Display screen module with chip on film shielding structure

Abstract

The utility model discloses a display screen module with a chip on film shielding structure, which comprises a display module, a flexible circuit board, a printed circuit board (PCB) and a backlight module, the display module is embedded in the front surface of the backlight module, and the PCB is arranged on the back surface of the backlight module; one end of the flexible circuit board is led out from the bottom of the display module, the other end of the flexible circuit board is bent to the back face of the backlight module and is electrically connected with the PCB, the flexible circuit board is provided with a chip on film, and the PCB is provided with a clearance area and a shielding structure corresponding to the chip on film. According to the display screen module with the chip-on-film shielding structure, the clearance area corresponding to the chip-on-film is arranged on the PCB, the chip-on-film is exactly embedded in the clearance area of the PCB, the structure is more compact and small, meanwhile, the shielding structure is arranged on the face, away from the backlight module, of the PCB to cover the clearance area, and therefore the shielding effect is better. And the control IC in the chip-on-film is prevented from being influenced by external electromagnetic interference.

Description

Technical Field

[0001] This utility model relates to the field of display screen technology, and in particular to a display screen module with a flip-chip thin film shielding structure. Background Technology

[0002] Electronic products, especially portable devices, are increasingly adopting thinner and smaller designs. Therefore, new materials and assembly technologies are constantly emerging. COF (Chip On Flex, or Chip On Film), often referred to as flip-chip film, is a die-on-film packaging technology that fixes integrated circuits (ICs) onto flexible circuit boards. It uses a flexible attached circuit board as a chip carrier to combine the chip with the flexible substrate circuitry. Alternatively, it can refer specifically to a flexible attached circuit board without packaged chips. This includes tape-and-roll packaging (TAB substrate, its process is called TCP), flexible board-to-chip assembly, and flexible IC carrier board packaging. It is particularly suitable for small-sized panels such as LCD modules in mobile phones or PDAs.

[0003] FPCs with COF need to be soldered onto PCBs. During assembly, one end of the FPC is electrically connected to the display module, and the other end is soldered onto the PCB. A clearance slot needs to be reserved between the display screen and the PCB to avoid the IC. The clearance slot structure in the existing technology occupies a large space and is complex, and the COF is easily affected by interference.

[0004] For example, Chinese utility model patent (CN209460526U) discloses a liquid crystal display screen, including a front frame, an open-circuit (OC), an inner frame, a backlight assembly, and a rear shell arranged sequentially from top to bottom. The inner frame includes a border and an eaves portion that bends inward from the upper edge of the border. An upwardly extending baffle is provided at the junction of the border and the eaves portion, and a slot is provided on the inner side of the eaves portion inside the baffle. A circuit board is connected to the edge of the glass side of the OC via a core-on-frame (COF). The COF can bypass the inner frame to fix the circuit board to the lower end face of the rear shell. The border has a clearance groove through which the COF passes. Although this patent uses the front frame, the inner frame, and the rear shell to sandwich the OC and the backlight assembly in the middle, and includes rubber pads and rubber strips inside, which can provide both stability and cushioning, the structure is complex, assembly is cumbersome, and it is not conducive to improving the anti-interference performance of the COF. Utility Model Content

[0005] Therefore, it is necessary to provide a display module with a flip-chip thin film shielding structure to address the above-mentioned technical problems.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A display module with a crystal-coated film shielding structure includes: a display module, a flexible circuit board, a PCB board, and a backlight module. The display module is embedded in the front of the backlight module, and the PCB board is placed on the back of the backlight module. One end of the flexible circuit board extends from the bottom of the display module, and the other end of the flexible circuit board is bent to the back of the backlight module and electrically connected to the PCB board. The flexible circuit board is provided with a crystal-coated film, and the PCB board is provided with an air gap area and a shielding structure corresponding to the crystal-coated film.

[0008] As a preferred embodiment of the display module with a flip-chip film shielding structure provided by this utility model, a clearance area is provided at the lower end of the PCB board corresponding to the position of the flip-chip film. The clearance area is a rectangular through hole, and the flip-chip film is embedded in the clearance area of ​​the PCB board.

[0009] As a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, the shielding structure covers the side of the PCB board away from the backlight module and the position corresponding to the clearance area.

[0010] As a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, the shielding structure is a copper foil, which is pasted on the edge of the surrounding area of ​​the clearance zone.

[0011] As a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, a GND copper leakage area is provided around the perimeter of the void area.

[0012] As a preferred embodiment of the display module with a flip-chip film shielding structure provided by this utility model, the copper foil and the flip-chip film are provided with conductive adhesive on the corresponding side, and the copper foil is attached to the GND copper leakage area by the conductive adhesive.

[0013] In a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, a solder is provided on each of the four sides of the copper foil.

[0014] As a preferred embodiment of the display module with flip-chip thin film shielding structure provided by this utility model, copper leakage protrusions are provided on the four sides of the GND copper leakage area, and the solder simultaneously covers the inner edge of the copper leakage protrusions and the outer edge of the copper foil.

[0015] In a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, the thickness of the copper foil is 0.12-0.18 mm, and the thickness of the copper foil includes the thickness of the conductive adhesive.

[0016] In a preferred embodiment of the display module with a flip-chip thin film shielding structure provided by this utility model, the thickness of the copper foil is 0.15mm.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] The display module with a flip-chip film shielding structure provided by this utility model has a corresponding clearance area on the PCB board. When the flexible circuit board is bent to the back of the backlight module, the flip-chip film is embedded in the clearance area of ​​the PCB board. The structure of the whole device is more compact and small, occupies less space, and looks more beautiful. At the same time, a shielding structure is set on the side of the PCB board away from the backlight module to cover the clearance area, preventing external electromagnetic interference from affecting the control IC inside the flip-chip film. Attached Figure Description

[0019] Figure 1 A schematic diagram of the display module with a flip-chip thin film shielding structure provided by this utility model;

[0020] Figure 2 A side view of the display module with a flip-chip thin film shielding structure provided by this utility model;

[0021] Figure 3 This is a schematic diagram of the display module with a flip-chip thin film shielding structure provided by this utility model;

[0022] Figure 4 A side view of the display module with a flip-chip thin film shielding structure provided by this utility model;

[0023] Figure 5 Schematic diagram of the back structure of the PCB board with flip-chip thin film shielding structure provided by this utility model Figure 1 ;

[0024] Figure 6 Schematic diagram of the back structure of the PCB board with flip-chip thin film shielding structure provided by this utility model Figure 2 .

[0025] The markings in the diagram are explained as follows:

[0026] Display module 1, upper polarizer 11, upper glass plate 12, lower glass plate 13, lower polarizer 14;

[0027] Flexible circuit board 2, flip-chip film 21;

[0028] PCB board 3, component area 31, connecting pin 32, clearance area 33, GND copper leakage area 34, copper leakage protrusion 341, copper foil 35, solder 36;

[0029] Backlight module 4;

[0030] Double-sided foam adhesive 5. Detailed Implementation

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0032] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0033] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] As described in the background section, existing displays with COFs are complex and not compact enough when assembled with PCB boards, and cannot protect the COFs from external interference.

[0035] To solve this technical problem, this utility model provides a display module with a flip-chip thin film shielding structure, which has a shielding structure to protect COF.

[0036] For details, please refer to Figures 1-6A display module with a flip-chip film shielding structure includes: a display module 1, a flexible circuit board 2, a PCB board 3, and a backlight module 4. The display module 1 is embedded on the front side of the backlight module 4, and the PCB board 3 is placed on the back side of the backlight module 4. One end of the flexible circuit board 2 extends from the bottom of the display module 1, and the other end of the flexible circuit board 2 is bent to the back side of the backlight module 4 and electrically connected to the PCB board 3. The flexible circuit board 2 is provided with a flip-chip film 21, and the PCB board 3 is provided with an air gap 33 corresponding to the flip-chip film 21 and a shielding structure.

[0037] The display module with a crystal-coated film shielding structure provided by this utility model has a clearance area 33 corresponding to the crystal-coated film 21 set on the PCB board 3. When the flexible circuit board 2 is bent to the back of the backlight module 4, the crystal-coated film 21 is embedded in the clearance area 33 of the PCB board. The structure of the whole device is more compact and small, occupies less space, and looks more beautiful. At the same time, a shielding structure is set on the side of the PCB board 3 away from the backlight module 4 to cover the clearance area 33, so as to prevent external electromagnetic interference from affecting the control IC in the crystal-coated film 21.

[0038] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0039] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0040] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0041] Example 1

[0042] Please refer to Figures 1-6 This embodiment provides a display module with a flip-chip thin-film shielding structure, comprising a display module 1, a backlight module 4, and a PCB board 3. The display module 1 is embedded in the front of the backlight module 4, and the PCB board 3 is placed on the back of the backlight module 4. Further, the display module also includes a flexible circuit board 2, which extends from the bottom of the display module 1, and the backlight module 4 is fixed to the PCB board 3. Further, a flexible backlight circuit board (not shown in the figure) extends from the bottom of the backlight module 4 and is soldered to the flexible circuit board 2.

[0043] Furthermore, the display module 1 includes, from top to bottom, an upper polarizer 11, an upper glass sheet 12, a lower glass sheet 13, and a lower polarizer 14 stacked sequentially. Liquid crystal material is disposed between the upper glass sheet 12 and the lower glass sheet 13. The lower glass sheet 14 is larger than the upper glass sheet 12 and its bottom protrudes from the upper glass sheet 12. Specifically, the bottom of the lower glass sheet 14 protrudes from the upper glass sheet 12 and is connected to the flexible circuit board 2.

[0044] Furthermore, the flexible circuit board 2 includes a flip-chip film 21 and gold fingers 22. The flip-chip film 21 contains a control IC, and the gold fingers 22 are located at the end of the flexible circuit board 2. Specifically, one end of the flexible circuit board 2 is connected to the lower glass sheet 13 of the display module 1 and then bent to the back of the backlight module 4. The gold fingers 22 at the end of the flexible circuit board 2 are soldered to the PCB board 3. After the flexible circuit board 2 and the PCB board 3 are electrically connected, the control of the display module is realized.

[0045] Furthermore, the flip-chip film 21 is bent together with the flexible circuit board 2 to the back of the backlight module 4 and corresponds to the position where the bottom of the lower glass sheet 14 protrudes from the upper glass sheet 12.

[0046] Furthermore, the back of the backlight module 4 and the PCB board 3 are provided with double-sided foam adhesive 5. The display module is fixed to the front of the PCB board 3 by the double-sided foam adhesive 5. During assembly, the flexible circuit board 2 is led out from the bottom of the display module 1 and bent to the back of the backlight module 4, and the gold fingers 22 are soldered to the PCB board 3. Then, the PCB board 3 with the gold fingers 22 of the soldered flexible circuit board 2 is pasted to the back of the backlight module 4 using double-sided foam adhesive 5.

[0047] Furthermore, the lower end of the PCB board 3 is provided with a clearance area 33 corresponding to the position of the flip-chip film 21. The clearance area 33 is a rectangular through hole. When the backlight module 4 and the PCB board 3 are pasted and fixed, the flip-chip film 21 is precisely embedded in the clearance area 33 of the PCB board 3.

[0048] Furthermore, such as Figure 5 and 6 As shown, the PCB board 3 also has a shielding structure for the flip-chip film 21, which shields the flip-chip film 21 and protects the IC. The shielding structure covers the side of the PCB board 3 away from the backlight module 4, corresponding to the void area 33. Furthermore, the shielding structure is a copper foil 35, which is adhered to the edges around the void area 33. The copper foil 35 effectively blocks the propagation of electromagnetic waves, improving the stability and reliability of the flip-chip film 21.

[0049] Specifically, a GND copper leakage area 34 is provided around the perimeter of the clearance area 33. Conductive adhesive is provided on the side of the copper foil 35 corresponding to the flip-chip film. The copper foil 35 is adhered to the GND copper leakage area 34 using the conductive adhesive, initially fixing the copper foil 35 to the PCB board 3. Then, a solder 36 is placed on each of the four sides of the copper foil 35 to further reinforce it. Specifically, copper leakage protrusions 341 are provided on the four sides of the GND copper leakage area 34. The solder 36 is placed at the corresponding positions of the copper leakage protrusions 341 to fix the copper foil 35 to the GND copper leakage area 34. Each solder 36 simultaneously covers the inner edge of the copper leakage protrusion 341 and the outer edge of the copper foil 35.

[0050] Furthermore, the thickness of the copper foil 35 is 0.12 to 0.18 mm, and the thickness of the copper foil 35 includes the thickness of the conductive adhesive. Preferably, in this embodiment, the thickness of the copper foil 35 is 0.15 mm.

[0051] Furthermore, the back side of the PCB board 3 also includes a component area 31 for mounting and fixing various electronic components, as well as connecting pins 32.

[0052] The assembly process of the display module with a flip-chip thin-film shielding structure provided by this utility model is as follows:

[0053] The display module 1 is embedded on the front of the backlight module 4, and the PCB board 3 is placed on the back of the backlight module 4. One end of the flexible circuit board 2 is soldered to the bottom end of the upper glass plate 12. Then, the flexible circuit board 2 is bent towards the back of the backlight module 4. The gold fingers 22 at the end of the flexible circuit board 2 are soldered to the PCB board 3. The PCB board 3 with the flexible circuit board 2 soldered on is pasted to the back of the backlight module 4 with double-sided foam adhesive 5. At this time, the flip-chip film 21 corresponds to the clearance area of ​​the PCB board 3. The copper foil 35 is pasted to the GND copper leakage area 34 with the conductive adhesive on the side facing the flip-chip film 21. The copper foil 35 is initially fixed to the PCB board 3. Then, the solder 36 is placed at the position corresponding to the copper leakage protrusion 341 to fix the copper foil 35 to the GND copper leakage area 34. By adding a simple shielding structure, the control IC built into the flip-chip film 21 is prevented from being interfered with by the outside.

[0054] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0055] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; conversely, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A display module with a flip-chip thin-film shielding structure, characterized in that, It includes: The display module (1), flexible circuit board (2), PCB board (3), and backlight module (4) are provided. The display module (1) is embedded on the front of the backlight module (4), and the PCB board (3) is placed on the back of the backlight module (4). One end of the flexible circuit board (2) extends from the bottom of the display module (1), and the other end of the flexible circuit board (2) is bent to the back of the backlight module (4) and electrically connected to the PCB board (3). The flexible circuit board (2) is provided with a flip-chip film (21), and the PCB board (3) is provided with an air gap area (33) and a shielding structure corresponding to the flip-chip film (21).

2. The display module with a flip-chip thin-film shielding structure according to claim 1, characterized in that, The lower end of the PCB board (3) is provided with a void area (33) corresponding to the position of the flip-chip film (21). The void area (33) is a rectangular through hole, and the flip-chip film (21) is embedded in the void area (33) of the PCB board (3).

3. The display module with a flip-chip thin-film shielding structure according to claim 2, characterized in that, The shielding structure covers the side of the PCB board (3) away from the backlight module (4) and the position corresponding to the clearance area (33).

4. The display module with a flip-chip thin-film shielding structure according to claim 3, characterized in that, The shielding structure is a copper foil (35), which is pasted on the edges around the shelter area (33).

5. The display module with a flip-chip thin-film shielding structure according to claim 4, characterized in that, The surrounding edges of the void area (33) are provided with a GND copper leakage area (34).

6. The display module with a flip-chip thin-film shielding structure according to claim 5, characterized in that, The copper foil (35) is provided with conductive adhesive on the side corresponding to the flip-chip film, and the copper foil (35) is attached to the GND copper leakage area (34) by the conductive adhesive.

7. The display module with a flip-chip thin-film shielding structure according to claim 6, characterized in that, A solder (36) is provided on each of the four sides of the copper foil (35).

8. The display module with a flip-chip thin-film shielding structure according to claim 7, characterized in that, The GND copper leakage area (34) has copper leakage protrusions (341) on its four sides, and the solder (36) simultaneously covers the inner edge of the copper leakage protrusions (341) and the outer edge of the copper foil (35).

9. The display module with a flip-chip thin-film shielding structure according to claim 6, characterized in that, The thickness of the copper foil (35) is 0.12 to 0.18 mm, and the thickness of the copper foil (35) includes the thickness of the conductive adhesive.

10. The display module with a flip-chip thin-film shielding structure according to claim 9, characterized in that, The thickness of the copper foil (35) is 0.15 mm.

Images