Earphone jack packaging structure and earphone

Abstract

The utility model relates to an earphone hole packaging structure and an earphone. In the earphone hole packaging structure, a first bonding layer is provided with a first through hole; the first through hole is communicated with the air hole of the earphone inner cavity; the filter layer is attached to the first surface of the first bonding layer and covers the first through hole; the shielding layer is provided with a second through hole and a shielding area, the shielding layer is attached to the second face of the first bonding layer, and the second through hole is communicated with the first through hole; the shielding area is arranged corresponding to the decorative hole of the inner cavity of the earphone so as to shield the decorative hole and realize packaging of the air hole, so that air is balanced inside and outside the earphone; meanwhile, the decorative hole is sealed and shielded, foreign matters such as dust and the like are prevented from entering the earphone through the decorative hole to cause blockage, the sound quality of the earphone is ensured not to be influenced, internal parts of the earphone can be prevented from being directly seen through the decorative hole, a visual shielding effect can be achieved, and the use experience of a user is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the earphone technical field, in particular to an earphone hole packaging structure and earphone. BACKGROUND

[0002] With the development of earphone technology, the types of earphones are becoming more and more diversified, and earphones have become an indispensable part of our daily life. The shell of the earphone is usually provided with a ventilation hole. After using the earphone for a period of time, some heat will be generated inside the earphone. The hot air inside the earphone can be discharged through the ventilation hole to avoid overheating of the earphone. In addition, air can enter the earphone through the ventilation hole of the earphone, reducing the air pressure difference between the outside air and the inside air, and reducing the pressure feeling on the ear.

[0003] At present, in order to be beautiful or convenient for tuning the earphone, a decorative hole is usually arranged on the earphone. However, the decorative hole is easy to enter dust and other foreign matters, which causes the decorative hole to be blocked, affects the sound quality of the earphone, and the user can easily see the internal components of the earphone through the decorative hole, affecting the user experience. CONTENT OF THE INVENTION

[0004] Therefore, the earphone hole packaging structure and earphone are provided.

[0005] In a first aspect, the present application provides an earphone hole packaging structure, comprising:

[0006] A first adhesive layer is provided with a first through hole; the first through hole is in communication with the ventilation hole of the earphone inner cavity;

[0007] A filter layer is attached to the first surface of the first adhesive layer, and the filter layer covers the first through hole;

[0008] A shielding layer is provided with a second through hole and a shielding area, and the shielding layer is attached to the second surface of the first adhesive layer, and the second through hole is in communication with the first through hole; the shielding area is arranged corresponding to the decorative hole of the earphone inner cavity to shield the decorative hole.

[0009] In one of the embodiments, a second adhesive layer is further included; the second adhesive layer is provided with a third through hole;

[0010] The first surface of the second adhesive layer is attached to the filter layer, and the second surface of the second adhesive layer is used to attach the earphone inner cavity; the third through hole is in communication with the first through hole, and the filter layer covers the third through hole.

[0011] In one of the embodiments, the area of the third through hole is greater than or equal to the area of the first through hole; the first through hole is located in the third through hole.

[0012] In one of the embodiments, the area of the first through hole is equal to the area of the second through hole; the first through hole and the second through hole are arranged coincidentally.

[0013] In one of the embodiments, the third through hole has an area greater than or equal to the sum of the area of the air vent hole and the area of the decorative hole.

[0014] In one of the embodiments, the thickness of the shielding layer, the first adhesive layer, the filter layer and the second adhesive layer is between 0.28 and 0.38 mm.

[0015] In one of the embodiments, the first adhesive layer is fully overlapped with the filter layer, and the shielding layer is fully overlapped with the first adhesive layer.

[0016] In one of the embodiments, the first side edge of the first adhesive layer is provided with a first positioning part, the first side edge of the filter layer is provided with a second positioning part, and the first side edge of the shielding layer is provided with a third positioning part.

[0017] The second positioning part is correspondingly arranged with the first positioning part, and the third positioning part is correspondingly arranged with the first positioning part.

[0018] In one of the embodiments, the first side edge of the second adhesive layer is provided with a fourth positioning part.

[0019] The fourth positioning part is correspondingly arranged with the second positioning part.

[0020] In a second aspect, the application provides an earphone, comprising an earphone cavity and an earphone hole packaging structure according to any one of the above embodiments, and the earphone hole packaging structure is arranged in the earphone cavity.

[0021] One of the above technical solutions has the following advantages and beneficial effects:

[0022] In the above earphone hole packaging structure, the first adhesive layer, the filter layer and the shielding layer are provided, the first adhesive layer is provided with a first through hole, the first through hole is communicated with the air vent hole of the earphone inner cavity, the filter layer is attached to the first surface of the first adhesive layer, and the filter layer covers the first through hole, the shielding layer is provided with a second through hole and a shielding area, the shielding layer is attached to the second surface of the first adhesive layer, the second through hole is communicated with the first through hole, and the shielding area is arranged corresponding to the decorative hole of the earphone inner cavity to shield the decorative hole, thereby realizing the packaging of the air vent hole and the sealing and shielding of the decorative hole. According to the application, the first through hole is arranged in the first adhesive layer, the second through hole is arranged in the shielding layer, and the air vent hole of the earphone inner cavity, the first through hole and the second through hole are communicated with each other, and then the corresponding area of the filter layer can cover the air vent hole, thereby realizing the packaging of the air vent hole to balance the air inside and outside the earphone. The shielding area is arranged in the shielding layer to shield the decorative hole of the earphone inner cavity, so that the decorative hole is sealed, dust and other foreign matters are prevented from entering the earphone interior through the decorative hole to cause blockage, the sound quality of the earphone is ensured not to be affected, at the same time, the internal components of the earphone can be directly seen through the decorative hole, which can play a visual shielding role and improve the user experience. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 FIG. 1 is a first angle structure schematic diagram of an earphone hole packaging structure in an embodiment of the present application;

[0024] Figure 2 FIG. 2 is a second angle structure schematic diagram of an earphone hole packaging structure in an embodiment of the present application;

[0025] Figure 3 FIG. 3 is a structure schematic diagram of a second adhesive layer in an embodiment of the present application;

[0026] Figure 4 FIG. 4 is a structure schematic diagram of a filter layer in an embodiment of the present application;

[0027] Figure 5 FIG. 5 is a structure schematic diagram of a first adhesive layer in an embodiment of the present application;

[0028] Figure 6 FIG. 6 is a structure schematic diagram of a shielding layer in an embodiment of the present application.

[0029] REFERENCE NUMERALS:

[0030] 10, first adhesive layer; 110, first through hole; 120, first positioning portion; 20, filter layer; 210, second positioning portion; 30, shielding layer; 310, second through hole; 320, shielding area; 330, third positioning portion; 40, second adhesive layer; 410, third through hole; 420, fourth positioning portion. DETAILED DESCRIPTION

[0031] In order to make the personnel in the technical field better understand the present application scheme, the technical scheme in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without making creative efforts should belong to the scope of protection of the present application.

[0032] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application and the above-described drawings are used to distinguish similar objects, and do not necessarily have to describe a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0033] In the present application, the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "transverse", "longitudinal" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not intended to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation.

[0034] In addition, in addition to indicating the orientation or positional relationship, the above-mentioned partial terms can also be used to indicate other meanings, for example, the term "upper" can also be used to indicate a certain dependent relationship or connection relationship in some cases. For those skilled in the art, the specific meaning of these terms in the present application can be understood according to the specific situation.

[0035] In addition, the meaning of the term "a plurality of" should be two and more than two.

[0036] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0037] In one embodiment, as shown in Figure 2 , Figure 4 , Figure 5 and Figure 6 , an earphone hole packaging structure is provided, which comprises a first adhesive layer 10, a filter layer 20 and a shielding layer 30, the first adhesive layer 10 is provided with a first through hole 110; the first through hole 110 is in communication with the air hole of the earphone inner cavity; the filter layer 20 is attached to the first surface of the first adhesive layer 10, and the filter layer 20 covers the first through hole 110; the shielding layer 30 is provided with a second through hole 310 and a shielding area 320, the shielding layer 30 is attached to the second surface of the first adhesive layer 10, the second through hole 310 is in communication with the first through hole 110; the shielding area 320 is arranged corresponding to the decorative hole of the earphone inner cavity to shield the decorative hole.

[0038] The earphone hole packaging structure is used to package the air hole and the decoration hole of the earphone. The earphone refers to a wireless earphone with an air hole and a decoration hole. For example, the earphone can be a Bluetooth earphone, an infrared earphone, or a 2.4G earphone. The shell of the earphone can include a rear cavity and a front cavity, and a containing space is formed between the rear cavity and the front cavity. The containing space can be used to accommodate components such as a microphone, a driving unit, and a circuit board. The inner cavity of the earphone can be the inner wall of the rear cavity, that is, the rear cavity is provided with an air hole and a decoration hole. The air hole of the earphone is used to exhaust the hot air inside, thereby playing a heat dissipation role. The air hole of the earphone is also used to balance the air pressure inside and outside the earphone, thereby reducing the pressure feeling on the user's ear. The air hole of the earphone can also be used to reduce noise and improve sound quality. The decoration hole of the earphone is also called the false hole of the earphone. The decoration hole of the earphone is used to play a decorative role. The shape of the air hole can be a circular shape, an elliptical shape, or other annular shapes. The shape of the decoration hole can be consistent with the shape of the air hole. The air hole and the decoration hole of the earphone are adjacently arranged.

[0039] The first adhesive layer 10 has a first surface and a second surface. The first surface of the first adhesive layer 10 is used to bond the filter layer 20, and the second surface of the first adhesive layer 10 is used to bond the shielding layer 30. For example, the first adhesive layer 10 can be a waterproof double-sided adhesive tape. The first adhesive layer 10 is provided with a first through hole 110. The shape and size of the first through hole 110 can be determined according to the shape and size of the air hole of the inner cavity of the earphone. For example, the shape of the first through hole 110 is the same as that of the air hole, and the size of the first through hole 110 is the same as that of the air hole. The first through hole 110 of the first adhesive layer 10 is arranged corresponding to the air hole of the inner cavity of the earphone, so that the first through hole 110 communicates with the air hole. For example, the first through hole 110 is arranged completely coincident with the air hole.

[0040] The filter layer 20 can be a mesh cloth, for example, the filter can be a black polyester mesh cloth. The filter layer 20 is arranged to cover the first through hole 110 of the first adhesive layer 10. Therefore, the filter layer 20 can cover the air hole of the inner cavity of the earphone, so that air can enter the inside of the earphone through the air hole and the filter layer 20, and the air is filtered by the filter layer 20, thereby preventing dust and other impurities from entering the inside of the earphone through the air hole.

[0041] The second through hole 310 of the shielding layer 30 can be determined according to the shape and size of the first through hole 110 of the first adhesive layer 10, for example, the shape of the second through hole 310 is the same as that of the first through hole 110, and the size of the second through hole 310 is the same as that of the first through hole 110. The second through hole 310 of the shielding layer 30 is arranged corresponding to the first through hole 110 of the first adhesive layer 10, so that the second through hole 310 communicates with the second through hole 310. For example, the second through hole 310 is arranged completely coincident with the first through hole 110. The shielding layer 30 can be a plastic film, for example, the shielding layer 30 can be a black light PET (Polyethylene terephthalate, thermoplastic polyester) layer. The shielding area 320 covers the decorative hole arranged in the earphone inner cavity, and the shielding area 320 is used to shield and seal the decorative hole.

[0042] For example, the first surface and the second surface of the first adhesive layer 10 are respectively provided with an adhesive, the filter layer 20 is adhered to the first surface of the first adhesive layer 10, the shielding layer 30 is adhered to the second surface of the first adhesive layer 10, and the first through hole 110 communicates with the second through hole 310 to form an assembled packaging structure. The packaging structure is arranged in the earphone inner cavity, and the first through hole 110, the second through hole 310 and the air hole are communicated with each other to realize packaging of the air hole. The shielding area 320 of the shielding layer 30 is arranged for the decorative hole to realize visual shielding of the decorative block.

[0043] In the above embodiment, the first adhesive layer 10 is provided with the first through hole 110; the first through hole 110 communicates with the air hole of the earphone inner cavity; the filter layer 20 is attached to the first surface of the first adhesive layer 10, and the filter layer 20 covers the first through hole 110; the shielding layer 30 is provided with the second through hole 310 and the shielding area 320, the shielding layer 30 is attached to the second surface of the first adhesive layer 10, and the second through hole 310 communicates with the first through hole 110; the shielding area 320 is arranged corresponding to the decorative hole of the earphone inner cavity to shield the decorative hole, realizing packaging of the air hole and sealing and shielding of the decorative hole. By arranging the first through hole 110 on the first adhesive layer 10 and the second through hole 310 on the shielding layer 30, and by making the air hole of the earphone inner cavity, the first through hole 110 and the second through hole 310 communicate with each other, the corresponding area of the filter layer 20 can cover the air hole to realize packaging of the air hole, so that air can balance between the inside and outside of the earphone; by arranging the shielding area 320 on the shielding layer 30, the shielding area 320 is arranged to shield the decorative hole of the earphone inner cavity, so that the decorative hole is sealed, dust and other foreign matters are prevented from entering the earphone interior through the decorative hole to cause blockage, the sound quality of the earphone is ensured not to be affected, at the same time, the internal components of the earphone can be directly seen through the decorative hole, the visual shielding effect can be achieved, and the user experience is improved.

[0044] In one embodiment, as shown in Figure 1 andFigure 3 As shown, the earphone hole packaging structure further comprises a second adhesive layer 40; the second adhesive layer 40 is provided with a third through hole 410; a first surface of the second adhesive layer 40 is attached to the filter layer 20, and a second surface of the second adhesive layer 40 is used to attach to the earphone inner cavity; the third through hole 410 is communicated with the first through hole 110, and the filter layer 20 covers the third through hole 410.

[0045] The second adhesive layer 40 has a first surface and a second surface, the first surface of the second adhesive layer 40 is used to adhere to the filter layer 20, and the second surface of the second adhesive layer 40 is used to adhere to the earphone inner cavity, so as to install the packaging structure.

[0046] For example, the second adhesive layer 40 can be a waterproof double-sided adhesive tape. The second adhesive layer 40 is provided with a third through hole 410, and the shape and size of the third through hole 410 can be determined according to the shape and size of the air hole of the earphone inner cavity and the decorative block. For example, the third through hole 410 is annular, and when the second adhesive layer 40 is attached to the filter layer 20, the second through hole 310 and the shielding area 320 can fall within the projection range of the third through hole 410 projected on the shielding layer 30. The third through hole 410 of the second adhesive layer 40 is correspondingly arranged with the first through hole 110 of the first adhesive layer 10, so that the third through hole 410 is communicated with the first through hole 110. The third through hole 410 of the second adhesive layer 40 is correspondingly arranged with the air hole of the earphone inner cavity, so that the third through hole 410 is communicated with the air hole.

[0047] By arranging the second adhesive layer 40 attached to the filter layer 20, the second adhesive layer 40 is attached to the corresponding position of the earphone inner cavity, so that the air hole, the third through hole 410, the first through hole 110 and the second through hole 310 are communicated with each other, the packaging of the air hole is realized, and then the filter layer 20 can cover the air hole of the earphone inner cavity, so that air can enter the earphone interior through the air hole, the third through hole 410, the filter layer 20, the first through hole 110 and the second through hole 310 in turn, and the air is filtered by the filter layer 20, so as to avoid dust and other sundries entering the earphone interior through the air hole, so as to balance the air inside and outside the earphone; the decorative hole of the earphone inner cavity is shielded by the shielding area 320 of the shielding layer 30, so that the decorative hole is sealed, dust and other sundries are prevented from entering the earphone interior through the decorative hole to cause blockage, the sound quality of the earphone is ensured not to be affected, at the same time, the internal components of the earphone can be directly avoided through the decorative hole, which can play a visual shielding role, and the user experience is improved.

[0048] In one embodiment, the area of the third through hole 410 is greater than or equal to the area of the first through hole 110; the first through hole 110 is located in the third through hole 410.

[0049] The area of the third through hole 410 is greater than or equal to the area of the first through hole 110, thereby ensuring that the filter layer 20 can completely cover the air hole. The projection range of the first through hole 110 of the first adhesive layer 10 on the second adhesive layer 40 is greater than or equal to the third through hole 410, so that the first through hole 110 is located in the third through hole 410.

[0050] In an embodiment, the area of the first through hole 110 is equal to the area of the second through hole 310; the first through hole 110 and the second through hole 310 are arranged coincidentally.

[0051] For example, the shape and size of the first through hole 110 of the first adhesive layer 10 are the same as the shape and size of the second through hole 310 of the shielding layer 30, that is, the area of the first through hole 110 is equal to the area of the second through hole 310, so that the first through hole 110 and the second through hole 310 are arranged coincidentally, thereby when the packaging structure is arranged at the corresponding position of the earphone inner cavity, the air hole, the third through hole 410, the first through hole 110 and the second through hole 310 are communicated with each other, the packaging of the air hole is realized, and the filter layer 20 can cover the air hole of the earphone inner cavity, so that the air can enter the earphone interior through the air hole, the third through hole 410, the filter layer 20, the first through hole 110 and the second through hole 310 in turn, and the air is filtered by the filter layer 20, avoiding dust and other sundries entering the earphone interior through the air hole, so as to balance the air inside and outside the earphone.

[0052] In an embodiment, the area of the third through hole 410 is greater than or equal to the sum of the area of the air hole and the area of the decorative hole.

[0053] For example, when the packaging structure is installed at the corresponding position of the earphone inner cavity, the projection area of the third through hole 410 on the earphone inner cavity is greater than or equal to the sum of the area of the air hole and the area of the decorative hole, so that the air hole and the decorative hole fall within the projection range of the third through hole 410, so as to position and assemble the second adhesive layer 40, and improve the assembly convenience of the packaging structure.

[0054] In an embodiment, the sum of the thicknesses of the shielding layer 30, the first adhesive layer 10, the filter layer 20 and the second adhesive layer 40 is between 0.28 and 0.38 millimeters.

[0055] For example, the thickness of the first adhesive layer 10 can be 0.1 millimeter, and the thickness of the second adhesive layer 40 can be 0.12 millimeter. By setting the thicknesses of the shielding layer 30, the first adhesive layer 10, the filter layer 20 and the second adhesive layer 40, the overall thickness of the packaging structure is reduced, thereby the occupied space in the earphone interior can be reduced.

[0056] In an embodiment, as Figure 1 and Figure 2As shown in the drawings, the first adhesive layer 10 is completely coincident with the filter layer 20; the shielding layer 30 is completely coincident with the first adhesive layer 10.

[0057] The shape and size of the outer frame of the first adhesive layer 10 are the same as those of the filter layer 20, so that the first adhesive layer 10 is completely coincident with the filter layer 20; the shape and size of the outer frame of the shielding layer 30 are the same as those of the outer frame of the first adhesive layer 10, so that the shielding layer 30 is completely coincident with the first adhesive layer 10. After the assembled packaging structure is arranged at the corresponding position of the earphone inner cavity, the air vent of the earphone inner cavity, the first through hole 110 and the second through hole 310 are in communication with each other, and the corresponding area of the filter layer 20 can cover the air vent, so as to realize the packaging of the air vent and balance the air inside and outside the earphone; the shielding area 320 of the shielding layer 30 can shield the decorative hole of the earphone inner cavity, so that the decorative hole is sealed, and direct viewing of the internal components of the earphone through the decorative hole is avoided, and a visual shielding effect is achieved.

[0058] In one embodiment, as shown in the drawings, the first adhesive layer 10 is completely coincident with the filter layer 20; the shielding layer 30 is completely coincident with the first adhesive layer 10. Figures 4 to 6 As shown in the drawings, the first side of the first adhesive layer 10 is provided with a first positioning part 120, the first side of the filter layer 20 is provided with a second positioning part 210, and the first side of the shielding layer 30 is provided with a third positioning part 330; the second positioning part 210 is arranged correspondingly to the first positioning part 120, and the third positioning part 330 is arranged correspondingly to the first positioning part 120.

[0059] The shape and size of the first positioning part 120, the shape and size of the second positioning part 210, and the shape and size of the third positioning part 330 are the same. By arranging the first positioning part 120 on the first adhesive layer 10, the second positioning part 210 on the filter layer 20, and the third positioning part 330 on the shielding layer 30, the filter layer 20 is positioned and adhered to the first surface of the first adhesive layer 10, and the shielding layer 30 is positioned and adhered to the second surface of the first adhesive layer 10, which facilitates the quick alignment of the first through hole 110 and the second through hole 310, thereby improving the assembly efficiency of the packaging structure.

[0060] In one embodiment, as shown in the drawings, the first adhesive layer 10 is completely coincident with the filter layer 20; the shielding layer 30 is completely coincident with the first adhesive layer 10. Figure 3 Figure 4 As shown in the drawings, the first side of the second adhesive layer 40 is provided with a fourth positioning part 420; the fourth positioning part 420 is arranged correspondingly to the second positioning part 210.

[0061] The shape and size of the fourth positioning part 420 are the same as those of the second positioning part 210. By arranging the fourth positioning part 420 on the second adhesive layer 40, the other surface of the filter layer 20 is positioned and adhered to the first surface of the first adhesive layer 10, which facilitates the quick alignment of the third through hole 410 and the first through hole 110, thereby improving the assembly efficiency of the packaging structure.​

[0062] In one embodiment, an earphone is also provided, comprising an earphone cavity and the earphone hole packaging structure according to any one of the above embodiments, and the earphone hole packaging structure is arranged in the earphone cavity.

[0063] In one embodiment, an earphone is also provided, comprising an earphone cavity and the earphone hole packaging structure according to any one of the above embodiments, and the earphone hole packaging structure is arranged in the earphone cavity.

[0064] The specific description of the earphone hole packaging structure can refer to the specific description of the earphone hole packaging structure in the above embodiments, which will not be repeated here.

[0065] For example, the earphone hole packaging structure comprises a first adhesive layer, a filter layer and a shielding layer, the first adhesive layer is provided with a first through hole; the first through hole is in communication with the air hole of the earphone cavity; the filter layer is attached to the first surface of the first adhesive layer, and the filter layer covers the first through hole; the shielding layer is provided with a second through hole and a shielding area, the shielding layer is attached to the second surface of the first adhesive layer, the second through hole is in communication with the first through hole; the shielding area is arranged corresponding to the decorative hole of the earphone cavity to shield the decorative hole, realizing the packaging of the air hole and the sealing and shielding of the decorative hole. The first through hole is arranged in the first adhesive layer, the second through hole is arranged in the shielding layer, and the air hole of the earphone cavity, the first through hole and the second through hole are in communication, and then the corresponding area of the filter layer can cover the air hole, realizing the packaging of the air hole, so as to balance the air inside and outside the earphone; the shielding area is arranged in the shielding layer, the shielding area shields the decorative hole of the earphone cavity, so that the decorative hole is sealed, avoiding the dust and other foreign matters from entering the earphone through the decorative hole and causing blockage, ensuring that the sound quality of the earphone is not affected, at the same time, the internal components of the earphone can be directly seen through the decorative hole, which can play a visual shielding role and improve the user experience.

[0066] It should be noted that the earphone can also include a microphone and other components, and the specific earphone can include more components than described in the above embodiments, or combine certain components, or have different component arrangements.

[0067] The technical features of the above embodiments can be combined in any way, and in order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combination of the technical features does not exist contradictory, it should be considered as the scope of the present application.

[0068] The above embodiments only express several implementation ways of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation to the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, which all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A headphone jack encapsulation structure, characterized in that, include: A first adhesive layer, wherein the first adhesive layer is provided with a first through hole; The first through hole is connected to the vent hole inside the earphone cavity; A filter layer is attached to the first side of the first adhesive layer and covers the first through hole. A shielding layer is provided with a second through hole and a shielding area. The shielding layer is attached to the second side of the first adhesive layer. The second through hole communicates with the first through hole. The shielding area is provided corresponding to the decorative hole in the inner cavity of the earphone to shield the decorative hole.

2. The headphone jack encapsulation structure according to claim 1, characterized in that, It also includes a second adhesive layer; the second adhesive layer is provided with a third through hole; The first side of the second adhesive layer is bonded to the filter layer, and the second side of the second adhesive layer is used to bond to the inner cavity of the earphone; the third through hole communicates with the first through hole, and the filter layer covers the third through hole.

3. The headphone jack encapsulation structure according to claim 2, characterized in that, The area of ​​the third through hole is greater than or equal to the area of ​​the first through hole; the first through hole is located inside the third through hole.

4. The headphone jack encapsulation structure according to claim 3, characterized in that, The area of ​​the first through hole is equal to the area of ​​the second through hole; the first through hole and the second through hole are arranged to overlap.

5. The headphone jack encapsulation structure according to claim 2, characterized in that, The area of ​​the third through hole is greater than or equal to the sum of the areas of the vent hole and the decorative hole.

6. The headphone jack encapsulation structure according to claim 2, characterized in that, The sum of the thicknesses of the shielding layer, the first adhesive layer, the filter layer, and the second adhesive layer is between 0.28 and 0.38 mm.

7. The headphone jack encapsulation structure according to claim 1, characterized in that, The first adhesive layer is completely overlapped with the filter layer; the shielding layer is completely overlapped with the first adhesive layer.

8. The headphone jack encapsulation structure according to any one of claims 2 to 6, characterized in that, The first adhesive layer has a first positioning part on its first side, the filter layer has a second positioning part on its first side, and the shielding layer has a third positioning part on its first side. The second positioning part is provided corresponding to the first positioning part, and the third positioning part is provided corresponding to the first positioning part.

9. The headphone jack encapsulation structure according to claim 8, characterized in that, A fourth positioning part is provided on the first side of the second adhesive layer; The fourth positioning part is provided in correspondence with the second positioning part.

10. An earphone, characterized in that, It includes an earphone cavity and an earphone hole encapsulation structure as described in any one of claims 1 to 9, wherein the earphone hole encapsulation structure is disposed in the earphone cavity.

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