Wafer film pasting device

Abstract

The utility model provides a wafer film pasting device which comprises a base and workbenches, four workbenches of different models are respectively located on the side faces of the base to meet different process requirements, a first transmission track is arranged on the side face of the base, and a second transmission track is arranged on the bottom face of each workbench. The first transmission track and the second transmission track are connected through the connecting device, when the workbench is replaced, the connecting device is matched with the first transmission track and the second transmission track, the workbench is made to move to the top face of the base, rapid replacement of the workbench is achieved, the working efficiency is remarkably improved, and meanwhile the risk of attachment of foreign matter is avoided; and the heating device and the refrigerating device are arranged in the workbench, so that the temperature of the workbench can be quickly adjusted in a short time, and the working efficiency is further improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically, it relates to a wafer lamination device. Background Technology

[0002] Semiconductor lamination processes have high requirements for time efficiency and process precision. Different types of wafers are suitable for different worktables (common 8 / 12-inch stainless steel and ceramic worktables). During the development of semiconductor packaging processes, it is necessary to change worktables multiple times to cope with different types of wafers and different lamination temperature requirements, which leads to reduced work efficiency. In addition, frequent worktable changes will cause wear and tear on the worktable and also pose a risk of foreign matter on the worktable surface and edges. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, this utility model provides a wafer lamination device, including a base and a worktable. Four different models of worktables are located on the side of the base to meet different process requirements. A first transmission rail is provided on the side of the base, and a second transmission rail is provided on the bottom surface of the worktable. The first and second transmission rails are connected by a connecting device. When changing worktables, the connecting device cooperates with the first and second transmission rails to move the worktable to the top surface of the base, realizing rapid worktable replacement, significantly improving work efficiency, and avoiding the risk of foreign matter adhesion. The worktable is equipped with a heating device and a cooling device, which can quickly adjust the temperature of the worktable in a short time, further improving work efficiency.

[0004] To achieve the above and other related objectives, this utility model provides a wafer bonding device, comprising:

[0005] The base is a regular square prism structure with a first side, a second side, a third side, and a fourth side connected in sequence. A first groove extends from the bottom of the first side along a third direction, a first direction, and a third direction to the bottom of the third side. A second groove extends from the bottom of the second side along a third direction, a second direction, and a third direction to the bottom of the fourth side. The first direction, the second direction, and the third direction are perpendicular to each other, and the plane formed by the first direction and the second direction coincides with the top surface of the base.

[0006] The first transmission track is located in the first groove of the first side and the third side, and in the second groove of the second side and the fourth side;

[0007] The workbench has a cylindrical structure with a second transmission rail on its bottom surface. The workbench includes a first part and a second part stacked together. The first part is equipped with a heating device, and the second part is equipped with a cooling device. There are four workbenches, and the four workbenches are of different models.

[0008] A connecting device is used to connect the base and the worktable. The connecting device includes a sliding rod, a swing arm shaft, and a connecting rod connected in sequence. The sliding rod is perpendicularly connected to the first transmission rail. The swing arm shaft is used to drive the connecting rod to rotate. The connecting rod is perpendicularly connected to the second transmission rail.

[0009] Optionally, the four worktables are: an 8-inch stainless steel worktable, an 8-inch ceramic worktable, a 12-inch stainless steel worktable, and a 12-inch ceramic worktable.

[0010] Optionally, the bottom surface of the workbench is provided with a heating connection port and a cooling connection port, the heating connection port being connected to the heating device and the cooling connection port being connected to the cooling device.

[0011] Optionally, the worktable has a plurality of through holes extending along the third direction at its center, the through holes penetrating the top and bottom surfaces of the worktable.

[0012] Optionally, the base center is provided with a plurality of support members extending along the third direction, and the number, position and size of the support members correspond to the through hole.

[0013] Optionally, the support member is a circular tube structure.

[0014] Optionally, the base is provided with a vacuum pumping device for evacuating the support member.

[0015] Optionally, the connecting device consists of one swing arm shaft, two sliding rods, and two connecting rods, with each end of the swing arm shaft having one sliding rod and one connecting rod.

[0016] Optionally, each side of the base is provided with four of the first transmission rails, which are divided into two groups, and one of the sliding rods is connected to one group of the first transmission rails.

[0017] Optionally, the bottom surface of the workbench is provided with four second transmission rails, which are divided into two groups, and one connecting rod is connected to one group of the second transmission rails.

[0018] The wafer bonding device provided by this utility model has at least the following beneficial effects:

[0019] 1) The wafer lamination unit includes four different models of worktables, enabling one lamination unit to meet the process requirements of different wafers and improving the utilization rate of the lamination unit; in addition, when not in operation, the worktables are set on the side of the base through the connecting device, which can reduce the space occupation of the lamination unit.

[0020] 2) When changing the worktable, the connecting device cooperates with the first transmission rail and the second transmission rail to move the worktable to the top surface of the base, realizing the quick replacement of the worktable, significantly improving work efficiency, and avoiding the risk of foreign objects adhering to it.

[0021] 3) The workbench is equipped with heating and cooling devices, which can quickly adjust the temperature of the workbench in a short time, further improving work efficiency. Attached Figure Description

[0022] Figure 1a The image shown is a top view of the wafer bonding apparatus provided in the embodiment.

[0023] Figure 1b The image shown is a side view of the wafer bonding apparatus provided in the embodiment.

[0024] Figure 2a The diagram shown is a structural schematic of the workbench provided in the embodiment.

[0025] Figure 2b The diagram shown is a schematic representation of the bottom surface of the workbench provided in the embodiment.

[0026] Figure 3 The diagram shown is a structural schematic of the base provided in the embodiment.

[0027] Figures 4a-4d The diagram shown illustrates the working principle of the wafer bonding device provided in this embodiment.

[0028] Component designation explanation

[0029] 1. Base

[0030] 11 First Groove

[0031] 12 Second Groove

[0032] 13 Heat source output port

[0033] 14 Cold source output port

[0034] 2 workbenches

[0035] 21. The first part of the workbench

[0036] 22. The second part of the workbench

[0037] 23 Heating Connection Port

[0038] 24 Refrigeration connection port

[0039] 200 through hole

[0040] 3. Connecting device

[0041] 31 Sliding rod

[0042] 32 swing arm shaft

[0043] 33 Connecting rod

[0044] 41 First transmission track

[0045] 42 Second transmission track

[0046] 5 Support components Detailed Implementation

[0047] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0048] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Although the illustrations only show components related to this utility model and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this utility model, and the layout of the components may also be more complex.

[0049] Example

[0050] This embodiment provides a wafer bonding device, such as... Figure 1a and 1b As shown, it includes a base 1 and a worktable 2. Four worktables 2 are arranged on the four sides of the base 1, and the base 1 and the worktables 2 are connected by a connecting device 3.

[0051] As an example, the four workbenches 2 are of different models: an 8-inch stainless steel workbench, an 8-inch ceramic workbench, a 12-inch stainless steel workbench, and a 12-inch ceramic workbench, to meet different needs in the wafer lamination process.

[0052] like Figure 2aAs shown, the worktable 2 has a cylindrical structure, including a first part 21 and a second part 22 stacked together. A heating device (not shown) is disposed in the first part 21, and a cooling device (not shown) is disposed in the second part 22. The heating and cooling devices are used to rapidly adjust the film-laying temperature during the wafer lamination process. The heating device is arranged in a spiral pattern in the first part 21, and the cooling device is also arranged in a spiral pattern in the second part 22 to ensure uniform heating / cooling of the worktable 2. In this embodiment, the first part 21 is located above the second part 22; in other alternative embodiments, the first part 21 may also be located below the second part 22.

[0053] like Figure 2a As shown, the center of workbench 2 has multiple points along a third direction ( Figure 2a A through hole 200 extending along the Z-axis (as shown) penetrates the top and bottom surfaces of the worktable 2. In this embodiment, there are three through holes 200, which are equally spaced.

[0054] like Figure 2b As shown, the bottom surface of the workbench 2 is provided with a heating connection port 23 and a cooling connection port 24. The heating connection port 23 is connected to the heating device and is used to provide a heat source for the heating device; the cooling connection port 24 is connected to the cooling device and is used to provide a cold source for the cooling device.

[0055] like Figure 3 As shown, the base 1 is a regular square prism structure with a first side surface, a second side surface, a third side surface, and a fourth side surface connected in sequence. As an example, the side surface and top surface of the base 1 have a first groove 11 and a second groove 12, wherein the first groove 11 extends sequentially from the bottom of the first side surface along a third direction (…). Figure 3 (shown in the Z-axis direction), first direction ( Figure 3 The second groove 12 extends from the bottom of the second side along the third direction and the third direction (as shown in the X-axis direction) to the bottom of the third side. Figure 3 The grooves extend from the Y-axis (as shown) to the bottom of the fourth side in the third direction. In this embodiment, there are four first grooves 11 and four second grooves 12.

[0056] like Figure 1a As shown, the base 1 has multiple points arranged along a third direction at its center. Figure 1aThe support member 5 extends along the Z-axis (as shown). The number, position, and size of the support member 5 correspond to the through hole 200, and the support member 5 is a hollow cylindrical structure. A vacuum pumping device (not shown in the figure) is also provided in the base 1 for evacuating the support member 5. During the wafer lamination process, when the stage 2 moves above the base 1, the support member 5 rises and passes through the through hole 200, thereby lifting the wafer located on the surface of the stage 2. Then, the vacuum pumping device evacuates the inside of the support member 5, thereby adsorbing the wafer.

[0057] like Figure 1a As shown, the top surface of the base 1 is provided with a heat source output port 13 and a cold source output port 14. The heat source output port 13 is used to connect to the heating connection port 23 to provide a heat source to the heating device; the cold source output port 14 is used to connect to the cooling connection port 24 to provide a cold source to the cooling device.

[0058] like Figure 3 As shown, the first groove 11 on the first and third sides, and the second groove 12 on the second and fourth sides, are each embedded with a first transmission track 41, which is used to drive the worktable 2 along a third direction ( Figure 3 (It moves in the Z-axis direction shown).

[0059] like Figure 2b As shown, a second transmission rail 42 is provided on the bottom surface of the worktable 2, which is used to drive the worktable 2 to move along the extension direction of the second transmission rail 42. Specifically, the second transmission rail 42 located on the bottom surface of the worktable 2 on the first and third sides is parallel to the first groove 11, and the second transmission rail 42 located on the bottom surface of the worktable 2 on the second and fourth sides is parallel to the second groove 12. As an example, the position and size of the second transmission rail 42 correspond to the first groove 11 and the second groove 12 on the top surface of the base 1, as shown... Figure 4c As shown, when the worktable 2 moves along the second transmission track 42 to above the center of the base 1, the second transmission track 42 can descend into the first groove 11 / second groove 12.

[0060] like Figure 1a and 1b As shown, the connecting device 3 includes a sliding rod 31, a swing arm shaft 32, and a connecting rod 33 connected in sequence. The sliding rod 31 is perpendicularly connected to the first transmission track 41, the swing arm shaft 32 is used to drive the connecting rod 33 to rotate, and the connecting rod 33 is perpendicularly connected to the second transmission track 42.

[0061] In this embodiment, the connecting device 3 consists of a swing arm shaft 32, two sliding rods 31, and two connecting rods 33. Each end of the swing arm shaft 32 is provided with a sliding rod 31 and a connecting rod 33. Figure 3As shown, each side of the base 1 is provided with four first transmission rails 41. The four first transmission rails 41 are divided into two groups, with the two first transmission rails 41 with smaller spacing forming one group. A sliding rod 31 is connected to one group of first transmission rails 41. Figure 2b As shown, the bottom surface of the workbench 2 is provided with four second transmission rails 42. The four second transmission rails 42 are divided into two groups. The two second transmission rails 42 with smaller spacing form one group. A connecting rod 33 is connected to one group of second transmission rails 42.

[0062] The working principle of the wafer bonding device provided in this embodiment is as follows:

[0063] like Figure 1a and 1b As shown, before the film application process begins, four different models of worktables 2 are located on the four sides of the base 1; then, according to the process requirements, the corresponding target worktable 2 is selected, and the sliding rod 31 moves along the first transmission track 41, as shown. Figure 4a As shown, this drives the worktable 2 along... Figure 4a As shown, it rises along the Z-axis to the edge of the top surface of base 1; then, as... Figure 4b As shown, the swing arm shaft 32 drives the connecting rod 33 to rotate until it is perpendicular to the sliding rod 31, at which point the worktable 2 is parallel to the top surface of the base 1; then, the worktable 2 moves along the extension direction of its bottom second transmission track 42 until the center of the worktable 2 is located above the center of the base 1, as shown. Figure 4c As shown; finally, as Figure 4d As shown, the sliding rod 31 moves downward along the first transmission track 41, causing the worktable 2 to descend to the top surface of the base 1. At this time, the second transmission track 42 is embedded in the first groove 11 / second groove 12 on the top surface of the base 1, and the heating connection port 23 is connected to the heat source output port 13, and the cooling connection port 24 is connected to the cold source output port 14, thus completing the replacement of the worktable.

[0064] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A wafer lamination device, characterized in that, include: The base is a regular square prism structure with a first side, a second side, a third side, and a fourth side connected in sequence. A first groove extends from the bottom of the first side along a third direction, a first direction, and a third direction to the bottom of the third side. A second groove extends from the bottom of the second side along a third direction, a second direction, and a third direction to the bottom of the fourth side. The first direction, the second direction, and the third direction are perpendicular to each other, and the plane formed by the first direction and the second direction coincides with the top surface of the base. The first transmission track is located in the first groove of the first side and the third side, and in the second groove of the second side and the fourth side; The workbench has a cylindrical structure with a second transmission rail on its bottom surface. The workbench includes a first part and a second part stacked together. The first part is equipped with a heating device, and the second part is equipped with a cooling device. There are four workbenches, and the four workbenches are of different models. A connecting device is used to connect the base and the worktable. The connecting device includes a sliding rod, a swing arm shaft, and a connecting rod connected in sequence. The sliding rod is perpendicularly connected to the first transmission rail. The swing arm shaft is used to drive the connecting rod to rotate. The connecting rod is perpendicularly connected to the second transmission rail.

2. The wafer bonding apparatus according to claim 1, characterized in that, The four workbenches are: 8-inch stainless steel workbench, 8-inch ceramic workbench, 12-inch stainless steel workbench, and 12-inch ceramic workbench.

3. The wafer bonding apparatus according to claim 1, characterized in that, The bottom surface of the workbench is provided with a heating connection port and a cooling connection port. The heating connection port is connected to the heating device, and the cooling connection port is connected to the cooling device.

4. The wafer bonding apparatus according to claim 1, characterized in that, The workbench has a plurality of through holes extending along the third direction at its center, the through holes penetrating the top and bottom surfaces of the workbench.

5. The wafer bonding apparatus according to claim 4, characterized in that, The base has a plurality of support members extending along the third direction at its center, and the number, position and size of the support members correspond to the through hole.

6. The wafer lamination apparatus according to claim 5, characterized in that, The support component is a circular tube structure.

7. The wafer bonding apparatus according to claim 6, characterized in that, The base is equipped with a vacuum pumping device for evacuating the support component.

8. The wafer bonding apparatus according to claim 1, characterized in that, The connecting device consists of one swing arm shaft, two sliding rods, and two connecting rods. Each end of the swing arm shaft is provided with one sliding rod and one connecting rod.

9. The wafer lamination apparatus according to claim 8, characterized in that, Each side of the base is provided with four of the first transmission rails, which are divided into two groups, and one of the sliding rods is connected to one group of the first transmission rails.

10. The wafer bonding apparatus according to claim 8, characterized in that, The bottom surface of the workbench is provided with four second transmission rails, which are divided into two groups. One of the connecting rods is connected to one group of the second transmission rails.

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