Laser processing head and laser processing equipment

Abstract

The utility model relates to a laser processing head and laser processing equipment. The laser processing head comprises a first laser transmitter, a second laser transmitter, a reflector assembly and a galvanometer assembly. The first laser emitter is used for emitting a first laser beam, and the second laser emitter is used for emitting a second laser beam. The reflector assembly is arranged corresponding to the first laser emitter and the second laser emitter and is used for receiving and emitting the first laser beam and / or the second laser beam. The galvanometer assembly and the reflector assembly are correspondingly arranged, and the galvanometer assembly is used for receiving the first laser beam and / or the second laser beam and emitting the first laser beam and / or the second laser beam to the workpiece to machine the workpiece. The laser machining head can better meet the machining requirement of a user, laser beams output by the first laser transmitter and the second laser transmitter can be combined and output to the galvanometer assembly through the reflector assembly, the galvanometer assembly emits the combined laser to a workpiece to machine the workpiece, and therefore the machining effect of the laser machining head can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to laser processing technical field, especially a kind of laser processing head and laser processing equipment. BACKGROUND

[0002] Laser processing equipment utilizes high-energy laser beam to cut, weld, engrave, heat treatment and other processing on material or material surface.Compared with traditional mechanical processing, the processing head of laser processing equipment does not directly contact workpiece, and workpiece is not easy to be damaged, and the energy of laser is high and the spot is small, with high processing efficiency.

[0003] In the related art, the laser processing head includes a laser emitter and a galvanometer assembly, the laser emitter directly emits a laser beam to the galvanometer assembly, and the galvanometer assembly reflects the laser beam to a workpiece at a predetermined angle to process the workpiece. However, one laser emitter cannot meet the needs of users to process more workpieces of different materials, nor can it meet the needs of users to process beams of different powers. SUMMARY

[0004] One object of the present utility model is to solve the problems in the prior art and provide a laser processing head. To solve the above technical problems, the present utility model adopts the following technical solutions:

[0005] A laser processing head includes:

[0006] A first laser emitter for emitting a first laser beam;

[0007] A second laser emitter for emitting a second laser beam;

[0008] A mirror assembly corresponding to the first and second laser emitters, for receiving the first and / or second laser beams and emitting them;

[0009] A galvanometer assembly corresponding to the mirror assembly, for receiving the first and / or second laser beams and emitting them to a workpiece to process the workpiece.

[0010] In one embodiment, the mirror assembly includes a first mirror and a first beam combiner, the first mirror is disposed in the emission path of the first laser emitter, for reflecting the first laser beam to the first beam combiner;

[0011] The first beam combiner is used to reflect the first laser beam reflected by the first mirror to the galvanometer assembly.

[0012] In one of the embodiments, the mirror assembly further comprises a second mirror, the second mirror is arranged in the emission light path of the second laser emitter, and is configured to reflect the second laser beam to the first beam combiner;

[0013] The first beam combiner is further arranged in the reflection light path of the second mirror, and is further configured to transmit the second laser beam reflected by the second mirror to the galvanometer assembly.

[0014] In one of the embodiments, the mirror assembly comprises a second beam combiner, the second beam combiner is arranged in the emission light paths of the first laser emitter and the second laser emitter, and is configured to reflect the first laser beam to the galvanometer assembly, and to transmit the second laser beam emitted by the second laser emitter to the galvanometer assembly.

[0015] In one of the embodiments, the laser processing head further comprises a beam adjusting assembly, the beam adjusting assembly is connected with the second laser emitter, and is configured to adjust the angle and / or the spot size of the second laser beam.

[0016] In one of the embodiments, the beam adjusting assembly comprises an angle adjusting component, the second laser emitter is supported and connected on the angle adjusting component, and the angle adjusting component is configured to adjust the emission angle of the second laser beam.

[0017] In one of the embodiments, the second laser emitter has opposite front end and tail end along the laser emission direction, the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged on the positioning seat, the positioning seat is configured to position the position of the front end of the second laser emitter in the front-rear direction, and the tail end of the second laser emitter is arranged on the adjusting seat, the adjusting seat is configured to adjust the position of the tail end of the second laser emitter in the plane perpendicular to the front-rear direction.

[0018] In one of the embodiments, the beam adjusting assembly comprises a beam expanding component, the beam expanding component is connected at the emission end of the second laser emitter, and is configured to adjust the spot size of the second laser beam.

[0019] In one of the embodiments, the beam expanding component comprises:

[0020] a first lens barrel;

[0021] a second lens barrel, the second lens barrel is connected at the emission end of the second laser emitter;

[0022] a first beam expanding lens, mounted on the first lens barrel;

[0023] a second beam expanding lens, mounted on the second lens barrel;

[0024] The first lens barrel and the second lens barrel are telescopically connected, so as to adjust the relative distance between the first beam expanding lens and the second beam expanding lens.

[0025] In one of the embodiments, the galvanometer assembly comprises a first galvanometer and a second galvanometer, the first galvanometer is rotatable around a first axis, and the second galvanometer is rotatable around a second axis, the first axis and the second axis are perpendicular to each other.

[0026] The first galvanometer is arranged in the output light path of the mirror assembly, and is used for receiving the first laser beam and / or the second laser beam output by the mirror assembly and reflecting to the second galvanometer.

[0027] In one of the embodiments, the galvanometer assembly further comprises a first driving member and a second driving member, the first driving member is connected with the first galvanometer and is used for driving the first galvanometer to rotate around the first axis, and the second driving member is connected with the second galvanometer and is used for driving the second galvanometer to rotate around the second axis.

[0028] In one of the embodiments, the first laser beam and the second laser beam are different types of beams; and / or, the first laser beam and the second laser beam are beams of different powers.

[0029] In one of the embodiments, the emission light path of the first laser emitter and the emission light path of the second laser emitter are perpendicular to each other.

[0030] Another purpose of the utility model is to provide a kind of laser processing equipment, including workbench and as any one described above laser processing head, workbench is used to carry workpiece, and laser processing head is used to process workpiece on workbench.

[0031] In one of the embodiments, the laser processing equipment further comprises a support assembly, one end of the support assembly is connected with the laser processing head, the other end of the support assembly is connected with the workbench, and the laser processing head is arranged opposite to the workbench;The laser processing head is slidably arranged in the support assembly to adjust the distance between the laser processing head and the workbench.

[0032] From the above technical solution, the utility model at least has following advantages and positive effects:

[0033] In the utility model, the laser processing head comprises a first laser emitter and a second laser emitter, by setting the type and / or power of laser beams emitted by the first laser emitter and the second laser emitter, different types of laser beams and / or different power laser beams can be emitted by the laser processing head, so that the demand of users for processing more workpieces of different materials and the demand for processing beams of different powers can be better met.

[0034] And, by setting the mirror assembly, the light paths of the first laser emitter and the second laser emitter are combined, so that the laser beams output by the first laser emitter and the second laser emitter can be combined and output to the galvanometer assembly, and the galvanometer assembly then outputs the combined laser beams to the workpiece to process the workpiece, thereby facilitating improvement of the processing effect of the laser processing head. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a schematic diagram of the internal structure of the laser processing head in an embodiment of the present application.

[0036] Figure 2 is Figure 1 is an exploded schematic diagram of the structure shown.

[0037] Figure 3 is Figure 1 is a schematic diagram of the laser emission trajectories of the two laser emitters in the structure shown.

[0038] Figure 4 is a schematic diagram of the laser emission trajectories of the two laser emitters in another embodiment.

[0039] Figure 5 is Figure 1 is a schematic diagram of the structure of the galvanometer assembly in the structure shown.

[0040] Figure 6 is Figure 1 is a schematic diagram of the connection of the beam adjustment assembly and the second laser emitter in the structure shown.

[0041] Figure 7 is Figure 6 is an exploded schematic diagram of the beam expansion component in the structure shown.

[0042] Figure 8 is a schematic diagram of the structure of the laser processing device in an embodiment of the present application.

[0043] The following is an explanation of the reference signs:

[0044] 10 - laser processing head; 20 - laser processing device; 201 - worktable; 202 - support assembly;

[0045] 100 - first laser emitter;

[0046] 200 - second laser emitter;

[0047] 300 - beam adjustment assembly;

[0048] 310 - angle adjustment component; 311 - positioning seat; 312 - adjustment seat; 3121 - seat body; 3122 - first adjustment bolt; 3123 - second adjustment bolt;

[0049] 320 - beam expanding component; 321 - first beam expanding lens; 322 - second beam expanding lens; 323 - first lens barrel; 324 - second lens barrel;

[0050] 400 - mirror assembly;

[0051] 410 - first mirror; 420 - first beam combining lens; 430 - second mirror;

[0052] 440 - second beam combining lens;

[0053] 500 - galvanometer assembly; 510 - first galvanometer; 520 - second galvanometer; 530 - first driving member; 540 - second driving member;

[0054] 600 - mounting platform. DETAILED DESCRIPTION

[0055] The typical embodiments embodying the features and advantages of the present application will be described in the following description with reference to the accompanying drawings. It should be understood that the present application can have various changes in the embodiments, and all of them do not deviate from the scope of the present application, and the description and drawings in the essence are used as a description, not to limit the present application.

[0056] In the description of the present application, it should be understood that in the embodiments shown in the drawings, the indication of direction or position relationship (such as up, down, left, right, front and back, etc.) is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation. When these elements are in the position shown in the drawings, these descriptions are appropriate. If the position of these elements changes, the indication of these directions also changes accordingly.

[0057] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0058] Please refer to Figure 1As shown, the laser processing head 10 of the embodiment of the utility model, including first laser transmitter 100 and second laser transmitter 200, and mirror assembly 400 and galvanometer assembly 500.First laser transmitter 100 is used to emit first laser beam, and second laser transmitter 200 is used to emit second laser beam.Mirror assembly 400 is correspondingly arranged with first laser transmitter 100 and second laser transmitter 200, is used to receive first laser beam and / or second laser beam and emit.Galvanometer assembly 500 is correspondingly arranged with mirror assembly 400, is used to receive first laser beam and / or second laser beam, and emit to workpiece to process workpiece.

[0059] Because laser processing head 10 includes first laser transmitter 100 and second laser transmitter 200, by setting the type and / or power of laser beam emitted by first laser transmitter 100 and second laser transmitter 200, laser processing head 10 can emit different types of laser beams and / or different power laser beams, to better meet the needs of users to process more different material workpieces and the needs of different power processing beams.

[0060] And, by setting mirror assembly 400, the light path of first laser transmitter 100 and second laser transmitter 200 is merged, so that the laser beams output by first laser transmitter 100 and second laser transmitter 200 can be merged and output to galvanometer assembly 500, and galvanometer assembly 500 emits the combined laser to the workpiece to process the workpiece, so that the processing effect of laser processing head 10 can be improved.

[0061] In addition, because the laser beams emitted by the laser transmitter are not directly emitted to the galvanometer assembly 500, but are emitted to the galvanometer assembly 500 through the mirror assembly 400, due to the presence of the mirror assembly 400, when at least two laser transmitters are arranged in the laser processing head 10, the arrangement of each laser transmitter is more free and is not limited by the position of the galvanometer assembly 500.Exemplarily, as shown, Figure 2 The emission light path of first laser transmitter 100 and the emission light path of second laser transmitter 200 are perpendicular.Mirror assembly 400 can combine the light paths of first laser transmitter 100 and second laser transmitter 200, so that the laser beams output by first laser transmitter 100 and second laser transmitter 200 can be merged and output to galvanometer assembly 500, so that the structure layout is more compact.

[0062] In a possible embodiment of the present application, as Figure 1 And Figure 2As shown, the mirror assembly 400 includes a first mirror 410 and a first beam combiner 420, the first mirror 410 is arranged in the light path of the first laser emitter 100 and is used to reflect the first laser beam to the first beam combiner 420. The first beam combiner 420 is used to reflect the first laser beam reflected by the first mirror 410 to the galvanometer assembly 500.

[0063] The mirror assembly 400 further includes a second mirror 430, the second mirror 430 is arranged in the light path of the second laser emitter 200 and is used to reflect the second laser beam to the first beam combiner 420. The first beam combiner 420 is also arranged in the reflected light path of the second mirror 430, and the first beam combiner 420 is also used to transmit the second laser beam reflected by the second mirror 430 to the galvanometer assembly 500.

[0064] It can be understood that, in the embodiment, as Figure 3 shown, the first laser beam emitted by the first laser emitter 100 is reflected to the galvanometer assembly 500 through the first mirror 410 and the first beam combiner 420, while the second laser beam emitted by the second laser emitter 200 is reflected by the second mirror 430 and transmitted by the first beam combiner 420 to exit to the galvanometer assembly 500. Since the first laser emitter 100 and the second laser emitter 200 share the first beam combiner 420, that is, both of them are through the first beam combiner 420 to exit the laser beam to the galvanometer assembly 500, and the first beam combiner 420 can both reflect the first laser beam and transmit the second laser beam, so the number of lenses can be reduced, the space volume required by the mirror assembly 400 is saved, and the internal structure of the laser processing head 10 is more compact.

[0065] In addition, when adjusting the beam angle of each laser emitter reflected to the galvanometer assembly 500, the beam angle of the first laser beam can be adjusted by adjusting the angle of the first mirror 410, and the beam angle of the second laser beam can be adjusted by adjusting the angle of the second mirror 430, that is, the first laser emitter 100 and the second laser emitter 200 do not share the mirror, and the light paths of the two are independent and do not interfere with each other, so the light exit angle of the two laser emitters at the galvanometer assembly 500 can be better adjusted.

[0066] In another possible embodiment of the present application, referring to Figure 4As shown, the mirror assembly 400 includes a second beam combining mirror 440, which is arranged in the light path of the first laser emitter 100 and the second laser emitter 200, and is configured to reflect the first laser beam to the galvanometer assembly 500 and transmit the second laser beam emitted by the second laser emitter 200 to the galvanometer assembly 500. It can be understood that in the embodiment, the second beam combining mirror 440 is located in the reflection path of the first laser emitter 100 and in the transmission path of the second laser emitter 200. Since the first laser emitter 100 and the second laser emitter 200 share the second beam combining mirror 440, that is, the second beam combining mirror 440 can reflect the first laser beam and transmit the second laser beam, the number of lenses can be reduced. In the embodiment, only one lens is used to realize the beam combining of the two lasers and output to the galvanometer assembly 500, thereby saving the space volume required by the mirror assembly 400 and making the internal structure of the laser processing head 10 more compact.

[0067] Referring to Figure 5 As shown, in a possible embodiment of the present application, the galvanometer assembly 500 includes a first galvanometer 510 and a second galvanometer 520, the first galvanometer 510 can rotate around a first axis, and the second galvanometer 520 can rotate around a second axis, the first axis and the second axis are perpendicular. By designing the first galvanometer 510 and the second galvanometer 520 as an angle-adjustable structure, different positions of the consumable can be processed. Specifically, by adjusting the angles of the first galvanometer 510 and the second galvanometer 520, the direction of the laser beam can be adjusted in the vertical direction and the horizontal direction, so that the laser beam acts on different positions of the consumable.

[0068] The first galvanometer 510 is arranged in the output light path of the mirror assembly 400, and is configured to receive the first laser beam and / or the second laser beam output by the mirror assembly 400 and reflect them to the second galvanometer 520. The second galvanometer 520 is configured to receive the first laser beam and / or the second laser beam output by the first galvanometer 510 and reflect them to output to the workpiece. Specifically, the first galvanometer 510 is configured to receive the first laser beam and / or the second laser beam reflected by the first beam combining mirror 420 and reflect the first laser beam and / or the second laser beam to the second galvanometer 520 at a predetermined angle. Alternatively, the first galvanometer 510 is configured to receive the first laser beam and / or the second laser beam reflected by the second beam combining mirror 440 and reflect the first laser beam and / or the second laser beam to the second galvanometer 520 at a predetermined angle. The deflection of the first galvanometer 510 can change the position of the laser beam output to the second galvanometer 520, so that the light spot output to the workpiece moves along a first direction, and the deflection of the second galvanometer 520 can make the light spot output to the workpiece move along a second direction. The first direction and the second direction are perpendicular, and the first axis and the second axis are perpendicular.

[0069] Referring toFigure 5 In order to conveniently adjust the angles of the first galvanometer 510 and the second galvanometer 520, the galvanometer assembly 500 further comprises a first driving member 530 and a second driving member 540, the first driving member 530 is connected with the first galvanometer 510 and used to drive the first galvanometer 510 to rotate around the first axis, and the second driving member 540 is connected with the second galvanometer 520 and used to drive the second galvanometer 520 to rotate around the second axis.

[0070] In order to improve the processing effect of the laser processing head 10, the laser processing head 10 further comprises a focusing mirror, the focusing mirror is arranged in the output light path of the second galvanometer 520, and the focusing mirror is used to receive the first laser beam and / or the second laser beam output by the second galvanometer 520 and focus the first laser beam and / or the second laser beam to be emitted to the workpiece. By arranging the focusing mirror, the laser beam can be focused, so that the processing effect is improved.

[0071] In order to ensure the processing effect of the workpiece, it is necessary to ensure the intensity of the laser acting on the workpiece and prevent dust from covering the galvanometer assembly 500 during use, therefore the laser processing head 10 further comprises a dust cover, the focusing mirror is connected with the dust cover and surrounds to form a dustproof chamber, and the first galvanometer 510 and the second galvanometer 520 are arranged in the dustproof chamber. It can be understood that, in order to ensure that the first driving member 530 and the second driving member 540 can smoothly drive the first galvanometer 510 and the second galvanometer 520, the dust cover is further provided with a first through hole and a second through hole, the first driving member 530 passes through the first through hole and is connected with the first galvanometer 510, and the second driving member 540 passes through the second through hole and is connected with the second galvanometer 520.

[0072] Further, the dust cover is provided with a light passing hole, the light passing hole is arranged on the output light path of the mirror assembly 400, and the light passing hole is used for the mirror assembly 400 to output the laser beam to the first galvanometer 510. By arranging the light passing hole on the dust cover, it can be ensured that the laser beam output by the mirror assembly 400 can be smoothly emitted to the first galvanometer 510.

[0073] In a possible embodiment of the present application, the first laser beam and the second laser beam are different types of beams, and / or the first laser beam and the second laser beam are beams of different powers.

[0074] In the present application, the first laser emitter 100 and the second laser emitter 200 can emit different types of laser, that is, the first laser beam and the second laser beam are different types of laser beams, for example, the first laser beam is blue light and the second laser beam is red light, since different types of laser beams are suitable for different types of consumables, therefore the user can select the corresponding laser beam according to the type of consumables. Alternatively, the first laser beam is blue light and the second laser beam is infrared light.

[0075] Alternatively, the first laser emitter 100 and the second laser emitter 200 can emit the same type of laser, and the power of the first laser beam and the second laser beam can be the same or different. The user can select a laser beam with different processing power to process the workpiece by enabling the first laser emitter 100 or the second laser emitter 200 respectively. Alternatively, the user can simultaneously enable the first laser emitter 100 and the second laser emitter 200, and the superposition of the laser beams emitted by the two laser emitters can generate a laser with greater power, thereby meeting the user's demand for a laser with greater power.

[0076] In the present application, as shown in Figure 2 In one embodiment, the first laser emitter 100 can be a ruby laser, a YAG laser, a semiconductor laser, or other commonly used laser suitable for laser processing. The second laser emitter 200 can be a fiber laser or a semiconductor laser. In one embodiment, the first laser emitter 100 is a semiconductor laser, and the second laser emitter 200 is a fiber laser. The laser output by the second laser emitter 200 can be transmitted through an optical fiber, enabling the laser to be transmitted and applied over a longer distance, thereby making the internal structural layout of the laser processing head 10 more reasonable.

[0077] Referring to Figure 2 In one embodiment of the present application, the laser processing head 10 further comprises a beam adjusting assembly 300 connected with the second laser emitter 200 for adjusting the angle and / or spot size of the second laser beam. In this embodiment, the beam adjusting assembly 300 is configured to adjust the laser emission angle and / or spot size of one of the laser emitters, so that the laser beam of the other laser emitter can be combined more effectively, thereby improving the processing effect of the laser processing head 10.

[0078] As shown in Figure 2 In one embodiment, the beam adjusting assembly 300 comprises an angle adjusting component 310, and the second laser emitter 200 is supported and connected to the angle adjusting component 310. The angle adjusting component 310 is configured to adjust the emission angle of the second laser beam.

[0079] As shown in Figure 6 For example, the second laser emitter 200 has opposite front and rear ends along the laser emission direction, and the angle adjusting component 310 comprises a positioning seat 311 and an adjusting seat 312. The front end of the second laser emitter 200 is arranged on the positioning seat 311, and the positioning seat 311 is configured to position the front end of the second laser emitter 200 in the front-rear direction. The rear end of the second laser emitter 200 is arranged on the adjusting seat 312, and the adjusting seat 312 is configured to adjust the position of the rear end of the second laser emitter 200 in a plane perpendicular to the front-rear direction.

[0080] Referring to Figure 6 As shown in the figure, for the convenience of description, the laser emission direction of the second laser 200 is defined as the front-rear direction, and the front end of the second laser emitter 200 is defined as the front, and vice versa. And the directions in the plane perpendicular to the front-rear direction are defined as the up-down, left-right directions respectively.

[0081] When it is necessary to adjust the emission angle of the laser beam of the second laser emitter 200, the position of the front end of the second laser emitter 200 is fixed along the front-rear direction by the positioning seat 311, and the position of the tail end of the second laser emitter 200 along the up-down and left-right directions is adjusted by the adjusting seat 312, so that the emission angle of the second laser beam emitted by the second laser emitter 200 can be adjusted.

[0082] It can be understood that there can be many ways to adjust the position of the tail end of the second laser emitter 200 along the up-down and left-right directions by the adjusting seat 312, which is not limited in the present application. For example, as shown in Figure 2 and Figure 6 As shown in the figure, the adjusting seat 312 can include a seat body 3121 and two sets of adjusting bolts, and the two sets of adjusting bolts are rotatably mounted on the seat body 3121. The two sets of adjusting bolts are respectively two first adjusting bolts 3122 extending along the up-down direction and two second adjusting bolts 3123 extending along the left-right direction. The two first adjusting bolts 3122 and the two second adjusting bolts 3123 can respectively abut against the tail end of the second laser emitter 200 to drive the tail end of the second laser emitter 200 to move along the up-down and left-right directions respectively.

[0083] When it is necessary to adjust the emission angle of the laser beam of the second laser emitter 200, the tail end of the second laser emitter 200 can be moved along the up-down direction by the two first adjusting bolts 3122, and the tail end of the second laser emitter 200 can be moved along the up-down and left-right directions by the two second adjusting bolts 3123, so that the tail end of the second laser emitter 200 can swing up-down and left-right relative to the front end, thereby realizing that the emission angle of the laser beam of the second laser emitter 200 can be adjusted up-down and left-right. Of course, in other embodiments, the number of adjusting bolts is not limited to the number shown in the figure, and can be determined according to the specific situation. Figure 2

[0084] In other embodiments, the adjusting seat 312 can also adopt other structures capable of adjusting the position of the tail end of the second laser emitter 200 in the up-down and left-right directions. For example, the position of the adjusting seat 312 can be adjusted up-down and left-right, and the tail end of the second laser emitter 200 is fixedly connected to the adjusting seat 312. Therefore, the adjusting seat 312 can adjust the position of the tail end of the second laser emitter 200 in the up-down and left-right directions. That is, the adjusting seat 312 can slide. ​

[0085] In some embodiments, the positioning base 311 can also adjust the front end of the second laser emitter 200, for example, adjusting the height of the front end in the vertical direction and / or adjusting the position of the front end in the horizontal direction. The positioning base 311 may include a base body and adjusting bolts disposed on the base body. There may be two adjusting bolts, one on the left side and one at the bottom. The adjusting bolt on the left side is used to adjust the position of the front end of the second laser emitter 200 in the horizontal direction, and the adjusting bolt at the bottom is used to adjust the position of the front end of the second laser emitter 200 in the vertical direction, thereby adjusting the angle of the second laser emitter 200. In some embodiments, the positioning base 311 can rotate the front end of the second laser emitter 200. For example, it may have two adjusting bolts: one adjusting bolt disposed on the base body and rotatable in the front-back direction, and the other adjusting bolt disposed on the base body and rotatable in the horizontal direction. The two adjusting bolts can act on the front end of the second laser emitter 200 to rotate the front end of the second laser emitter 200. In some embodiments, the two adjusting bolts can act as fulcrums to adjust the angle of the second laser emitter 200 when the adjusting seat 312 is adjusting, so that the optical path of the second laser emitter 200 is not easily changed during adjustment.

[0086] See Figure 6 and Figure 7 As shown, in one embodiment, the beam adjustment assembly 300 further includes a beam expander 320, which is connected to the emission end of the second laser emitter 200 and is used to adjust the spot size of the second laser beam. For example, as Figure 7 As shown, the beam expander 320 includes a first beam expander 321 and a second beam expander 322, a first lens barrel 323 for mounting the first beam expander 321, and a second lens barrel 324 for mounting the second beam expander 322. The second lens barrel 324 is connected to the emission end of the second laser emitter 200. The first lens barrel 323 and the second lens barrel 324 are telescopically connected to adjust the relative distance between the first beam expander 321 and the second beam expander 322, thereby adjusting the beam spot size.

[0087] In one embodiment, the first beam expander 321 can be a convex lens, and the second beam expander 322 can be a concave lens. The beam expansion factor of the second laser beam can be controlled by adjusting the relative distance between the first beam expander 321 and the second beam expander 322. For example, increasing the relative distance between the first beam expander 321 and the second beam expander 322 will increase the beam expansion factor, while decreasing the relative distance will decrease the beam expansion factor, thereby allowing adjustment of the beam spot size.

[0088] Therefore, when the spot size of the laser beam emitted by the second laser emitter 200 needs to be adjusted, the first lens barrel 323 is made to be telescopically moved relative to the second lens barrel 324 in the front-rear direction, so that the adjustment of the spot size of the laser beam emitted by the second laser emitter 200 can be realized.

[0089] As shown in Figure 6 and Figure 7 , the first lens barrel 323 is telescopically connected to the end of the second lens barrel 324 away from the second laser emitter 200, i.e. the first lens barrel 323 is telescopically connected to the front end of the second lens barrel 324. It can be understood that there can be various ways to make the first lens barrel 323 telescopically move relative to the second lens barrel 324 in the front-rear direction, which is not specifically limited in the present application. For example, as shown in Figure 7 , the rear end of the first lens barrel 323 can be provided with external threads, and the front end of the second lens barrel 324 can be correspondingly provided with internal threads matched with the external threads, so that the telescopic connection of the first lens barrel 323 and the second lens barrel 324 can be realized through the cooperation of the external threads and the internal threads. Of course, in other embodiments, other structures capable of achieving the telescopic connection of the first lens barrel 323 and the second lens barrel 324 can also be used, such as slide rail and slide groove cooperation.

[0090] In some embodiments of the present application, the second laser emitter 200 is a fiber laser, and therefore, by designing the beam adjustment assembly 300 to adjust the angle and spot size of the laser beam emitted by the second laser emitter 200, the beam combination effect of the second laser emitter 200 and the first laser emitter 100 can be better, thereby improving the processing effect of the laser processing head 10.

[0091] Referring to Figure 1 , in a possible embodiment of the present application, the laser processing head 10 further comprises a mounting platform 600, and the first laser emitter 100, the second laser emitter 200, the mirror assembly 400 and the galvanometer assembly 500 are all mounted on the mounting platform 600. It should be noted that in the present embodiment, the second laser emitter 200 is movably mounted on the mounting platform 600 through the aforementioned angle adjustment component 310. While the first laser emitter 100, the mirror assembly 400 and the galvanometer assembly 500 are all relatively fixedly mounted on the mounting platform 600.

[0092] Referring to Figure 8 , the present application further provides a laser processing equipment 20, comprising a workbench 201 and the laser processing head 10 as claimed in any one of the above, the workbench 201 is used for carrying a workpiece, and the laser processing head 10 is used for processing the workpiece on the workbench 201.

[0093] In an embodiment, as shown in Figure 8As shown, the laser processing device 20 further comprises a support assembly 202, one end of the support assembly 202 is connected with the laser processing head 10, the other end of the support assembly 202 is connected with the workbench 201, the laser processing head 10 is arranged opposite to the workbench 201; the laser processing head 10 is slidably arranged on the support assembly 202, so as to adjust the distance between the laser processing head 10 and the workbench 201. Since the laser processing head 10 can slide on the support assembly 202, the focal point position of the laser processing head 10 can be adjusted more conveniently, and the processing effect on the workpiece is better.

[0094] The laser processing device 20 can be a laser engraving machine, a laser welding machine, a laser cutting machine or the like, and is not specifically limited herein.

[0095] The above embodiments are only exemplary descriptions of structures, and the structures in the embodiments are not fixedly combined structures. In the absence of structural conflicts, the structures in the embodiments can be used in any combination.

[0096] Although the present application has been described with reference to several exemplary embodiments, it will be understood that the terms used are illustrative and exemplary, rather than restrictive. Since the present application can be embodied in various forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the foregoing details, but are to be liberally interpreted in the spirit and scope of the appended claims, thereby including all equivalents and modifications thereof.

Claims

1. A laser machining head, characterized by, The laser processing head comprises: a first laser emitter configured to emit a first laser beam; a second laser emitter configured to emit a second laser beam; a mirror assembly corresponding to the first laser emitter and the second laser emitter, configured to receive the first laser beam and / or the second laser beam and emit the first laser beam and / or the second laser beam; a galvanometer assembly corresponding to the mirror assembly, configured to receive the first laser beam and / or the second laser beam and emit the first laser beam and / or the second laser beam onto a workpiece to process the workpiece.

2. The laser machining head of claim 1, wherein, The mirror assembly comprises a first mirror and a first beam combiner, the first mirror is arranged in a light path of the first laser emitter and configured to reflect the first laser beam to the first beam combiner. The first beam combiner is configured to reflect the first laser beam reflected by the first mirror to the galvanometer assembly.

3. The laser machining head of claim 2, wherein, The mirror assembly further comprises a second mirror, the second mirror is arranged in a light path of the second laser emitter and configured to reflect the second laser beam to the first beam combiner. The first beam combiner is further arranged in a light path of the second mirror, and the first beam combiner is further configured to transmit the second laser beam reflected by the second mirror to the galvanometer assembly.

4. The laser machining head of claim 1, wherein, The mirror assembly comprises a second beam combiner, the second beam combiner is arranged in a light path of the first laser emitter and the second laser emitter, and the second beam combiner is configured to reflect the first laser beam to the galvanometer assembly and transmit the second laser beam emitted by the second laser emitter to the galvanometer assembly.

5. The laser machining head of claim 1, wherein, The laser processing head further comprises a beam adjusting assembly, the beam adjusting assembly is connected to the second laser emitter, and the beam adjusting assembly is configured to adjust an angle and / or a spot size of the second laser beam.

6. The laser machining head of claim 5, wherein, The beam adjusting assembly comprises an angle adjusting component, the second laser emitter is supported and connected to the angle adjusting component, and the angle adjusting component is configured to adjust an emission angle of the second laser beam.

7. The laser machining head of claim 6, wherein, The second laser emitter has opposite front and rear ends in a laser emission direction, the angle adjusting component comprises a positioning seat and an adjusting seat, the front end of the second laser emitter is arranged in the positioning seat, the positioning seat is used to position a position of the front end of the second laser emitter in a front-rear direction, and the rear end of the second laser emitter is arranged in the adjusting seat, the adjusting seat is used to adjust a position of the rear end of the second laser emitter in a plane perpendicular to the front-rear direction.

8. The laser machining head of claim 5, wherein, The beam adjusting assembly comprises a beam expander, the beam expander is connected to an emission end of the second laser emitter and configured to adjust a spot size of the second laser beam.

9. The laser machining head of claim 8, wherein, The beam expander comprises: a first lens barrel; a second lens barrel connected to the emission end of the second laser emitter; a first beam expander lens mounted in the first lens barrel; a second beam expander lens mounted in the second lens barrel; the first lens barrel and the second lens barrel are telescopically connected to adjust a relative distance between the first beam expander lens and the second beam expander lens.

10. The laser machining head according to any one of claims 1 to 9, characterized in that The galvanometer assembly comprises a first galvanometer and a second galvanometer, the first galvanometer is rotatable around a first axis, the second galvanometer is rotatable around a second axis, and the first axis and the second axis are perpendicular; The first galvanometer is arranged in an output light path of the mirror assembly, and is configured to receive the first laser beam and / or the second laser beam output by the mirror assembly and reflect the first laser beam and / or the second laser beam to the second galvanometer; the second galvanometer is configured to receive the first laser beam and / or the second laser beam output by the first galvanometer and reflect the first laser beam and / or the second laser beam to output to the workpiece.

11. The laser machining head of claim 10, wherein, The galvanometer assembly further comprises a first driving member and a second driving member, the first driving member is connected to the first galvanometer and configured to drive the first galvanometer to rotate around the first axis; the second driving member is connected to the second galvanometer and configured to drive the second galvanometer to rotate around the second axis.

12. The laser processing head according to any one of claims 1 to 9, wherein, the first laser beam and the second laser beam are different types of beams; and / or, the first laser beam and the second laser beam are beams of different powers.

13. The laser machining head according to any one of claims 1 to 9, characterized in that The emission light path of the first laser emitter and the emission light path of the second laser emitter are perpendicular.

14. A laser processing apparatus characterized by comprising: The laser processing device further comprises a support assembly, one end of the support assembly is connected to the laser processing head, and the other end of the support assembly is connected to the worktable, and the laser processing head and the worktable are arranged opposite to each other; the laser processing head is slidably arranged on the support assembly to adjust the distance between the laser processing head and the worktable.

15. The laser processing apparatus according to claim 14, characterized by the first laser beam and the second laser beam are different types of beams; and / or, the first laser beam and the second laser beam are beams of different powers. The emission light path of the first laser emitter and the emission light path of the second laser emitter are perpendicular. The laser processing device further comprises a support assembly, one end of the support assembly is connected to the laser processing head, and the other end of the support assembly is connected to the worktable, and the laser processing head and the worktable are arranged opposite to each other; the laser processing head is slidably arranged on the support assembly to adjust the distance between the laser processing head and the worktable.

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