Foot pad manufacturing mold for electronic product

Abstract

The utility model relates to the technical field of electronic products, and discloses an electronic product foot pad manufacturing die which comprises a main frame, the upper surface of the main frame is fixedly connected with a supporting bottom plate, the upper surface of the supporting bottom plate is provided with a pressure plate, and the upper surface of the pressure plate is fixedly connected with a lower die holder. When the lower die holder is pressed by the upper die holder, impact force can be buffered through cooperation of a rotary block, a movable sleeve, a pressing ring and a buffer spring and under the action of an auxiliary sleeve, a main sleeve and a reset spring, the situation that the lower die holder is deformed and abraded due to long-time pressure is avoided, the service life of the die is prolonged, and the maintenance and replacement cost of the die is reduced; due to the fact that the die is well protected and the lower die base is not prone to deformation and abrasion, the manufacturing precision of the foot pad can be guaranteed, in the production process of the foot pad, the high-precision die can guarantee that the size, the shape and the like of the foot pad meet the design requirements, the product quality is improved, and the defective rate is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product technical field especially relates to a foot pad manufacturing mould for electronic product. BACKGROUND

[0002] With the rapid development of electronic products, such as mobile phones, tablet computers, notebook computers and other equipment are widely used in people's daily life and work, electronic product foot pad as an important accessory, plays a variety of key roles, it not only can increase the friction between electronic products and the placement plane, prevent equipment accidental sliding, but also can play the effect of shock absorption, buffering to a certain extent, protect internal electronic components from damage caused by slight collision or vibration.

[0003] In the traditional foot pad manufacturing mould, there is lack of effective buffer structure, when the mould is in the process of closing, the upper die holder exerts a large pressure on the lower die holder, the lower die holder is easy to deform and wear for a long time to withstand this pressure, since the mould is usually made of metal and other materials, frequent closing operation makes the impact force accumulated on the lower die holder, the wear will gradually change the shape and size accuracy of the lower die holder, the deformation and wear of the lower die holder directly affect the manufacturing precision of the foot pad, because the size, shape and other characteristics of the foot pad are determined by the mould cavity, once the lower die holder is deformed, it will cause the size deviation and irregular shape of the foot pad. SUMMARY

[0004] To solve the above technical problems, the utility model provides a foot pad manufacturing mould for electronic product.

[0005] The utility model discloses the following technical scheme realizes: a foot pad manufacturing mould for electronic product, including main frame, the upper surface fixed connection of main frame has the support base plate, the upper surface of support base plate is provided with the pressure plate, the upper surface fixed connection of pressure plate has the lower die holder, the lower surface rotation of pressure plate is connected with the rotary block, the surface rotation of rotary block is connected with the movable sleeve, the upper surface fixed connection of support base plate has the support, the surface fixed connection of support has the translation support, the outer surface of translation support is provided with buffer spring, the surface fixed connection of movable sleeve has the pressure ring.

[0006] Through the above technical scheme, the lower die holder is effectively protected, the shape accuracy of the lower die holder is ensured, thereby meeting the high-precision mould demand of electronic products, which helps to improve the quality and precision of foot pad manufacturing.

[0007] As a further improvement of the above scheme, the translation support penetrates the movable sleeve and the pressure ring, and the pressure ring is in contact with the buffer spring.

[0008] As a further improvement of the above scheme, the upper surface of the support base is fixedly connected with a main sleeve at four corners, and an inner embedding groove is formed in the inner wall of the main sleeve.

[0009] The above technical scheme provides a preliminary buffer mechanism for the whole mold structure, and in the pressure transmission process, the part of the pressure is shared by the descending of the auxiliary sleeve, thereby reducing the direct impact on the lower mold base.

[0010] As a further improvement of the above scheme, the surface of the auxiliary sleeve is fixedly connected with a sliding block, and the sliding block is matched with the inner embedding groove.

[0011] The above technical scheme ensures that the sliding of the auxiliary sleeve in the main sleeve is stable and directional, and improves the reliability of the whole mold structure in the buffering process, thereby preventing the auxiliary sleeve from deviating and affecting the buffering effect.

[0012] As a further improvement of the above scheme, the inner bottom wall of the main sleeve is fixedly connected with a reset spring, and the top end of the reset spring is fixedly connected to the lower surface of the auxiliary sleeve.

[0013] The above technical scheme further buffers the impact of the pressure on the lower mold base when the pressure exists, and on the other hand, the auxiliary sleeve can be reset after the pressure disappears, thereby ensuring the repeatability and stability of the mold structure and facilitating the next insole manufacturing operation.

[0014] As a further improvement of the above scheme, the upper surface of the main frame is fixedly connected with a cover plate, and the upper surface of the cover plate is fixedly connected with a gas cylinder.

[0015] As a further improvement of the above scheme, the output end of the gas cylinder is fixedly connected with a piston rod, and the surface of the piston rod is fixedly connected with an upper mold base matched with the lower mold base.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] The buffer structure effectively protects the mold, the impact force can be buffered by the cooperation of the rotary block, the movable sleeve, the compression ring and the buffer spring, and the action of the auxiliary sleeve, the main sleeve and the reset spring, the deformation and wear of the lower mold base caused by long-time pressure are avoided, the service life of the mold is prolonged, the cost of mold maintenance and replacement is reduced, the mold is well protected, the deformation and wear of the lower mold base are avoided, which helps to ensure the precision of insole manufacturing, in the insole production process, the high-precision mold can ensure that the size and shape of the insole meet the design requirements, thereby improving the quality of the product and reducing the rate of defective products. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the whole structure schematic view of the utility model;

[0019] Figure 2 It is the structure schematic view of the translation support rod of the utility model;

[0020] Figure 3 It is the structure schematic view of the reset spring of the utility model;

[0021] Figure 4 It is the structure schematic view of the compression ring of the utility model.

[0022] Main symbol explanation:

[0023] 1, main frame; 2, support bottom plate; 3, pressure plate; 4, lower die seat; 5, rotary block; 6, movable sleeve; 7, support; 8, translation support rod; 9, buffer spring; 10, compression ring; 11, main sleeve; 12, embedded groove; 13, vice sleeve; 14, sliding block; 15, reset spring; 16, cover plate; 17, air cylinder; 18, piston rod; 19, upper die seat. Specific implementation

[0024] Next, the utility model is further described in combination with the drawings and specific implementation, and it should be explained that, under the premise of not conflicting, the following described each embodiment or each technical feature between can be combined to form new embodiment.

[0025] Embodiment:

[0026] Please combine Figures 1-4 The electronic product foot pad manufacturing mold of the embodiment comprises a main frame 1, the upper surface of the main frame 1 is fixedly connected with a support bottom plate 2, the upper surface of the support bottom plate 2 is provided with a pressure plate 3, the upper surface of the pressure plate 3 is fixedly connected with a lower die seat 4, the lower surface of the pressure plate 3 is rotatably connected with a rotary block 5, the surface of the rotary block 5 is rotatably connected with a movable sleeve 6, the upper surface of the support bottom plate 2 is fixedly connected with a support 7, the surface of the support 7 is fixedly connected with a translation support rod 8, the outer surface of the translation support rod 8 is provided with a buffer spring 9, the surface of the movable sleeve 6 is fixedly connected with a compression ring 10, when foot pad manufacturing is carried out, the lower die seat 4 will drive the lower rotary block 5 connected with it to rotate when the upper die seat 19 exerts pressure on the lower die seat 4.The rotation of the rotary block 5 will push the movable sleeve 6 to move on the surface of the translation support rod 8, since the surface of the movable sleeve 6 is fixedly connected with the compression ring 10, the compression ring 10 will gradually compress the buffer spring 9 in the movable sleeve 6 moving process, the impact force of the upper die seat 19 on the lower die seat 4 is buffered through the compression of the buffer spring 9, thereby avoiding the problem that the lower die seat 4 is deformed and worn out for a long time under the pressure of the upper die seat 19.

[0027] The translation support rod 8 penetrates the movable sleeve 6 and the compression ring 10, and the compression ring 10 is in contact with the buffer spring 9. The translation support rod 8 penetrates the movable sleeve 6 and the compression ring 10, which ensures that the movable sleeve 6 can move stably on the translation support rod 8, and the compression ring 10 is in contact with the buffer spring 9, so that when the movable sleeve 6 moves, the compression ring 10 can accurately compress the buffer spring 9, ensuring the realization of the buffering function.

[0028] The upper surface of the support bottom plate 2 is fixedly connected with a main sleeve 11 at four corners, the inner wall of the main sleeve 11 is provided with an embedded groove 12, and the main sleeve 11 is slidably connected with a secondary sleeve 13 through the embedded groove 12. When the pressure plate 3 is pressed and lowered, the secondary sleeve 13 will slide and descend on the inner wall of the main sleeve 11.

[0029] The surface of the secondary sleeve 13 is fixedly connected with a sliding block 14, and the sliding block 14 is matched with the embedded groove 12. When the secondary sleeve 13 slides in the main sleeve 11, the sliding block 14 slides along the embedded groove 12. This structure limits the movement direction of the secondary sleeve 13, so that it can only slide up and down along the embedded groove 12, ensuring the stability of the movement of the secondary sleeve 13.

[0030] The inner bottom wall of the main sleeve 11 is fixedly connected with a return spring 15, and the top end of the return spring 15 is fixedly connected to the lower surface of the secondary sleeve 13. When the secondary sleeve 13 descends, the return spring 15 will be compressed, and the return spring 15 will generate an upward elastic force. After the pressure disappears, this elastic force will prompt the secondary sleeve 13 to return to the original position, and at the same time, it also plays a certain buffering role when the pressure exists, further reducing the impact on the lower mold base 4.

[0031] The upper surface of the main frame 1 is fixedly connected with a cover plate 16, and the upper surface of the cover plate 16 is fixedly connected with an air cylinder 17.

[0032] The output end of the air cylinder 17 is fixedly connected with a piston rod 18, and the surface of the piston rod 18 is fixedly connected with an upper mold base 19. The upper mold base 19 is matched with the lower mold base 4. When the air cylinder 17 works, the piston rod 18 will perform extension and contraction movement according to the action of the air cylinder 17. Since the surface of the piston rod 18 is fixedly connected with the upper mold base 19, the extension and contraction of the piston rod 18 will drive the movement of the upper mold base 19, so that the upper mold base 19 is matched with the lower mold base 4, thereby realizing the production of the foot pad.

[0033] The implementation principle of the foot pad manufacturing mold for an electronic product in the embodiment of the application is as follows: the cylinder 17 starts to work, the piston rod 18 at the output end of the cylinder 17 moves downward under the pushing of the air pressure, since the surface of the piston rod 18 is fixedly connected with the upper mold base 19, the downward movement of the piston rod 18 directly drives the upper mold base 19 to move downward, at this time, the distance between the upper mold base 19 and the lower mold base 4 gradually decreases and starts to gradually approach, with the continuous descending of the upper mold base 19, the pressure between the upper mold base 19 and the lower mold base 4 gradually increases, the pressure plate 3 above the lower mold base 4 starts to descend after being subjected to the pressure, at the same time, the corresponding change occurs in the inner part of the main sleeve 11 fixedly connected with the upper surface of the four corners of the supporting bottom plate 2, the auxiliary sleeve 13 starts to slide and descend on the inner wall of the main sleeve 11, the surface of the auxiliary sleeve 13 is fixedly connected with the sliding block 14, the inner wall of the main sleeve 11 is provided with the embedded groove 12, the sliding block 14 is matched with the embedded groove 12, this structure ensures that the auxiliary sleeve 13 can only stably slide up and down along the embedded groove 12, in the descending process of the auxiliary sleeve 13, the reset spring 15 below the auxiliary sleeve 13 is compressed, thereby playing a preliminary buffering role, at the same time, since the lower surface of the pressure plate 3 is rotatably connected with the rotary block 5, and the rotary block 5 is connected with the lower mold base 4, the lower mold base 4 drives the rotary block 5 to rotate, the surface of the rotary block 5 is rotatably connected with the movable sleeve 6, with the rotation of the rotary block 5, the rotary block 5 pushes the movable sleeve 6 to move on the surface of the translation support rod 8, the surface of the movable sleeve 6 is fixedly connected with the pressure ring 10, the outer surface of the translation support rod 8 is provided with the buffer spring 9, in the moving process of the movable sleeve 6, the pressure ring 10 gradually compresses the buffer spring 9, in this way, the impact force of the upper mold base 19 on the lower mold base 4 is further buffered, thereby protecting the mold in multiple directions in the whole mold closing process, and reducing the possibility of deformation and wear of the mold due to excessive impact force.

[0034] The above embodiment is only a preferred embodiment of the utility model, and cannot be used to limit the protection range of the utility model, and any non-substantial change and replacement made by the person skilled in the art on the basis of the utility model belongs to the range required to be protected by the utility model.

Claims

1. An electronic product foot mat manufacturing mold characterized by comprising: The utility model relates to a kind of moulding machine, including main frame (1), the upper surface of the main frame (1) is fixedly connected with support base plate (2), the upper surface of the support base plate (2) is provided with pressure plate (3), the upper surface of the pressure plate (3) is fixedly connected with lower die seat (4), the lower surface of the pressure plate (3) is rotatably connected with rotary block (5), the surface of the rotary block (5) is rotatably connected with movable sleeve (6), the upper surface of the support base plate (2) is fixedly connected with support (7), the surface of the support (7) is fixedly connected with translation support rod (8), the outer surface of the translation support rod (8) is provided with buffer spring (9), the surface of the movable sleeve (6) is fixedly connected with compression ring (10).

2. The mold for manufacturing a foot pad for an electronic product according to claim 1, wherein: The translation support rod (8) passes through movable sleeve (6) and compression ring (10), and the compression ring (10) is in contact with buffer spring (9).

3. The mold for manufacturing a foot pad for an electronic product according to claim 1, wherein: The upper surface of the support base plate (2) is fixedly connected with main sleeve pipe (11) at four corners, the inner wall of the main sleeve pipe (11) is provided with embedded groove (12), and the main sleeve pipe (11) is slidably connected with auxiliary sleeve pipe (13) by embedded groove (12).

4. The mold for manufacturing a foot pad for an electronic product according to claim 3, wherein: The surface of the auxiliary sleeve pipe (13) is fixedly connected with sliding block (14), and the sliding block (14) is matched with embedded groove (12).

5. A mold for manufacturing foot pads for electronic products as described in claim 3, characterized in that: The inner bottom wall of the main sleeve pipe (11) is fixedly connected with reset spring (15), and the top end of the reset spring (15) is fixedly connected to the lower surface of the auxiliary sleeve pipe (13).

6. The mold for making a foot pad for an electronic product according to claim 1, wherein: The upper surface of the main frame (1) is fixedly connected with cover plate (16), and the upper surface of the cover plate (16) is fixedly connected with air cylinder (17).

7. The mold for manufacturing a foot pad for an electronic product according to claim 6, wherein: The output end of the air cylinder (17) is fixedly connected with piston rod (18), and the surface of the piston rod (18) is fixedly connected with upper die seat (19), and the upper die seat (19) is matched with lower die seat (4).

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