Display module and display device

Abstract

The utility model discloses a display module and a display device.The display module comprises a back plate, a heat dissipation buffer layer and a display panel, the heat dissipation buffer layer is arranged on one side of the back plate and comprises a buffer layer, and at least one of the face, close to the back plate, of the buffer layer and the face, away from the back plate, of the buffer layer is provided with first exhaust grooves; the first exhaust groove penetrates through the side surface of the buffer layer; at least part of the display panel is arranged on the side, away from the heat dissipation buffer layer, of the back plate. The reliability of the display module can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] Organic Light Emitting Diode (OLED) display modules consist of a stacked display panel, a backplate, and a heat dissipation buffer layer. The heat dissipation buffer layer is a multi-layered material composed of adhesive layers, semi-perforated foam, copper foil, and other materials that provides cushioning, shielding, and thermal conductivity. It protects the display panel from damage to a certain extent and is a crucial structure for maintaining the stability of the display panel under various environmental conditions.

[0003] However, when the display module needs to be disassembled for analysis after assembly at the OEM factory due to reasons such as misalignment, it is subjected to external forces during disassembly. Furthermore, the gas inside the semi-open foam cannot be quickly discharged during the heating process. The semi-open foam will generate cohesion, and the stress concentration will cause the inner film layer of the heat dissipation buffer layer to peel, resulting in a decrease in the reliability of the display module.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this application is to provide a display module and a display device to improve the reliability of the display module.

[0006] To solve the above problems, the technical solution of this application is as follows:

[0007] In a first aspect, this application proposes a display module, comprising:

[0008] First back panel;

[0009] A heat dissipation buffer layer is disposed on one side of the first back plate. The heat dissipation buffer layer includes a buffer layer, and at least one of the side of the buffer layer near the first back plate and the side of the buffer layer away from the first back plate is provided with a first vent groove, the first vent groove penetrating the side surface of the buffer layer; and

[0010] The display panel, at least a portion of which is disposed on the side of the first back panel away from the heat dissipation buffer layer.

[0011] In one embodiment of this application, the buffer layer is a foam layer;

[0012] The heat dissipation buffer layer also includes:

[0013] A first adhesive layer is disposed between the first back plate and the buffer layer; and

[0014] A heat dissipation layer is disposed on the side of the buffer layer away from the first adhesive layer;

[0015] The first venting groove is located on the side of the buffer layer near the first adhesive layer.

[0016] In one embodiment of this application, in a plan view of the display module, a plurality of the first exhaust slots are spaced apart.

[0017] In one embodiment of this application, the heat dissipation buffer layer further includes a plurality of fillers;

[0018] In this embodiment, at least one of the first exhaust channels is provided with a plurality of the filling elements at intervals.

[0019] In one embodiment of this application, a second venting groove is further provided on the side of the buffer layer near the first adhesive layer, and the second venting groove is connected to the first venting groove;

[0020] In a plan view of the display module, the first exhaust groove extends along a first direction, the second exhaust groove extends along a second direction, and the first direction intersects the second direction.

[0021] In one embodiment of this application, the buffer layer is further provided with a third vent groove on the side near the heat dissipation layer, and the third vent groove is disposed through the side of the buffer layer.

[0022] In one embodiment of this application, in a plan view of the display module, a plurality of the third exhaust slots are spaced apart.

[0023] In one embodiment of this application, in a plan view of the display module, the extension direction of the first exhaust groove and the extension direction of the third exhaust groove are the same.

[0024] In one embodiment of this application, the display panel includes a display part, a bending part, and a bonding part connected in sequence. The display part is disposed on the side of the first back plate away from the heat dissipation buffer layer, the bonding part is disposed on the side of the heat dissipation buffer layer away from the first back plate, and the bending part is located between the display part and the bonding part.

[0025] Secondly, this application proposes a display device including a display module, the display module including a first back plate, a heat dissipation buffer layer and a display panel, the heat dissipation buffer layer being disposed on one side of the first back plate, the heat dissipation buffer layer including a buffer layer, at least one of the side of the buffer layer near the first back plate and the side of the buffer layer away from the first back plate having a first vent groove, the first vent groove penetrating the side of the buffer layer; at least a portion of the display panel being disposed on the side of the first back plate away from the heat dissipation buffer layer.

[0026] In this application, by providing a first venting groove in the buffer layer, which extends through the side of the buffer layer, a structure is formed that allows for rapid exhaust of gas inside the buffer layer during heating. When the display module needs to be disassembled for analysis due to misalignment or other reasons, the gas inside the buffer layer can be quickly exhausted through the first venting groove during heating, reducing the cohesion of the buffer layer and thus reducing the phenomenon of peeling of the internal film layer of the heat dissipation buffer layer caused by stress concentration, thereby improving the reliability of the display module. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the display module of this application;

[0028] Figure 2 This is a schematic diagram of the heat dissipation buffer layer of the first embodiment of this application;

[0029] Figure 3 yes Figure 2 A cross-sectional view of the heat dissipation buffer layer at section line A-A' shown;

[0030] Figure 4 yes Figure 2 A cross-sectional view of the heat dissipation buffer layer at section line B-B' shown;

[0031] Figure 5 yes Figure 2 An exploded view of the heat dissipation buffer layer is shown.

[0032] Figure 6 This is a schematic diagram of the buffer layer and filler of the second embodiment of this application;

[0033] Figure 7 This is a schematic diagram of a buffer layer according to a third embodiment of this application;

[0034] Figure 8 This is another schematic diagram of the buffer layer in the third embodiment of this application;

[0035] Figure 9 This is a cross-sectional view of the heat dissipation buffer layer according to the fourth embodiment of this application;

[0036] Figure 10 This is a schematic diagram of the side of the buffer layer near the heat dissipation layer in the fourth embodiment of this application. Detailed Implementation

[0037] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0038] This application discloses a display device, which can be a tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display module 100.

[0039] Please see Figure 1 This application proposes a display module 100, which includes a first backplate 10, a heat dissipation buffer layer 20, and a display panel 30. The display panel 30 may be an organic light-emitting diode (OLED) display panel 30.

[0040] The heat dissipation buffer layer 20 is disposed on one side of the first back plate 10. The heat dissipation buffer layer 20 includes a buffer layer 21. At least one of the side of the buffer layer 21 near the first back plate 10 and the side of the buffer layer 21 away from the first back plate 10 is provided with a first vent groove 21a. The first vent groove 21a penetrates the side of the buffer layer 21. At least a portion of the display panel 30 is disposed on the side of the first back plate 10 away from the heat dissipation buffer layer 20.

[0041] In this embodiment, by providing a first venting groove 21a through the side of the buffer layer 21, a structure is formed that allows for rapid exhaust of gas inside the buffer layer 21 during heating. When the display module 100 needs to be disassembled for analysis due to misalignment or other reasons, the gas inside the buffer layer 21 can be quickly exhausted through the first venting groove 21a during heating, reducing the cohesion of the buffer layer 21. This reduces the phenomenon of peeling of the internal film layer of the heat dissipation buffer layer 20 due to stress concentration, thereby improving the reliability of the display module 100.

[0042] Optionally, the display panel 30 includes a display portion 31, a bending portion 32, and a bonding portion 33 connected in sequence. The display portion 31 is located on the side of the first back plate 10 away from the heat dissipation buffer layer 20. The bonding portion 33 is located on the side of the heat dissipation buffer layer 20 away from the first back plate 10, and the bending portion 32 is located between the display portion 31 and the bonding portion 33.

[0043] Optionally, the display module 100 also includes a second backplate 40. The second backplate 40 is located between the heat dissipation buffer layer 20 and the bonding portion 33.

[0044] In this embodiment, by bending the binding part 33 of the display panel 30 to the back, the bezel size of the display module 100 can be reduced, achieving a narrow bezel design.

[0045] It is important to understand that the heat dissipation buffer layer 20 in the display module 100 serves multiple functions, including buffering protection, light shielding, heat dissipation, support and fixation, and prevention of moisture intrusion. The buffer layer 21, in particular, provides buffering protection, sealing against dust, sound and heat insulation, filling, and support. The structure of the buffer layer 21 can be a semi-open-cell foam layer. Semi-open-cell foam is a material intermediate between open-cell and closed-cell foam, with its pore structure being partially interconnected and partially closed. This unique structure gives semi-open-cell foam the characteristics of both open-cell and closed-cell foam. Specifically, the pores of semi-open-cell foam are interconnected to a certain extent, but not completely open, and some pores are also closed. Therefore, when the buffer layer 21 of this application has a semi-open-cell foam layer structure, a first vent hole is required to achieve rapid venting and prevent the gas inside the semi-open-cell foam layer from being unable to escape quickly, which could lead to the peeling of the heat dissipation buffer layer 20.

[0046] It should be understood that foam is typically made of polymers, such as rubber, plastic, or silicone. In this application, the material of the cushioning layer 21 can be one of polyurethane foam, silicone foam, aluminum foil foam, CR foam, EPE pearl cotton, and Poron foam. The polyurethane foam can be one of KTS foam, Inoue foam, Sekisui foam, and Rogers foam.

[0047] First embodiment of this application:

[0048] Please see Figure 2 In the display module 100 of the first embodiment of this application,

[0049] Optional, please refer to Figure 3 The buffer layer 21 is a foam layer, and the heat dissipation buffer layer 20 also includes a first adhesive layer 22 and a heat dissipation layer 23. The first adhesive layer 22 is disposed between the first back plate 10 and the buffer layer 21. The heat dissipation layer 23 is disposed on the side of the buffer layer 21 away from the first adhesive layer 22. Please refer to [link / reference]. Figure 4 The first venting groove 21a is located on the side of the buffer layer 21 near the first adhesive layer 22.

[0050] In this embodiment, the first adhesive layer 22 is made of a mesh adhesive material. During use, the mesh adhesive layer can effectively adhere to various surfaces, ensuring a tight bond between adjacent film layers and reducing cracks caused by temperature changes or structural stress. It has excellent flexibility, remains stable in different environments, and is not prone to cracking. In addition, the mesh adhesive also has good weather resistance, allowing for long-term use in outdoor environments without significant impact.

[0051] In this embodiment, the heat dissipation layer 23 is made of thermally conductive materials such as metal and graphite. The heat dissipation layer 23 serves to conduct heat, effectively dissipating the heat generated by the display section 31 of the display panel 30 during operation and preventing performance degradation due to overheating. Simultaneously, its excellent thermal conductivity helps maintain the temperature stability of the display module 100, extending its service life.

[0052] Optionally, when the material of the heat dissipation layer 23 is a metal, the metal is at least one of silver, aluminum, copper, iron, tungsten, and platinum.

[0053] Optionally, the heat dissipation layer 23 can be connected to the buffer layer 21 via an adhesive layer, and the heat dissipation layer 23 can be connected to the second back plate 40 via an adhesive layer.

[0054] In this embodiment, the first venting groove 21a is provided on the side of the buffer layer 21 close to the first adhesive layer 22. The first venting groove 21a can quickly discharge the gas inside the buffer layer 21, reduce the phenomenon of peeling of the inner film layer of the heat dissipation buffer layer 20 due to stress concentration, and improve the reliability of the display module 100.

[0055] It is important to understand that during the assembly of the display module 100, the heat dissipation buffer layer 20 needs to be attached to the first backplate 10. Before the heat dissipation buffer layer 20 is attached to the first backplate 10, a release film 24 is provided on the side of the first adhesive layer 22 away from the buffer layer 21, and a protective layer 25 is provided on the side of the heat dissipation layer 23 away from the buffer layer 21. During the assembly of the display module 100, the release film 24 is first removed from the side of the first adhesive layer 22 away from the buffer layer 21, exposing the first adhesive layer 22, and then the first adhesive layer 22 is attached to the first backplate 10. Then, the protective layer 25 is removed from the side of the heat dissipation layer 23 away from the buffer layer 21, exposing the heat dissipation layer 23, and then the heat dissipation layer 23 is attached to the second backplate 40.

[0056] Optional, please refer to Figure 5 In the plan view of the display module 100, a plurality of first exhaust slots 21a are spaced apart.

[0057] In this embodiment, multiple first exhaust grooves 21a are spaced apart, which can improve the exhaust efficiency inside the buffer layer 21 on the one hand, and make the exhaust inside the buffer layer 21 more uniform on the other hand, reducing the phenomenon of local bulging caused by low local exhaust efficiency, thereby improving the reliability of the display module 100.

[0058] In the second embodiment of this application:

[0059] To avoid redundancy, the second embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0060] The second embodiment of this application differs from the first embodiment of this application in that:

[0061] Please see Figure 6 Optionally, the heat dissipation buffer layer 20 also includes a plurality of fillers 50. Among them, at least one first vent groove 21a is provided with a plurality of fillers 50 at intervals.

[0062] In this embodiment, the filler 50 is disposed in the first venting groove 21a to support the first adhesive layer 22, thereby reducing the partial collapse of the first adhesive layer 22 corresponding to the first venting groove 21a and improving the stability of the heat dissipation buffer layer 20 structure.

[0063] Optionally, the filler 50 may be made of plastic. For example, the filler 50 may be made of polyethylene terephthalate (PET), polyethylene 2,5-furandicarboxylate (PEF), polylactic acid (PLA), or polyethylene naphthalate (PEN).

[0064] In order to reduce the blockage of the first exhaust groove 21a by the filler 50 and improve the exhaust performance of the heat dissipation buffer layer 20, two improvements were also made in this embodiment.

[0065] First, please refer to Figure 6 In the plan view of the display module 100, the width of the filler 50 in the second direction is smaller than the width of the first exhaust groove 21a in the second direction, so that the gas inside the first exhaust groove 21a where the filler 50 is provided can still be discharged from the gap between the first exhaust groove 21a and the filler 50, thereby reducing the phenomenon of peeling of the inner film layer of the heat dissipation buffer layer 20 due to stress concentration and improving the reliability of the display module 100.

[0066] Secondly, please refer to Figure 6 In the two adjacent first exhaust grooves 21a in the second direction, only one first exhaust groove 21a is provided with a filler 50, while the other exhaust groove is not provided with a filler 50. This ensures the exhaust speed at all points inside the heat dissipation buffer layer 20, reduces local peeling caused by different exhaust speeds inside the heat dissipation buffer layer 20, and improves the reliability of the display module 100.

[0067] In this application, the first method for manufacturing the heat dissipation buffer layer 20 includes the following steps:

[0068] Step S1: A number of first exhaust grooves 21a are formed on one surface of the heat dissipation layer 23 by using a round knife or a flat knife die, and the waste material after cutting is discharged.

[0069] Step S2: Die-cut the PET pad into a buffer piece with a shape and size smaller than the first venting groove 21a, and attach multiple buffer pieces into one first venting groove 21a.

[0070] Step S3: Attach the heat dissipation layer 23 and the first adhesive layer 22 to the two surfaces of the buffer layer 21 respectively to form a buffer heat dissipation material.

[0071] Step S4: Use a die to cut the composite buffer heat dissipation material into heat dissipation buffer layer 20.

[0072] In the third embodiment of this application:

[0073] To avoid redundancy, the third embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0074] The third embodiment of this application differs from the first embodiment in that:

[0075] Please see Figure 7 Optionally, the buffer layer 21 may also have a second venting groove 21b on the side near the first adhesive layer 22. The second venting groove 21b is connected to the first venting groove 21a.

[0076] In the plan view of the display module 100, the first exhaust groove 21a extends along a first direction. The second exhaust groove 21b extends along a second direction. The first direction and the second direction intersect.

[0077] In this embodiment, the arrangement of the second exhaust groove 21b communicating with the first exhaust groove 21a can increase the exhaust contact area inside the heat dissipation buffer layer 20, thereby allowing the gas inside the heat dissipation buffer layer 20 to be discharged more quickly, reducing the phenomenon of peeling of the film layer inside the heat dissipation buffer layer 20 due to stress concentration, and improving the reliability of the display module 100.

[0078] Please see Figure 8 Optionally, the first direction is perpendicular to the second direction, and the second exhaust groove 21b penetrates the side of the buffer layer 21.

[0079] In this embodiment, the second exhaust groove 21b penetrates the buffer layer 21, which can increase the exhaust path of the heat dissipation buffer layer 20, thereby further improving the exhaust speed of the heat dissipation buffer layer 20, reducing the phenomenon of peeling of the internal film layer of the heat dissipation buffer layer 20 due to stress concentration, and improving the reliability of the display module 100.

[0080] In the fourth embodiment of this application:

[0081] To avoid redundancy, the fourth embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0082] The fourth embodiment of this application differs from the first embodiment in that:

[0083] Please see Figure 9Optionally, the buffer layer 21 may also have a third venting groove 21c on the side near the heat dissipation layer 23. The third venting groove 21c extends through the side of the buffer layer 21.

[0084] Based on the first embodiment, this embodiment further provides a third venting groove 21c on the side of the buffer layer 21 near the heat dissipation layer 23. The third venting groove 21c penetrates the side of the buffer layer 21, forming a structure that can quickly expel the gas inside the buffer layer 21 during heating. When the display module 100 needs to be disassembled for analysis due to reasons such as misalignment, the gas inside the buffer layer 21 can be quickly expelled through both the first venting groove 21a and the third venting groove 21c during heating. This further reduces the cohesion of the buffer layer 21, thereby further reducing the phenomenon of peeling of the internal film layer of the heat dissipation buffer layer 20 due to stress concentration, and further improving the reliability of the display module 100.

[0085] Please see Figure 10 Optionally, in a plan view of the display module 100, a plurality of the third exhaust slots 21c are spaced apart.

[0086] In this embodiment, multiple third exhaust grooves 21c are spaced apart, which can improve the exhaust efficiency inside the buffer layer 21 on the one hand, and make the exhaust inside the buffer layer 21 more uniform on the other hand, reducing the phenomenon of local bulging caused by low local exhaust efficiency, thereby improving the reliability of the display module 100.

[0087] Optionally, in a plan view of the display module 100, the extending direction of the first exhaust groove 21a is the same as the extending direction of the third exhaust groove 21c.

[0088] Since the first venting groove 21a is formed by cutting with a round or flat die, in order to reduce mold opening costs, the extension direction of the third venting groove 21c is set to be the same as the extension direction of the first venting groove 21a. That is, when the first venting groove 21a extends along the first direction, the third venting groove 21c extends along the first direction. After forming the first venting groove 21a by cutting the side of the heat dissipation layer 23 near the first adhesive layer 22 with a round or flat die, the buffer layer 21 is flipped over, and the side of the buffer layer 21 near the heat dissipation layer 23 is then cut with a round or flat die to form the third venting groove 21c. This embodiment can reduce the production cost of the display module 100 and improve production efficiency.

[0089] Optionally, in the thickness direction of the display module 100, at least one first exhaust groove 21a overlaps with at least one third exhaust groove 21c.

[0090] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display module, characterized by The display module comprises: a first back plate; a heat dissipation buffer layer arranged on one side of the first back plate, the heat dissipation buffer layer comprising a buffer layer, at least one of a side of the buffer layer close to the first back plate and a side of the buffer layer away from the first back plate being provided with a first exhaust groove, the first exhaust groove penetrating through the side of the buffer layer; and a display panel, at least a part of the display panel being arranged on a side of the first back plate away from the heat dissipation buffer layer.

2. The display module of claim 1, wherein, The buffer layer is a foam layer. The heat dissipation buffer layer further comprises: a first adhesive layer arranged between the first back plate and the buffer layer; and a heat dissipation layer arranged on a side of the buffer layer away from the first adhesive layer; wherein the first exhaust groove is arranged on the side of the buffer layer close to the first adhesive layer.

3. The display module of claim 2, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. In a plan view of the display module, a plurality of the first exhaust grooves are arranged at intervals.

4. The display module of claim 3, wherein, The heat dissipation buffer layer further comprises a plurality of filling pieces. At least one of the first exhaust grooves is provided with a plurality of the filling pieces arranged at intervals therein.

5. The display module of claim 2, wherein the display module is configured to be mounted on a display stand. The side of the buffer layer close to the first adhesive layer is further provided with a second exhaust groove, the second exhaust groove being in communication with the first exhaust groove. In a plan view of the display module, the first exhaust groove extends in a first direction, and the second exhaust groove extends in a second direction, the first direction intersecting the second direction.

6. The display module of claim 2, wherein the display module is configured to be mounted on a display stand. The side of the buffer layer close to the heat dissipation layer is further provided with a third exhaust groove, the third exhaust groove penetrating through the side of the buffer layer.

7. The display module of claim 6, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. In a plan view of the display module, a plurality of the third exhaust grooves are arranged at intervals.

8. The display module of claim 7, wherein the display module is configured to be mounted to a display module mounting surface of a display module mounting structure. In a plan view of the display module, the first exhaust groove and the third exhaust groove extend in the same direction.

9. The display module of any one of claims 1-8, wherein, The display panel comprises a display portion, a bending portion and a binding portion connected in sequence, the display portion being arranged on a side of the first back plate away from the heat dissipation buffer layer, the binding portion being arranged on a side of the heat dissipation buffer layer away from the first back plate, and the bending portion being located between the display portion and the binding portion.

10. A display device comprising: The display module comprises any one of the display modules according to claims 1-9.

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