Phantom screen structure

Abstract

The utility model discloses a phantom screen structure. The phantom screen structure comprises lamp beads, a lamp panel and a transparent protective material, the lamp panel comprises a regular cube formed by cutting the edge by a milling cutter according to a preset direction; a plurality of first-class through holes and a plurality of second-class through holes are alternately formed in the lamp panel; the multiple lamp beads are arranged at the positions, not provided with the through holes, of the lamp panel at preset intervals. And the transparent protective material covers the surfaces of the lamp beads through a GOB process. The surface of the LED lamp bead is coated with a layer of transparent protective material by utilizing a GOB process, so that the dustproof, impact-resistant and UV-resistant capabilities of the LED display screen are greatly improved, and the service life of the product is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of phantom screen processing technology, and in particular to a phantom screen structure. Background Technology

[0002] A phantom display is a display technology that typically refers to a transparent display screen that can show images or videos without completely obstructing the viewer's line of sight. It works by using special materials and optical effects to allow the displayed content to appear on a transparent or semi-transparent surface. Phantom displays are commonly found in high-end display devices, advertising displays, and augmented reality applications that require integration with the real world. This technology provides an intuitive visual effect, giving viewers a feeling of "floating" or "seeing through."

[0003] Existing phantom screens on the market use the original light board and LEDs, with the PCB (Printed Circuit Board) light board being hollowed out. Although the large space improves the transparency of the phantom screen and ensures the visual effect, the hollowing out of the light board results in insufficient structural strength of some parts of the phantom screen, which in turn makes it easy to be damaged during use.

[0004] Therefore, this utility model proposes a new phantom screen structure to solve the problem of insufficient structural strength in the phantom screen section. Utility Model Content

[0005] The purpose of this invention is to provide a phantom screen structure to solve the problem of insufficient structural strength in the phantom screen.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A phantom screen structure includes LED beads, a light board, and a transparent protective material; the light board includes a regular cube formed by cutting the edges with a milling cutter in a preset direction; the light board is provided with a plurality of first-type through holes and a plurality of second-type through holes alternately; a plurality of LED beads are arranged at preset distances at the locations on the light board where no through holes are provided; the transparent protective material is covered on the surface of the LED beads using a GOB process.

[0008] Furthermore, the first type of through hole is composed of several circular holes that are evenly spaced and interconnected.

[0009] Furthermore, the second type of through hole consists of several circular holes with consistent spacing.

[0010] Furthermore, the edge of the lamp panel is formed into a continuous arc chamfer by cutting along the edge direction of the cube, and the chamfer radius is 1 / 5 to 1 / 3 of the thickness of the lamp panel.

[0011] Furthermore, the lamp beads are SMD packaged LEDs or COB integrated light sources, which are fixed to the non-through-hole area of ​​the lamp board by reflow soldering process. The center-to-center spacing of adjacent lamp beads in the horizontal direction and the center-to-center spacing of adjacent lamp beads in the vertical direction are configured in an asymmetrical manner to form a differentiated arrangement.

[0012] Furthermore, the transparent protective material is formed by two coating processes using the GOB process. The bottom layer has an ultra-thin coating layer to enhance the interfacial adhesion with the lamp board substrate, and the top layer has a thickened optical coating layer to achieve optical path control.

[0013] Furthermore, the transparent protective material is a modified epoxy resin or silicone.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] Without compromising transparency, a transparent protective material is coated onto the surface of the LED beads using the GOB process. This treatment method greatly improves the LED display's dustproof, impact-resistant, and UV-resistant capabilities, extends the product's lifespan, maintains good display effects, and also enhances the overall waterproof capability of the phantom screen to some extent. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0018] Figure 1 This is a schematic diagram of one embodiment of the phantom screen structure of this utility model;

[0019] Figure 2 This is a partial enlarged view of an embodiment of the phantom screen structure of this utility model;

[0020] Figure 3 This is a side view of an embodiment of the phantom screen structure of this utility model;

[0021] Figure 4 This is a top view of an embodiment of the phantom screen structure of this utility model;

[0022] Figure 5 This is a schematic diagram of the structure of a light panel according to an embodiment of the phantom screen structure of this utility model.

[0023] Illustration: 100, LED bead; 200, LED board; 300, transparent protective material; 210, Type I through hole; 220, Type II through hole; 230, chamfer. Detailed Implementation

[0024] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0025] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0026] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0027] Figure 1 This is a schematic diagram of one embodiment of the phantom screen structure of this utility model; Figure 2 This is a partial enlarged view of an embodiment of the phantom screen structure of this utility model; Figure 3 This is a side view of an embodiment of the phantom screen structure of this utility model; Figure 4 This is a top view of an embodiment of the phantom screen structure of this utility model; Figure 5 This is a schematic diagram of the structure of a light panel according to an embodiment of the phantom screen structure of this utility model.

[0028] Reference Figure 1 and Figure 2This utility model provides a phantom screen structure, characterized in that the phantom screen structure includes LED beads 100, a light board 200, and a transparent protective material 300; the light board 200 includes a regular cube formed by cutting off the edges with several cylinders in a preset direction; the light board 200 is provided with a plurality of first-type through holes 210 and a plurality of second-type through holes 220 alternately; a plurality of LED beads 100 are arranged at preset distances at the locations of the un-through holes on the light board 200; the transparent protective material 300 is covered on the surface of the LED beads 100 by a GOB process.

[0029] It should be noted that the lamp panel 200 is a regular cube, and its edges are formed by cutting along a preset direction with a milling cutter. Preferably, it is formed by machining on a lathe. By changing to a suitable milling cutter, the preset direction, i.e., the cutting direction, can be along the edge direction or the diagonal direction of the cube. For example, when fixing the lamp panel 200 to a machining table, an arc program needs to be pre-set. The milling cutter should reach one side of the lamp panel 200 beforehand, and its lowest point should be on the same horizontal plane as the contact surface between the lamp panel 200 and the machining table. Then, machining begins from the side end along the edge of the lamp panel 200, which can be automated, forming a continuous arc-shaped chamfer 230 after cutting. During installation, ensure that the height of the lamp panels is consistent, and protect the surface of the lamp panel 200 by using a fixed direct support or spring-type support structure to prevent deformation or damage due to improper positioning.

[0030] Furthermore, in a preferred embodiment, the first type of through hole 210 includes multiple circular holes and multiple connecting holes. Every two equidistant circular holes are connected by a connecting hole to form the first type of through hole 210. The second type of through hole 220 is composed of several equidistant circular holes. The first type of through hole 210 and the second type of through hole 220 are arrayed in rows and columns and alternately distributed on the lamp panel 200. The number of rows of the first type of through hole 210 is 3 and the number of columns is 10. The number of rows of the second type of through hole 220 is 3 and the number of columns is 9. The distance between the center positions of the first type of through hole 210 and the center positions of the second type of through hole 220 in two adjacent columns is slightly different from the distance between the center positions of the two closest circular holes of the first type of through hole 210 in two adjacent rows, and they are not equidistant, forming a differentiated arrangement.

[0031] Furthermore, the radius of chamfer 230 is 1 / 5 to 1 / 3 of the thickness of the lamp panel 200.

[0032] Furthermore, in combination Figure 3The transparent protective material 300 is applied to both sides of the lamp panel 200 using the GOB process. The side of the lamp panel 200 where the LED beads 100 are located must cover the LED beads 100. Preferably, the transparent protective material 300 is formed by two coating processes using the GOB process. The bottom layer has an ultra-thin coating layer to enhance the interfacial adhesion with the substrate of the lamp panel 200, and the top layer has a thickened optical coating layer to achieve light path control. The bottom layer (the side without LED beads 100) has a coating thickness of 0.01mm-0.1mm, and the top layer has a coating thickness of 1mm-1.5mm. The overall light transmittance is ≥92%, and the refractive index is 1.45-1.55. The above thicknesses are based on the reference surfaces of each side of the lamp panel 200, and are the distances from the nearest surface of the lamp panel 200 in the direction away from the lamp panel 200. The thickness of the front surface coating must ensure that the LED 100 is completely encapsulated in the colloid, eliminating the risk of exposed pins and resisting physical impact and moisture corrosion. The ultra-thin back layer coating provides basic protection while preventing excessive heat transfer due to excessive colloid thickness, maintaining the thermal expansion coefficient balance of both sides of the LED board 200, and preventing warping and deformation. The thickness of the colloid surface layer provides sufficient space for light path adjustment. Through gradient matching between the refractive index (1.45-1.55) and the LED 100 encapsulation material (usually 1.5-1.6), the reflection loss of light at the interface between the LED 100 surface and the colloid is reduced (down to below 3%). At the same time, the colloid thickness and light transmittance work together to make the light scatter more evenly when passing through the colloid layer, improving the overall display brightness and viewing angle consistency of the phantom screen. Only a thin layer is needed on the back, significantly reducing the amount of adhesive used (saving approximately 30% in material costs). The thin layer also cures quickly, reducing production cycle time. The double-sided synchronous coating process completes coating on both sides in a single clamping and positioning operation, avoiding displacement deviations of the lamp board 200 caused by multiple clamping operations and ensuring the positional accuracy of the LED beads 100 and the through-holes. The double-sided coating completely isolates the lamp board 200 from the external environment, even in high humidity (85% RH) and salt spray (5%) conditions. Even under conditions of extreme temperature fluctuations (-40℃ to 85℃), it can still prevent oxidation of metal circuits, blockage of through-holes, and 100% light decay of LEDs, increasing lifespan by more than 2 times compared to traditional single-sided covering solutions (exposed back). It can also prevent impacts, further extending the product's lifespan.

[0033] Furthermore, the transparent protective material 300 is a modified epoxy resin or silicone rubber. It should be noted that the high hardness (≥3H) and strong adhesion (peel strength to the lamp board 200 ≥5N / mm) of the modified epoxy resin effectively resists external scratches and mechanical impacts. Its low viscosity (300-500cps) ensures that the bottom layer fully fills the gaps between the LED bead 100 leads, preventing moisture from penetrating the solder joints. The flexibility (elongation at break ≥200%) and temperature resistance (-50℃~200℃) of silicone rubber can absorb the micro-strain caused by thermal expansion and contraction of the lamp board 200, preventing the protective layer from cracking. Simultaneously, its high light transmittance (≥93%) and UV aging resistance (yellowing index after 1000 hours of UV irradiation) also contribute to its performance. To ensure optical stability during long-term use, the high hardness of modified epoxy resin is preferred.

[0034] Furthermore, the transparent protective material is formed on the surface of the LED bead 100 using a GOB (Glue On The Board) process, a technology that directly covers and encapsulates the circuit board surface and electronic components with an adhesive material. Its core lies in utilizing liquid transparent protective material 300 to flow, fill, and wrap the target area on the LED board 200, subsequently curing to form a continuous protective layer, achieving physical protection, environmental isolation, and optical control—a triple function. The specific principles include:

[0035] Impregnation and filling: Low-viscosity colloid penetrates into the pin gaps of LED 100, solder joints, and surface microstructure of LED board 200 under capillary action, eliminating air gaps.

[0036] Layered curing: By curing in stages (such as pre-curing of the bottom layer + final curing of the surface layer), the shrinkage rate of the colloid is controlled to avoid stress damage to the LED beads.

[0037] Optical matching: By adjusting the refractive index of the colloidal material (1.45-1.55) to be between that of air (1.0) and the LED encapsulation material (1.5-1.6), the reflection loss of light at the interface is reduced.

[0038] Traditional potting processes (such as epoxy resin potting) result in poor colloid flowability, easily forming air bubbles in the densely packed areas of the LED beads 100. Furthermore, the cured colloid is highly hard and brittle, unable to adapt to the flexible deformation of the LED panel 200, and cannot achieve double-sided protection and differentiated thickness control. Excessively thick colloid on one side (e.g., full coverage of 1.1mm) increases thermal resistance and causes the center of gravity of the LED panel 200 to shift, while double-sided equal-thickness coverage (e.g., 0.55mm on each side) reduces heat dissipation efficiency due to redundant colloid on the back side. This solution, through a double-sided asymmetric coverage design, achieves the optimal balance between protection, optical performance, and heat dissipation efficiency while minimizing material consumption. The GOB process, through precise matching of material properties and process parameters, fulfills the core requirements of high light transmittance, strong sealing, and resistance to environmental stress in the phantom screen structure.

[0039] Furthermore, in combination Figure 4 and Figure 5 The first type of through hole 210 consists of several circular holes with consistent spacing and interconnection; the second type of through hole 220 consists of several circular holes with consistent spacing. It should be noted that the first type of through hole 210 forms a continuous airflow path through the interconnected channels, accelerating air convection and heat dissipation. Especially in the high-heat area in the center of the lamp panel 200 (the dense area of ​​the lamp beads 100), heat can be quickly conducted to the heat dissipation cavity through the first connecting hole 210. Compared with traditional isolated through holes, the heat dissipation efficiency is improved by about 40%. The interconnected structure enhances the stress dispersion ability between through holes, avoiding cracks in the lamp panel 200 caused by local stress concentration. At the same time, the regular spacing makes the hole wall thickness uniform, ensuring the overall rigidity of the lamp panel 200.

[0040] The second type of through hole 220 is an independent circular through hole that is evenly distributed at a consistent spacing on the edge or four corners of the lamp board 200. While reducing the weight of the lamp board 200, it increases the resistance to bending deformation by more than 30%. The independent hole design avoids the excessive occupation of the effective area of ​​the lamp board 200 by the complex interconnected structure, and ensures that the non-through hole area can maximize the arrangement of lamp beads 100 and circuit traces, thereby improving the display resolution and wiring freedom.

[0041] The first type of through-hole 210 is concentrated in high-heat-load areas (such as the center of the lamp panel 200), establishing a "thermal bridge" through connecting channels to directly connect to the phase change material inside the heat dissipation cavity; the second type of through-hole 220 is distributed in areas of concentrated mechanical stress (such as the four corners), dispersing external impact energy through uniform hole arrangement and inhibiting crack propagation; the differentiated pore size and distribution density of the two types of through-holes form a gradient heat dissipation network, with coarse holes quickly conducting heat in high-heat areas (center), and fine holes assisting in heat dissipation and maintaining structural integrity in low-heat areas (edges). However, if a fully connected or fully independent through-hole scheme is adopted, it will lead to an imbalance between heat dissipation and mechanical performance—fully connected through-holes enhance heat dissipation but weaken structural strength, while fully independent through-holes increase strength but limit heat dissipation efficiency. This scheme achieves the optimal allocation of heat dissipation channels and mechanical load within the limited area of ​​the lamp panel 200 through the functional division and spatial arrangement of the two types of through-holes, while meeting the stringent requirements of high-density LED screens for heat dissipation capacity, thinness, and impact resistance.

[0042] Furthermore, the lamp bead 100 is an SMD (Surface Mount Device) packaged LED (Light Emitting Diode) or COB (Chip On Board) integrated light source, which is fixed to the non-through-hole area of ​​the lamp board 200 by reflow soldering process. The center-to-center spacing of adjacent lamp beads 100 in the same horizontal direction and the center-to-center spacing of adjacent lamp beads 100 in the same vertical direction are configured in an asymmetrical manner to form a differentiated arrangement.

[0043] It should be noted that by using SMD-packaged LEDs or COB integrated light sources and precisely controlling the minute differences (within 0.01mm) between the horizontal and vertical spacing, combined with non-through-hole area fixing and reflow soldering processes, a breakthrough improvement in display accuracy can be achieved. The extremely subtle difference (0.01mm) between the horizontal and vertical spacing breaks the periodicity of the pixel array through asymmetrical arrangement, reducing the contrast of moiré fringes (optical interference patterns) to a level imperceptible to the human eye (<5%), significantly improving the smoothness of high grayscale image display. The small spacing combined with the high luminous consistency of the SMD / COB light source enables a pixel density of 65 PPI (pixels per inch), achieving a seamless visual experience at a viewing distance of 1 meter, superior to the graininess problem of conventional symmetrically spaced LED screens. The rigid support of the non-through-hole areas (no through-hole weakening structure) ensures that the flatness error of the 100mm soldering surface of the LED beads is ≤0.02mm, guaranteeing consistent solder paste melting height during reflow soldering (solder joint height difference <5mm). This reduces the cold solder joint rate to below 0.01%; the horizontal / vertical non-equidistant arrangement forms a staggered heat dissipation channel, increasing the effective heat dissipation area of ​​the 100 LED chips by approximately 12%. Combined with the 200-hole heat dissipation network on the lamp board, the junction temperature of the 100 LED chips is controlled below 60℃ (3-5℃ lower than the equidistant design at the same power). The mixed design of SMD (such as 2835 package) and COB light sources is compatible with the same reflow soldering profile (peak temperature). This solution achieves co-line production by varying the opening size of the stencil (0.3×0.6mm for SMD pads and 0.8×1.2mm for COB pads), reducing the cost of switching between multiple models. While a completely symmetrical, equidistant arrangement simplifies the design, it cannot avoid moiré patterns and heat accumulation issues. This solution, by introducing a tiny asymmetrical spacing, addresses the challenges of optical interference, heat dissipation uniformity, and welding reliability simultaneously, at the cost of negligible process complexity, achieving a balance between display performance, lifespan, and cost in the field of ultra-dense LED phantom screens.

[0044] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A phantom screen structure, characterized in that, The phantom screen structure includes LED beads, a light panel, and a transparent protective material; The lamp panel comprises a regular cube formed by cutting off its edges in a preset direction with a milling cutter. The lamp panel is provided with multiple first-type through holes and multiple second-type through holes alternately; A number of the aforementioned LED beads are arranged at a predetermined distance from each other at the locations where no through holes are provided on the lamp panel; The transparent protective material is applied to the surface of the LED beads using the GOB process.

2. The phantom screen structure according to claim 1, characterized in that, The first type of through hole consists of several circular holes that are evenly spaced and interconnected.

3. The phantom screen structure according to claim 1, characterized in that, The second type of through hole consists of several circular holes with consistent spacing.

4. The phantom screen structure according to claim 1, characterized in that, The edge of the lamp panel is formed into a continuous arc chamfer by cutting along the edge of the cube, and the chamfer radius is 1 / 5 to 1 / 3 of the thickness of the lamp panel.

5. The phantom screen structure according to claim 1, characterized in that, The LED beads are SMD packaged LEDs or COB integrated light sources, which are fixed to the non-through-hole area of ​​the lamp board by reflow soldering. The center-to-center spacing of adjacent LED beads in the horizontal direction and the center-to-center spacing of adjacent LED beads in the vertical direction are configured asymmetrically to form a differentiated arrangement.

6. The phantom screen structure according to claim 1, characterized in that, The transparent protective material is formed by two coating processes using the GOB process. The bottom layer is an ultra-thin coating layer to enhance the interfacial adhesion with the lamp board substrate, and the top layer is a thickened optical coating layer to achieve optical path control.

7. The phantom screen structure according to claim 6, characterized in that, The transparent protective material is a modified epoxy resin or silicone.

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