Integrated circuit module for intelligent wireless communication
By using a combination of heat insulation strips, PTC thermistors, semiconductor cooling chips, and copper sheets in wireless communication integrated circuits, the problem of overheating in integrated circuits is solved, signal transmission smoothness is improved, and service life is extended.
Patent Information
- Application Number
- CN202520337380.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-02-28
AI Technical Summary
The integrated circuits in wireless communication are prone to overheating when the power is high, which can cause lag and affect their lifespan.
The signal transmitter and receiver are separated into two areas by thermal insulation strips, and temperature monitoring and cooling are performed using PTC thermistors and semiconductor cooling chips, combined with copper sheets for heat management.
It effectively isolates heat, improves signal smoothness, prevents integrated circuits from overheating for extended periods, and extends their service life.
Smart Images
Figure CN223859657U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to integrated circuit technical field, concretely relates to an integrated circuit module of intelligent wireless communication. BACKGROUND
[0002] Integrated circuit is the transistor, diode, resistance, capacitor and inductance element and wiring interconnection needed in circuit, is made on a small piece or several small pieces semiconductor wafer or dielectric substrate, is encapsulated in tube shell, becomes the microstructure with required circuit function.
[0003] For the integrated circuit for wireless communication, when receiving and transmitting signals, especially when the power is large, a large amount of heat will be generated. If the integrated circuit is overheated, it will easily appear the phenomenon of lag, and long time overheating will easily affect the service life of the integrated circuit. UTILITY MODEL CONTENTS
[0004] The utility model aims at providing an integrated circuit module of intelligent wireless communication to solve the technical problem that the existing integrated circuit of wireless communication is easy to overheat.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0006] An integrated circuit module of intelligent wireless communication, comprising a signal transmitter, a signal receiver and a heat insulation strip, the signal transmitter, the signal receiver and the heat insulation strip are all encapsulated in an encapsulation body, and the heat insulation strip divides the signal transmitter and the signal receiver into two regions.
[0007] PTC thermistor and semiconductor refrigeration sheet are arranged in the two regions respectively, the PTC thermistor is electrically connected with the IC chip through series voltage division method, and the semiconductor refrigeration sheet is controlled by the IC chip; one side surface of the semiconductor refrigeration sheet is exposed on the surface of the encapsulation body; a copper sheet is attached to one side surface of the semiconductor refrigeration sheet, and the copper sheet is encapsulated in the encapsulation body.
[0008] As a preferred scheme of the utility model, the heat absorbing surface of the semiconductor refrigeration sheet is attached to the copper sheet, and the heat releasing surface of the semiconductor refrigeration sheet is flush with the surface of the encapsulation body.
[0009] As a preferred scheme of the utility model, a power management module is encapsulated in the encapsulation body, and the power management module and the signal transmitter are arranged in the same region.
[0010] As a preferred scheme of the utility model, the heat insulation strip is arranged above the IC chip, and the IC chip can be arranged in the two regions.
[0011] As a preferred scheme of the utility model, the heat insulation strip is a nylon heat insulation strip.
[0012] As the preferred scheme of the utility model, the surface of the heat insulation strip is coated with a heat insulation coating, and the heat insulation coating is arranged around the semiconductor refrigeration sheet.
[0013] As the further scheme of the utility model, the heat insulation coating is a silicon aluminum fiber coating.
[0014] As the further preferred scheme of the utility model, the thickness of the copper sheet is 0.2-1.0mm.
[0015] Compared with the prior art, the integrated circuit module with intelligent wireless communication provided by the utility model has the following beneficial effects:
[0016] 1. The packaging body is divided into two areas by the heat insulation strip, a signal transmitter is arranged in one area, and a signal receiver is arranged in the other area, heat is separated by the heat insulation strip, heat is separated in the two areas, and there is no great influence between signal receiving and transmitting, so that the smoothness of the signal is improved;
[0017] 2. The semiconductor refrigeration sheet and the PTC thermistor are used to measure the temperature of the integrated circuit by measuring the change of the resistance value of the PTC thermistor by the IC chip; when the temperature is high, the semiconductor refrigeration sheet is used for rapid cooling, so that the problem of long-term overheating of the integrated circuit is avoided;
[0018] 3. The copper sheet can insulate the heat of the lower layer and the surface layer of the integrated circuit, plays a role of heat dissipation when the temperature of the integrated circuit is not overheated, starts the semiconductor refrigeration sheet when the temperature is overheated, so that the copper sheet forms a low-temperature layer, insulates external heat and absorbs the heat of the integrated circuit, and plays a role of protecting the integrated circuit. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme of the embodiments of the application, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the application, and those skilled in the art can obtain other drawings according to the drawings without creative labor.
[0020] Fig. 1 It is a structural schematic view of the embodiment of the utility model;
[0021] Fig. 2 It is a structural schematic view of the semiconductor refrigeration sheet in the embodiment of the utility model;
[0022] Fig. 3 It is a layout structural schematic view of the internal elements of the packaging body of the embodiment of the utility model.
[0023] Reference signs: 100, package; 101, heat insulation coating; 200, IC chip; 300, semiconductor refrigeration sheet; 400, copper sheet; 500, PTC thermistor; 600, heat insulation strip; 700, signal transmitter; 800, signal receiver; 900, power management module. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the embodiments of the present application are further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.
[0025] In the description of the embodiments of the present application, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.
[0026] In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood broadly, for example, it can be fixed connection, integral connection, or detachable connection; it can be the communication between the two elements; it can be directly connected, or indirectly connected through an intermediate medium; for those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.
[0027] Referring to the drawings Figs. 1-3 As shown in the drawings, the present application provides an integrated circuit module for intelligent wireless communication, which comprises a signal transmitter 700, a signal receiver 800 and a heat insulation strip 600, the signal transmitter 700, the signal receiver 800 and the heat insulation strip 600 are all encapsulated in a package 100, and the heat insulation strip 600 divides the signal transmitter 700 and the signal receiver 800 into two areas; the heat insulation strip 600 divides the package 100 into two areas, one area is provided with the signal transmitter 700, and the other area is provided with the signal receiver 800, the heat is separated by the heat insulation strip 600, the heat is separated in two areas, and there is no great influence between the receiving and transmitting of signals, which facilitates to improve the smoothness of signals.
[0028] The PTC thermistor 500 is electrically connected with the IC chip 200 through a series voltage division method, and the semiconductor refrigeration sheet 300 is controlled by the IC chip 200; one side surface of the semiconductor refrigeration sheet 300 is exposed on the surface of the packaging body 100; the copper sheet 400 is attached to one side surface of the semiconductor refrigeration sheet 300, and the copper sheet 400 is packaged in the packaging body 100. Through the semiconductor refrigeration sheet 300 and the PTC thermistor 500, the change of the resistance value of the PTC thermistor 500 is measured by the IC chip 200, so that the temperature of the integrated circuit can be measured; when the temperature is high, the semiconductor refrigeration sheet 300 can be used for rapid cooling, so that the problem of long-term overheating of the integrated circuit is avoided.
[0029] In the use of the embodiment of the utility model, the heat absorbing surface of the semiconductor refrigeration sheet 300 is attached to the copper sheet 400, and the heat releasing surface of the semiconductor refrigeration sheet 300 is flush with the surface of the packaging body 100. By starting the semiconductor refrigeration sheet 300, the heat on the copper sheet 400 can be absorbed and released through the heat releasing surface of the semiconductor refrigeration sheet 300. The copper sheet 400 is conducive to heat conduction and can quickly transfer heat. The thickness of the copper sheet 400 is 0.2-1.0mm.
[0030] The power management module 900 is packaged in the packaging body 100, and the power management module 900 and the signal transmitter 700 are arranged in the same area. Generally, electronic products such as mobile phones are used for signal reception, that is, the power consumption of the signal receiver 800 is large, and it is also easy to heat; and the power management module 900 is also easy to heat, so the power management module 900 is arranged in the same area as the signal transmitter 700, which is convenient for balancing heat.
[0031] As shown in Fig. 2 and Fig. 3 , the heat insulation strip 600 is arranged above the IC chip 200, and the IC chip 200 can be arranged in the two areas. Among them, the heat insulation strip 600 is arranged as a nylon heat insulation strip.
[0032] The surface of the heat insulation strip 600 is coated with a heat insulation coating 101, and the heat insulation coating 101 surrounds the semiconductor refrigeration sheet 300. Among them, the heat insulation coating 101 is arranged as a silicon aluminum fiber coating. The heat insulation coating 101 can play a partial heat insulation role, avoiding the heat generated by the semiconductor refrigeration sheet 300 from flowing back directly.
[0033] The above shows and describes the basic principles of the present application, the above is only the preferred embodiment of the present application, and does not limit the present application, the above embodiment and the description in the specification only illustrate the principles of the present application, any modification, equivalent replacement and improvement within the scope of the present application, etc. should be included in the protection scope of the present application.
Claims
1. An intelligent radio communication integrated circuit module, characterized by: The application relates to a signal transmitter (700), a signal receiver (800) and a heat insulation strip (600), which are all encapsulated in an encapsulation body (100), and the heat insulation strip (600) divides the signal transmitter (700) and the signal receiver (800) into two areas. Wherein, PTC thermistors (500) and semiconductor refrigerating sheets (300) are arranged in the two areas respectively, the PTC thermistors (500) are electrically connected with IC chips (200) through a series voltage division method, and the semiconductor refrigerating sheets (300) are controlled by the IC chips (200); one side of the semiconductor refrigerating sheets (300) is exposed on the surface of the encapsulation body (100). One side of the semiconductor refrigerating sheets (300) is attached with copper sheets (400), and the copper sheets (400) are encapsulated in the encapsulation body (100).
2. The IC module of claim 1, wherein: the IC module is configured to: receive a request from the wireless communication device to establish a connection with the wireless communication device; and transmit a response to the request to the wireless communication device. The heat absorbing surface of the semiconductor refrigerating sheets (300) is attached on the copper sheets (400), and the heat releasing surface of the semiconductor refrigerating sheets (300) is exposed on the surface of the encapsulation body (100).
3. The integrated circuit module for intelligent wireless communication according to claim 1, characterized in that: A power management module (900) is encapsulated in the encapsulation body (100), and the power management module (900) is arranged in the same area as the signal transmitter (700).
4. The intelligent wireless communication IC module of claim 1, wherein: The heat insulation strip (600) is arranged above the IC chips (200), and the IC chips (200) are arranged in the two areas.
5. The intelligent wireless communication IC module of claim 1, wherein: The heat insulation strip (600) is a nylon heat insulation strip.
6. The intelligent wireless communication IC module of claim 1, wherein: The surface of the heat insulation strip (600) is coated with a heat insulation coating (101), and the heat insulation coating (101) surrounds the semiconductor refrigerating sheets (300).
7. The intelligent wireless communication IC module of claim 6, wherein: The heat insulation coating (101) is a silicon-aluminum fiber coating.
8. The intelligent wireless communication IC module of claim 1, wherein: The thickness of the copper sheets (400) is 0.2-1.0 mm.