Display device

Abstract

The utility model provides a display device. The display device comprises a display module, the display module comprises a display panel, a chip on film and a circuit board, the circuit board is located on the non-display side of the display panel, one end of the chip on film is connected with the display panel in a binding mode, and the other end of the chip on film is connected with the circuit board in a binding mode; the heat conduction cover plate is at least partially located on the side, away from the display panel, of the circuit board, the surface of one side of the heat conduction cover plate is a part of the appearance face of the display device, and the other side of the heat conduction cover plate makes contact with the chip on film. The heat generated by the chip on film during working can be conducted to the heat conduction cover plate, and the heat conduction cover plate further dissipates the heat to the air outside the display equipment, so that the heat dissipation of the chip on film can be realized. According to the scheme in the embodiment of the invention, heat-conducting silica gel does not need to be used, so that the problem of relatively high cost caused by using the heat-conducting silica gel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device. Background Technology

[0002] With the development of OLED (Organic Light-Emitting Diode) display technology, OLED display modules have been widely used in various display devices. Among them, display devices with narrow bezel designs are particularly favored by users.

[0003] Some display devices in related technologies mainly rely on Chip On Flex (COF) technology to achieve narrow bezel solutions. In these display devices, the COF film is bonded to both the display panel and the circuit board. During the operation of the display device, the COF film generates a significant amount of heat, becoming a high-temperature area within the display device, thus requiring targeted cooling measures.

[0004] One cooling method in related technologies involves attaching thermally conductive silicone to a flip-chip film to dissipate heat into the air. However, the thermally conductive silicone itself is relatively expensive, and it also requires an anti-detachment structure, indirectly increasing costs. Therefore, it is necessary to consider other heat dissipation methods to reduce costs. Utility Model Content

[0005] This application provides a display device designed to dissipate heat and cool the flip-chip film, thereby improving the high cost associated with heat dissipation using thermally conductive silicone in related technologies.

[0006] The specific technical solution is as follows:

[0007] This application embodiment provides a display device, the display device comprising:

[0008] A display module, comprising a display panel, a crystal-film overlay film, and a circuit board, wherein the circuit board is located on the non-display side of the display panel, one end of the crystal-film overlay film is bonded to the display panel, and the other end of the crystal-film overlay film is bonded to the circuit board; and

[0009] A thermally conductive cover plate, at least partially located on the side of the circuit board away from the display panel, one side surface of the thermally conductive cover plate being part of the exterior surface of the display device, and the other side of the thermally conductive cover plate being in contact with the flip-chip film.

[0010] The display device in this embodiment includes a thermally conductive cover plate, which is at least partially located on the side of the circuit board facing away from the display panel. One surface of the thermally conductive cover plate is part of the external surface of the display device, and the other side of the thermally conductive cover plate is in contact with the flip-chip film. With this configuration, the heat generated by the flip-chip film during operation can be conducted to the thermally conductive cover plate, which further dissipates the heat into the air outside the display device, thereby achieving heat dissipation for the flip-chip film. Compared with the heat dissipation measures used in related technologies, the solution in this embodiment does not require the use of thermally conductive silicone, thus improving the high cost associated with using thermally conductive silicone and achieving cost reduction.

[0011] In some embodiments, the thermally conductive cover plate includes a cover plate body and a thermally conductive portion connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive portion is located on the side of the cover plate body close to the display panel. The thermally conductive portion is in contact with the flip-chip film.

[0012] The cover plate is primarily used to form part of the exterior surface of the display device. In addition, the cover plate also protects the flip-chip film, circuit board, etc. The heat-conducting part is located on the side of the cover plate close to the display panel, so that the heat-conducting part can contact the flip-chip film. In this way, the heat generated by the flip-chip film during operation can be conducted to the cover plate through the heat-conducting part, and then dissipated into the outside air through the cover plate.

[0013] In some embodiments, the display module further includes a driver chip connected to the flip-chip film;

[0014] The heat-conducting part is in contact with the portion of the flip-chip film where the driving chip is located, and the heat-conducting part and the driving chip are located on different sides of the flip-chip film.

[0015] The heat-conducting part makes contact with the portion of the flip-chip film where the driver chip is located. This allows the heat-conducting part to directly contact the part of the flip-chip film where heat generation is most significant, which helps improve heat dissipation efficiency. In addition, the heat-conducting part and the driver chip are located on different sides of the flip-chip film. This avoids direct contact between the heat-conducting part and the driver chip, preventing the driver chip from being squeezed or scratched. This helps ensure the operational stability of the driver chip.

[0016] In some embodiments, the flip-chip film includes a first extension, a bent portion, and a second extension connected in sequence. The end of the first extension away from the bent portion is bonded to the display panel. The second extension is located on the non-display side of the display panel. The end of the second extension away from the bent portion is bonded to the circuit board.

[0017] The driving chip is located in the second extension, and the heat-conducting part is located on the side of the second extension opposite to the driving chip.

[0018] By providing a bend between the first and second extensions, a portion of the flip-chip film extends to the non-display side of the display panel, facilitating bonding with the circuit board located on the non-display side. Furthermore, the driver chip is located in the second extension, placing it also on the non-display side of the display panel. The driver chip is relatively close to the cover plate body, allowing the heat-conducting portion to contact the portion of the flip-chip film containing the driver chip without requiring a large height along the first direction. It is understood that a smaller height of the heat-conducting portion along the first direction results in a shorter time for heat to reach the cover plate body, leading to higher heat dissipation efficiency. Therefore, this arrangement further enhances heat dissipation efficiency.

[0019] In some embodiments, the heat-conducting portion has a contact surface that contacts the second extension portion;

[0020] The orthographic projection of the driver chip on the second extension is within the orthographic projection of the contact surface on the second extension.

[0021] In other words, the orthographic projection area of ​​the contact surface on the second extension is larger than the orthographic projection area of ​​the driver chip on the second extension, and the orthographic projection of the contact surface on the second extension covers the orthographic projection of the driver chip on the second extension. This allows the heat-conducting part to receive as much heat as possible generated by the driver chip during operation, thereby further improving heat dissipation efficiency.

[0022] In some embodiments, the heat-conducting cover is a metal part, and the heat-conducting cover further includes a protective part connected to the cover body. The protective part extends along a first direction, which is parallel to the thickness direction of the display module. The protective part extends at least partially to one side of the bent portion along a second direction, which is perpendicular to the first direction.

[0023] The heat-conducting cover is made of metal, thus possessing good structural strength and rigidity. In addition, the heat-conducting cover also includes a protective part connected to the cover body, and the protective part extends at least partially to one side of the bending portion along the second direction. Therefore, the bending portion of the flip-chip film can be protected by the heat-conducting cover with good structural strength and rigidity, thereby better ensuring the working stability of the flip-chip film.

[0024] In some embodiments, the thermally conductive cover plate includes a cover plate body and a thermally conductive portion connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive portion is located on the side of the cover plate body close to the display panel. The thermally conductive portion is in contact with the flip-chip film.

[0025] The cover plate body is provided with a plurality of heat dissipation holes, at least some of which are opposite to the circuit board along a first direction, the first direction being parallel to the thickness direction of the display module.

[0026] The cover plate body is provided with multiple heat dissipation holes, at least some of which are opposite to the circuit board along the first direction. This arrangement allows the heat generated by the circuit board during operation to be discharged into the outside air through the heat dissipation holes, thereby helping to ensure the performance stability of the circuit board.

[0027] In some embodiments, some of the heat dissipation holes are opposite to the flip-chip film along the first direction; when the display device is in use, the thickness direction of the display module is arranged in the horizontal direction, the heat dissipation holes are located above the heat-conducting part, and the opening direction of the heat dissipation holes is upward.

[0028] A portion of the multiple heat dissipation holes faces the circuit board along a first direction, while another portion faces the flip-chip film along the same direction. This allows for a wider distribution of the heat dissipation holes, thereby increasing the flow area inside and outside the thermally conductive cover. This also allows some of the heat generated by the flip-chip film to be dissipated into the outside air through the heat dissipation holes.

[0029] When the display device is in use, the thickness direction of the display module is arranged horizontally, which makes the display panel generally vertical. Based on this, the heat dissipation holes are located above the heat-conducting parts. The heat generated by the flip-chip film is transferred to the surrounding air, and the resulting hot air rises and is exhausted into the outside air through the heat dissipation holes located above the heat-conducting parts. This gives the flip-chip film two heat dissipation paths: one is the heat-conducting cover plate in direct contact with the flip-chip film, and the other is the heat dissipation holes located above the heat-conducting parts. This allows for more efficient heat dissipation of the flip-chip film.

[0030] In some embodiments, the display module further includes a support structure, which is located between the circuit board and the display panel along a first direction, the first direction being parallel to the thickness direction of the display module, and the circuit board being connected to the support structure;

[0031] The thermally conductive cover plate includes a cover plate body and a thermally conductive part connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive part is located on the side of the cover plate body close to the display panel. The thermally conductive part is in contact with the flip-chip film.

[0032] The heat-conducting cover plate also includes a fixing part, which is connected to the cover plate body and the supporting structure.

[0033] The display module also includes a support structure, to which the circuit board is connected. This improves the positional stability of the circuit board within the display module, thereby enhancing the positional stability of the flip-chip film. Furthermore, the thermally conductive cover plate also includes a fixing part, which is connected to both the cover plate body and the support structure. This ensures the thermally conductive cover plate remains fixed relative to the display module, facilitating a more stable contact between the thermally conductive part and the flip-chip film.

[0034] In some embodiments, the support structure is connected to the non-display side of the display panel.

[0035] The support structure is connected to both the circuit board and the non-display side of the display panel. This helps maintain the stability of the circuit board relative to the display panel, and consequently, it helps maintain good positional stability of the flip-chip film, which is bonded to both the circuit board and the display panel. This, in turn, facilitates a more stable contact between the heat-conducting components and the flip-chip film. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0037] Figure 2 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0038] Figure 3 This is a schematic diagram of the structure of a display device in use according to an embodiment of this application;

[0039] Figure 4 This is a schematic diagram of the structure of a display device provided in another embodiment of this application.

[0040] Explanation of reference numerals in the attached figures:

[0041] 10. Display module;

[0042] 100. Display panel;

[0043] 200, flip-chip film; 210, first extension; 220, bending portion; 230, second extension;

[0044] 300. Circuit board;

[0045] 400. Driver chip;

[0046] 500. Supporting structure;

[0047] 20. Heat-conducting cover plate; 21. Cover plate body; 211. Heat dissipation hole; 22. Heat-conducting part; 221. Contact surface; 23. Protective part; 24. Fixing part. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0049] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0050] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0051] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0052] As mentioned in the background section, some display devices in related technologies primarily rely on Chip On Flex (COF) technology to achieve narrow bezel designs. In these devices, the COF film is bonded to both the display panel and the circuit board. During operation, the COF film generates significant heat, becoming a high-temperature area within the display device, thus requiring targeted cooling measures. One such cooling method involves attaching thermally conductive silicone to the COF film to dissipate heat into the air. However, the thermally conductive silicone itself is relatively expensive, and it also requires an anti-detachment structure, indirectly increasing costs. Therefore, it is necessary to consider other heat dissipation methods to reduce costs.

[0053] Based on the above, the applicant proposes a technical solution in the embodiments of this application. Specifically, a thermally conductive cover plate is provided in the display device. The thermally conductive cover plate is constructed as part of the outer surface of the display device and is in contact with the flip-chip film. With this configuration, the heat generated by the flip-chip film during operation can be conducted to the thermally conductive cover plate, which further dissipates the heat into the air outside the display device, thereby achieving heat dissipation for the flip-chip film. Since this technical solution does not require the use of thermally conductive silicone, costs can be reduced.

[0054] The above is the core idea of ​​this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0055] like Figure 1 As shown in the figure, this application embodiment proposes a display device, which includes a display module 10 and a thermally conductive cover plate 20. The display module 10 includes a display panel 100, a chip-on-film 200, and a circuit board 300. The circuit board 300 is located on the non-display side of the display panel 100. One end of the chip-on-film 200 is bonded to the display panel 100, and the other end of the chip-on-film 200 is bonded to the circuit board 300. The thermally conductive cover plate 20 is at least partially located on the side of the circuit board 300 facing away from the display panel 100. One side surface of the thermally conductive cover plate 20 is part of the exterior surface of the display device, and the other side of the thermally conductive cover plate 20 is in contact with the chip-on-film 200.

[0056] Among them, display devices can be products with display functions such as commercial display terminals, interactive whiteboards for conferences, monitors, and televisions.

[0057] Specifically, the display panel is an OLED display panel. Figure 2 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application. Figure 2As shown, the display panel 100 may include a substrate 110, a driving circuit layer 120 disposed on one side of the substrate 110, and a display layer group disposed on the side of the driving circuit layer 120 opposite to the substrate 110. The substrate 110 may be a rigid material such as glass or silicon wafer, or a flexible material such as metal foil or polymer plastic. The rigid or flexible substrate 110 can block oxygen and moisture, preventing water, oxygen, or impurities from diffusing into the interior of the display panel 100 through the substrate 110. The display layer group includes multiple light-emitting elements 130, which may specifically include a first light-emitting element 130a for emitting light of a first color, a second light-emitting element 130b for emitting light of a second color, and a third light-emitting element 130c for emitting light of a third color. The first, second, and third colors may, for example, correspond to red, green, and blue. Each light-emitting element 130 corresponds to a sub-pixel of the display panel 100. The light-emitting element 130 may include a first electrode 131, a light-emitting body 132 disposed on the side of the first electrode 131 facing away from the driving circuit layer 120, and a second electrode 133 disposed on the side of the light-emitting body 132 facing away from the first electrode 131. The first electrode 131 is the anode, and the second electrode 133 is the cathode. Since the side where the cathode is located is usually the light-emitting side of the light-emitting element 130, the cathode can be a transparent electrode or a semi-transparent electrode, and its material can be, for example, ITO (indium tin oxide), IZO (indium zinc oxide), ITO / Ag / ITO, etc. The anode can be a metal electrode, and its material can be, for example, Cr, Pt, Ru, Au, Ag, Mo, Al, W, Cu, etc. The light-emitting material of the light-emitting body 132 can be a low-molecular-weight or high-molecular-weight organic material.

[0058] The circuit board 300 can be a PCB (Printed Circuit Board) or a flexible printed circuit (FPC).

[0059] The bonding connection between the flip-chip film 200 and the display panel 100 means that the flip-chip film 200 and the display panel 100 are physically connected as well as electrically connected. For example, the flip-chip film 200 and the display panel 100 are each provided with pins, and the pins of the flip-chip film 200 are connected to the corresponding pins of the display panel 100 through conductive adhesive, so that the pins of the flip-chip film 200 and the corresponding pins of the display panel 100 are connected together and can transmit electrical signals between them.

[0060] Similarly, the bonding connection between the flip-chip film 200 and the circuit board 300 means that the flip-chip film 200 and the circuit board 300 achieve both physical and electrical connection.

[0061] Similarly, the term "binding connection" mentioned later can be understood as: the connection objects achieve both physical and electrical connection at the same time.

[0062] The thermally conductive cover plate 20 is a cover plate structure made of thermally conductive material (such as metal or graphene). One side surface of the thermally conductive cover plate 20 is part of the appearance surface of the display device. That is, the display device also has a device housing. The thermally conductive cover plate 20 and the device housing together constitute the appearance surface of the display device.

[0063] The display device in this embodiment includes a thermally conductive cover plate 20. The thermally conductive cover plate 20 is at least partially located on the side of the circuit board 300 facing away from the display panel 100. One surface of the thermally conductive cover plate 20 is part of the external surface of the display device, and the other side of the thermally conductive cover plate 20 is in contact with the flip-chip film 200. With this configuration, the heat generated by the flip-chip film 200 during operation can be conducted to the thermally conductive cover plate 20, which further dissipates the heat into the air outside the display device, thereby achieving heat dissipation for the flip-chip film 200. Compared with heat dissipation measures used in related technologies, the solution in this embodiment does not require the use of thermally conductive silicone, thus improving the high cost associated with using thermally conductive silicone and achieving cost reduction.

[0064] like Figure 1 As shown, in some embodiments, the thermally conductive cover plate 20 includes a cover plate body 21 and a thermally conductive part 22 connected to the cover plate body 21. The cover plate body 21 is located on the side of the circuit board 300 away from the display panel 100, and the thermally conductive part 22 is located on the side of the cover plate body 21 close to the display panel 100. The thermally conductive part 22 is in contact with the flip-chip film 200.

[0065] The cover plate body 21 is mainly used to form part of the outer surface of the display device. In addition, the cover plate body 21 also has a protective function for the flip-chip film 200, circuit board 300, etc. The heat-conducting part 22 is located on the side of the cover plate body 21 close to the display panel 100 so that the heat-conducting part 22 can contact the flip-chip film 200. In this way, the heat generated by the flip-chip film 200 during operation can be conducted to the cover plate body 21 through the heat-conducting part 22 and dissipated into the outside air through the cover plate body 21.

[0066] like Figure 1 As shown, in some embodiments, the display module 10 further includes a driver chip 400, which is connected to the flip-chip film 200. The heat-conducting part 22 is in contact with the portion of the flip-chip film 200 where the driver chip 400 is located, and the heat-conducting part 22 and the driver chip 400 are located on different sides of the flip-chip film 200.

[0067] The driver chip 400 is connected to the flip-chip film 200, which means that the driver chip 400 is fixed to the flip-chip film 200 and the driver chip 400 and the flip-chip film 200 are electrically connected so that electrical signals can be transmitted between them.

[0068] For a display module 10 using COF technology, the driver chip 400 used to drive the display panel 100 is typically located on the chip-on-film 200. Since OLED display modules are self-emissive, when OLED and LCD display modules achieve the same brightness, the driver chip 400 in the OLED display module consumes more power and generates more heat. This means that the portion of the chip-on-film 200 where the driver chip 400 is located generates the most significant amount of heat.

[0069] Based on the above, in this embodiment, the heat-conducting part 22 is in contact with the portion of the flip-chip film 200 where the driver chip 400 is located. This allows the heat-conducting part 22 to directly contact the portion of the flip-chip film 200 where the heat generation is most significant, which is beneficial for improving heat dissipation efficiency. Furthermore, the heat-conducting part 22 and the driver chip 400 are located on different sides of the flip-chip film 200. This avoids direct contact between the heat-conducting part 22 and the driver chip 400, preventing the driver chip 400 from being squeezed or scratched, thus ensuring the operational stability of the driver chip 400.

[0070] like Figure 1 As shown, in one embodiment, the flip-chip film 200 includes a first extension 210, a bending portion 220, and a second extension 230 connected in sequence. The end of the first extension 210 away from the bending portion 220 is bonded to the display panel 100. The second extension 230 is located on the non-display side of the display panel 100, and the end of the second extension 230 away from the bending portion 220 is bonded to the circuit board 300. A driver chip 400 is located in the second extension 230, and a heat-conducting portion 22 is located on the side of the second extension 230 opposite to the driver chip 400.

[0071] By providing a bending portion 220 between the first extension portion 210 and the second extension portion 230, a portion of the structure of the flip-chip film 200 extends to the non-display side of the display panel 100 so that it can be bonded and connected to the circuit board 300 located on the non-display side of the display panel 100.

[0072] Based on this, the driver chip 400 is located in the second extension 230, which places the driver chip 400 on the non-display side of the display panel 100. Furthermore, the driver chip 400 is relatively close to the cover plate body 21. This allows the heat-conducting part 22 to contact the portion of the flip-chip film 200 where the driver chip 400 is located without requiring a large height along the first direction. It is understood that the smaller the height of the heat-conducting part 22 along the first direction, the shorter the time it takes for heat to transfer to the cover plate body 21, resulting in higher heat dissipation efficiency. Therefore, the above arrangement further improves heat dissipation efficiency.

[0073] like Figure 1 As shown, in one embodiment, the heat-conducting part 22 has a contact surface 221 that contacts the second extension 230, and the orthographic projection of the driving chip 400 on the second extension 230 is within the orthographic projection of the contact surface 221 on the second extension 230.

[0074] In other words, the orthographic projection area of ​​the contact surface 221 on the second extension 230 is larger than the orthographic projection area of ​​the driver chip 400 on the second extension 230, and the orthographic projection of the contact surface 221 on the second extension 230 covers the orthographic projection of the driver chip 400 on the second extension 230. This allows the heat-conducting part 22 to receive as much heat as possible generated by the driver chip 400 during operation, thereby further improving heat dissipation efficiency.

[0075] In one embodiment, the heat-conducting cover 20 is a metal part, and the heat-conducting cover 20 also includes a protective part 23, which is connected to the cover body 21. The protective part 23 extends along a first direction, which is parallel to the thickness direction of the display module 10. The protective part 23 extends at least partially to one side of the bending part 220 along a second direction, which is perpendicular to the first direction.

[0076] In this embodiment, the heat-conducting cover plate 20 is a metal part, thus having good structural strength and rigidity. In addition, the heat-conducting cover plate 20 also includes a protective part 23 connected to the cover plate body 21, and the protective part 23 extends at least partially to one side of the bending part 220 along the second direction. Thus, the bending part 220 of the flip-chip film 200 can be protected by the heat-conducting cover plate 20 with good structural strength and rigidity, thereby better ensuring the working stability of the flip-chip film 200.

[0077] In some embodiments, the heat-conducting cover 20 is a sheet metal part, and the heat-conducting part 22 is formed by sheet metal stamping.

[0078] The heat-conducting cover plate 20 is made of sheet metal, and the heat-conducting part 22 is formed by sheet metal stamping. Compared with the method of separately manufacturing the heat-conducting part 22 and the cover plate body 21 and then connecting them, the use of connecting parts (such as screws, rivets, etc.) can be reduced, thereby saving costs. In addition, the assembly process of the heat-conducting part 22 and the cover plate body 21 can be reduced, which is conducive to improving production efficiency.

[0079] It is understandable that the heat-conducting part 22 is formed by sheet metal stamping, which results in a pit on the outer surface of the heat-conducting cover plate 20 corresponding to the heat-conducting part 22 when viewed from the outside. Since the heat-conducting cover plate 20 is located on the non-display side of the display panel 100, that is, on the back side of the display device, i.e., on the side that is not easily observed by the user, the presence of the pit does not affect the aesthetics of the display device.

[0080] like Figure 1 As shown, in some embodiments, the heat-conducting cover plate 20 includes a cover plate body 21 and a heat-conducting part 22 connected to the cover plate body 21. The cover plate body 21 is located on the side of the circuit board 300 away from the display panel 100, and the heat-conducting part 22 is located on the side of the cover plate body 21 close to the display panel 100. The heat-conducting part 22 is in contact with the flip-chip film 200. The cover plate body 21 is provided with a plurality of heat dissipation holes 211, at least some of which are opposite to the circuit board 300 along a first direction, which is parallel to the thickness direction of the display module 10.

[0081] The circuit board 300 also generates heat when it is working. Therefore, in this embodiment, the cover plate body 21 is provided with a plurality of heat dissipation holes 211, and at least some of the heat dissipation holes 211 are opposite to the circuit board 300 along the first direction. This arrangement allows the heat generated by the circuit board 300 when it is working to be discharged to the outside air through the heat dissipation holes 211, which helps to ensure the performance stability of the circuit board 300.

[0082] It is understandable that the heat generated by the circuit board 300 is relatively small compared to the flip-chip 200 with the driver chip 400. Therefore, by setting heat dissipation holes 211 in the cover body 21, the heat of the circuit board 300 can be dissipated naturally through the heat dissipation holes 211, which can meet the heat dissipation requirements of the circuit board 300.

[0083] like Figure 1 , Figure 3 As shown, in one embodiment, some of the heat dissipation holes 211 are opposite to the flip-chip film 200 along a first direction. When the display device is in use, the thickness direction of the display module 10 is arranged horizontally, and the heat dissipation holes 211 are located above the heat-conducting part 22, with the opening direction of the heat dissipation holes 211 facing upwards.

[0084] A portion of the multiple heat dissipation holes 211 are aligned with the circuit board 300 along the first direction, while another portion of the multiple heat dissipation holes 211 are aligned with the flip-chip film 200 along the first direction. This allows the heat dissipation holes 211 to be distributed more widely, thereby increasing the flow area inside and outside the thermally conductive cover plate 20. This also allows some of the heat generated by the flip-chip film 200 to be discharged to the outside air through the heat dissipation holes 211.

[0085] When the display device is in use, the thickness direction of the display module 10 is arranged horizontally, which makes the display panel 100 generally vertical. For example, taking the display device as a conference interactive flat panel, the conference interactive flat panel can be wall-mounted. In this case, the thickness direction of the display module 10 in the conference interactive flat panel is arranged horizontally, while the display panel 100 is vertically set.

[0086] Based on this, the heat dissipation holes 211 are located above the heat-conducting part 22. After the heat generated by the flip-chip film 200 is transferred to the surrounding air, the resulting hot air rises and is discharged into the outside air through the heat dissipation holes 211 located above the heat-conducting part 22. Thus, the flip-chip film 200 has two heat dissipation paths simultaneously. The heat-conducting cover plate 20, which is in direct contact with the flip-chip film 200, constitutes one heat dissipation path, while the heat dissipation holes 211 located above the heat-conducting part 22 constitute the other. This allows for more efficient heat dissipation of the flip-chip film 200.

[0087] like Figure 1 As shown, in some embodiments, the display module 10 further includes a support structure 500. Along a first direction, the support structure 500 is located between the circuit board 300 and the display panel 100. The first direction is parallel to the thickness direction of the display module 10. The circuit board 300 is connected to the support structure 500. The thermally conductive cover plate 20 includes a cover plate body 21 and a thermally conductive portion 22 connected to the cover plate body 21. The cover plate body 21 is located on the side of the circuit board 300 facing away from the display panel 100, and the thermally conductive portion 22 is located on the side of the cover plate body 21 close to the display panel 100. The thermally conductive portion 22 is in contact with the flip-chip film 200. The thermally conductive cover plate 20 also includes a fixing portion 24, which is connected to the cover plate body 21 and the support structure 500.

[0088] The display module 10 also includes a support structure 500, to which the circuit board 300 is connected. This improves the positional stability of the circuit board 300 within the display module 10, thereby enhancing the positional stability of the flip-chip film 200. Furthermore, the thermally conductive cover 20 includes a fixing part 24, which is connected to both the cover body 21 and the support structure 500. This ensures that the thermally conductive cover 20 remains fixed relative to the display module 10, facilitating a more stable contact between the thermally conductive part 22 and the flip-chip film 200.

[0089] like Figure 4 As shown, in one embodiment, the support structure 500 is connected to the non-display side of the display panel 100.

[0090] For example, a first adhesive layer and a second adhesive layer may be provided on both sides of the support structure 500, the support structure 500 is connected to the circuit board 300 through the first adhesive layer, and the support structure 500 is connected to the display panel 100 through the second adhesive layer.

[0091] The support structure 500 is connected to the circuit board 300 and the non-display side of the display panel 100, which helps to keep the circuit board 300 in a stable position relative to the display panel 100, and also helps to keep the flip-chip film 200, which is bonded to both the circuit board 300 and the display panel 100, in a good position. This, in turn, helps to maintain a more stable contact between the heat-conducting part 22 and the flip-chip film 200.

[0092] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display device, characterized in that, include: The display module includes a display panel, a crystal-film overlay film, and a circuit board. The circuit board is located on the non-display side of the display panel. One end of the crystal-film overlay film is bonded to the display panel, and the other end of the crystal-film overlay film is bonded to the circuit board. as well as A thermally conductive cover plate, at least partially located on the side of the circuit board away from the display panel, one side surface of the thermally conductive cover plate being part of the exterior surface of the display device, and the other side of the thermally conductive cover plate being in contact with the flip-chip film.

2. The display device according to claim 1, characterized in that, The thermally conductive cover plate includes a cover plate body and a thermally conductive part connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive part is located on the side of the cover plate body close to the display panel. The thermally conductive part is in contact with the crystal film.

3. The display device according to claim 2, characterized in that, The display module further includes a driver chip, which is connected to the flip-chip film; The heat-conducting part is in contact with the portion of the flip-chip film where the driving chip is located, and the heat-conducting part and the driving chip are located on different sides of the flip-chip film.

4. The display device according to claim 3, characterized in that, The flip-chip film includes a first extension, a bent portion, and a second extension connected in sequence. The end of the first extension away from the bent portion is bonded to the display panel. The second extension is located on the non-display side of the display panel. The end of the second extension away from the bent portion is bonded to the circuit board. The driving chip is located in the second extension, and the heat-conducting part is located on the side of the second extension opposite to the driving chip.

5. The display device according to claim 4, characterized in that, The heat-conducting part has a contact surface that contacts the second extension part; The orthographic projection of the driver chip on the second extension is within the orthographic projection of the contact surface on the second extension.

6. The display device according to claim 4, characterized in that, The heat-conducting cover is a metal part, and the heat-conducting cover also includes a protective part, which is connected to the cover body. The protective part extends along a first direction, which is parallel to the thickness direction of the display module. The protective part extends at least partially to one side of the bent part along a second direction, which is perpendicular to the first direction.

7. The display device according to claim 1, characterized in that, The thermally conductive cover plate includes a cover plate body and a thermally conductive part connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive part is located on the side of the cover plate body close to the display panel. The thermally conductive part is in contact with the flip-chip film. The cover plate body is provided with a plurality of heat dissipation holes, at least some of which are opposite to the circuit board along a first direction, the first direction being parallel to the thickness direction of the display module.

8. The display device according to claim 7, characterized in that, Some of the heat dissipation holes are opposite to the ferrofilm along the first direction; When the display device is in use, the thickness direction of the display module is arranged horizontally, the heat dissipation hole is located above the heat conduction part, and the opening direction of the heat dissipation hole is set upward.

9. The display device according to claim 1, characterized in that, The display module further includes a support structure, which is located between the circuit board and the display panel along a first direction, the first direction being parallel to the thickness direction of the display module, and the circuit board being connected to the support structure; The thermally conductive cover plate includes a cover plate body and a thermally conductive part connected to the cover plate body. The cover plate body is located on the side of the circuit board away from the display panel, and the thermally conductive part is located on the side of the cover plate body close to the display panel. The thermally conductive part is in contact with the flip-chip film. The heat-conducting cover plate also includes a fixing part, which is connected to the cover plate body and the supporting structure.

10. The display device according to claim 9, characterized in that, The support structure is connected to the non-display side of the display panel.

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