Surface layer structure of electroplating jig

Abstract

The utility model discloses a surface structure of an electroplating jig, the electroplating jig comprises a base metal and an electrolytic deplating protective layer, and the electrolytic deplating protective layer covers the outer surface of the base metal. According to the electroplating jig disclosed by the utility model, the electrolytic deplating protection layer is covered on the outer surface of the matrix metal, so that the matrix metal can be protected from being corroded when the electroplating jig is used for deplating, and the service life of the electroplating jig is prolonged.

Description

[TECHNICAL FIELD]

[0001] The utility model relates to electroplating fixture especially relates to a surface layer structure of electroplating fixture. [BACKGROUND]

[0002] Electroplating fixture is used for fixing and supporting workpieces to be electroplated, ensuring that they can be uniformly plated during electroplating. Electroplating fixtures mainly include clamps, hangers, baskets, and frames.

[0003] In the circuit board and hardware industry, the material of electroplating fixture is usually 316 stainless steel. For example, the invention with the application number CN202310602948.3 discloses an electroplating hanger and a method for improving the uniformity of DPC ceramic substrate copper plating, which relates to the field of ceramic substrate electroplating processing, aiming to solve the problem of uneven ceramic substrate copper plating. The technical solution is as follows: an electroplating hanger is formed by cutting a frame made of stainless steel material as a whole, the frame is fixedly connected with a conductive rod and a hook, and a plurality of ceramic substrate loading areas are arranged in the frame. Each ceramic substrate loading area is provided with at least two conductive steps for providing support and conductive effect to the ceramic substrate. Limiting devices are also provided on the frame corresponding to each conductive step to fix the ceramic substrate. The frame of the invention is not glued as a whole, and the stainless steel frame provides a conductive path for the workpiece while also being plated with copper. The copper layer on the surface of the hanger becomes thicker and thicker, which not only affects the quality of the product but also may cause the hanger to fail.

[0004] There are two methods to remove the copper layer on the surface of the hanger: chemical stripping and electrolytic stripping.

[0005] Chemical stripping is a method that dissolves the copper layer on the surface of the workpiece through chemical reaction. The advantage of this method is that the operation is relatively simple and does not require complex equipment. Commonly used chemical stripping solutions include nitric acid and sulfuric acid solutions. The disadvantage is that a large amount of chemical waste liquid is generated, which needs to be properly treated to avoid environmental pollution.

[0006] Electrolytic stripping uses electrochemical principles to remove the copper layer on the workpiece. Typically, the workpiece is used as the anode, and an appropriate electrolyte (such as a solution containing copper sulfate) is used. Through the action of electric current, the copper layer is reduced into the electrolyte. The advantage of electrolytic stripping is that it can accurately control the degree of stripping, and the waste liquid can be further treated to recover copper resources, which has less impact on the environment.

[0007] Electrolytic stripping is more corrosive to stainless steel hangers than chemical stripping. However, regardless of which stripping method is used, some corrosion of the stainless steel hanger will occur, thereby reducing the service life of the electroplating hanger. [SUMMARY]

[0008] The technical problem to be solved by this utility model is to provide a surface structure of an electroplating fixture that will not corrode the base metal of the fixture during deplating.

[0009] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is a surface structure of an electroplating fixture, wherein the electroplating fixture includes a base metal and an electrolytic stripping protective layer, and the electrolytic stripping protective layer covers the outer surface of the base metal.

[0010] The surface structure of the electroplating fixture described above includes a copper plating layer as a conductive layer, which covers the outer surface of the base metal, and an electrolytic stripping protective layer covering the outer surface of the copper plating layer.

[0011] The surface structure of the electroplating fixture described above, wherein the electrolytic stripping protective layer is a vacuum-deposited titanium layer or a vacuum-sputtered titanium layer.

[0012] The surface structure of the electroplating fixture described above includes an intermediate bonding layer, which is located between the vacuum-deposited titanium layer or the vacuum-sputtered titanium layer and the copper plating layer.

[0013] The surface structure of the electroplating fixture described above, wherein the intermediate bonding layer is a nickel plating layer or a chromium plating layer.

[0014] The surface structure of the electroplating fixture described above includes a titanium oxide layer on the outer surface of the vacuum-deposited titanium layer or the vacuum-sputtered titanium layer.

[0015] The surface structure of the electroplating fixture described above has an electrolytic stripping protective layer with a thickness of 1-5 μm and a copper plating layer with a thickness of 10-500 μm.

[0016] The electroplating fixture of this invention has an electrolytic stripping protective layer covering the outer surface of the base metal. When the electroplating fixture is stripped, it can protect the base metal from corrosion and extend the service life of the electroplating fixture. [Image Description]

[0017] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0018] Figure 1 This is a cross-sectional view of the surface structure of the electroplating fixture of Embodiment 1 of this utility model.

[0019] Figure 2 This is a cross-sectional view of the surface structure of the electroplating fixture of Embodiment 2 of this utility model. [Detailed Implementation]

[0020] The surface structure of the electroplating fixture in Embodiment 1 of this utility model is as follows: Figure 1As shown, the electroplating fixture comprises a base metal 1, a copper plating layer 2 as a conductive layer, and an electrolytic stripping protection layer 3 covering the outer surface of the base metal 1.

[0021] The copper plating layer 2 is plated on the outer surface of the base metal 1, and the copper plating layer 2 protection layer covers the outer surface of the conductive layer. The electrolytic stripping protection layer 3 is a vacuum titanium evaporation layer or a vacuum titanium sputtering layer.

[0022] The thickness of the electrolytic stripping protection layer 3 is 1-5 μm, and the thickness of the copper plating layer 2 is 10-50 μm.

[0023] The conductivity of pure copper is about 48 times that of 316 stainless steel. The size of the conductivity directly affects the energy consumption of electroplating, and the use of a copper plating layer as a surface conductive layer can greatly reduce energy consumption.

[0024] Anodic dissolution potential refers to the potential at which the surface of a material begins to dissolve when it is used as an anode in a specific electrolyte. The more positive the anodic dissolution potential (i.e., the larger the value), the less likely the material is to dissolve in the electrolyte, and the better its corrosion resistance.

[0025] The anodic dissolution potential of copper is about +0.3 to +0.4 V, close to the cathode deposition potential, making it suitable as a soluble anode. Moreover, copper does not form a significant passivation film in copper sulfate solution. During the stripping process, the copper on the surface of the electroplating fixture acts as an anode and undergoes an oxidation reaction, releasing copper ions into the electrolyte and gradually consuming them.

[0026] The anodic dissolution potential of titanium is +2.0 to +3.0 V. Within this range, the titanium anode does not dissolve significantly, behaving as an inert anode. The passivation film on titanium is dense and highly stable in strong acidic electrolytes.

[0027] Specifically, in neutral or acidic electrolytes, the anodic dissolution potential of titanium is high, making it less likely to dissolve anodically. In alkaline electrolytes, a dense oxide film (TiO2) forms on the surface of titanium, further enhancing its corrosion resistance.

[0028] As an electrolytic protection layer for electroplating fixtures, titanium can maintain its structural integrity during electrolysis. The high anodic dissolution potential of titanium means that it is less likely to dissolve in the electrolyte, ensuring long-term use of the fixture. Titanium easily forms a passivation film in the electrolyte, which further prevents its dissolution and improves its corrosion resistance.

[0029] The electroplating fixture of the embodiment 1 of the utility model has the following advantages:

[0030] 1) The service life of the electroplating fixture can be extended: since titanium is not easily eroded by the electrolyte, the service life of the electroplating fixture can be significantly extended.

[0031] 2) Improved electrolysis efficiency: The stability and corrosion resistance of titanium ensure efficient electrolysis process with reduced unnecessary side reactions.

[0032] 3) Reduced maintenance costs: The protective layer of titanium reduces the frequency of maintenance and replacement of fixtures, reducing overall maintenance costs.

[0033] 4) The structure of the electroplating fixture can adopt a composite structure with a steel skeleton, a copper plating surface, and a titanium plating surface. Since the base metal no longer requires the corrosion resistance of 316 stainless steel, the selection range of the base metal is wider, and the cost is more advantageous.

[0034] The surface layer structure of the electroplating fixture according to the embodiment 2 is shown in Figure 2 The embodiment 2 further includes an intermediate bonding layer 4 between the vacuum titanium evaporation layer or vacuum titanium sputtering layer and the copper plating layer 2. The intermediate bonding layer 4 is a nickel plating layer or a chromium plating layer, which can increase the adhesion of the titanium evaporation layer or vacuum titanium sputtering layer and the copper plating layer 2. The outer surface of the vacuum titanium evaporation layer or vacuum titanium sputtering layer can also include a titanium oxide layer 5, which can further improve the hardness and corrosion resistance of the surface of the electroplating fixture.

Claims

1. A surface layer structure of an electroplating jig comprising a base metal, characterized by, The electrolytic stripping protective layer covers the outer surface of the base metal.

2. The surface layer structure of an electroplating fixture according to claim 1, wherein The electrolytic stripping protective layer covers the outer surface of the base metal.

3. The surface layer structure of an electroplating fixture according to claim 1 or 2, wherein The electrolytic stripping protective layer is a vacuum evaporated titanium layer or a vacuum sputtered titanium layer.

4. The surface layer structure of an electroplating fixture according to claim 3, wherein The intermediate bonding layer is located between the vacuum evaporated titanium layer or the vacuum sputtered titanium layer and the copper plating layer.

5. The surface layer structure of an electroplating fixture according to claim 4, wherein The intermediate bonding layer is a nickel plating layer or a chromium plating layer.

6. The surface layer structure of an electroplating fixture according to claim 3, wherein The outer surface of the vacuum evaporated titanium layer or the vacuum sputtered titanium layer comprises a titanium oxide layer.

7. The surface layer structure of an electroplating fixture according to claim 2, wherein The thickness of the electrolytic stripping protective layer is 1-5 μm, and the thickness of the copper plating layer is 10-500 μm.

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