Head-mounted display device

Abstract

The utility model provides a head-mounted display device. The head-mounted display device comprises a glasses frame and glasses legs extending outwards from the two ends of the glasses frame. The SIP module is arranged in the glasses legs, the SIP module comprises a substrate and at least two electronic devices, and the at least two electronic devices are arranged on the surfaces of the two opposite sides of the substrate respectively; and the protection structure is arranged on the surface of one side of the substrate and is used for protecting part of the electronic devices. The head-mounted display equipment is arranged in the glasses leg through the SIP module, so that the space utilization rate in the glasses leg is improved; and the protection structure is arranged on the surface of one side of the substrate and is used for protecting part of electronic devices, so that the reliability and durability of the SIP module are ensured.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of wearable devices, and in particular, the present application relates to a head-mounted display device. BACKGROUND

[0002] With the increasing diversification of functions of smart glasses, the experience of obtaining virtual and real pictures through smart glasses is increasingly valued.

[0003] In the prior art, it is difficult for smart glasses to achieve balanced development in terms of light weight and high integration, such as insufficient utilization of the narrow space in the temple. The diversification and high integration of the functions of smart glasses require space and integrated modules to support, which limits the expansion and use of the functions of smart glasses. UTILITARIAN CONTENT

[0004] An object of an embodiment of the present application is to provide a new technical solution for a head-mounted display device.

[0005] According to a first aspect of the present application, a head-mounted display device is provided, which comprises a frame and a temple extending outward from both ends of the frame; the head-mounted display device further comprises:

[0006] An SIP module is arranged in the temple, and the SIP module comprises a substrate and at least two electronic devices, and the at least two electronic devices are arranged on opposite side surfaces of the substrate, respectively.

[0007] A protective structure is arranged on one side surface of the substrate and is used to protect part of the electronic devices.

[0008] Optionally, the protective structure comprises an encapsulation layer, which is arranged on one side surface of the substrate and is used to encapsulate part of the electronic devices.

[0009] Optionally, the protective structure comprises a shielding layer, which is located between the inner wall of the temple and the encapsulation layer.

[0010] Optionally, the encapsulation layer is arranged in parallel with the temple away from one side surface of the substrate, and the shielding layer is arranged on the encapsulation layer.

[0011] Optionally, the shielding layer is plated on the inner wall of the temple, and the encapsulation layer is connected with the shielding layer away from one side of the substrate.

[0012] Optionally, the substrate has a first surface, and the first surface faces the inner shell of the temple.

[0013] The electronic devices comprise exposed devices, and the exposed devices are arranged on the first surface.

[0014] Optionally, the substrate has a second surface, the second surface faces the outer shell of the temple;

[0015] The electronic device includes a packaged device, the packaged device is disposed on the second surface, and the protective structure is disposed on the second surface and used for protecting the packaged device.

[0016] Optionally, the protective structure is attached to an inner wall of the outer shell.

[0017] Optionally, in a direction from the outer shell of the temple to the inner shell of the temple, the SIP module has a size less than or equal to 3.5 mm.

[0018] Optionally, in a direction from the outer shell of the temple to the inner shell of the temple, a ratio of the size of the SIP module to an internal size of the temple is 0.5-0.8.

[0019] One technical effect of the head-mounted display device provided by the present application is that:

[0020] The head-mounted display device provided by the present application includes a frame and a temple extending outward from both ends of the frame, a SIP module, the SIP module is disposed in the temple, the SIP module includes a substrate and at least two electronic devices, the at least two electronic devices are respectively disposed on opposite side surfaces of the substrate, and a protective structure, the protective structure is disposed on one side surface of the substrate and used for protecting part of the electronic devices.

[0021] Other features and advantages of the present application will become apparent from the following detailed description of exemplary embodiments thereof, taken in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings incorporated in and forming a part of the specification illustrate embodiments of the present application and, together with the description, serve to explain the principles of the application.

[0023] Figure 1 A head-mounted display device provided by one embodiment of the present application Figure One (the area of the frame is schematically shown in the dashed box area);

[0024] Figure 2 A head-mounted display device provided by one embodiment of the present application Figure Two (the area of the frame is schematically shown in the dashed box area);

[0025] Figure 3A SIP module schematic diagram of a head-mounted display device provided by an embodiment of the present application;

[0026] Figure 4 A structure schematic diagram of a head-mounted display device provided by an embodiment of the present application.

[0027] Wherein: 1, mirror frame; 11, display module; 2, mirror leg; 3, SIP module; 31, substrate; 32, electronic device; 321, bare device; 322, packaged device; 33, protection structure; 331, packaging layer; 332, shielding layer; 4, optical machine; 5, camera module; 6, battery. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. Note that the relative arrangement, numerical expressions, and numerical values of components and steps set forth in these embodiments are not limiting to the scope of the present application unless otherwise specifically stated.

[0029] Embodiments of the present application will be described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below by reference to the accompanying drawings are exemplary and are only used to explain the present application and cannot be understood as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0030] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise stated. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0032] In the description of the application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0033] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0034] The head-mounted display device provided by the embodiment of the application can be AR glasses, VR glasses or MR glasses and the like, which can be worn. The head-mounted display device is arranged in the temple through the SIP module, thereby improving the space utilization rate in the temple. The protective structure is arranged on one side surface of the substrate and is used for protecting part of the electronic devices, so as to prevent the encapsulated electronic devices from being damaged by the external environment, thereby ensuring the reliability and durability of the SIP module.

[0035] With reference to Figure 1 and Figure 4 , the embodiment of the application provides a head-mounted display device, which comprises:

[0036] a frame 1 and a temple 2 extending outward from both ends of the frame 1; and

[0037] a SIP module 3, the SIP module 3 being arranged in the temple 2, the SIP module 3 comprising a substrate 31 and at least two electronic devices 32, the at least two electronic devices 32 being arranged on opposite side surfaces of the substrate 31 respectively;

[0038] a protective structure 33, the protective structure 33 being arranged on one side surface of the substrate 31 and being used for protecting part of the electronic devices 32.

[0039] In this embodiment, the frame 1 can serve as a display part of the head-mounted display device, so that the wearer can obtain a virtual or real display picture through the frame 1. The two temples 2 are connected to the two ends of the frame 1 respectively, so as to facilitate wearing the head-mounted display device on the head of the wearer.

[0040] In one embodiment, the two temples 2 are fixedly connected to the two ends of the frame 1 respectively, and the temple 2 has elasticity, so as to match the wearing requirements of different wearers.

[0041] In another embodiment, the two temple arms 2 are respectively pivotally connected to the two ends of the frame 1, and by setting a rotation damping between the temple arm 2 and the frame 1, on the one hand, the head-mounted display device can be matched to the wearing requirements of different wearers, and on the other hand, the head-mounted display device can be conveniently stored.

[0042] In this embodiment, referring to Figure 1 , the SIP module 3 integrates at least two electronic devices 32 on the opposite side surfaces of the substrate 31 by using the SIP (System in Package) process, and while maintaining the miniaturization and low power consumption of the module, the SIP module 3 can realize diversified functions of multi-device integration.

[0043] In this embodiment, the SIP module 3 is applied to the temple arm 2 of the head-mounted display device, which not only meets the wearing requirements of the wearer for the head-mounted display device to be small, light and high in performance, but also improves the integration efficiency and structural compactness of the head-mounted display device.

[0044] Referring to Figure 1 , the SIP module 3 is arranged in the temple arm 2, that is, the SIP module 3 can make full use of the narrow space inside the temple arm 2, thereby improving the space utilization inside the temple arm 2 and ensuring the lightweight and high integration of the head-mounted display device.

[0045] Referring to Figure 1 and Figure 2 , the protective structure 33 is arranged on one side surface of the substrate 31 and is used for protecting part of the electronic devices 32, for example, the electronic devices 32 can include chips such as main chips, storage chips, power management chips and power amplification chips, which need to be stably arranged to exert the stability of signal transmission and control on the chips.

[0046] The protective structure 33 acts on the packaging and protection of the electronic devices 32, and the protective structure 33 is closely combined with the substrate 31 and the packaged electronic devices 32 to form a stable structure, which can prevent the packaged electronic devices 32 from being damaged by the external environment and ensure the reliability and durability of the SIP module 3.

[0047] In this embodiment, the SIP module 3 can integrate the wireless communication functions such as Bluetooth and WiFi, and sensors such as acceleration sensors, gyroscopes and optical sensors through the electronic devices 32, so as to realize the functions such as interconnection and signal sensing of the head-mounted display device. When the above functions are realized, the electronic devices 32 will generate a large amount of heat; by arranging the SIP module 3 in the temple arm 2, the electronic devices 32 can be easily cooled to the side wall of the temple arm 2, and then cooled to the outside through the side wall of the temple arm 2, which is helpful for the effective dissipation of heat inside the temple arm 2 and avoids the damage of the substrate 31 and the electronic devices 32 due to the high temperature of the SIP module 3.

[0048] In some embodiments, referring to Figure 2 and Figure 3 , the protection structure 33 comprises an encapsulation layer 331, which is arranged on one side surface of the substrate 31 and used for encapsulating the partial electronic device 32.

[0049] In the above embodiment, the encapsulated electronic device can be a packaged device, and the encapsulation layer 331 directly covers the packaged device to provide physical protection for the packaged device and ensure the stability of the arrangement of the packaged device.

[0050] In one embodiment, the encapsulation layer 331 can be made of polyimide, polyamide or other materials that facilitate heat conduction. The encapsulation layer 331 covering the packaged device can provide a heat conduction path for the packaged device to facilitate heat dissipation of the packaged device and improve the heat dissipation efficiency of the packaged device.

[0051] In some embodiments, referring to Figure 2 and Figure 3 , the protection structure comprises a shielding layer 332, which is located between the inner wall of the temple and the encapsulation layer.

[0052] In the above embodiment, the shielding layer 332 is located between the encapsulation layer 331 and the temple 2, which can effectively block the electromagnetic wave interference from the outside to interfere with the encapsulated device 322 and ensure the normal operation of the encapsulated device 322.

[0053] In the above embodiment, the shielding layer 332 located between the encapsulation layer 331 and the temple 2 can be that the shielding layer 332 is arranged outside the encapsulation layer 331, or the shielding layer 332 is arranged on the inner wall of the temple 2 close to the encapsulation layer 331, or the shielding layer 332 is located between the encapsulation layer 331 and the temple 2 without contacting the encapsulation layer 331 and the temple 2, so as to realize the electromagnetic shielding of the encapsulated device 322.

[0054] In some embodiments, referring to Figure 2 and Figure 3 , the encapsulation layer 331 is arranged parallel to the temple 2 away from the one side surface of the substrate 31, and the shielding layer 332 is arranged on the encapsulation layer 331.

[0055] In the above embodiment, the thickness of the encapsulation layer 331 arranged on the substrate 31 can be kept consistent, so that the one side of the encapsulation layer 331 away from the substrate 31 is parallel to the substrate 31 and can be parallel to the temple 2, facilitating the arrangement of the SIP module 3 in the temple 2 and effectively utilizing the internal space of the temple 2.

[0056] Referring to Figure 2The shielding layer 332 is arranged on the packaging layer 331 and spaced from the inner wall of the temple 2, forming a continuous electromagnetic shielding layer, which can more effectively block the interference of external electromagnetic waves, and at the same time reduce the risk of damage to the protection structure 33 caused by vibration or impact of the temple 2. The installation of the SIP module 3 can consider connecting the SIP module 3 to the connecting end of the temple 2, which can also ensure the stable setting of the SIP module 3.

[0057] In some embodiments, the shielding layer 332 is plated on the inner wall of the temple 2, and the packaging layer 331 is connected to the shielding layer 332 away from the substrate 31.

[0058] In the above embodiment, the surface of the protection structure 33 away from the substrate 31 forms a surface parallel to the outer shell of the temple 2. When the SIP module 3 is installed and fixed, the shielding layer 332 can be arranged on the inner wall of the temple 2 by electroplating or deposition, and then the packaging layer 331 away from the substrate 31 is connected to the shielding layer 332, so as to realize the connection of the SIP module 3 to the inner wall of the temple 2.

[0059] In some embodiments, referring to Figure 2 and Figure 3 The substrate 31 has a first surface, and the first surface faces the inner shell of the temple 2.

[0060] The electronic device 32 includes a bare device 321 arranged on the first surface.

[0061] In the above embodiment, the bare device 321 can be a device on the substrate 31 that is not encapsulated, that is, a device directly exposed on the substrate 31. It is worth noting that some devices can be self-encapsulated and attached to the surface of the substrate 31 to form a separate device similar to a bare device. The separate device also belongs to the bare device defined in the embodiments of the present application.

[0062] In the above embodiment, the inner shell of the temple 2 is the shell of the temple 2 close to the wearer when the head-mounted display device is in a wearing state, and the first surface of the substrate 31 faces the inner shell of the temple 2. On the one hand, it can more effectively utilize the space inside the temple 2, and on the other hand, it can facilitate the heat dissipation of the bare device 321 arranged on the first surface; the heat dissipated by the bare device 321 can be transmitted to the tail of the temple 2 in the extension direction of the temple 2 through the inner shell of the temple 2, and the tail of the temple 2 is the part of the temple 2 away from the frame 1, that is, the heat can be transmitted to the end of the temple 2 away from the frame 1, facilitating the external heat dissipation of the temple 2 and ensuring the use stability of the bare device 321.

[0063] In some embodiments, referring to Figure 2 and Figure 3The substrate 31 has a second surface facing the outer shell of the temple 2.

[0064] The electronic device 32 comprises a packaged device 322 disposed on the second surface, and the protection structure 33 is disposed on the second surface and used for protecting the packaged device 322.

[0065] In the above embodiment, the packaged device 322 can be a device encapsulated on the substrate 31, that is, a device covered and protected by the packaging structure to ensure the stability of the structural design and circuit arrangement of the packaged device 322.

[0066] In the above embodiment, the outer shell of the temple 2 is the shell away from the wearer when the head-mounted display device is in the wearing state, the second surface of the substrate 31 faces the outer shell of the temple 2, which can more effectively utilize the space inside the temple 2, and on the other hand, can facilitate heat dissipation of the packaged device 322 disposed on the second surface to the outer shell of the temple 2, and then diffuses outward through the outer shell of the temple 2, avoiding the heat generated by the packaged device 322 from being transmitted to the wearing space of the head-mounted display device, that is, the space enclosed by the frame 1 and the two temples 2.

[0067] In one embodiment, the protection structure 33 is attached to the inner wall of the outer shell.

[0068] Referring to Figure 2 , the side surface of the protection structure 33 away from the substrate 31 is parallel to the outer shell of the temple 2, so that the SIP module 3 is more easily installed and fixed to the outer shell of the temple 2, such as directly attaching the side of the protection structure 33 away from the substrate 31 to the outer shell of the temple 2, which can realize the fixation of the SIP module 3 in the temple 2 and simplify the installation process of the SIP module 3.

[0069] In some embodiments, referring to Figure 2 and Figure 3 , the size of the SIP module 3 is less than or equal to 3.5 mm in the direction from the outer shell of the temple 2 to the inner shell of the temple 2.

[0070] In the above embodiment, the outer shell of the temple 2 can be Figure 2 the shell on the left side of the temple 2, and the inner shell of the temple 2 can be Figure 2 the shell on the right side of the temple 2, and the direction from the outer shell of the temple 2 to the inner shell of the temple 2 is the direction perpendicular to the temple 2, and the size of the SIP module 3 is the sum of the thickness of the substrate of the SIP module 3, the height of the electronic device on the substrate, and the height of the protection structure. Controlling the size of the SIP module 3 within the range of 3.5 mm can realize the high integration of the SIP module 3 in the limited space of the temple 2, avoid excessive occupation of the internal space of the temple 2, and on the other hand, ensure the thinness of the temple 2.

[0071] In some embodiments, the ratio of the size of the SIP module 3 to the internal size of the temple 2 is 0.5-0.8 in the direction from the outer shell of the temple 2 to the inner shell of the temple 2, that is, in the transverse direction of the temple 2. Figure 2

[0072] In the above embodiments, in order to facilitate the installation of the SIP module 3 in the temple 2 and facilitate the heat dissipation of the SIP module 3, the ratio of the size of the SIP module 3 to the internal size of the temple 2 can be controlled within the range of 0.8, such as setting the ratio of the size of the SIP module 3 to the internal size of the temple 2 to 0.6, 0.65, 0.7 or 0.75; and the SIP module 3 can make full use of the limited space inside the temple 2, maintain the overall structural strength of the temple 2, and the ratio of the size of the SIP module 3 to the internal size of the temple 2 can be set to be greater than or equal to 0.5, such as setting the ratio of the size of the SIP module 3 to the internal size of the temple 2 to 0.53 or 0.58.

[0073] In some embodiments, referring to Figure 1 and Figure 2 The head-mounted display device further comprises an optical machine 4, which is arranged at the end of the frame 1, and the frame 1 is provided with a display module 11, and the display module 11 and the optical machine 4 are both electrically connected with the SIP module 3.

[0074] In the above embodiments, the end of the frame 1 can be the position close to the temple 2 at both ends of the frame 1, and the optical machine 4 arranged at the end of the frame 1 can be arranged at the corner of the frame 1, so that after the optical machine 4 converts the image information into optical signals, the light is coupled into the waveguide lens in the frame 1 through the lens system, avoiding occupying the display area in the frame 1.

[0075] The display module 11 and the optical machine 4 are both electrically connected with the SIP module 3, and the SIP module 3 can efficiently process the signals from the display module 11 and the optical machine 4, ensuring that the signals are quickly and accurately transmitted between the modules, thereby improving the overall performance and response speed of the head-mounted display device.

[0076] In one embodiment, the head-mounted display device is an AR glasses, and the frame of the AR glasses is provided with an MCU (Micro Controller Unit) chip, which can receive signals from input modules such as sensors and camera modules, and process these signals according to a preset program logic, to improve the interactive experience and functionality of the AR glasses.

[0077] In some embodiments, referring to Figure 1 and Figure 2 ​The head-mounted display device further comprises a camera module 5 arranged at the end of the frame 1 and electrically connected with the SIP module 3.

[0078] In the above embodiment, the head-mounted display device can be audio or photo glasses, which comprises a processor chip to process image and video data, ensuring the clarity and smoothness of the image. Two camera modules 5 are arranged at the two ends of the frame 1, so that the camera modules 5 can capture the actual environmental images or videos around the device, providing users with a more real and immersive augmented reality experience.

[0079] In the above embodiment, through the electrical connection between the camera module 5 and the SIP module 3, the camera module 5 can transmit data to the SIP module 3 in real time for processing and analysis, thereby realizing the rapid response and feedback of environmental information.

[0080] In another embodiment, the camera module 5 is arranged in the middle of the frame 1, so that a group of camera modules 5 can capture the actual environmental images or videos around the device.

[0081] In some embodiments, referring to Figure 1 and Figure 2 The head-mounted display device further comprises a battery 6 arranged in the temple 2 and electrically connected with the SIP module 3.

[0082] In the above embodiment, the SIP module 3 is close to the front end of the temple 2, and the battery 6 is located on the side of the SIP module 3 away from the front end of the temple 2.

[0083] In the above embodiment, the front end of the temple 2 is the region where the temple 2 connects with the frame 1. Placing the battery 6 in the temple 2, such as placing the battery 6 in the rear end region of the temple 2 instead of the most front end, helps to optimize the weight distribution of the entire head-mounted display device, reduces the weight of the front end of the temple 2, and improves the comfort of the wearer when wearing.

[0084] In the above embodiment, the electrical connection between the battery 6 and the SIP module 3 enables the SIP module 3 to obtain stable and continuous power supply through the battery 6.

[0085] Although some specific embodiments of the present application have been described in detail by examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present application. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A head-mounted display device, comprising: The head-mounted display device comprises a frame and temple legs extending outward from both ends of the frame; The head-mounted display device further comprises: An SIP module is arranged in the temple leg, and the SIP module comprises a substrate and at least two electronic devices, and the at least two electronic devices are arranged on opposite side surfaces of the substrate, respectively. A protective structure is arranged on one side surface of the substrate and used for protecting part of the electronic devices.

2. The head-mounted display device of claim 1, wherein, The protective structure comprises an encapsulation layer arranged on one side surface of the substrate and used for encapsulating part of the electronic devices.

3. The head-mounted display device of claim 2, wherein, The protective structure comprises a shielding layer between the inner wall of the temple leg and the encapsulation layer.

4. The head-mounted display device of claim 3, wherein, The encapsulation layer is arranged parallel to the temple leg away from one side surface of the substrate, and the shielding layer is arranged on the encapsulation layer.

5. The head-mounted display device of claim 3, wherein, The shielding layer is plated on the inner wall of the temple leg, and the encapsulation layer is connected to the shielding layer away from one side of the substrate.

6. The head-mounted display device of claim 1, wherein, The substrate has a first surface facing the inner shell of the temple leg. The electronic devices comprise bare devices arranged on the first surface.

7. The head-mounted display device of claim 1, wherein, The substrate has a second surface facing the outer shell of the temple leg. The electronic devices comprise encapsulated devices arranged on the second surface, and the protective structure is arranged on the second surface and used for protecting the encapsulated devices.

8. The head-mounted display device of claim 7, wherein, The protective structure is attached to the inner wall of the outer shell.

9. The head-mounted display device of claim 1, wherein, In the direction from the outer shell of the temple leg to the inner shell of the temple leg, the size of the SIP module is less than or equal to 3.5 mm.

10. The head-mounted display device of claim 1, wherein, In the direction from the outer shell of the temple leg to the inner shell of the temple leg, the ratio of the size of the SIP module to the internal size of the temple leg is 0.5-0.8.

Images