Monopole dual-frequency antenna

Abstract

A monopole dual-frequency antenna comprises an antenna structure and a mainboard. The antenna structure comprises a circuit board, a high-frequency radiation layer, a low-frequency radiation layer, a conductive metal layer and a half-hole electrode layer. The circuit board is provided with a front surface, a back surface, a top surface, a bottom surface and two side surfaces. The high-frequency radiation layer is arranged on the front surface. The low-frequency radiation layer is arranged on the back surface. The conductive metal layer is arranged on the top surface, one end of the conductive metal layer is electrically connected with the high-frequency radiation layer, and the other end is electrically connected with the low-frequency radiation layer. The half-hole electrode layer is arranged on the bottom surface, penetrates through the bottom surface and is electrically connected with the high-frequency radiation layer on the front surface. The mainboard at least comprises a bonding pad and a signal feed-in layer. The semi-hole electrode layer is electrically and fixedly connected with the bonding pad and the signal feed-in layer, and after a signal is fed in, two current paths are generated at the same time and respectively flow through the high-frequency radiation layer and the low-frequency radiation layer.

Description

Technical Field

[0001] This utility model relates to an antenna, and more particularly to a single-pole dual-band antenna in which the antenna structure is side-mounted and soldered onto a motherboard. Background Technology

[0002] With the widespread adoption of the internet and people's increasing reliance on it, more and more internet access devices have emerged, such as Wi-Fi products, network communication products, Internet of Things (IoT) devices, IP cameras, routers, and modems. The antenna structures used in most of these devices employ etching techniques to create different radiating layer patterns on copper foil on a circuit board for signal reception and transmission.

[0003] However, a high-frequency radiating layer and a low-frequency radiating layer are fabricated on the circuit board. There is a coupling gap between the high-frequency radiating layer and the low-frequency radiating layer. This coupling gap can shorten the low-frequency current path, reduce the size of the antenna structure, and adjust the antenna impedance, operating bandwidth, and antenna performance.

[0004] Because the antenna structure has a coupling gap between the high-frequency radiating layer and the low-frequency radiating layer, this coupling gap can shorten the low-frequency current path and reduce the size of the antenna structure. However, the size of the coupling gap between the high-frequency radiating layer and the low-frequency radiating layer cannot be easily adjusted during antenna structure fabrication. Therefore, if the coupling gap is not properly adjusted, it will lead to a decrease in antenna performance and cause difficulties in antenna structure fabrication.

[0005] Therefore, the main problem to be solved by this invention is how to make the antenna easier to manufacture, shorten the low-frequency current path, and reduce the size of the antenna. Utility Model Content

[0006] Therefore, the main purpose of this utility model is to solve the shortcomings of the traditional method. This utility model redesigns the antenna structure so that the high-frequency radiation layer and the low-frequency radiation layer of the antenna are electrically linked through a conductive metal layer, which makes the antenna easier to manufacture and can shorten the low-frequency current path and reduce the size of the antenna.

[0007] To achieve the above objectives, this utility model provides a single-pole dual-band antenna, comprising: an antenna structure and a main board. The antenna structure includes: a circuit board, a high-frequency radiating layer, a low-frequency radiating layer, a conductive metal layer, and at least one half-hole electrode layer. The circuit board is rectangular, having a front surface, a back surface, a top surface, a bottom surface, and two side surfaces. The high-frequency radiating layer is disposed on the front surface of the circuit board. The low-frequency radiating layer is disposed on the back surface of the circuit board. The conductive metal layer is disposed on the top surface of the circuit board, with one end electrically connected to the high-frequency radiating layer and the other end electrically connected to the low-frequency radiating layer. The half-hole electrode layers are respectively disposed on the bottom surface of the circuit board, penetrating the bottom surface and electrically connected to the high-frequency radiating layer on the front surface. The main board includes at least: a solder pad and a signal feed layer. The semi-hole electrode layer is electrically fixed to the pad and the signal feed layer. After the signal is fed in, two current paths are generated simultaneously, flowing through the high-frequency radiation layer and the low-frequency radiation layer respectively.

[0008] In one embodiment of the present invention, the high-frequency radiation layer includes a trapezoidal metal layer and an edge metal layer electrically connected to the trapezoidal metal layer; the edge metal layer extends along the junction of the front surface and one of the side surfaces of the circuit board to the junction of the top surface and the front surface.

[0009] In one embodiment of the present invention, the low-frequency radiation layer is a side metal line segment. The side metal line segment extends along the junction of the top surface and the back surface of the circuit board, and then extends from the junction of one side surface and the back surface of the circuit board to the junction of the other side surface and the back surface.

[0010] In one embodiment of the present invention, one end of the conductive metal layer is electrically connected to the edge metal layer of the high-frequency radiation layer.

[0011] In one embodiment of the present invention, one end of the semi-hole electrode layer is electrically connected to the trapezoidal metal layer on the front side of the circuit board.

[0012] In one embodiment of this utility model, the semi-circular, semi-elliptical, or polygonal electrode layer is formed.

[0013] In one embodiment of the present invention, an electrode layer is further included, disposed on the back side of the circuit board and located at the junction of the bottom surface and the back side; the electrode layer includes a first electrode layer and a second electrode layer, the first electrode layer and the second electrode layer being electrically connected to the half-hole electrode layer.

[0014] In one embodiment of the present invention, the motherboard has a front side and a back side, and each of the front side and the back side has a symmetrical first ground layer, a second ground layer, a first clearance area and a second clearance area. The first clearance area of ​​the motherboard has a pad, which includes a first pad and a second pad.

[0015] In one embodiment of this utility model, the first pad and the second pad of the pad are shaped like an H or a Roman numeral II.

[0016] In one embodiment of the present invention, the front side of the motherboard has a signal feed layer coupled to the first ground layer, the signal feed layer comprising a first signal feed layer and a second signal feed layer.

[0017] In one embodiment of the present invention, the first signal feed layer, the second signal feed layer, the first ground layer and the pad each have a plurality of solder joints, such that the solder joints between the first signal feed layer and the second signal feed layer, and each solder joint between the first signal feed layer and the second signal feed layer, the pad and the first ground layer are electrically connected to a matching component.

[0018] In one embodiment of this invention, the matching component is an inductor or a capacitor.

[0019] In one embodiment of the present invention, a half-hole metal layer is provided on the circuit board. The half-hole metal layer is disposed on the top surface. One end of the half-hole metal layer is electrically connected to the high-frequency radiation layer, and the other end is electrically connected to the low-frequency radiation layer.

[0020] In one embodiment of the present invention, a through-hole metal layer is provided on the circuit board, the through-hole metal layer penetrates the circuit board, so that one end of the through-hole metal layer is electrically connected to the high-frequency radiation layer and the other end is electrically connected to the low-frequency radiation layer. Attached Figure Description

[0021] Figure 1 This is an exploded view of the antenna structure and motherboard of the first embodiment of this utility model;

[0022] Figure 2 yes Figure 1 Another perspective on the antenna structure and the exploded diagram of the motherboard;

[0023] Figure 3 yes Figure 1 A three-dimensional combination diagram;

[0024] Figure 4 yes Figure 2 A three-dimensional combination diagram;

[0025] Figure 5 This is an exploded view of the antenna structure and motherboard of the second embodiment of this utility model;

[0026] Figure 6 yes Figure 5 Another perspective on the antenna structure and the exploded diagram of the motherboard;

[0027] Figure 7 This is an exploded view of the antenna structure and motherboard according to the third embodiment of this utility model;

[0028] Figure 8 yes Figure 7 Another perspective on the antenna structure and the exploded diagram of the motherboard. Detailed Implementation

[0029] The technical content and detailed description of this utility model are now explained in conjunction with the accompanying drawings:

[0030] Please see Figures 1-4 The first embodiment of this utility model includes an exploded view of the antenna structure and the motherboard. Figure 1 Another perspective on the antenna structure and the exploded diagram of the motherboard. Figure 1 3D combination diagram and Figure 2 A three-dimensional combined schematic diagram is shown. As shown in the figure: The monopole dual-frequency antenna of this utility model includes an antenna structure 10 and a main board 20. The antenna structure 10 includes: a circuit board 1, a high-frequency radiating layer 2, a low-frequency radiating layer 3, a conductive metal layer 4, an electrode layer 5, and at least one half-hole electrode layer 6.

[0031] The circuit board 1 is a square shape, having a front surface 11, a back surface 12, a top surface 13, a bottom surface 14, and two side surfaces 15. In this drawing, the circuit board 1 is a printed circuit board.

[0032] The high-frequency radiation layer 2 is disposed on the front side 11 of the circuit board 1. The high-frequency radiation layer 2 includes a trapezoidal metal layer 21 and an edge metal layer 22 electrically connected to the trapezoidal metal layer 21. The edge metal layer 22 extends along the junction of the front side 11 and one of its side surfaces 15 to the junction of the top surface 13 and the front side 11.

[0033] The low-frequency radiation layer 3 is disposed on the back side 12 of the circuit board 1. The low-frequency radiation layer 3 is a side metal line segment. The side metal line segment extends from the junction of the top surface 13 and the back side 12, and then from the junction of one side 15 and the back side 12 of the circuit board 1 to the junction of the other side 15 and the back side 12.

[0034] It is worth mentioning that the high-frequency radiating layer 2 and the low-frequency radiating layer 3 are electrically connected together. When a signal is fed in, two current paths are generated simultaneously. One long path flows through the low-frequency radiating layer 3 to generate a low-frequency 2.4G band; the other short path flows through the trapezoidal metal layer 21 and the edge metal layer 22 of the high-frequency radiating layer 2 to generate a high-frequency 5-6G band. Since the high-frequency radiating layer 2 has a large area trapezoidal metal layer 21, the bandwidth of the antenna structure 10 can be increased.

[0035] The conductive metal layer 4 is disposed on the top surface 13. One end of the conductive metal layer 4 is electrically connected to the edge metal layer 22 of the high-frequency radiation layer 2, and the other end is electrically connected to the low-frequency radiation layer 3. After the signal is fed in, two current paths can be generated simultaneously.

[0036] The electrode layer 5 is disposed on the back surface 12 of the circuit board 1, and is located at the junction of the bottom surface 14 and the back surface 12. The electrode layer 5 includes a first electrode layer 51 and a second electrode layer 52. The first electrode layer 51 and the second electrode layer 52 are used to provide electrical bonding with the first pad 2051 and the second pad 2052 on the motherboard 20.

[0037] The semi-hole electrode layer 6 is disposed on the bottom surface 14 of the circuit board 1 and penetrates the bottom surface 14 of the circuit board 1. One end of the semi-hole electrode layer 6 is electrically connected to the trapezoidal metal layer 21 of the high-frequency radiation layer 2 on the front side 11 of the circuit board 1, and the other end is electrically connected to a first electrode layer 51 and a second electrode layer 52 of the electrode layer 5 on the back side 12. In this figure, the semi-hole electrode layer 6 is semi-circular, semi-elliptical, or polygonal.

[0038] It is worth mentioning that the design of the semi-hole electrode layer 6 reduces the manufacturing cost of the antenna structure 10, and allows the antenna structure 10 to be electrically fixed to the first pad 2051 and the second pad 2052 of the pad 205 on the motherboard 20 without damaging the original motherboard 20 structure.

[0039] When the antenna structure 10 of this utility model is used with the motherboard 20 of the electronic device, the front and back of the motherboard 20 each have a first ground layer 201, a second ground layer 202, a first clearance area 203 and a second clearance area 204 that are symmetrically arranged. The first clearance area 203 of the motherboard 20 has a pad 205, which includes a first pad 2051 and a second pad 2052.

[0040] Additionally, a signal feed layer 206 coupled to the first ground layer 201 is located on the front side of the motherboard 20. This signal feed layer 206 includes a first signal feed layer 2061 and a second signal feed layer 2062. Multiple solder points 2063, 2011, and 2053 are respectively located on the signal feed layer 206, the first ground layer 201, and the pad 205. Each solder point 2063, 2053, and 2011 between the first signal feed layer 2061, the second signal feed layer, the pad 205, and the first ground layer 201 is electrically connected to a matching component (not shown in the figure) for adjusting the impedance and frequency characteristics of the antenna structure 10. In this diagram, the first pad 2051 and the second pad 2052 of the pad 205 are H-shaped or in the shape of a Roman numeral II.

[0041] It is worth mentioning that the present invention mentions that the matching components electrically connected to the solder joints 2063 between the first signal feed layer 2061 and the second signal feed layer 2062 of the signal feed layer 206, and the solder joints 2063, 2053, and 2011 between the first signal feed layer 2061 and the second signal feed layer 2062, the solder pad 205, and the first ground layer 201 are inductors or capacitors. In manufacturing, the impedance and frequency characteristics of the antenna structure 10 can be adjusted so that the impedance and frequency characteristics of the antenna structure 10 are suitable for use in electronic products.

[0042] Because the signal fed into the antenna structure 10 via the signal feed layer 206 generates two current paths simultaneously, one long path flows through the low-frequency radiating layer 3, generating a low-frequency 2.4 GHz band. The other short path flows through the trapezoidal metal layer 21 and the edge metal layer 22 of the high-frequency radiating layer 2, generating a high-frequency 5-6 GHz band. Since the high-frequency radiating layer 2 has a large-area trapezoidal metal layer 21, the bandwidth of the antenna structure 10 can be increased. This allows the antenna structure 10 to generate two current paths simultaneously, enabling rapid switching between high-frequency and low-frequency signal transmission and reception, resulting in more stable signal transmission and reception performance and gain.

[0043] In addition, the design of the pads 205 on the motherboard 20 can increase the stability and firmness of the antenna structure 10 during soldering, prevent the antenna structure 10 from shifting or deviating during surface mount technology (SMT) manufacturing, and also increase the pads 205 to firmly grasp or fix the antenna structure 10 body, thereby improving the problem of falling when dropped.

[0044] Please see Figure 5 , 6 An exploded view of the antenna structure and motherboard of the second embodiment of this utility model. Figure 5 Another perspective of the antenna structure and the exploded diagram of the motherboard, also referencing... Figures 1-4 As shown in the figure: This embodiment is largely the same as the antenna structure 10 and main board 20 in the first embodiment. The difference is that the conductive metal layer 4 of the antenna structure 10 can be designed as a half-hole metal layer 4a. The half-hole metal layer 4a is disposed on the top surface 13 of the circuit board 1. One end of the half-hole metal layer 4a is electrically connected to the edge metal layer 22 of the high-frequency radiation layer 2, and the other end is electrically connected to the low-frequency radiation layer 3. Two current paths can be generated simultaneously after the signal is fed in.

[0045] These two current paths are as follows: one is a long path flowing through the low-frequency radiating layer 3, generating a low-frequency 2.4 GHz band; the other is a short path flowing through the trapezoidal metal layer 21 and the edge metal layer 22 of the high-frequency radiating layer 2, generating a high-frequency 5-6 GHz band. Since the high-frequency radiating layer 2 has a large-area trapezoidal metal layer 21, the bandwidth of the antenna structure 10 can be increased. Therefore, the antenna structure 10 can generate two current paths simultaneously, enabling rapid switching between high-frequency and low-frequency signals during transmission and reception, resulting in more stable signal transmission and reception performance and gain.

[0046] Please see Figure 7 , 8 An exploded view of the antenna structure and motherboard of the third embodiment of this utility model. Figure 7 Another perspective of the antenna structure and the exploded diagram of the motherboard, also referencing... Figures 1-6 As shown in the figure: This embodiment is largely the same as the antenna structure 10 and main board 20 in the first and second embodiments. The difference is that the conductive metal layer 4 or the half-hole metal layer 4a of the antenna structure 10 can be designed as a through-hole metal layer 4b. The through-hole metal layer 4b directly penetrates the circuit board 1, so that one end of the through-hole metal layer 4b is electrically connected to the edge metal layer 22 of the high-frequency radiation layer 2, and the other end is electrically connected to the low-frequency radiation layer 3. After the signal is fed in, two current paths are generated at the same time.

[0047] The two current paths are as follows: one is a long path flowing through the low-frequency radiating layer 3, generating a low-frequency 2.4 GHz band; the other is a short path flowing through the trapezoidal metal layer 21 and the edge metal layer 22 of the high-frequency radiating layer 2, generating a high-frequency 5-6 GHz band. Since the high-frequency radiating layer 2 has a large-area trapezoidal metal layer 21, the bandwidth of the antenna structure 10 can be increased. This antenna structure 10 can generate two current paths simultaneously, enabling rapid switching between high-frequency and low-frequency signal transmission and reception, resulting in more stable signal transmission and reception performance and gain.

[0048] However, the above description is only a preferred embodiment of the present utility model and is not intended to limit the scope of patent protection of the present utility model. Therefore, all equivalent changes made based on the content of the present utility model specification or drawings are similarly included within the scope of protection of the present utility model and are explained accordingly.

[0049] [Symbol Explanation]

[0050] 10: Antenna Structure

[0051] 1: Circuit board

[0052] 11: Front

[0053] 12: Back

[0054] 13: Top surface

[0055] 14: Bottom surface

[0056] 15: Side view

[0057] 2: High-frequency radiation layer

[0058] 21: Trapezoidal metal layer

[0059] 22: Edge metal layer

[0060] 3: Low-frequency radiation layer

[0061] 4: Conductive metal layer

[0062] 4a: Semi-porous metal layer

[0063] 4b: Perforated metal layer

[0064] 5: Electrode layer

[0065] 51: First electrode layer

[0066] 52: Second electrode layer

[0067] 6: Semi-hole electrode layer

[0068] 20: Motherboard

[0069] 201: First grounding layer

[0070] 202: Second grounding layer

[0071] 203: First Clear Zone

[0072] 204: Second Clear Zone

[0073] 205: Solder pad

[0074] 2051: First Pad

[0075] 2052: Second pad

[0076] 2053, 2063, 2011: Welding points

[0077] 206: Signal Feed Layer

[0078] 2061: First signal feed layer

[0079] 2062: Second signal feed layer

Claims

1. A single-pole dual-band antenna, characterized in that, include: A single antenna structure and a motherboard; The antenna structure includes: A circuit board is a square shape, having a front, a back, a top, a bottom, and two side surfaces. A high-frequency radiation layer is disposed on the front side of the circuit board; A low-frequency radiation layer is disposed on the back side of the circuit board; A conductive metal layer is disposed on the top surface of the circuit board, one end of the conductive metal layer being electrically connected to the high-frequency radiation layer and the other end being electrically connected to the low-frequency radiation layer; and At least one semi-hole electrode layer is disposed on the bottom surface of the circuit board and penetrates the bottom surface to be electrically connected to the high-frequency radiation layer on the front surface; The motherboard includes at least: a pad and a signal feed layer; The semi-hole electrode layer is electrically fixed to the pad and the signal feed layer. After the signal is fed in, two current paths are generated simultaneously, flowing through the high-frequency radiation layer and the low-frequency radiation layer respectively.

2. The monopole dual-band antenna according to claim 1, characterized in that, The high-frequency radiation layer includes a trapezoidal metal layer and an edge metal layer electrically connected to the trapezoidal metal layer; the edge metal layer extends along the junction of the front surface and one of the side surfaces of the circuit board to the junction of the top surface and the front surface.

3. The single-pole dual-band antenna according to claim 2, characterized in that, The low-frequency radiation layer is a side metal line segment. The side metal line segment extends along the junction of the top surface and the back surface of the circuit board, and then extends from the junction of one side surface and the back surface of the circuit board to the junction of the other side surface and the back surface.

4. The single-pole dual-band antenna according to claim 3, characterized in that, One end of the conductive metal layer is electrically connected to the edge metal layer of the high-frequency radiation layer.

5. The single-pole dual-band antenna according to claim 4, characterized in that, One end of the semi-hole electrode layer is electrically connected to the trapezoidal metal layer on the front side of the circuit board.

6. The single-pole dual-band antenna according to claim 5, characterized in that, The semi-hole electrode layer is semi-circular, semi-elliptical, or polygonal.

7. The monopole dual-band antenna according to claim 5, characterized in that, It also includes an electrode layer disposed on the back side of the circuit board and located at the junction of the bottom surface and the back side; the electrode layer includes a first electrode layer and a second electrode layer, the first electrode layer and the second electrode layer being electrically connected to the half-hole electrode layer.

8. The single-pole dual-band antenna according to claim 7, characterized in that, The motherboard has a front side and a back side. The front side and the back side of the motherboard each have a symmetrical first ground layer, a second ground layer, a first clearance area and a second clearance area. The first clearance area of ​​the motherboard has a pad, which includes a first pad and a second pad.

9. The single-pole dual-band antenna according to claim 8, characterized in that, The first and second pads of the pads are shaped like an H or a Roman numeral II.

10. The monopole dual-band antenna according to claim 8, characterized in that, The front side of the motherboard has a signal feed layer coupled to the first ground layer, the signal feed layer comprising a first signal feed layer and a second signal feed layer.

11. The monopole dual-band antenna according to claim 10, characterized in that, The first signal feed layer, the second signal feed layer, the first ground layer, and the pad each have a plurality of solder points, such that the solder points between the first signal feed layer and the second signal feed layer, and each solder point between the first signal feed layer and the second signal feed layer, the pad, and the first ground layer are electrically connected to a matching component.

12. The monopole dual-band antenna according to claim 11, characterized in that, The matching component is an inductor or a capacitor.

13. The monopole dual-band antenna according to claim 1, characterized in that, The circuit board has a half-hole metal layer, which is located on the top surface. One end of the half-hole metal layer is electrically connected to the high-frequency radiation layer, and the other end is electrically connected to the low-frequency radiation layer.

14. The monopole dual-band antenna according to claim 1, characterized in that, The circuit board has a through-hole metal layer that penetrates the circuit board, so that one end of the through-hole metal layer is electrically connected to the high-frequency radiation layer and the other end is electrically connected to the low-frequency radiation layer.

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