LED packaging structure

Abstract

The utility model discloses an LED packaging structure, and the key points of the technical scheme are that the LED packaging structure comprises a substrate and a protection layer; a plurality of LED chips are arranged on the substrate, a fluoride fluorescent film is arranged on each LED chip, a cutting gap is reserved between every two adjacent fluoride fluorescent films, the side walls of the LED chips and the fluoride fluorescent films are wrapped with white wall layers, and the protective layer is arranged on the white wall layers and the fluoride fluorescent films. The ceramic water jet cutter can effectively avoid deterioration of fluoride fluorescent powder in a high-temperature and high-humidity environment, effectively solves the problem of cutting reliability of the ceramic water jet cutter, and greatly improves reliability and service life of fluoride products.

Description

TECHNICAL FIELD

[0001] The utility model belongs to LED packaging technical field, especially a kind of LED packaging structure. BACKGROUND

[0002] In the field of LED packaging technology, the advantages of ceramic packaging compared with other support packaging are high airtightness and good thermal conductivity. Using a ceramic substrate as a bearing bracket, multiple flip chips are arranged on the ceramic substrate, and the flip chips serve as light sources, providing a high color gamut product solution containing fluoride phosphor for backlight products and the like. However, ceramic packaging must be water-cut to form a single light source.

[0003] Due to the high temperature and water vapor generated during the water-cut process, combined with the characteristics of fluoride powder, especially KSF powder (K2SiF6:Mn4+), which has high color rendering index, high color gamut, hygroscopicity, and light-sensitive degradation, the high temperature and water vapor generated during the water-cut process greatly affect the characteristics of fluoride phosphor. SUMMARY

[0004] The utility model discloses a kind of LED packaging structures, can prevent affecting the characteristics of fluoride fluorescent film.

[0005] The technical solutions for achieving the above-mentioned purposes include the following:

[0006] The LED packaging structure includes a substrate and a protective layer. The substrate has a plurality of LED chips arranged thereon. Each LED chip has a fluoride fluorescent film arranged thereon. A cutting gap is left between adjacent fluoride fluorescent films. The sidewalls of the LED chips and the fluoride fluorescent films are wrapped with a white wall layer. The protective layer is arranged on the white wall layer and the fluoride fluorescent film.

[0007] In some embodiments, the fluoride fluorescent film completely covers the corresponding LED chip, and the size of the fluoride fluorescent film is greater than the size of the LED chip.

[0008] In some embodiments, the white wall layer is not higher than the fluoride fluorescent film, and the white wall layer completely wraps the sidewalls of the LED chip.

[0009] In some embodiments, the fluoride fluorescent film includes β-sailong green powder, fluoride red powder and silica gel. The β-sailong green powder and the fluoride red powder are mixed in the silica gel. The ratio of the β-sailong green powder, the fluoride red powder and the silica gel is 1:3:6.

[0010] In some embodiments, the white wall layer is made of organic silicone paint.

[0011] In some embodiments, the protective layer comprises: diffusion powder mixed in silica gel, and the ratio of the diffusion powder and the silica gel is 1:20.

[0012] In some embodiments, the substrate comprises an insulating plate body, and a surface of the insulating plate body is provided with a metal plating layer.

[0013] In some embodiments, the LED chip is soldered on the substrate.

[0014] In some embodiments, the LED chip comprises at least one flip chip arranged on the substrate.

[0015] In some embodiments, a plurality of the LED chips are arranged in an array on the substrate.

[0016] The technical scheme provided by the utility model has the following advantages and effects: by arranging a single fluoride fluorescent film on each LED chip and providing a cutting gap between adjacent fluoride fluorescent films, the fluoride fluorescent film is prevented from being cut during the water cutting process, thereby avoiding the influence of high temperature and water vapor generated during the water cutting process on the characteristics of the fluoride fluorescent powder. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings show specific examples of the technical scheme of the utility model and constitute part of the specification together with the specific embodiments, for explaining the technical scheme, principle and effect of the utility model.

[0018] Unless specifically stated or defined otherwise, the same reference signs in different drawings represent the same or similar technical features, and different reference signs may also be used to represent the same or similar technical features.

[0019] Fig. 1 is a sectional view of the structure of the embodiment of the utility model;

[0020] Fig. 2 is a structure schematic view of the embodiment of the utility model after cutting

[0021] Fig. 3 is a structure schematic view of the substrate of the embodiment of the utility model.

[0022] BRIEF DESCRIPTION OF DRAWINGS

[0023] 1, substrate; 11, insulating plate body; 12, metal plating layer; 2, protective layer; 3, LED chip; 4, fluoride fluorescent film; 5, white wall layer; 6, cutting gap. DETAILED DESCRIPTION

[0024] For the convenience of understanding the utility model, the specific embodiments of the utility model will be described in more detail below with reference to the accompanying drawings of the description.

[0025] Unless specifically stated or otherwise defined, the "first, second" used in the present text is only used for the differentiation of the name, and does not represent the specific quantity or order.

[0026] Unless specifically stated or otherwise defined, the term "and / or" used in the present text includes any and all combinations of one or more related listed items.

[0027] It should be noted that when an element is considered to be "fixed to" another element, it can be directly fixed to the other element or a middle element can exist; when an element is considered to be "connected to" another element, it can be directly connected to the other element or a middle element can exist; when an element is considered to be "mounted on" another element, it can be directly mounted on the other element or a middle element can exist. When an element is considered to be "provided on" another element, it can be directly provided on the other element or a middle element can exist.

[0028] As Figs. 1-3 As shown in the utility model embodiment provides a kind of LED packaging structure, comprising: substrate 1 and protective layer 2;The substrate 1 is provided with multiple LED chips 3, fluoride fluorescent film 4 is provided on each LED chip 3, cutting gap 6 is left between adjacent fluoride fluorescent film 4, the side wall of LED chip 3 and fluoride fluorescent film 4 is wrapped with white wall layer 5, and the protective layer 2 is arranged on white wall layer 5 and fluoride fluorescent film 4.

[0029] In practical application, substrate 1 includes insulating plate body 11, the surface of insulating plate body 11 is provided with metal plating layer 12, insulating plate body 11 can be made of ceramic, in other embodiments, other insulating materials with high thermal conductivity and air tightness, such as silicon carbide, metal plating layer 12 is arranged on the upper and lower surfaces of ceramic substrate 1, which is usually copper plating layer, ceramic substrate 1 is used as the support of LED packaging, which has the advantages of high air tightness and good thermal conductivity. However, in order to form a single light source, the LED chip 3 must be water cut on the ceramic substrate 1, by providing a separate fluoride fluorescent film 4 on each LED chip 3, and having a cutting gap 6 between adjacent fluoride fluorescent films 4, the cutting of fluoride fluorescent film 4 during water cutting is avoided, thereby avoiding the influence of high temperature and water vapor generated during water cutting on the properties of fluoride fluorescent powder. Specifically, the separate fluoride fluorescent film 4 can be obtained by laser cutting a whole fluoride fluorescent film 4, which avoids the influence of water cutting on fluoride fluorescent powder.

[0030] Further, the fluoride fluorescent film 4 completely covers the corresponding LED chip 3, and the size of the fluoride fluorescent film 4 is greater than the size of the LED chip 3.

[0031] In practical applications, the fluoride fluorescent film 4 is used to emit high-intensity light after being excited by the light source emitted by the LED chip 3. By completely covering the LED chip 3 with the fluoride fluorescent film 4 and making the size of the fluoride fluorescent film 4 greater than the size of the LED chip 3, the fluoride fluorescent film 4 can efficiently absorb the light energy emitted by the LED chip 3 and convert it into fluorescent light, thereby reducing energy waste. Specifically, the surface of the LED chip 3 is uniformly covered with a layer of film adhesive by spraying or dispensing, the fluoride fluorescent film 4 is attached to the surface of the LED chip 3, and the film adhesive at the bonding site of the fluoride fluorescent film 4 and the LED chip 3 is cured by a certain temperature and time, so that the fluoride fluorescent film 4 is firmly bonded to the LED chip 3.

[0032] Further, the white wall layer 5 is not higher than the fluoride fluorescent film 4, and the white wall layer 5 completely wraps the side wall of the LED chip 3.

[0033] In practical applications, by setting the white wall layer 5 not higher than the fluoride fluorescent film 4, the blocking of the emitted light is reduced, and the light efficiency is improved. By wrapping the side wall of the LED chip 3 with the white wall layer 5, the light generated by the LED chip 3 is more effectively directed to the outside through reflection or scattering, reducing light loss and thereby improving the light-emitting efficiency of the LED. In addition, it can also reduce the impact and damage of external factors on the LED chip 3 and the fluoride fluorescent film 4, and improve the reliability and service life of the LED. Specifically, the white wall layer 5 is made of silicone paint, such as ZK-S1860W white wall glue, which is a reflective white glue with good airtightness and high hydrophobicity, and can produce better scattering effect on the light generated by the LED chip 3. The substrate 1 provided with the LED chip 3 and the fluoride fluorescent film 4 is transferred to the dispensing position, the dam white wall layer 5 is formed, the adhesive fills the cutting gap 6 during the dispensing process, and the height of the white wall layer 5 is slightly lower or flush with the fluoride fluorescent film 4 during the dispensing process. Then, the LED chip 3 is transferred to the oven for baking and curing.

[0034] Further, the fluoride fluorescent film 4 comprises: β-sailon green powder, fluoride red powder and silica gel; the β-sailon green powder and the fluoride red powder are mixed in the silica gel, and the ratio of the β-sailon green powder, the fluoride red powder and the silica gel is 1:3:6. In other embodiments, the ratio of the β-sailon green powder, the fluoride red powder and the silica gel can be adjusted according to the wavelength band and target color area of different powders.

[0035] In practical application, the β-sialon green powder can emit green light when excited by light, and the combination of the green light and the red light emitted by the fluoride red powder can adjust the overall light-emitting color of the fluoride fluorescent film 4, increase the color gamut range, and make the color more vivid and rich. The silica gel plays the role of adhesive and fixing agent in the fluoride fluorescent film 4, and can firmly combine the β-sialon green powder, the fluoride red powder and other fluorescent materials together to form a stable fluorescent film structure.

[0036] Further, the protective layer 2 comprises diffusion powder mixed in silica gel, and the ratio of the diffusion powder to the silica gel is 1:20.

[0037] In practical application, a protective layer 2 is formed on the surface of the fluoride fluorescent film 4 by spraying or molding process. The molding process utilizes the physical properties of thermosetting plastic to flow and fill the mold through heating and pressing, and forms a hard protective shell after cooling. By adding diffusion powder in the silica gel, the light is scattered when passing through the protective layer 2, further achieving the effect of optical diffusion, further making the light more soft and uniform, and improving the visual comfort.

[0038] Further, the LED chip 3 is soldered on the substrate 1.

[0039] In practical application, the soldering realizes the seamless bonding of the LED chip 3 and the substrate 1. Compared with the traditional die bonding method, this metal-to-metal fusion method can significantly reduce the ohmic resistance and effectively improve the heat conduction efficiency.

[0040] Further, the LED chip 3 comprises at least one flip chip arranged on the substrate 1.

[0041] In practical application, the LED chip 3 can be a single or multiple flip gold-tin electrode chip of different wavebands and high current resistance, which is used to excite the fluorescent powder to obtain the target color. The flip chip contains the surface of the transistor and the interconnection line, which directly faces the substrate 1. Compared with the traditional wire bonding technology, the connection method of the flip chip greatly shortens the signal path, reduces the parasitic capacitance and inductance, thereby improving the performance of the LED chip 3 and reducing the power consumption.

[0042] Further, a plurality of the LED chips 3 are arranged in an array on the substrate 1.

[0043] In practical application, through the array arrangement of the plurality of LED chips 3, it is more convenient to cut the plurality of LED chips 3 provided with the plurality of LED chips 3, specifically, the whole substrate 1 is moved to the cutting place of the ceramic water cutting for cutting, the blade passes through the surface protection layer 2, the white wall layer 5 and the substrate 1 from the top, the water cutting process completely avoids the fluoride fluorescent film 4, and finally a single LED light source is formed, so that the LED light source sealed with fluoride powder is obtained.

[0044] When referring to the drawings, the new features appearing are described; in order to avoid the description being not simple enough due to repeated reference to the drawings, the features already described are not repeatedly referred to the drawings in the case of clear expression.

[0045] The purpose of the above embodiments is to exemplarily reproduce and deduce the technical scheme of the utility model, and to completely describe the technical scheme, purpose and effect of the utility model, so that the public can understand the disclosure of the utility model more thoroughly and comprehensively, and the protection scope of the utility model is not limited.

[0046] The above embodiments are not exhaustive enumeration based on the utility model, and there can be a plurality of other implementation manners not listed. Any replacement and improvement made without violating the concept of the utility model belongs to the protection scope of the utility model.

Claims

1. An LED packaging structure, characterized in that, include: A substrate and a protective layer; a plurality of LED chips are disposed on the substrate, each LED chip is disposed on a fluoride fluorescent film, and a cutting gap is left between adjacent fluoride fluorescent films. The sidewalls of the LED chips and the fluoride fluorescent films are wrapped with a white wall layer, and the protective layer is disposed on the white wall layer and the fluoride fluorescent film.

2. The LED packaging structure as described in claim 1, characterized in that, The fluoride fluorescent film completely covers the corresponding LED chip, and the size of the fluoride fluorescent film is larger than the size of the LED chip.

3. The LED packaging structure as described in claim 1, characterized in that, The white wall layer is no higher than the fluoride fluorescent film, and the white wall layer completely covers the sidewalls of the LED chip.

4. The LED packaging structure as described in claim 1, characterized in that, The fluoride fluorescent film comprises β-Cyrone green powder, fluoride red powder, and silica gel; the β-Cyrone green powder and fluoride red powder are mixed in the silica gel, and the ratio of β-Cyrone green powder, fluoride red powder, and silica gel is 1:3:

6.

5. The LED packaging structure as described in claim 1, characterized in that, The white wall layer is made of silicone coating.

6. The LED packaging structure as described in claim 1, characterized in that, The protective layer comprises: a diffusion powder and a silicone rubber, wherein the diffusion powder is mixed in the silicone rubber, and the ratio of the diffusion powder to the silicone rubber is 1:

20.

7. The LED packaging structure according to any one of claims 1-6, characterized in that, The substrate includes an insulating plate, and the surface of the insulating plate is provided with a metal plating layer.

8. The LED packaging structure according to any one of claims 1-6, characterized in that, The LED chip is eutectic bonded to the substrate.

9. The LED packaging structure according to any one of claims 1-6, characterized in that, The LED chip includes at least one flip chip, which is disposed on a substrate.

10. The LED packaging structure according to any one of claims 1-6, characterized in that, Multiple LED chip arrays are arranged on the substrate.

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