Automatic ball mounting equipment and packaging substrate

Abstract

The utility model discloses automatic ball mounting equipment and a packaging substrate. The automatic ball mounting equipment comprises a supporting seat, a ball supply device, a ball mounting device and a positioning device. Wherein the ball mounting device is switched between a ball suction state and a ball release state, when the ball supply device sprays welding balls to the supporting seat, the ball mounting device is switched to the ball suction state, and after the suction cup sucks the welding balls to the ball mounting position, the ball mounting device is switched to the ball release state, so that the welding balls fall to the ball mounting position. According to the automatic ball mounting equipment, the chip ball mounting process is simplified, automation of the ball mounting process is realized, the ball mounting precision, the production efficiency and the product quality are greatly improved, the chip ball mounting cost is reduced, and meanwhile, the automatic ball mounting equipment is high in adjustability, wide in application range and high in practicability. And the requirement on the distance between the welded balls in the welded ball shear test can be better met.

Description

TECHNICAL FIELD

[0001] The utility model relates to ball mounting technical field especially to automatic ball mounting equipment and package substrate. BACKGROUND

[0002] In the related art, the soldering performance of the solder joint of the package substrate is often tested through a tin ball shearing experiment. During the tin ball shearing experiment, pure manual ball mounting is often used, that is, an operator applies flux to the ball mounting position of the solder pad, and then manually places tin balls on the surface of the solder pad one by one. Alternatively, a manual ball mounting device is used to mount the balls, and then the excess tin balls are removed to ensure that the push knife does not touch other tin balls during the pushing process. However, the ball mounting efficiency of the above ball mounting process is low, and the accuracy of manual removal is poor and the efficiency is low. SUMMARY

[0003] The utility model aims at at least one of the technical problems existing in the prior art. Therefore, one purpose of the utility model is to provide an automatic ball mounting equipment, which realizes the automation of the ball mounting process, greatly improves the ball mounting precision, production efficiency and product quality, and reduces the cost of chip ball mounting.

[0004] Another purpose of the utility model is to provide a package substrate.

[0005] According to the automatic ball mounting equipment of the first aspect of the utility model, the support seat is provided with a chip clamp, and the chip clamp is suitable for placing a chip. The ball supply device is provided above the support seat, and the ball supply device is used to provide a soldering ball. The ball mounting device is movably arranged between the ball supply device and the chip clamp, and the ball mounting device has a suction cup. The positioning device is arranged between the ball supply device and the ball mounting device, and is used to position the ball mounting position of the chip. The ball mounting device is switched between the ball suction state and the ball release state. When the ball supply device sprays the soldering ball onto the support seat, the ball mounting device is switched to the ball suction state. After the soldering ball is sucked to the ball mounting position by the suction cup, the ball mounting device is switched to the ball release state, so that the soldering ball falls to the ball mounting position.

[0006] According to the automated ball-planting equipment of this utility model embodiment, the ball-planting device descends in the ball-supplying state to pick up the welding balls ejected by the ball-supplying device and moves to the ball-planting position positioned by the positioning device. The ball-planting device then switches to the ball-releasing state, thereby completing the automated ball-planting process. This simplifies the chip ball-planting process, automates the process, greatly improves ball-planting accuracy, production efficiency, and product quality, and reduces the cost of chip ball-planting. Furthermore, the automated ball-planting equipment is highly adjustable, has a wide range of applications, and can better meet the spacing requirements of welding balls in welding ball shearing tests.

[0007] According to some embodiments of the present invention, the ball supply device includes: a hopper for storing the welding balls; a ball feeding channel, one end of which is connected to the outlet of the hopper, and the other end of which is the ball outlet; and an adjustment mechanism disposed adjacent to the ball outlet for adjusting the opening of the ball outlet.

[0008] According to some embodiments of the present invention, the adjusting mechanism includes a motor, a transmission component, and at least one baffle. The output shaft of the motor is connected to one end of the transmission component, and one end of the transmission component is connected to the baffle. When the motor operates, it drives the baffle to move in a direction perpendicular to the central axis of the ball outlet through the transmission component.

[0009] According to some embodiments of the present invention, the central axis of the ball outlet is perpendicular to the central axis of the ball delivery channel.

[0010] According to some embodiments of the present invention, the ball supply device further includes at least one vibrator, which is disposed on the hopper.

[0011] According to some embodiments of the present invention, the automated ball-planting equipment further includes: a control device, which is communicatively connected to the positioning device, the ball-supplying device, and the ball-planting device, respectively. The control device includes a first camera and a first graphics processing system. The first camera is communicatively connected to the first graphics processing system and is used to capture images of the positioning device, the ball-supplying device, the ball-planting device, and the chip.

[0012] According to some embodiments of the present invention, the positioning device includes a second camera and a second image processing system. The second image processing system is communicatively connected to the second camera and the first image processing system, respectively. The second camera is used to capture surface images of the chip.

[0013] According to some embodiments of the present application, the ball mounting device comprises: a ball mounting body, which is arranged between the ball supply device and the support base; a driving mechanism, which is movably arranged on one side of the ball mounting body adjacent to the support base, and the positioning device and the suction disc are respectively arranged at two ends of the driving mechanism.

[0014] According to some embodiments of the present application, the automatic ball mounting equipment further comprises: a detection device, which is arranged on the ball mounting body and is used for detecting the quality of the chip after ball mounting.

[0015] The packaging substrate according to the second aspect of the present application is prepared by using the automatic ball mounting equipment according to the first aspect of the present application.

[0016] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 is a schematic view of the ball supply device according to the embodiment of the present application;

[0019] Figure 2 is a schematic view of the ball supply device according to the embodiment of the present application;

[0020] Figure 3 is Figure 2 a schematic view of the adjusting mechanism of the ball supply device shown in FIG.

[0021] Figure 4 is a schematic view of the ball mounting device and the positioning device of the automatic ball mounting equipment according to the embodiment of the present application;

[0022] Figure 5 is a partial schematic view of the automatic ball mounting equipment according to the embodiment of the present application.

[0023] REFERENCE NUMERALS:

[0024] 100: automatic ball mounting equipment;

[0025] 1: Support base; 11: Chip holder; 2: Ball supply device; 21: Hopper; 22: Ball feeding channel; 221: Ball outlet; 23: Adjustment mechanism; 231: Motor; 232: Transmission component; 233: Baffle; 234: Vibrator; 3: Ball planting device; 31: Suction cup; 32: Ball planting body; 33: Drive mechanism; 4: Positioning device; 5: Control device; 51: First camera; 52: First image processing system; 6: Detection device. Detailed Implementation

[0026] The following is for reference. Figures 1-5 This invention describes an automated ball-planting device 100 according to an embodiment of the present invention.

[0027] like Figures 1-5 As shown, the automated ball-planting device 100 according to an embodiment of the present utility model includes a support base 1, a ball-supplying device 2, a ball-planting device 3, and a positioning device 4.

[0028] Specifically, a chip holder 11 is mounted on the support base 1, and the chip holder 11 is adapted to hold chips. A ball supply device 2 is located above the support base 1, and the ball supply device 2 is used to provide solder balls. A ball placement device 3 is movably located between the ball supply device 2 and the chip holder 11, and the ball placement device 3 has a suction cup 31. A positioning device 4 is located between the ball supply device 2 and the ball placement device 3, and the positioning device 4 is used to position the chip ball placement.

[0029] The ball-planting device 3 switches between a ball-suction state and a ball-releasing state. When the ball-supplying device 2 sprays the welding ball onto the support seat 1, the ball-planting device 3 switches to a ball-suction state. After the suction cup 31 sucks the welding ball to the ball-planting position, the ball-planting device 3 switches to a ball-releasing state, causing the welding ball to fall to the ball-planting position.

[0030] For example, in Figure 1 In the example, along the direction from bottom to top (e.g., Figure 1The support base 1, the chip holder 11, the ball placement device 3, the positioning device 4 and the ball supply device 2 are arranged in sequence. The support base 1 provides stable support for the entire automatic ball placement device 100, ensuring the stability and reliability of the automatic ball placement device 100 during operation. The chip holder 11 is used to clamp and fix the chip, thereby increasing the stability of the chip placement and improving the accuracy of the ball placement operation. The ball supply device 2 is used to store and provide the solder balls required for ball placement, so as to facilitate the ball placement operation. The ball placement device 3 is used to accurately place the solder balls in the preset position (i.e., the ball placement position) of the chip (e.g., a semiconductor chip), so as to realize mechanized operation and avoid contamination of the chip and the automatic ball placement device 100 caused by manual operation. The suction cup 31 of the ball placement device 3 can be used to suck and place the solder balls, so as to realize switching between the ball suction state and the ball placement state of the ball placement device 3. The positioning device 4 is used to accurately position the position of the chip where the ball placement is required, i.e., to position the ball placement position, so as to improve the accuracy of the ball placement.

[0031] In actual use, the ball supply device 2 sprays the solder balls onto the support base 1, and the support base 1 is suitable for the operation area of the ball suction device of the ball placement device 3. When the ball placement device 3 is switched to the ball suction state, the ball placement device 3 sucks and moves the solder balls. Under the indication of the positioning device 4, the ball placement device 3 moves the solder balls to the ball placement position of the chip. At this time, the ball placement device 3 is switched to the ball placement state, so as to accurately place the solder balls in the ball placement position on the chip. In this way, the automatic ball placement of the chip by the automatic ball placement device 100 is completed.

[0032] Alternatively, the solder balls can be tin balls. No specific limitation is made herein.

[0033] According to the automatic ball placement device 100 of the embodiment of the present application, the ball placement device 3 sucks the solder balls sprayed by the ball supply device 2 in the ball suction state, and moves to the ball placement position positioned by the positioning device 4. The ball placement device 3 is switched to the ball placement state, so as to complete the automatic ball placement of the automatic ball placement device 100. In this way, the process of placing balls on the chip is simplified, the automation of the ball placement process is realized, the ball placement precision, the production efficiency and the product quality are greatly improved, the cost of the chip ball placement is reduced, and meanwhile, the automatic ball placement device 100 has strong adjustability and wide adaptability, and can better meet the spacing requirement of the solder balls in the solder ball shear test.

[0034] According to some embodiments of the present application, reference can be made to Figure 1 and Figure 2The ball supply device 2 comprises a hopper 21, a ball feeding channel 22 and an adjusting mechanism 23. The hopper 21 is used to store the welding balls. One end of the ball feeding channel 22 is in communication with the discharge port of the hopper 21, and the other end of the ball feeding channel 22 is a ball outlet 221. The adjusting mechanism 23 is arranged adjacent to the ball outlet 221, and is used to adjust the opening degree of the ball outlet 221. That is to say, the hopper 21 is arranged on the side of the ball feeding channel 22 away from the support base 1, and the ball outlet 221 is arranged on the side of the ball feeding channel 22 adjacent to the ball implanting device 3, so that the welding balls in the hopper 21 are sprayed out of the ball outlet 221 through the ball feeding channel 22, and the operation of the ball implanting device 3 is facilitated. The adjusting mechanism 23 is arranged, and the opening degree of the ball outlet 221 is adjusted, so that the ball outlet 221 is suitable for welding balls of different sizes and shapes, and the applicability of the ball supply device 2 is increased. For example, for welding balls of larger size, the ball outlet 221 can be enlarged to ensure that the welding balls can be smoothly sprayed out; for welding balls of smaller size, the ball outlet 221 can be reduced to prevent multiple welding balls from being sprayed out at the same time.

[0035] Among them, the hopper 21 is used as a container for storing welding balls, and the shape and size thereof can be designed according to the size and quantity of the welding balls.

[0036] Optionally, the adjusting mechanism 23 comprises a knob and a sliding rail, and a user can manually operate the knob to adjust the size of the ball outlet 221.

[0037] Further, with reference to Figure 1 and Figure 3 The adjusting mechanism 23 comprises a motor 231, a transmission member 232 and at least one baffle 233, one end of the output shaft of the motor 231 is connected with the transmission member 232, one end of the transmission member 232 is connected with the baffle 233, and the motor 231 works to drive the baffle 233 to move in a direction perpendicular to the central axis of the ball outlet 221. In this way, the degree of automation of the adjusting mechanism 23 is improved. The motor 231 is a driving force source of the adjusting mechanism 23, and can rotate. The transmission member 232 converts the rotary motion of the motor 231 into the linear motion of the baffle 233, for example, the transmission member 232 can be a gear transmission device. In use, the motor 231 is driven to move the transmission member 232, and the transmission member 232 drives the baffle 233 to move, so that the baffle 233 moves horizontally in a plane perpendicular to the direction of the welding balls flowing out, to adjust the distance between the baffle 233 and the inner wall of the ball outlet 221 and / or the adjacent baffle 233, that is, to change the size of the ball outlet 221, so that the ball outlet 221 can adapt to welding balls of different sizes and shapes, thereby improving the use effect of the ball supply device 2.

[0038] Therefore, by adjusting the adjusting mechanism 23, the accuracy and consistency of the size of the ball outlet 221 can be ensured, and the efficiency and reliability of the automatic ball planting device 100 are improved. At the same time, the adjusting mechanism 23 can also be quickly adjusted according to actual needs, so that the ball outlet 221 can adapt to welding balls of different sizes and shapes.

[0039] According to some embodiments of the present application, referring to Figure 1 and Figure 3 , the center axis of the ball outlet 221 is perpendicular to the center axis of the ball feeding channel 22. That is, the ball outlet 221 is formed on the side of the ball feeding channel 22, thereby facilitating the spraying of the welding balls to a farther position, avoiding the spraying of the welding balls onto other components, and ensuring the cleanliness of the welding balls.

[0040] In some optional embodiments, referring to Figure 1 and Figure 2 , the ball feeding device 2 further comprises at least one vibrator 234 arranged on the hopper 21. The use of the vibrator 234 facilitates the movement of the welding balls in the hopper 21 along the ball feeding channel 22 to the ball outlet 221, thereby ensuring the smooth spraying of the welding balls from the ball outlet 221.

[0041] According to some embodiments of the present application, referring to Figure 1 and Figure 5 , the automatic ball planting device 100 further comprises a control device 5, which is in communication connection with the positioning device 4, the ball feeding device 2 and the ball planting device 3, and the control device 5 comprises a first camera 51 and a first graphic processing system 52, the first camera 51 is in communication connection with the first graphic processing system 52, and the first camera 51 is used to capture the images of the positioning device 4, the ball feeding device 2, the ball planting device 3 and the chip. The control device 5 is the brain of the entire automatic ball planting device 100, responsible for coordinating and managing the operation of the positioning device 4, the ball feeding device 2 and the ball planting device 3, etc. Among them, the first camera 51 and the first graphic processing system 52 are suitable for monitoring, feedback adjustment and accurate calculation of the ball planting process.

[0042] Specifically, the first camera 51 can monitor the running state of the positioning device 4, the ball feeding device 2 and the ball planting device 3 and the situation of the chip surface in real time. The first graphic processing system 52 can judge the actual size of the ball outlet 221 of the ball feeding device 2, whether the position of the ball planting device 3 is accurate and identify specific marks on the chip based on the images captured by the first camera 51, and make corresponding adjustments. In addition, the first graphic processing system 52 can calculate the appropriate size of the ball outlet 221 and the movement path of the ball planting device 3 through the obtained sensor data or user input values, and based on the above calculation results, the first graphic processing system 52 sends accurate driving signals to the ball feeding device 2 and the ball planting device 3, so that the ball feeding device 2 and the ball planting device 3 can work according to the predetermined parameters.

[0043] Therefore, the control device 5 adopts the first camera 51 and the first graphic processing system 52, improves the precision and efficiency of chip positioning, and realizes accurate control of the whole ball mounting process; through the precise mechanical structure and control system, the automation of the ball mounting process and the precision of the ball mounting position are realized.

[0044] In actual use, the chip is first placed on the chip holder 11. When the ball mounting process starts, the ball supply device 2 sends out the soldering balls one by one, and the first graphic processing system 52 determines the position, size of the chip and the ball mounting position through the first camera 51 and the positioning device 4. At the same time, the first graphic processing system 52 calculates the size of the soldering balls provided by the ball supply device 2 for adjusting the opening of the ball outlet 221 of the ball supply device 2, and calculates the moving path of the ball mounting device 3 for driving the ball mounting device 3 to move to the ball mounting position. The ball mounting device 3 is switched to the ball suction state, sucks a soldering ball, and then moves to the preset position of the chip. The ball mounting device 3 is switched to the ball release state, so as to accurately implant the soldering ball into the ball mounting position of the chip.

[0045] For example, the control device 5 identifies the size of the required soldering ball through the sensor or user input data, and calculates the appropriate size of the ball outlet 221. Then, the control device 5 sends a control signal to the above-mentioned motor 231 to drive the baffle 233 to move to the correct position, thereby automatically adjusting the size of the ball outlet 221. After receiving the control signal, the motor 231 starts to rotate and drives the baffle 233 to move through the transmission member 232 to change the distance between the adjacent baffles 233 and / or the baffle 233 and the inner wall of the adjacent ball outlet 221, thereby adjusting the size of the ball outlet 221 until the preset size is reached. After adjusting the opening of the ball outlet 221, the control device 5 will maintain the current position of the baffle 233 until a new adjustment instruction is received. Therefore, the automatic adjustment design of the automatic ball mounting equipment 100 can ensure the accuracy and consistency of the size of the ball outlet 221, and improve the efficiency and reliability of the automatic ball mounting equipment 100. At the same time, the automatic ball mounting equipment 100 can also quickly adjust the opening of the ball outlet 221 according to actual needs to adapt to soldering balls of different sizes and shapes.

[0046] Therefore, the automatic ball mounting equipment 100 realizes the automation of the ball mounting process and the precision of the position through the precise mechanical structure (the positioning device 4, the ball supply device 2 and the ball mounting device 3) and the control device 5, greatly improves the production efficiency and product quality, and reduces the ball mounting cost of the chip.

[0047] Further, with reference to Figure 1 and Figure 4The positioning device 4 comprises a second camera and a second image processing system, which are respectively in communication connection with the second camera and the first image processing system 52. The second camera is used to capture the surface image of the chip. The positioning device 4 mainly focuses on the identification of the specific position and state of the chip, and is used for accurately positioning the position of the chip where the soldering ball is needed. Specifically, the second camera and the second image processing system can be used for image capture, feature recognition, determination of the ball placement position of the chip, and data transmission. Specifically, the second camera and the second image processing system can capture the image of the surface of the chip, recognize the specific mark or feature on the chip, such as the position, shape or size of the pad, determine the ball placement position of the chip where the soldering ball is needed based on the recognized feature, and then transmit the determined position information to the first image processing system 52 of the control device 5, so that the control device 5 can control the ball placement device 3 to accurately move to the target position for ball placement.

[0048] Optionally, the second camera can capture images through a macro lens or a high-resolution camera.

[0049] Further, referring to Figure 1 and Figure 4 The ball placement device 3 comprises a ball placement body 32 and a driving mechanism 33. The ball placement body 32 is arranged between the ball supply device 2 and the support seat 1. The driving mechanism 33 is movably arranged on one side of the ball placement body 32 adjacent to the support seat 1, and the positioning device 4 and the suction cup 31 are respectively arranged at two ends of the driving mechanism 33. The ball placement device 3 realizes accurate movement in three-dimensional space through the driving mechanism 33. The ball placement body 32 moves under the driving of the driving mechanism 33 to realize the ball suction operation or find the ball placement position. The positioning device 4 is adjacent to the driving mechanism 33, which improves the positioning accuracy and is beneficial to judge the distance between the ball placement body 32 and the ball placement position. In the up-down direction, the suction cup 31 is arranged at one end of the driving mechanism 33 adjacent to the support seat 1, and the positioning device 4 is arranged at one end of the driving mechanism 33 away from the support seat 1, which can avoid direct interference between the suction cup 31 and the positioning device 4, thereby ensuring the reliability of the switching between the ball suction state and the ball release state of the ball placement device 3, and ensuring the positioning accuracy of the positioning device 4. Therefore, it is beneficial to improve the accuracy and automation of implanting the soldering ball on the chip.

[0050] In addition, referring to Figure 1 and Figure 4The automatic ball mounting device 100 further comprises a detection device 6 arranged on the ball mounting body 32, and the detection device 6 is used for detecting the quality of the chip after ball mounting. Thus, by using the detection device 6, the quality of the chip after ball mounting can be controlled, so that the chip after ball mounting can meet the solder ball shear test. Specifically, the detection device 6 can comprise a microscope and a third image processing system. The microscope is used for observing the chip after ball mounting, and the third image processing system is used for processing and analyzing the observed image to determine whether the chip after ball mounting meets the quality standard. If the chip does not meet the standard, the automatic ball mounting device 100 can automatically perform a reballing operation.

[0051] The packaging substrate (not shown in the figure) according to the second aspect of the present application is prepared by using the automatic ball mounting device 100 according to the first aspect of the present application.

[0052] The packaging substrate according to the present application is suitable for the solder ball shear test for testing the soldering performance of the packaging substrate, and is conducive to the smooth progress of the solder ball shear test.

[0053] Other configurations and operations of the packaging substrate according to the present application are known to those skilled in the art, and will not be described in detail here.

[0054] In the description of the present application, it should be understood that the terms "center", "upper", "lower", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0055] In the description of the present application, it should be understood that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0056] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example.

[0057] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. An automated bulb-planting device, characterized in that, include: A support base on which a chip holder is mounted, the chip holder being adapted to hold a chip; A ball supply device is disposed above the support base and is used to supply welding balls; A ball-planting device, which is movably disposed between the ball-supplying device and the chip holder, and the ball-planting device has a suction cup; A positioning device is provided between the ball supply device and the ball placement device, and the positioning device is used to locate the ball placement position of the chip; The ball-planting device switches between a ball-suction state and a ball-releasing state. When the ball-supplying device sprays the welding ball onto the support base, the ball-planting device switches to the ball-suction state. After the suction cup sucks the welding ball to the ball-planting position, the ball-planting device switches to the ball-releasing state, causing the welding ball to fall to the ball-planting position.

2. The automated ball-planting equipment according to claim 1, characterized in that, The ball supply device includes: The hopper is used to store the welded spheres; A ball feeding channel, one end of which is connected to the discharge port of the hopper, and the other end of which is the ball outlet; An adjustment mechanism is provided adjacent to the ball outlet and is used to adjust the opening degree of the ball outlet.

3. The automated bulb-planting equipment according to claim 2, characterized in that, The adjustment mechanism includes a motor, a transmission component, and at least one baffle. The output shaft of the motor is connected to one end of the transmission component, and one end of the transmission component is connected to the baffle. When the motor operates, it drives the baffle to move along a direction perpendicular to the central axis of the ball outlet through the transmission component.

4. The automated ball-planting equipment according to claim 2, characterized in that, The central axis of the ball outlet is perpendicular to the central axis of the ball delivery channel.

5. The automated ball-planting equipment according to claim 2, characterized in that, The ball supply device also includes at least one vibrator, which is located on the hopper.

6. The automated ball-planting equipment according to any one of claims 1-5, characterized in that, Also includes: A control device is communicatively connected to the positioning device, the ball supply device, and the ball planting device. The control device includes a first camera and a first graphics processing system. The first camera is communicatively connected to the first graphics processing system and is used to capture images of the positioning device, the ball supply device, the ball planting device, and the chip.

7. The automated ball-planting equipment according to claim 6, characterized in that, The positioning device includes a second camera and a second image processing system. The second image processing system is communicatively connected to the second camera and the first image processing system, respectively. The second camera is used to capture surface images of the chip.

8. The automated ball-planting equipment according to claim 7, characterized in that, The bulb-planting device includes: The main body for planting balls is located between the ball supply device and the support base; A driving mechanism is movably disposed on one side of the main body of the planter adjacent to the support base, and the positioning device and the suction cup are respectively disposed at both ends of the driving mechanism.

9. The automated ball-planting equipment according to claim 8, characterized in that, Also includes: A detection device is installed on the implanted chip body and is used to detect the quality of the chip after implantation.

10. A packaging substrate, characterized in that, It is prepared using the automated ball-planting equipment described in any one of claims 1-9.

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