact 4 to move closer to the stationary contact 6. When the moving contact 4 and the stationary contact 6 come into contact, the heat dissipation structure activates. The temperature-sensing structure can monitor temperature changes on the heat-conducting plate 2 in real time, without hysteresis and with strong anti-interference capabilities.

[0061] When the heat dissipation structure is activated, it will drive the fan blades 16 to rotate, thereby accelerating the airflow speed; and the corner structure will drive the fan blades 16 to deflect, so that the fan blades 16 will synchronously change from a parallel airflow direction to a non-parallel state, thereby reducing the resistance of the fan blades 16 in rotation, thus improving the service life of the device, and increasing the speed at which hot air flows from the air inlet 101 to the exhaust outlet 501, thereby improving the heat dissipation effect of the device.

[0062] As a further embodiment of this utility model, the heat dissipation structure also includes a motor 8 fixedly mounted on the mounting frame 5; a rotating shaft 9 is fixedly mounted on the output end of the motor 8; a fixing block 14 is fixedly mounted on the rotating shaft 9; a rotating rod 15 is rotatably mounted on the fixing block 14; and the rotating rod 15 is fixedly connected to the fan blade 16.

[0063] In this embodiment, after the motor 8 is powered on, it can drive the rotating shaft 9 to rotate, thereby driving the rotating rod 15 to rotate, which in turn drives the fan blade 16 to rotate synchronously, thereby accelerating the airflow speed and improving the heat dissipation effect.

[0064] When the electronic device is operating at low power or for a short time, the fan blades 16 are parallel to the direction of air convection (air flows from the air inlet 101 to the exhaust port 501) to minimize the resistance to airflow, thereby preventing the temperature on the heat-conducting plate 2 from rising due to the slow flow of high-temperature air, thus improving the heat conduction effect of the heat-conducting plate 2.

[0065] When electronic devices operate for extended periods or at high power, the heat dissipation structure drives the corner structure to rotate, thereby causing the fan blades 16 to deflect. This causes the fan blades 16 to synchronously change from a parallel airflow direction to a non-parallel state, thereby reducing the resistance of the fan blades 16 during rotation, thus improving the service life of the device. It also increases the speed at which hot air flows from the inlet 101 to the outlet 501, thereby improving the heat dissipation effect of the device.

[0066] As a further embodiment of this utility model, the corner structure includes a centrifugal disc 10 fixedly mounted on the rotating shaft 9; multiple sets of centrifugal blocks 11 are slidably fitted on the centrifugal disc 10; a telescopic sleeve 1101 is fixedly mounted on the centrifugal block 11; a sliding sleeve 12 is slidably mounted on the rotating shaft 9; a telescopic column 1201 that slidably fits with the telescopic sleeve 1101 is fixedly mounted on the sliding sleeve 12; a turntable 13 is provided on the rotating shaft 9; a first protruding column 1301 is fixedly mounted on the turntable 13; and a first inclined groove 90 is formed on the rotating shaft 9 that slidably fits with the first protruding column 1301. 1; A third inclined groove 1501 is provided on the rotating rod 15; A slip ring 18 is provided on the rotating rod 15; A second protruding post 1801 that slides and engages with the third inclined groove 1501 is fixedly installed on the slip ring 18; Multiple sets of second inclined grooves 1302 are provided on the turntable 13; A connecting rod 17 that is fixedly connected to the slip ring 18 is slidably engaged in the second inclined groove 1302; A bracket 20 that slides and engages with the connecting rod 17 is fixedly installed on the fixing block 14; A return spring 19 is wrapped around the rotating shaft 9; The two ends of the return spring 19 abut against the turntable 13 and the fixing block 14 respectively.

[0067] In this embodiment, when the rotating shaft 9 rotates, it will drive the centrifugal disc 10 to rotate, thereby driving the centrifugal block 11 to rotate. Under the action of centrifugal force, the centrifugal block 11 will gradually move away from the rotating shaft 9, thereby driving the sliding sleeve 12 to move towards the fixed block 14 through the telescopic sleeve 1101 and the telescopic column 1201. The telescopic column 1201 slides outward in the telescopic sleeve 1101.

[0068] When the sliding sleeve 12 moves, it will squeeze the turntable 13, thereby driving the turntable 13 to move synchronously and compressing the return spring 19.

[0069] In the initial state, the first protruding post 1301 is located at the end of the first inclined groove 901 away from the fixed block 14. When the rotating shaft 9 rotates, the compression of the inner wall of the first inclined groove 901 will squeeze the first protruding post 1301, thereby driving the turntable 13 to rotate synchronously.

[0070] During the movement of the turntable 13, the first protruding post 1301 slides in the first inclined groove 901, thereby causing the turntable 13 to rotate. During this process, the inner wall of the first inclined groove 901 always presses against the first protruding post 1301, so the turntable 13 always rotates at the same speed as the rotating shaft 9.

[0071] When the turntable 13 deflects, it will drive the second inclined groove 1302 to rotate synchronously. Under the pressure of the inner wall of the second inclined groove 1302, the connecting rod 17 will slide in the second inclined groove 1302, thereby gradually moving away from the rotating shaft 9, and the connecting rod 17 will slide on the bracket 20.

[0072] The connecting rod 17 will drive the slip ring 18 to move synchronously, thereby causing the second protruding post 1801 to slide in the third inclined groove 1501, thereby causing the rotating rod 15 to rotate, which in turn causes the fan blade 16 to deflect.

[0073] When the electronic device is operating at low power or for a short time, the fan blades 16 are parallel to the direction of air convection (air flows from the air inlet 101 to the exhaust port 501) to minimize the resistance to airflow, thereby preventing the temperature on the heat-conducting plate 2 from rising due to the slow flow of high-temperature air, thus improving the heat conduction effect of the heat-conducting plate 2.

[0074] When electronic devices operate for extended periods or at high power, the heat dissipation structure drives the corner structure to rotate, thereby causing the fan blades 16 to deflect. This causes the fan blades 16 to synchronously change from a parallel airflow direction to a non-parallel state, thereby reducing the resistance of the fan blades 16 during rotation, thus improving the service life of the device. It also increases the speed at which hot air flows from the inlet 101 to the outlet 501, thereby improving the heat dissipation effect of the device.

[0075] When the temperature of the electronic device decreases, the moving contact 4 and the stationary contact 6 will separate, causing the heat dissipation structure to stop operating. Under the elastic force of the return spring 19, the turntable 13 will reset, thereby causing the rotating rod 15 to deflect in the opposite direction, so as to drive the fan blade 16 to deflect and reset, and will also drive the sliding sleeve 12 to move away from the fixed block 14, thereby driving the centrifugal block 11 to reset. The telescopic column 1201 will slide inward in the telescopic sleeve 1101.

[0076] As a further embodiment of this utility model, the temperature sensing structure includes a temperature sensing tank 3 fixedly installed on the heat-conducting plate 2; a piston 301 fixedly connected to the moving contact 4 is slidably fitted inside the temperature sensing tank 3.

[0077] In this embodiment, the temperature-sensing tank 3 contains a medium with a high thermal conductivity. After the temperature-sensing tank 3 absorbs the temperature from the heat-conducting plate 2, the heat-conducting medium will expand due to the heat, thereby squeezing the piston 301, causing the piston 301 to drive the moving contact 4 towards the stationary contact 6.

[0078] When the stationary contact 6 comes into contact with the moving contact 4, the power supply will supply power to the motor 8, thereby driving the fan blade 16 to rotate, thus improving the heat dissipation effect of the device.

[0079] Because electronic devices generate less heat in low-power states, the heat generated causes the heat-conducting medium to expand due to heat, resulting in a short distance that the moving contact 4 can not make contact with the stationary contact 6. At this time, the heat dissipation structure does not operate, thereby reducing the overall power consumption of the heat dissipation device.

[0080] As a further embodiment of this utility model, the stationary contact 6 is slidably fitted with the mounting frame 5, and a buffer spring 7 is provided inside the mounting frame 5; the two ends of the buffer spring 7 respectively abut against the stationary contact 6 and the mounting frame 5.

[0081] In this embodiment, when the moving contact 4 comes into contact with the stationary contact 6, the heat dissipation structure is activated, thereby improving the heat dissipation effect of the device on electronic components.

[0082] After the heat dissipation structure is activated, if the temperature of the heat conduction plate 2 continues to rise, the heat conduction medium in the temperature sensing tank 3 will continue to expand, causing the moving contact 4 to press the stationary contact 6. At this time, the stationary contact 6 will move towards the fixed block 14 and compress the buffer spring 7 to prevent the heat conduction medium from leaking, thereby improving the service life of the device.

[0083] As a further embodiment of this utility model, multiple sets of heat-conducting fins 201 are fixedly installed on the heat-conducting plate 2; the heat-conducting fins 201 are equidistantly distributed along the circumference of the heat-conducting plate 2.

[0084] In this embodiment, the heat-conducting fins 201 increase the contact area between the heat-conducting plate 2 and the air, thereby improving the heat dissipation effect of the heat-conducting plate 2, so as to meet the heat dissipation capacity of electronic devices when operating in a low-power state and avoid heat accumulation damage to electronic devices.

[0085] As a further embodiment of this invention, there is an angle between the exhaust port 501 and the plane where the heat-conducting plate 2 is located.

[0086] In this embodiment, the exhaust port 501 can discharge hot air to the surrounding area of ​​the mounting frame 5. Specifically, since the exhaust port 501 and the heat conduction plate 2 have an angle, the area for discharging hot air can be increased, thus preventing a certain area of ​​the equipment from being continuously heated and affecting the normal operation of the equipment.

[0087] The above embodiments are exemplary and not restrictive. Therefore, without departing from the spirit or basic characteristics of this utility model, any technical solutions that can be implemented in other specific forms are included in this utility model.

Claims

1. A double-layer heat dissipation device for electronic devices, comprising a fixed frame (1); and a mounting frame (5) fixedly mounted on the fixed frame (1); Its features are, The fixed frame (1) has multiple sets of air inlets (101); the mounting frame (5) has multiple sets of exhaust outlets (501) that are connected to the air inlets (101); A heat-conducting plate (2) is fixedly installed on the fixed frame (1); The mounting frame (5) is provided with a heat dissipation structure; the heat dissipation structure includes multiple sets of fan blades (16); the multiple sets of fan blades (16) are rotatable; The mounting frame (5) is provided with a corner structure; the corner structure can drive the fan blades (16) to deflect when the heat dissipation structure is activated; The fixed frame (1) is provided with a moving contact (4); the mounting frame (5) is provided with a stationary contact (6); The heat-conducting plate (2) is provided with a temperature-sensing structure, which can drive the moving contact (4) to move closer to or further away from the stationary contact (6) to change the operating state of the heat dissipation structure.

2. The double-layer heat dissipation device for electronic devices according to claim 1, characterized in that, The heat dissipation structure also includes a motor (8) fixedly installed on the mounting frame (5); a rotating shaft (9) is fixedly installed on the output end of the motor (8); a fixing block (14) is fixedly installed on the rotating shaft (9); a rotating rod (15) is rotatably installed on the fixing block (14); and the rotating rod (15) is fixedly connected to the fan blade (16).

3. A double-layer heat dissipation device for electronic devices according to claim 2, characterized in that, The corner structure includes a centrifugal disc (10) fixedly mounted on the rotating shaft (9); multiple sets of centrifugal blocks (11) are slidably fitted on the centrifugal disc (10); a telescopic sleeve (1101) is fixedly mounted on the centrifugal block (11); a sliding sleeve (12) is slidably mounted on the rotating shaft (9); a telescopic column (1201) is fixedly mounted on the sliding sleeve (12) and slidably fitted with the telescopic sleeve (1101); a turntable (13) is provided on the rotating shaft (9); a first protruding column (1301) is fixedly mounted on the turntable (13); a first inclined groove (901) is opened on the rotating shaft (9) and slidably fitted with the first protruding column (1301); the rotating rod (1 5) A third inclined groove (1501) is provided on the rotating rod (15); a slip ring (18) is provided on the rotating rod (15); a second protruding column (1801) that slides and engages with the third inclined groove (1501) is fixedly installed on the slip ring (18); multiple sets of second inclined grooves (1302) are provided on the turntable (13); a connecting rod (17) that is fixedly connected to the slip ring (18) slides and engages in the second inclined groove (1302); a bracket (20) that slides and engages with the connecting rod (17) is fixedly installed on the fixing block (14); a return spring (19) is wrapped around the rotating shaft (9); the two ends of the return spring (19) abut against the turntable (13) and the fixing block (14) respectively.

4. A double-layer heat dissipation device for electronic devices according to claim 1, characterized in that, The temperature sensing structure includes a temperature sensing tank (3) fixedly installed on the heat-conducting plate (2); a piston (301) fixedly connected to the moving contact (4) is slidably fitted inside the temperature sensing tank (3).

5. A double-layer heat dissipation device for electronic devices according to claim 4, characterized in that, The stationary contact (6) is slidably engaged with the mounting frame (5), and a buffer spring (7) is provided inside the mounting frame (5); the two ends of the buffer spring (7) respectively abut against the stationary contact (6) and the mounting frame (5).

6. A double-layer heat dissipation device for electronic devices according to claim 1, characterized in that, Multiple sets of heat-conducting fins (201) are fixedly installed on the heat-conducting plate (2); the heat-conducting fins (201) are equidistantly distributed along the circumference of the heat-conducting plate (2).

7. A double-layer heat dissipation device for electronic devices according to claim 1, characterized in that, There is an angle between the exhaust port (501) and the plane where the heat-conducting plate (2) is located.

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