PIN-out circuit structure capable of preventing poor insulation and membrane switch
By indenting the lower conductive ink layer by 0.3-0.5mm at the end to avoid the punched position, the insulation problem caused by punching in the PIN circuit of the membrane switch was solved, and good insulation performance was achieved.
Patent Information
- Application Number
- CN202520415180.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-11
AI Technical Summary
In existing membrane switches, the conductive ink layer is damaged during the punching process, resulting in poor insulation.
The end of the lower conductive ink layer is recessed by 0.3-0.5mm to avoid the punching position and prevent ink residue from remaining on the line.
This effectively prevents insulation problems caused by punching and ensures the insulation performance of the circuit at the PIN exit point.
Smart Images
Figure CN223884330U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a film switch technical field, especially in a kind of PIN line structure and film switch of preventing bad insulation. BACKGROUND
[0002] PIN line structure is mainly composed of isolation layer and the upper conductive layer and lower conductive layer set on the both sides of isolation layer.Upper conductive layer and lower conductive layer are set on the upper and lower sides of the adhesive material isolation layer by upper conductive ink layer and lower conductive ink layer.PIN line needs to be punched on its end bottom side (lower conductive layer) when processing, and the lower conductive ink layer will be damaged in punching process, and residual ink will cause insulation problem of line at PIN.
[0003] Therefore, in view of the deficiencies of the prior art, it is necessary to design a PIN line structure and film switch to prevent bad insulation to solve the above problems. SUMMARY
[0004] To overcome the deficiencies in the prior art, the utility model aims at providing a PIN line structure and film switch to prevent bad insulation.
[0005] To achieve the above object and other related objects, the technical scheme provided by the utility model is as follows: a PIN line structure to prevent bad insulation, comprising an adhesive material isolation layer, the both sides of the adhesive material isolation layer are provided with upper conductive layer and lower conductive layer, the upper conductive layer and the lower conductive layer are set on the upper and lower sides of the adhesive material isolation layer by upper conductive ink layer and lower conductive ink layer, and the end of the lower conductive ink layer is set inwards to avoid punching position.
[0006] The preferred technical scheme is that the lower conductive ink layer is inwards set by 0.3-0.5mm.
[0007] A film switch adopts the above PIN line structure.
[0008] Due to the use of the above technical scheme, the utility model has the beneficial effects that:
[0009] The PIN line structure and film switch to prevent bad insulation are provided, the end of the lower conductive ink layer is set inwards to avoid punching position, the residual ink on the line caused by punching of the lower conductive ink layer can be avoided, and the insulation problem of line at PIN is caused. BRIEF DESCRIPTION OF DRAWINGS
[0010] Figure 1 It is the PIN line cross section schematic view involved in the utility model. DETAILED DESCRIPTION
[0011] The following describes the embodiments of the present application by specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the description.
[0012] Please refer to Figure 1 . It should be noted that in the description of the present application, it is necessary to explain that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description and cannot be understood as indicating or implying relative importance. The terms "horizontal", "vertical", "overhanging" and the like do not mean that the components must be absolutely horizontal or overhanging, but can be slightly inclined. For example, "horizontal" only means that its direction is relatively more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.
[0013] In the description of the present application, it should also be noted that unless otherwise explicitly specified and limited, the terms "provided", "mounted", "connected", "connected" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0014] Embodiment:
[0015] As shown in Figure 1 , in an example embodiment of the present application, a PIN line structure for preventing poor insulation is provided, which comprises a glue material isolation layer 1, and an upper conductive layer 2 and a lower conductive layer 3 are arranged on both sides of the glue material isolation layer 1, respectively. The upper conductive layer 2 and the lower conductive layer 3 are arranged on the upper and lower sides of the glue material isolation layer 1 through an upper conductive ink layer 4 and a lower conductive ink layer 5, respectively. The end of the lower conductive ink layer 5 is inwardly recessed to avoid the punching position.
[0016] As shown in Figure 1 , in an example embodiment of the present application, the lower conductive ink layer 5 is inwardly recessed by 0.3-0.5mm to avoid ink residue on the line due to punching of the lower conductive ink layer 5, thereby causing poor insulation of the line at the PIN outlet.
[0017] A film switch adopts the PIN outlet line structure.
[0018] Therefore, the utility model has the advantages of the following:
[0019] The utility model discloses a prevent the PIN outlet line structure and film switch of bad insulation, through the end of lower conductive ink layer is in the retraction setting, avoids the type position, can avoid the ink residue on the line because of the type of lower conductive ink layer, thereby causes the line insulation problem of PIN place.
[0020] The above embodiment only illustrates the principle and effect of the utility model, and is not used to limit the utility model. Any person skilled in the art can modify or change the above embodiment without departing from the spirit and scope of the utility model. Therefore, all equivalent modifications or changes completed by those skilled in the art without departing from the spirit and technical thought disclosed by the utility model should be covered by the claims of the utility model.
Claims
1. An out-PIN line structure for preventing insulation failure, characterized by: The adhesive isolation layer is provided with an upper conductive layer and a lower conductive layer on both sides, and the upper conductive layer and the lower conductive layer are arranged on the upper and lower sides of the adhesive isolation layer through an upper conductive ink layer and a lower conductive ink layer respectively, and the end of the lower conductive ink layer is arranged in a recessed manner to avoid the punching position.
2. The pin-out line structure for preventing insulation failure according to claim 1, wherein: The lower conductive ink layer is recessed by 0.3-0.5mm.
3. A membrane switch characterized by: The PIN line structure of any one of claims 1-2 is adopted.