Electronic device

Abstract

The utility model discloses electronic equipment, and belongs to the technical field of electronic products. The electronic equipment comprises a circuit board, a sound production device, a circuit board support and a supporting piece, the sound production device is arranged on the circuit board, the supporting piece is arranged between the circuit board and the circuit board support, the supporting piece is arranged in the circumferential direction of the sound production device, the supporting piece is attached to the circuit board, and the sound production device is arranged on the circuit board support. The supporting piece is in sealing fit with the circuit board bracket, so that a first rear cavity is defined by the circuit board bracket, the supporting piece and the circuit board; the side, facing the sound production device, of the supporting piece is provided with a groove so as to form a second rear cavity, and the first rear cavity is communicated with the second rear cavity.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic products, and particularly relates to an electronic device. BACKGROUND

[0002] With more and more integrated components of electronic devices and higher and higher design requirements of the size of electronic devices, the structural design of electronic devices is more and more difficult. The sound emitting device is one of important components of the electronic device, and the sound emitting effect of the sound emitting device is one of the performances that users pay particular attention to, and the size of the back cavity of the sound emitting device determines the sound emitting effect of the sound emitting device.

[0003] The back cavity of the sound emitting device is usually surrounded by a middle frame, a circuit board and a circuit board support. Specifically, part of the structure of the middle frame and the circuit board support are located on the opposite sides of the circuit board, and the middle frame and the circuit board and the circuit board support and the circuit board are all sealed and matched by sealing foam, so as to surround the back cavity of the sound emitting device. In order to improve the sound emitting effect of the sound emitting device, the method usually adopted is to thin the middle frame and the circuit board support to increase the volume of the back cavity, but this setting mode generally has a poor effect on the increase of the volume of the back cavity. Therefore, the electronic device related to the related art has the problem of poor acoustic performance. UTILITY MODEL CONTENT

[0004] The purpose of the embodiment of the application is to provide an electronic device, which can solve the problem of poor acoustic performance of the electronic device related to the related art.

[0005] The embodiment of the application provides an electronic device, which comprises a circuit board, a sound emitting device, a circuit board support and a support piece,

[0006] The sound emitting device is arranged on the circuit board, the support piece is arranged between the circuit board and the circuit board support, and the support piece is arranged in the circumferential direction of the sound emitting device. The support piece is attached to the circuit board, and the support piece and the circuit board support are sealed and matched, so that the circuit board support, the support piece and the circuit board surround a first back cavity.

[0007] The side of the support piece facing the sound emitting device is provided with a groove to form a second back cavity, and the first back cavity and the second back cavity are connected.

[0008] In the embodiments of the present application, the support member is arranged between the circuit board and the circuit board support, and the support member has a certain supporting capacity, i.e., the structural strength of the support member is relatively large, which can ensure the supporting strength of the circuit board. Meanwhile, the circuit board support, the support member and the circuit board enclose a first rear cavity, the support member is arranged in the circumferential direction of the sound generating device, and the side of the support member facing the sound generating device is provided with a groove to form a second rear cavity, the first rear cavity and the second rear cavity are in communication, which to some extent increases the volume of the rear cavity of the sound generating device, thereby improving the acoustic performance of the electronic device. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 A partial exploded view of the electronic device disclosed in the embodiments of the present application;

[0010] Figure 2 A partial structure schematic view of the electronic device disclosed in the embodiments of the present application;

[0011] Figure 3 A cross-sectional view of the electronic device in FIG. 1 along the direction of A-A in FIG. 1; Figure 2 Figure 2 A cross-sectional view of the electronic device in FIG. 1 along the direction of B-B in FIG. 1;

[0012] Figure 4 Figure 2 A cross-sectional view of the first support member in FIG. 1 along the direction of C-C in FIG. 1; Figure 2

[0013] A cross-sectional view of the first support member in FIG. 1 along the direction of D-D in FIG. 1; Figure 5

[0014] A partial structure schematic view of the circuit board support and the middle frame disclosed in the embodiments of the present application; Figures 6 to 11

[0015] A projection view of the first sealing member on the circuit board disclosed in the embodiments of the present application; Figure 12 Figure 11 Figure 11 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application;

[0016] Figure 13 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application; Figure 11 Figure 11 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application;

[0017] Figure 14 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application;

[0018] Figure 15 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application;

[0019] Figure 16 A projection view of the second sealing member on the circuit board disclosed in the embodiments of the present application;​​​​​

[0020] Figures 17 to 22 Structure diagram of the second support in different view angles disclosed by the embodiment of the present application;

[0021] Figure 23 The second support in the Figure 22 Sectional view of the second support in the Figure 22 Sectional view of the second support in the

[0022] Figure 24 The second support in the Figure 22 Sectional view of the second support in the Figure 22 Sectional view of the second support in the

[0023] Explanation of reference signs:

[0024] 100-circuit board, 110-avoidance hole;

[0025] 200-sound generating device;

[0026] 300-circuit board support;

[0027] 400-support, 410-second rear cavity, 420-first support, 430-second support, 440-connection plate, 450-support plate, 460-transition plate, 470-stiffener;

[0028] 510-first rear cavity, 520-third rear cavity;

[0029] 610-first seal, 620-second seal;

[0030] 700-middle frame;

[0031] 810-solder, 820-first projection line, 830-second projection line. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0033] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of a kind and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the objects before and after are in a "or" relationship.

[0034] The electronic device disclosed in the embodiments of the present application will be described in detail below in combination with the drawings, through specific embodiments and application scenarios.

[0035] Please refer to Figures 1-24 The electronic device disclosed in the embodiments of the present application will be described in detail below in combination with the drawings, through specific embodiments and application scenarios.

[0036] The circuit board 100 is used to provide working current for electronic devices in the electronic device, for example, to provide working current for the sound generating device 200, the circuit board 100 can be a main board or a sub-board, the sound generating device 200 is used to realize the sound generating function of the electronic device, and the circuit board support 300 is used to support the circuit board 100. Optionally, the electronic device disclosed in the present application can further include a screen, a middle frame 700 and a battery cover, the screen and the battery cover are arranged on opposite sides of the middle frame 700, the circuit board 100 and the circuit board support 300 are located between the middle frame 700 and the battery cover, and part of the structure of the middle frame 700 and the circuit board support 300 are located on opposite sides of the circuit board 100.

[0037] Please refer to Figure 1 and Figure 4The sound generating device 200 is arranged on the circuit board 100, and specifically, the circuit board 100 is provided with a relief hole 110 for accommodating the sound generating device 200, that is, the sound generating device 200 is mounted in the relief hole 110, and at least part of the sound generating device 200 is located in the relief hole 110, which can reduce the overall thickness of the electronic device. The support member 400 is arranged between the circuit board 100 and the circuit board support 300, and the support member 400 is arranged in the circumferential direction of the sound generating device 200. The support member 400 is attached to the circuit board 100, and the support member 400 is sealingly connected to the circuit board support 300, so that the circuit board support 300, the support member 400 and the circuit board 100 can form a first rear cavity 510. The rear cavity arranged by the sound generating device 200 is in communication with the first rear cavity 510, and part of the structure of the middle frame 700 and the circuit board 100 can form a third rear cavity 520. The first rear cavity 510 and the third rear cavity 520 can be in communication through the relief hole 110, so that the acoustic rear cavity of the sound generating device 200 includes the rear cavity arranged by itself, the first rear cavity 510 and the third rear cavity 520.

[0038] The support member 400 has a certain supporting capacity, and since the support member 400 is arranged in the circumferential direction of the sound generating device 200, the support member 400 has a side facing the sound generating device 200, that is, a side facing the first rear cavity 510. The side can be provided with a groove to form a second rear cavity 410. Specifically, it can be understood that the space surrounded by the groove wall of the groove is the second rear cavity 410, and the first rear cavity 510 and the second rear cavity 410 are in communication, so that the acoustic rear cavity of the sound generating device 200 not only includes the rear cavity arranged by itself, the first rear cavity 510 and the third rear cavity 520, but also includes the second rear cavity 410.

[0039] As can be seen, the second rear cavity 410 is an additional rear cavity space formed under the condition that the original space is unchanged. This can increase the volume of the rear cavity of the sound generating device 200, thereby effectively improving the acoustic performance of the electronic device, reducing the working energy consumption of the sound generating device 200, prolonging the working time of the entire electronic device, and improving the user experience.

[0040] In the embodiments of the present application, the support member 400 is arranged between the circuit board 100 and the circuit board support 300, and the support member 400 has a certain supporting capacity, that is, the structural strength of the support member 400 is large, which can ensure the supporting strength of the circuit board 100. At the same time, the circuit board support 300, the support member 400 and the circuit board 100 form the first rear cavity 510, the support member 400 is arranged in the circumferential direction of the sound generating device 200, and the side of the support member 400 facing the sound generating device 200 is provided with a groove to form the second rear cavity 410. The first rear cavity 510 and the second rear cavity 410 are in communication, which to some extent increases the volume of the rear cavity of the sound generating device 200, thereby improving the acoustic performance of the electronic device.

[0041] Optionally, the support 400 can be a straight strip structure, and the number of the support 400 can be one.

[0042] In one embodiment, referring to Figure 1 , Figures 5 to 11 and Figures 17 to 22 , the number of the support 400 can be at least two, including a first support 420 and a second support 430 connected in series, the extending direction of the first support 420 intersects with the extending direction of the second support 430, and optionally, the extending direction of the first support 420 can be perpendicular to the extending direction of the second support 430. One part of the circuit board support 300 cooperates with the circuit board 100 through the first support 420 and the second support 430, and another part of the circuit board support 300 directly contacts the circuit board 100 to form the first rear cavity 510. In this embodiment, the sealing surface between the support 400 and the circuit board support 300 protrudes from the sealing surface between the circuit board 100 and the circuit board support 300.

[0043] In this embodiment, since the second rear cavity 410 is formed on both the first support 420 and the second support 430, the overall volume of the formed second rear cavity 410 is large, which can further increase the volume of the rear cavity of the sound generating device 200 to make the acoustic performance of the electronic device better. At the same time, the support 400 is arranged in the local area of the circuit board 100, and other areas of the circuit board 100 can still directly cooperate with the circuit board support 300, so that the circuit board support 300 can still provide better support for the circuit board 100.

[0044] In another embodiment, the number of the support 400 can be more, and each support 400 can be connected in series to form a ring-shaped member, which surrounds the sound generating device 200, and the circuit board support 300 cooperates with the circuit board 100 through the ring-shaped member, that is, in the thickness direction of the electronic device, the circuit board support 300, the ring-shaped member and the circuit board 100 are arranged in series, and the circuit board support 300, the ring-shaped member and the circuit board 100 cooperate to form the first rear cavity 510 described above. In this embodiment, since the number of the support 400 is more, the second rear cavity 410 formed on each support 400 can form a ring-shaped rear cavity, and the volume of the ring-shaped rear cavity is larger, which can further increase the volume of the rear cavity of the sound generating device 200.

[0045] Optionally, referring to Figures 3 to 10 and Figures 17 to 21Each support member 400 can include a connecting plate 440 and a support plate 450. The connecting plate 440 is connected to the circuit board 100 at a side close to the circuit board 100, and is connected to the support plate 450 at a side away from the sound production device 200, i.e., the connecting plate 440 has a first edge away from the circuit board 100, and the support plate 450 has a second edge away from the sound production device 200, and the first edge and the second edge are connected. A side of the connecting plate 440 facing the sound production device 200, a side of the support plate 450 facing the circuit board 100, and the circuit board 100 together enclose the second back cavity 410. The support plate 450 can cooperate with the circuit board support 300. At this time, the volume of the second back cavity 410 is the maximum value among the volumes of a plurality of different second back cavities 410 enclosed by the connecting plate 440 and the support plate 450 at different positions, i.e., this connection mode can make the volume of the second back cavity 410 as large as possible to increase the back cavity volume of the sound production device 200. Of course, in other embodiments, the first edge can be connected to other regions of the support plate 450 other than the second edge.

[0046] Optionally, the connecting plate 440 and the support plate 450 can each be a strip-shaped plate, and the width direction of the support plate 450 is parallel to the plane in which the circuit board 100 is located, so that the cooperation area of the support plate 450 and the circuit board support 300 is larger, thereby ensuring the cooperation stability of the two. Of course, in other embodiments, the width direction of the support plate 450 can also be non-parallel to the plane in which the circuit board 100 is located.

[0047] In this embodiment, the width direction of the connecting plate 440 intersects the width direction of the support plate 450. Optionally, the width direction of the connecting plate 440 can be perpendicular to the width direction of the support plate 450, so that the connecting plate 440 and the support plate 450 are perpendicular, and then the connecting plate 440 and the circuit board 100 are perpendicular, so as to facilitate the calculation of the volume of the second back cavity 410 enclosed by the connecting plate 440, the support plate 450, and the circuit board 100. The side of the connecting plate 440 close to the circuit board 100 can be a third edge, which is attached to the circuit board 100, and the third edge and the first edge are located on opposite sides of the connecting plate 440.

[0048] In this embodiment, the volume of the second back cavity 410 can be obtained by the following formula:

[0049] V=(A-B)*C*L;

[0050] Wherein, V is the volume of the second back cavity 410, A is the size of the support 400 in the width direction of the support plate 450, B is the thickness of the connecting plate 440, C is the distance between the third edge and the first edge of the connecting plate 440, and L is the length of the support plate 450. When the number of the support 400 is at least two, at least two second back cavities 410 are formed, and the volume of each second back cavity 410 can be obtained according to the above formula.

[0051] Optionally, to facilitate the sealed cooperation between the circuit board support 300 and the support 400, each support 400 can further include a blocking plate, which can be vertically arranged relative to the circuit board 100, and the end of the blocking plate and the end of the connecting plate 440 and the end of the support plate 450 are connected. The part of the circuit board support 300 corresponding to the blocking plate can be perpendicular to the part of the circuit board support 300 corresponding to the support plate 450, so that the circuit board support 300 is sealed with the blocking plate and the support plate 450.

[0052] In another embodiment, please refer to Figures 5 to 13 and Figures 17 to 24 Each support 400 can further include a transition plate 460, which is connected to the end of the connecting plate 440 and the end of the support plate 450, and smoothly transitions with the end of the support plate 450 and the end of the connecting plate 440. The end of the transition plate 460 away from the support plate 450 is attached to the circuit board 100, and the transition plate 460 is inclined relative to the circuit board 100. In this embodiment, one end of the connecting plate 440 can protrude relative to one end of the support plate 450, so that the end thereof is connected to the transition plate 460.

[0053] In this embodiment, since the transition plate 460 is inclined relative to the circuit board 100, i.e. the transition plate 460 is an inclined transition plate 460, and the end of the support plate 450 smoothly transitions with the transition plate 460, this can make the part of the circuit board support 300 corresponding to the transition plate 460 closely adhere to the support plate 450 and the transition plate 460 after being slightly bent relative to the part of the circuit board support 300 corresponding to the support plate 450, i.e. this arrangement makes the circuit board support 300 and the support 400 as a whole have a greater degree of adhesion, and thus can be better sealed with the support 400 everywhere, thereby ensuring the sealing of the first back cavity 510 and the second back cavity 410.

[0054] In one embodiment, to facilitate the manufacture of the transition plate 460, the transition plate 460 can be a flat plate.

[0055] In another embodiment, the transition plate 460 can be an arc-shaped plate, and the arc-shaped plate is curved towards the side away from the circuit board 100. In this case, the circuit board support 300 has a larger area of adhesion with the transition plate 460, and thus the sealing effect at the adhesion position is better.

[0056] Optionally, the support plate 450 and the connecting plate 440 can be separately provided during the manufacturing process, and then the support plate 450 and the connecting plate 440 are connected respectively during the specific assembly process.

[0057] In another embodiment, the connecting plate 440 and the support plate 450 can be integrally provided, i.e., the support plate 450 and the connecting plate 440 can be integrally formed during the manufacturing process, so that the support plate 450 and the connecting plate 440 are integrally provided. This can improve the overall assembly efficiency, and at the same time, the structural strength of the entire support 400 can be improved.

[0058] Optionally, the thickness of the support plate 450 and the thickness of the connecting plate 440 can be less than 0.15 mm or greater than 0.2 mm.

[0059] In another embodiment, the thickness of the connecting plate 440 and the thickness of the support plate 450 can be between 0.15 mm and 0.2 mm. In this case, the structural strength of the support 400 can better meet the conventional requirements, and the volume of the second rear cavity 410 formed by the connection of the connecting plate 440 and the support plate 450 is relatively large.

[0060] Optionally, each support 400 can be separately provided during the manufacturing process, and then each support 400 is connected in sequence during the specific assembly process.

[0061] In another embodiment, each support 400 can be integrally formed, i.e., each support 400 can be integrally formed during the manufacturing process, so that each support 400 can be integrally provided. This can improve the overall assembly efficiency, and at the same time, the overall structural strength can be improved.

[0062] Optionally, the support 400 can be a plastic piece with relatively high structural strength.

[0063] In another embodiment, the support 400 can be a metal piece, i.e., the material of the support 400 can be metal. This makes the structural strength of the support 400 relatively large, and the support 400 and the circuit board 100 can be connected by soldering 810. This makes the connection between the support 400 and the circuit board 100 relatively stable, i.e., not easily affected by external factors, and the soldering connection between the support 400 and the circuit board 100 can better ensure the sealing of the first rear cavity 510.

[0064] Optionally, please refer to Figures 17 to 24Each support member 400 can further include a reinforcing rib 470, one end of the reinforcing rib 470 can be connected with the above-mentioned connecting plate 440 or the above-mentioned support plate 450, and the other end of the reinforcing rib 470 can be connected with the circuit board 100, the reinforcing rib 470 can better support the connecting plate 440 or the support plate 450 through the circuit board 100, so as to improve the structural strength of each support member 400. Of course, in other embodiments, each support member 400 can also not include the reinforcing rib 470.

[0065] Optionally, the reinforcing rib 470 can be connected with the support plate 450, specifically, the support plate 450 has a fourth edge close to the sound generating device 200, the reinforcing rib 470 can be connected with the fourth edge, the fourth edge is located on the opposite side of the support plate 450 from the above-mentioned second edge, so that the reinforcing rib 470 and the connecting plate 440 are located on the opposite sides of the support plate 450, at this time, the support plate 450 can be more balancedly installed on the circuit board 100 through the reinforcing rib 470 and the connecting plate 440, so that the support plate 450 can be stably supported between the circuit board 100 and the circuit board support 300. Of course, in other embodiments, the reinforcing rib 470 can also be connected with the connecting plate 440.

[0066] Optionally, the number of reinforcing ribs 470 can be one.

[0067] In another embodiment, the number of reinforcing ribs 470 can be at least two, each reinforcing rib 470 can be arranged at intervals along the extension direction of the support member 400, the extension direction can be the length direction of the support member 400, or the width direction of the support member 400. In this embodiment, the structural strength of each support member 400 at each location can be further improved, that is, the overall structural strength of each support member 400 can be further improved, so as to better resist the deformation of each support member 400 due to stress.

[0068] Optionally, please refer to Figure 3 and Figure 4 The electronic device can further include a first sealing member 610, the first sealing member 610 is located between the support member 400 and the circuit board support 300, that is, the first sealing member 610 can be arranged between the support member 400 and the circuit board support 300, and the first sealing member 610 is sealingly matched with the support member 400 and the circuit board support 300, which can further ensure the sealing performance between the support member 400 and the circuit board support 300, and further ensure the sealing performance of the acoustic back cavity of the sound generating device 200. Of course, the first sealing member 610 can also not be arranged between the support member 400 and the circuit board support 300.

[0069] Optionally, according to the above, the support 400 can include the connecting plate 440 and the support plate 450 connected to each other, and the first seal 610 can be arranged between the support plate 450 and the circuit board support 300, so that the first seal 610 is in sealing fit with the support plate 450 and the circuit board support 300. Since the width direction of the support plate 450 is parallel to the plane where the circuit board 100 is located, the contact area of the first seal 610 with the support plate 450 and the circuit board support 300 is large, that is, the first seal 610 with a wide width can be used for sealing, which can better ensure the sealing effect of the first rear cavity 510.

[0070] When a part of the circuit board support 300 is in fit with the circuit board 100 through the first support 420 and the second support 430, and another part of the circuit board support 300 is in direct contact with the circuit board 100, different parts of the first seal 610 can have different heights, and the first seal 610 is in a curved surface shape, so that the shape of the part of the first seal 610 in fit with the support 400 is adapted to the shape of the support 400.

[0071] Of course, in other embodiments, the first seal 610 can also be arranged between the third edge of the connecting plate 440 and the circuit board 100.

[0072] Optionally, referring to Figure 4 , the second seal 620 can be arranged between the circuit board 100 and the middle frame 700, and the second seal 620 is in sealing fit with the circuit board 100 and the middle frame 700, which can better ensure the sealing effect of the third rear cavity 520, thereby ensuring the rear cavity sealing of the sound generating device 200.

[0073] Optionally, the first seal 610 and the second seal 620 can both be sealing foam, and can both be ring-shaped seals, referring to Figure 15 , the projection line of the first seal 610 on the circuit board 100 along the thickness direction of the electronic device can be a first projection line 820, referring to Figure 16 , the projection line of the second seal 620 on the circuit board 100 along the thickness direction of the electronic device can be a second projection line 830.

[0074] In addition, according to the above, the support 400 can also include a transition plate 460 connected to the end of the connecting plate 440 and the end of the support plate 450, and the transition plate 460 can be an arc-shaped plate. The first seal 610 can be closely attached to the support plate 450 and the transition plate 460 in sequence, so that the first seal 610 has a large degree of fit with the support 400 as a whole, thereby being in good sealing fit with each part of the support 400, and thereby ensuring the sealing of the first rear cavity 510 and the second rear cavity 410.

[0075] Optionally, the electronic device disclosed by the embodiments of the present application can be a smart phone, a tablet computer, an electronic book reader, a wearable device, an electronic game machine, or the like. Of course, the embodiments of the present application do not limit the specific types of electronic devices.

[0076] The embodiments of the present application are described above in combination with the drawings, but the present application is not limited to the specific implementation described above, which is only illustrative but not restrictive. Those skilled in the art can make many forms under the inspiration of the present application without departing from the scope of the present application and the scope protected by the claims.

Claims

1. An electronic device, characterized in that, Includes circuit boards, sound-generating devices, circuit board brackets, and support components. The sound-generating device is disposed on the circuit board, and the support member is provided between the circuit board and the circuit board support. The support member is disposed in the circumferential direction of the sound-generating device, and the support member is attached to the circuit board. The support member and the circuit board support are sealed together so that the circuit board support, the support member and the circuit board form a first rear cavity. The support member has a groove on the side facing the sound-generating device to form a second rear cavity, and the first rear cavity is connected to the second rear cavity.

2. The electronic device according to claim 1, characterized in that, The number of the support members is at least two, including a first support member and a second support member connected together. The extension direction of the first support member intersects the extension direction of the second support member. A portion of the circuit board bracket cooperates with the circuit board through the first support member and the second support member, and another portion of the circuit board bracket contacts the circuit board to form the first rear cavity.

3. The electronic device according to claim 1, characterized in that, The number of the support members is at least two, and the support members are connected in sequence to form a ring, and the ring surrounds the sound-generating device. The circuit board bracket cooperates with the circuit board through the ring to form the first rear cavity.

4. The electronic device according to claim 2 or 3, characterized in that, Each of the aforementioned support components includes a connecting plate and a supporting plate. The side of the connecting plate closest to the circuit board is connected to the circuit board, and the side of the connecting plate furthest from the circuit board is connected to the side of the supporting plate furthest from the sound-generating device. The side of the connecting plate facing the sound-generating device, the side of the supporting plate facing the circuit board, and the circuit board together form the second rear cavity. Both the connecting plate and the supporting plate are strip plates, and the width direction of the supporting plate is parallel to the plane where the circuit board is located.

5. The electronic device according to claim 4, characterized in that, Each of the aforementioned support members further includes a transition plate, which is connected to the end of the connecting plate and the end of the support plate, and smoothly transitions to both the end of the support plate and the end of the connecting plate. The end of the transition plate away from the support plate is attached to the circuit board, and the transition plate is inclined relative to the circuit board.

6. The electronic device according to claim 5, characterized in that, The transition plate is a flat plate; or the transition plate is an arc-shaped plate, and the arc-shaped plate is bent toward the side away from the circuit board.

7. The electronic device according to claim 4, characterized in that, The connecting plate and the supporting plate are integrally formed; and / or, The thickness of both the connecting plate and the supporting plate is between 0.15mm and 0.2mm; and / or, Each of the aforementioned support components is integrally formed.

8. The electronic device according to claim 4, characterized in that, Each of the aforementioned support components further includes a reinforcing rib, one end of which is connected to the connecting plate or the support plate, and the other end of which is connected to the circuit board.

9. The electronic device according to claim 8, characterized in that, The number of reinforcing ribs is at least two, and each reinforcing rib is spaced apart along the extension direction of the support member.

10. The electronic device according to any one of claims 1-9, characterized in that, The electronic device further includes a first seal, which is located between the support and the circuit board bracket, and the first seal is in sealing fit with both the support and the circuit board bracket. The shape of the portion of the first seal that fits with the support is adapted to the shape of the support.

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