Dust removal device for wafer detection

Abstract

The utility model discloses a dust removal device for wafer detection, which is applied to the field of dust removal devices and comprises a base, the top of the base is slidably sleeved with a fixed cylinder, a partition plate is mounted in the fixed cylinder, the bottom of the partition plate is bolted with a motor, and the output end of the motor is fixedly sleeved with a transmission shaft. And a bearing plate is installed at the other end of the transmission shaft, a dust removal mechanism is arranged in the fixing cylinder, a filter screen plate is arranged in the fixing cylinder, the surface of the fixing cylinder is fixedly sleeved with a second fixing frame, and the surface of the fixing cylinder is fixedly sleeved with an air suction pipe communicating with the second fixing frame. The wafer surface dust removal device can have an automatic rotation function, can improve the dust removal effect of the wafer surface, reduces the nearby assistance burden of personnel, is good in flexibility, can conveniently collect and treat foreign matters, is simple and convenient to operate, reduces the cleaning burden of the personnel, and is high in practicability.

Description

Technical Field

[0001] This utility model relates to the field of dust removal devices, and in particular to a dust removal device for wafer inspection. Background Technology

[0002] Currently, Chinese utility model patent CN209843674U discloses a dust removal device for wafer inspection. While this device can blow impurities off the wafer surface, it has other problems during use. For example, it lacks an automatic rotation function, and the air inlet's position is fixed after opening, failing to fully cover the wafer from above. This results in uneven airflow across the wafer surface and makes it difficult to collect and process foreign objects. Dust on the wafer surface, after being blown away by the wind, tends to disperse and settle at the bottom. Blowing this out of the device would pollute the surrounding environment and increase the cleaning burden on personnel. To address these problems, we propose a dust removal device for wafer inspection. Utility Model Content

[0003] The purpose of this invention is to provide a dust removal device for wafer inspection, which solves the problems of existing dust removal devices lacking automatic rotation function and being inconvenient for collecting and processing foreign objects.

[0004] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a dust removal device for wafer inspection, comprising a base, a fixed cylinder slidably sleeved on the top of the base, a partition installed inside the fixed cylinder, a motor bolted to the bottom of the partition, a drive shaft fixedly sleeved at the output end of the motor, a bearing plate installed at the other end of the drive shaft, a dust removal mechanism provided inside the fixed cylinder, a filter plate provided inside the fixed cylinder, a second fixed frame fixedly sleeved on the surface of the fixed cylinder, a suction pipe fixedly sleeved on the surface of the fixed cylinder communicating with the second fixed frame, and a suction port communicating with the second fixed frame opened on the surface of the fixed cylinder.

[0005] The above technical solution can achieve automatic rotation, which can improve the dust removal effect on the wafer surface, reduce the burden of personnel assistance, provide good flexibility, facilitate the collection and treatment of foreign objects, and is simple and convenient to operate, reducing the cleaning burden of personnel and making it highly practical.

[0006] The present invention is further configured such that: the dust removal mechanism includes a fan, the fan is bolted to the bottom of the partition by a fastener, a first fixing frame is bolted to the top of the fixing cylinder, a blower pipe communicating with the first fixing frame is fixedly sleeved on the surface of the fixing cylinder, and a blower port communicating with the first fixing frame is opened on the top of the fixing cylinder.

[0007] By adopting the above technical solution, the foreign matter on the wafer surface can be removed by blowing through the fan, the first fixed frame, the air pipe and the air outlet, which improves the cleanliness of the wafer surface and facilitates subsequent wafer testing.

[0008] The present invention is further configured such that the surfaces of the base, the fixing cylinder and the partition are all coated with anti-corrosion coating.

[0009] By adopting the above technical solution and applying anti-corrosion coating, the anti-corrosion and moisture-proof effects of the base, fixing cylinder and partition surface can be improved.

[0010] The present invention is further provided that: an anti-slip pad is adhered to the top of the bearing plate.

[0011] By adopting the above technical solution and setting the anti-slip pad, the friction force when the wafer is placed on the carrier plate can be improved.

[0012] The present invention is further configured such that: both the top and bottom of the filter plate are fitted with a retainer, and the other side of the two retainers are respectively bolted to the partition and the base.

[0013] By adopting the above technical solution, the filter screen can be limited by the setting of the card holder, preventing the filter screen from tipping over or shifting after placement.

[0014] The present invention is further configured such that: the top of the base is provided with a mounting hole.

[0015] By adopting the above technical solution, the installation holes facilitate the installation and fixing of the base with screws.

[0016] In summary, this utility model has the following beneficial effects:

[0017] 1. This utility model involves placing a wafer into an anti-slip pad inside a fixed cylinder through an opening at the top. After the wafer is placed, the motor is started. Once started, the motor drives the transmission shaft to rotate through the fixation of the partition. When the transmission shaft rotates, it drives the support plate to rotate. When the support plate rotates, it drives the wafer to rotate together. This provides an automatic rotation function, which can improve the dust removal effect on the wafer surface, reduce the burden of personnel assistance, and offer good flexibility.

[0018] 2. This utility model utilizes a blower. After starting, the blower draws in air, compresses it, and pushes it into the blower pipe. The air pushed into the blower pipe is then blown downwards from the blower outlet through the first fixed frame. While one end of the blower is blowing air, the other end also generates suction. Under the action of suction, foreign objects separated from the wafer inside the fixed cylinder enter the base through the air inlet. The filter plate adsorbs and intercepts the foreign objects in the gas, making it easy to collect and process them. The operation is simple and convenient, reducing the cleaning burden on personnel and making it highly practical. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural view of the present invention;

[0020] Figure 2 This is a front sectional view of the structure of this utility model;

[0021] Figure 3 This is a utility model Figure 2 Enlarged view of the structure at point A in the middle.

[0022] Reference numerals in the attached drawings: 1. Base; 2. Fixing cylinder; 3. Partition plate; 4. Motor; 5. Drive shaft; 6. Bearing plate; 7. Dust removal mechanism; 71. Fan; 72. First fixing frame; 73. Air blowing pipe; 74. Air blowing port; 8. Filter plate; 9. Second fixing frame; 10. Suction pipe; 11. Suction port; 12. Anti-slip pad; 13. Card seat; 14. Mounting hole. Detailed Implementation

[0023] The present invention will be further described in detail below with reference to the accompanying drawings.

[0024] Example 1:

[0025] refer to Figure 1 , Figure 2 and Figure 3 A dust removal device for wafer inspection includes a base 1, a fixed cylinder 2 slidably sleeved on the top of the base 1, a partition 3 installed inside the fixed cylinder 2, a motor 4 bolted to the bottom of the partition 3, a drive shaft 5 fixedly sleeved at the output end of the motor 4, and a support plate 6 installed at the other end of the drive shaft 5. By placing the wafer into the anti-slip pad 12 inside the fixed cylinder 2 through the upper opening, the motor 4 is started after the wafer is placed. After starting, the motor 4 drives the drive shaft 5 to rotate under the fixation of the partition 3. When the drive shaft 5 rotates, it drives the support plate 6 to rotate. When the support plate 6 rotates, it drives the wafer to rotate together. It has an automatic rotation function, which can improve the dust removal effect on the wafer surface, reduce the burden of personnel assistance, and has good flexibility.

[0026] refer to Figure 1 , Figure 2 and Figure 3 The surfaces of the base 1, the fixing cylinder 2, and the partition 3 are all coated with anti-corrosion paint. The anti-corrosion and moisture-proof effects of the base 1, the fixing cylinder 2, and the partition 3 can be improved by the application of anti-corrosion paint.

[0027] refer to Figure 1 and Figure 3 An anti-slip pad 12 is attached to the top of the carrier plate 6. The anti-slip pad 12 can improve the friction force when the wafer is placed on the carrier plate 6.

[0028] refer to Figure 1 The base 1 has a mounting hole 14 on its top, which allows personnel to easily install and fix the base 1 with screws.

[0029] Brief description of the usage process: The wafer is placed into the anti-slip pad 12 inside the fixed cylinder 2 through the top opening. After the wafer is placed, the motor 4 is started. After the motor 4 is started, it will drive the transmission shaft 5 to rotate under the fixation of the partition 3. When the transmission shaft 5 rotates, it will drive the support plate 6 to rotate. When the support plate 6 rotates, it will drive the wafer to rotate together.

[0030] Example 2:

[0031] refer to Figure 1 and Figure 2 A dust removal device for wafer inspection includes a dust removal mechanism 7 and a filter plate 8 inside a fixed cylinder 2. A second fixed frame 9 is fixedly fitted onto the surface of the fixed cylinder 2, and a suction pipe 10 communicating with the second fixed frame 9 is fixedly fitted onto the surface of the fixed cylinder 2. A suction port 11 communicating with the second fixed frame 9 is opened on the surface of the fixed cylinder 2. When the fan 71 is started, it draws in air, compresses it, and pushes it into the blowing pipe 73. The air pushed into the blowing pipe 73 is blown downward from the blowing port 74 through the first fixed frame 72. When one end of the fan 71 blows air, the other end also generates suction. Under the action of suction, foreign objects separated from the wafer inside the fixed cylinder 2 enter the base 1 through the suction port 11. The filter plate 8 adsorbs and intercepts foreign objects in the gas, which facilitates the collection and treatment of foreign objects. The operation is simple and convenient, reduces the cleaning burden of personnel, and has high practicality.

[0032] refer to Figure 1 and Figure 2 The dust removal mechanism 7 includes a fan 71, which is bolted to the bottom of the partition 3 by a fastener. A first fixing frame 72 is bolted to the top of the fixing cylinder 2. A blowing pipe 73 communicating with the first fixing frame 72 is fixedly sleeved on the surface of the fixing cylinder 2. A blowing port 74 communicating with the first fixing frame 72 is opened on the top of the fixing cylinder 2. Through the arrangement of the fan 71, the first fixing frame 72, the blowing pipe 73 and the blowing port 74, foreign objects on the wafer surface can be removed by blowing, which improves the cleanliness of the wafer surface and facilitates the subsequent inspection of the wafer.

[0033] refer to Figure 2 The top and bottom of the filter plate 8 are both secured with a retainer 13. The other side of the two retainers 13 is respectively bolted to the partition 3 and the base 1. The retainers 13 can limit the filter plate 8 and prevent it from tipping over or shifting after placement.

[0034] Brief description of the usage process: By starting the fan 71, the fan 71 will draw in air, compress it and push it into the blower pipe 73. The air pushed into the blower pipe 73 will be blown downward from the blower port 74 through the first fixed frame 72. When one end of the fan 71 blows air, the other end will also generate suction. Under the action of suction, foreign objects separated from the wafer in the fixed cylinder 2 will enter the base 1 from the air intake port 11. The filter plate 8 will adsorb and intercept the foreign objects in the gas.

[0035] This specific embodiment is merely an explanation of the present utility model and is not intended to limit the present utility model. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but as long as they are within the scope of the claims of the present utility model, they are protected by patent law.

Claims

1. A dust removal device for wafer inspection, comprising a base (1), characterized in that: A fixed cylinder (2) is slidably sleeved on the top of the base (1). A partition (3) is installed inside the fixed cylinder (2). A motor (4) is bolted to the bottom of the partition (3). A transmission shaft (5) is fixedly sleeved on the output end of the motor (4). A bearing plate (6) is installed on the other end of the transmission shaft (5). A dust removal mechanism (7) is provided inside the fixed cylinder (2). A filter plate (8) is provided inside the fixed cylinder (2). A second fixed frame (9) is fixedly sleeved on the surface of the fixed cylinder (2). A suction pipe (10) communicating with the second fixed frame (9) is fixedly sleeved on the surface of the fixed cylinder (2). A suction port (11) communicating with the second fixed frame (9) is opened on the surface of the fixed cylinder (2).

2. The dust removal device for wafer inspection according to claim 1, characterized in that, The dust removal mechanism (7) includes a fan (71), which is bolted to the bottom of the partition (3) by a fastener. A first fixed frame (72) is bolted to the top of the fixed cylinder (2). A blower pipe (73) communicating with the first fixed frame (72) is fixedly sleeved on the surface of the fixed cylinder (2). A blower port (74) communicating with the first fixed frame (72) is opened on the top of the fixed cylinder (2).

3. The dust removal device for wafer inspection according to claim 1, characterized in that, The surfaces of the base (1), the fixing cylinder (2), and the partition (3) are all coated with anti-corrosion paint.

4. The dust removal device for wafer inspection according to claim 1, characterized in that, The top of the support plate (6) is bonded with an anti-slip pad (12).

5. A dust removal device for wafer inspection according to claim 1, characterized in that, The top and bottom of the filter plate (8) are both fitted with a bracket (13), and the other side of the two brackets (13) are respectively bolted to the partition (3) and the base (1).

6. A dust removal device for wafer inspection according to claim 1, characterized in that, The base (1) has a mounting hole (14) on its top.

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