Semiconductor thermal management air-conditioning automobile seat

Abstract

The utility model relates to the technical field of automobile seats, and discloses a semiconductor thermal management air-conditioning automobile seat which comprises a cushion and a cold and heat management mechanism assembled outside the cushion. According to the air-conditioned automobile seat for semiconductor thermal management, through the arrangement of a cold and heat management mechanism, an L-shaped pipe and a connecting pipe, when the seat cushion needs to be heated, a semiconductor chilling plate body is opened, a hydraulic rod and an air blower are opened, the hydraulic rod pushes a sliding block, then a movable block drives a Y-shaped pipe to horizontally move, one end of the Y-shaped pipe faces an air outlet hole in the bottom of one shielding cover, and the other end of the Y-shaped pipe faces an air outlet hole in the bottom of the other shielding cover; the other end of the Y-shaped pipe is blocked, hot air can only be sucked out from the semiconductor refrigeration side, finally, the hot air is input into the connecting pipe through the first guide pipe at the output end of the air blower and exhausted towards the cushion through the through holes in the surface of the L-shaped pipe, then the cushion is heated, and if refrigeration is needed, the hydraulic rod is driven to contract. And the same device is used for heating and refrigerating, so that the production cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of automotive seat technology, and in particular to an air-conditioned automotive seat with semiconductor thermal management. Background Technology

[0002] Car air conditioning is now widely standard equipment in existing vehicles, providing people with a comfortable mobile space. Some mid-to-high-end models now offer seat heating, allowing people to quickly feel the warmth of the seats in cold weather. In hot summer days, cars with ventilated seats can lower the temperature of the seats.

[0003] Currently, the disadvantages of commercially available air-conditioned car seats with semiconductor thermal management are that conventional car seats use two different systems for heating and ventilation, which makes subsequent maintenance inconvenient and increases the cost of seat production. To address this, we have designed an air-conditioned car seat with semiconductor thermal management. Utility Model Content

[0004] The technical problem solved by this utility model is to provide a semiconductor thermal management air-conditioned car seat that is highly practical, easy to operate, and has a simple structure. This solves the problem mentioned in the background art that general car seats use two different systems for heating and ventilation, which is inconvenient for subsequent maintenance and increases production costs.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: an air-conditioned car seat with semiconductor thermal management, including a seat cushion and a thermal management mechanism assembled on the outside of the seat cushion;

[0006] The heating and cooling management mechanism includes a fixed bracket fixedly connected to one side of the seat cushion, a semiconductor cooling chip body fixedly connected to one side of the fixed bracket, and two heat-absorbing plates fixedly connected to both sides of the semiconductor cooling chip body. A mounting plate is fixedly connected to one side of the fixed bracket, a hydraulic rod is fixedly connected to one side of the mounting plate, a slider is fixedly connected to the output end of the hydraulic rod, a blower is fixedly installed on the top of the slider, a first conduit is connected through the output end of the blower, a Y-shaped tube is connected through the input end of the blower, a movable block is fixedly connected to the surface of the Y-shaped tube, and both sides of the movable block are fixedly connected to one side of the slider. Several through-hole plates are fixedly connected to the surface of each of the two heat-absorbing plates, and two shields are fixedly connected to the surface of the two heat-absorbing plates. An air inlet is opened on one side of each shield, and an air outlet is opened at the bottom of each shield.

[0007] Optionally, the air vents at the bottom of the two shields are at the same level, but the air vents are located at different positions on the bottom of the shields.

[0008] Optionally, two L-shaped tubes are fixedly connected to one side of the seat cushion surface. Several round holes are opened on the surface of the two L-shaped tubes, and the surfaces of the two L-shaped tubes are connected through a connecting tube.

[0009] Optionally, one end of the first conduit passes through the connecting tube and is located inside the connecting tube.

[0010] Optionally, the surface of the cushion has several through holes, and a sponge pad is fixedly connected to the other side of the surface of the cushion.

[0011] This invention provides an air-conditioned car seat with semiconductor thermal management, which has the following advantages:

[0012] This semiconductor thermal management system for air-conditioned car seats, through the arrangement of a heating and cooling management mechanism, an L-shaped tube, and connecting pipes, allows for heating of the seat cushion. When heating is required, the semiconductor cooling chip is activated, along with a hydraulic rod and a blower. The hydraulic rod pushes a slider, which in turn moves a movable block carrying a Y-shaped tube horizontally. One end of the Y-shaped tube aligns with an air outlet at the bottom of a shield, while the other end is blocked. External air is drawn in through an air inlet on one side of the shield into the cavity between the shield, the heat-absorbing plate, and the through-hole. The heat-absorbing plate absorbs the heat generated by the semiconductor cooling chip onto the surface of the through-hole plate. Finally, the air is heated through the through-holes on the surface of the through-hole plate and then delivered to the connecting pipe through the first conduit at the blower's output end. The hot air is then discharged through the through-holes on the L-shaped tube towards the seat cushion, thus heating the cushion. To cool, the hydraulic rod is retracted. This system utilizes the same device for both heating and cooling, reducing production costs. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the overall cross-sectional structure of this utility model;

[0015] Figure 3 This is a schematic diagram of the overall disassembled structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the bottom structure of the shielding cover of this utility model.

[0017] In the diagram: 1. Seat cushion; 2. Heating and cooling management mechanism; 201. Fixed bracket; 202. Semiconductor cooling chip body; 203. Heat absorption plate; 204. Mounting plate; 205. Hydraulic rod; 206. Slider; 207. Blower; 208. First conduit; 209. Y-shaped tube; 210. Movable block; 211. Through-hole plate; 212. Shield; 3. L-shaped tube; 4. Connecting tube; 5. Sponge pad. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0019] Please see Figures 1 to 4 This utility model provides a technical solution: an air-conditioned car seat with semiconductor thermal management, including a seat cushion 1 and a thermal management mechanism 2 assembled on the outside of the seat cushion 1. The thermal management mechanism 2 includes a fixed bracket 201 fixedly connected to one side of the seat cushion 1, a semiconductor cooling chip body 202 fixedly connected to one side of the fixed bracket 201, and two heat-absorbing plates 203 fixedly connected to both sides of the semiconductor cooling chip body 202. A mounting plate 204 is fixedly connected to one side of the fixed bracket 201, and a hydraulic system is fixedly connected to one side of the mounting plate 204. A hydraulic rod 205 has a slider 206 fixedly connected to its output end. A blower 207 is fixedly mounted on the top of the slider 206. A first conduit 208 is connected through the output end of the blower 207, and a Y-shaped tube 209 is connected through the input end of the blower 207. A movable block 210 is fixedly connected to the surface of the Y-shaped tube 209. Both sides of the movable block 210 are fixedly connected to one side of the slider 206. Several through-hole plates 211 are fixedly connected to the surfaces of the two heat-absorbing plates 203. Two shields 212 are provided, each with an air inlet on one side and an air outlet at the bottom. When heating the seat cushion 1 is required, the semiconductor cooling chip body 202 is opened, along with the hydraulic rod 205 and the blower 207. This causes the hydraulic rod 205 to push the slider 206, which in turn causes the movable block 210 to move the Y-shaped tube 209 horizontally. One end of the Y-shaped tube 209 is aligned with the air outlet at the bottom of one of the shields 212, while the other end is blocked, allowing air to be drawn in only from the air inlet on one side of the shield 212. External air is introduced into the cavity between the shield 212, the heat absorber 203, and the through hole. The heat absorber 203 absorbs the heat generated by the semiconductor cooling chip to the surface of the through hole plate 211. Finally, the air is heated through the through hole on the surface of the through hole plate 211. The hot air is then input into the connecting pipe 4 through the first conduit 208 at the output end of the blower 207 and discharged from the through hole on the surface of the L-shaped pipe 3 toward the seat cushion 1, thereby heating the seat cushion 1. If cooling is desired, the hydraulic rod 205 is driven to retract, thus achieving the function of using the same device for both heating and cooling.

[0020] Furthermore, the air vents at the bottom of the two shields 212 are at the same level, but the air vents are located at different positions at the bottom of the shields 212.

[0021] Furthermore, two L-shaped tubes 3 are fixedly connected to one side of the surface of the cushion 1. Several round holes are opened on the surface of the two L-shaped tubes 3, and the surfaces of the two L-shaped tubes 3 are connected through the connecting tube 4.

[0022] Furthermore, one end of the first conduit 208 passes through the connecting pipe 4 and is located inside the connecting pipe 4, wherein the first conduit 208 can transmit the air drawn out by the blower 207 to the connecting pipe 4.

[0023] Furthermore, the surface of the seat cushion 1 has several through holes, and a sponge pad 5 is fixedly connected to the other side of the surface of the seat cushion 1, wherein the sponge pad 5 is more comfortable to sit on.

[0024] In this invention, the working steps of the device are as follows:

[0025] First step: When heating the seat cushion 1 is required, turn on the semiconductor cooling chip body 202, and turn on the hydraulic rod 205 and blower 207. The hydraulic rod 205 pushes the slider 206, and then the movable block 210 moves the Y-shaped tube 209 horizontally. One end of the Y-shaped tube 209 is aligned with the air outlet at the bottom of a shield 212, while the other end of the Y-shaped tube 209 is blocked. Hot air can only be drawn out from the semiconductor cooling side. Finally, the hot air is input into the connecting pipe 4 through the first conduit 208 at the output end of the blower 207, and discharged towards the seat cushion 1 through the through hole on the surface of the L-shaped tube 3, thereby heating the seat cushion 1. If cooling is desired, the hydraulic rod 205 is driven to retract, thus achieving the effect of using the same device for heating and cooling. It should be noted that the device structure and accompanying drawings of this utility model mainly describe the principle of this utility model. In terms of the technical aspects of this design principle, the setting of the power mechanism, power supply system and control system of the device is not fully described. However, under the premise that those skilled in the art understand the principle of the above utility model, the specific details of its power mechanism, power supply system and control system can be clearly understood. The control method in the application document is automatic control through a controller. The control circuit of the controller can be implemented by those skilled in the art through simple programming.

[0026] All standard parts used can be purchased from the market, and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the existing technology. The machinery, parts and equipment adopt conventional models in the existing technology, and the structure and principle of the components known to those skilled in the art can be known by those skilled in the art through technical manuals or conventional experimental methods.

[0027] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An air-conditioned car seat with semiconductor thermal management, characterized in that: The device includes a seat cushion (1) and a heating and cooling management mechanism (2) assembled on the outside of the seat cushion (1). The heating and cooling management mechanism (2) includes a fixed bracket (201) fixedly connected to one side of the seat cushion (1), a semiconductor cooling chip body (202) fixedly connected to one side of the fixed bracket (201), and two heat-absorbing plates (203) fixedly connected to both sides of the semiconductor cooling chip body (202). A mounting plate (204) is fixedly connected to one side of the fixed bracket (201), and a hydraulic rod (205) is fixedly connected to one side of the mounting plate (204). A slider (206) is fixedly connected to the output end of the hydraulic rod (205), and the top of the slider (206) is fixedly mounted. There is a blower (207), the output end of the blower (207) is connected to a first conduit (208), the input end of the blower (207) is connected to a Y-shaped tube (209), the surface of the Y-shaped tube (209) is fixedly connected to a movable block (210), the two sides of the movable block (210) are fixedly connected to one side of the slider (206), the surfaces of the two heat absorption plates (203) are fixedly connected to several through-hole plates (211), the surfaces of the two heat absorption plates (203) are fixedly connected to two shields (212), one side of the two shields (212) is provided with an air inlet, and the bottom of the shields (212) is provided with an air outlet.

2. The air-conditioned car seat with semiconductor thermal management according to claim 1, characterized in that: The air vents at the bottom of the two shields (212) are at the same level, but the air vents are located at different positions at the bottom of the shields (212).

3. The air-conditioned car seat with semiconductor thermal management according to claim 1, characterized in that: Two L-shaped tubes (3) are fixedly connected to one side of the surface of the cushion (1). Several round holes are opened on the surface of the two L-shaped tubes (3). The surfaces of the two L-shaped tubes (3) are connected through a connecting tube (4).

4. The air-conditioned car seat with semiconductor thermal management according to claim 1, characterized in that: One end of the first conduit (208) passes through the connecting tube (4) and is located inside the connecting tube (4).

5. An air-conditioned car seat with semiconductor thermal management according to claim 1, characterized in that: The surface of the cushion (1) has several through holes, and a sponge pad (5) is fixedly connected to the other side of the surface of the cushion (1).

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