Liquid-cooled lower shell heat dissipation type controller

Abstract

The utility model discloses a liquid-cooled lower shell heat dissipation type controller, which comprises an outer shell formed by an upper shell and a lower shell and a control panel arranged in the outer shell, and the control panel comprises a first circuit board arranged on the lower shell and a second circuit board positioned above the first circuit board, the first circuit board comprises a first printed circuit board, and a plurality of power devices and a plurality of binding posts which are arranged on the first printed circuit board; the second circuit board comprises a second printed circuit board, at least one functional connector arranged on the second printed circuit board, and binding post via holes in one-to-one correspondence with the binding posts; a cooling chamber and a bottom cover covering the cooling chamber are arranged in the lower shell, and a pair of cooling liquid via holes communicated with the two ends of the cooling chamber respectively are formed in the lower shell. The heat dissipation effect of the liquid-cooled lower shell heat dissipation type controller is greatly improved, and the service life of the controller can be greatly prolonged.

Description

Technical Field

[0001] This utility model relates to a controller, specifically a lower shell heat dissipation controller for controlling electric vehicles. Background Technology

[0002] Currently, the heat dissipation of the lower shell type controller used in electric vehicles relies solely on the metal lower shell and the heat dissipation fins on the bottom surface of the lower shell for heat dissipation. For some high-power controllers, this traditional heat dissipation method cannot provide ideal heat dissipation, causing the controller to often operate at high temperatures during actual use, which greatly shortens its service life. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a liquid-cooled lower shell heat dissipation controller that significantly improves heat dissipation effect.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: a liquid-cooled lower shell heat dissipation controller, comprising: a shell and a control board disposed in the shell, wherein the shell comprises: a lower shell and an upper shell disposed on the lower shell, the inner side of the lower shell being a mounting surface; the control board comprises: a first circuit board disposed on the lower shell and a second circuit board disposed above the first circuit board, the specific structure of the first circuit board comprising: a first printed circuit board, and a plurality of power devices, a plurality of terminals, a plurality of mounting vias and a plurality of mounting through holes disposed on the first printed circuit board; the specific structure of the second circuit board comprises: a second printed circuit board, and at least one [unclear - possibly a component or element] disposed on the second printed circuit board. The system includes functional connectors, terminal vias corresponding to the terminals, and mounting through holes corresponding to the mounting vias on the first printed circuit board. The upper housing has a wiring chamber and insertion windows corresponding to the functional connectors; all functional connectors are sealed together with their corresponding insertion windows on the upper housing. The bottom wall of the wiring chamber has terminal mounting holes corresponding to the terminals; the terminals pass through the corresponding terminal vias on the second printed circuit board and extend into the corresponding terminal mounting holes on the bottom wall of the wiring chamber. The lower housing has a cooling chamber and a bottom cover covering the cooling chamber; coolant through holes communicating with the cooling chamber are located at both ends of the lower housing near the cooling chamber.

[0005] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the upper shell has an annular wiring chamber sealing groove around the upper edge of the wiring chamber, a sealing strip is provided in the wiring chamber sealing groove, and an annular wire buckle for threading wires is provided on the sealing strip. The upper shell is provided with a protective cover that covers the sealing strip, and the protective cover and the upper shell are provided with arc-shaped wiring clips corresponding to the annular wire buckle of the sealing strip.

[0006] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the specific structure of the lower shell includes: a lower shell and a bottom cover disposed at the bottom of the lower shell; the specific structure of the cooling chamber includes: a cooling chamber formed on the bottom surface of the lower shell, the bottom cover covering the cooling chamber to form the cooling chamber, and transverse barrier dams are respectively provided on a pair of opposite side walls of the cooling chamber facing each other, and all the transverse barrier dams are staggered from each other, and the length of the transverse barrier dams is greater than half the distance between the pair of side walls, thereby forming an S-shaped flow channel composed of multiple transverse flow areas in the cooling chamber, and the two coolant passages are connected to the transverse flow areas at both ends in a one-to-one correspondence.

[0007] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the cooling chamber has transverse barrier dams on its opposite pair of side walls, and all the transverse barrier dams are staggered from each other. The length of the transverse barrier dams is greater than half the distance between the pair of side walls, thereby forming an S-shaped flow channel composed of multiple transverse flow zones in the cooling chamber. The two coolant passages are connected to the transverse flow zones at both ends in a one-to-one correspondence.

[0008] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, a plurality of heat dissipation fins are provided on the bottom wall of the cooling chamber.

[0009] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the heat dissipation fins cover the entire flow channel.

[0010] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, a wiring rack is provided in the wiring compartment, and the wiring rack is provided with wiring channels corresponding to the terminal blocks.

[0011] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the first printed circuit board is an aluminum-based printed circuit board.

[0012] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the lower shell has a recessed mounting chamber on its mounting surface that corresponds to the first printed circuit board, and the first printed circuit board is disposed in the mounting chamber and abuts against the bottom wall of the mounting chamber.

[0013] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the lower shell is provided with an annular glue injection groove around its edge.

[0014] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the second printed circuit board is provided with magnetic rings corresponding to the terminals, and the terminals are inserted into the corresponding magnetic rings.

[0015] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the annular wire buckle has an open-loop structure, that is, the annular wire buckle has a transverse slit.

[0016] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the functional connectors are mounted on the second printed circuit board via an adapter board and corresponding pin headers and female headers. That is, the functional connectors are mounted on the adapter board, the pin headers are mounted on the adapter board, and the female headers are mounted on the second printed circuit board.

[0017] As a preferred embodiment, in the liquid-cooled lower shell heat dissipation controller, the mounting surface of the lower shell is provided with mounting threaded holes corresponding to the mounting through holes on the first printed circuit board and the mounting through holes on the second printed circuit board. A screw is selected, passes through the mounting through hole on the first printed circuit board, and is tightened into the corresponding mounting threaded hole on the lower shell. After passing through the mounting through hole on the second printed circuit board, the screw passes through the cylindrical washer placed in the mounting through hole on the first printed circuit board and is tightened into the corresponding mounting threaded hole on the lower shell.

[0018] The beneficial effects of this utility model are:

[0019] 1. This utility model provides a cooling chamber on the lower shell and provides coolant passages at both ends of the lower shell near the cooling chamber, which are connected to the cooling chamber. This allows coolant to continuously flow in from one coolant passage and out from the other, achieving external circulation and greatly improving the heat dissipation effect.

[0020] 2. This utility model forms an S-shaped flow channel in the cooling chamber by setting a transverse barrier dam in the cooling chamber, thereby enabling relatively balanced cooling of all parts of the heat dissipation platform.

[0021] 3. This utility model increases the heat dissipation area and further improves the heat dissipation effect by setting heat dissipation fins on the bottom wall of the cooling chamber.

[0022] 4. This utility model provides a cable tray in the wiring compartment with cable routing channels corresponding to the terminal blocks, making the wiring neater and preventing short circuits between adjacent wires.

[0023] 5. By setting up a recessed mounting chamber and using an aluminum-based printed circuit board (aluminum substrate) as the first printed circuit board, the first printed circuit board can be placed in the mounting chamber and attached to the bottom wall of the mounting chamber, which further improves the heat dissipation effect; at the same time, it makes the positioning and installation of the first printed circuit board more accurate and convenient, and improves the assembly efficiency.

[0024] 6. This utility model improves the anti-interference capability of input and output signals transmitted by the terminals by setting magnetic rings corresponding to the terminals one by one on the second printed circuit board, so that the terminals are inserted into the corresponding magnetic rings.

[0025] 7. By setting the ring-shaped wire buckle to an open-loop structure, the deformation of the ring-shaped wire buckle is more complete, thus ensuring the seal between the wire and the ring-shaped wire buckle.

[0026] 8. This utility model provides an adhesive injection sealing groove around the edge of the lower shell, allowing sealant to be dripped into the annular sealing groove during installation, thus ensuring a seal between the upper and lower shells. Attached Figure Description

[0027] Figure 1 This is an exploded view of the controller described in this utility model.

[0028] Figure 2 This is an exploded structural diagram of the controller described in this utility model from another perspective.

[0029] Figure 3 This is a partial exploded view of the controller described in this utility model.

[0030] Figure 4 This is a three-dimensional structural diagram of the controller described in this utility model.

[0031] Figure 5 This is a three-dimensional structural diagram of the controller described in this utility model after the protective cover and sealing strip have been removed.

[0032] Figures 1 to 5The reference numerals in the attached diagrams are as follows: 1. Protective cover; 15. Arc-shaped wiring bayonet; 2. Sealing strip; 25. Circular wire buckle; 251. Horizontal seam; 3. Cable tray; 31. Cable routing channel; 4. Upper shell; 41. Wiring chamber; 411. Terminal mounting hole; 412. Wiring chamber sealing groove; 43. Plug-in window; 45. Arc-shaped wiring bayonet; 5. Second circuit board; 50. Second printed circuit board; 500. Adapter board; 51. Magnetic ring. 52. Functional connector; 6. First circuit board; 60. First printed circuit board; 61. Terminal block; 68. Power device; 7. Lower shell; 71. Mounting surface; 711. Mounting chamber; 72. Annular injection groove; 73. Coolant through hole; 74. Mounting threaded hole; 75. Cooling chamber; 751. Lateral barrier dam; 752. Lateral barrier dam; 76. External mounting through hole; 77. Heat dissipation fins; 78. Cylindrical washer; 9. Bottom cover. Detailed Implementation

[0033] The following describes in detail, with reference to the accompanying drawings, the specific implementation scheme of the liquid-cooled lower shell heat dissipation controller of this utility model.

[0034] like Figure 1 and Figure 2As shown, the liquid-cooled lower shell heat dissipation controller of this utility model includes: a shell and a control board disposed in the shell. The shell includes: a lower shell 7 and an upper shell 4 disposed on the lower shell 7; the inner side of the lower shell 7 is a mounting surface 71, and the lower shell 7 has mounting threaded holes 74 for fixing the upper shell 4 and the lower shell 7 at each of the four corners of its mounting surface 71, and external mounting through holes 76 for mounting the lower shell 7 on corresponding carriers. The lower shell 7 has an annular glue injection groove 72 around its edge on its mounting surface 71, and the annular glue injection groove 72 is located inside all the mounting threaded holes 74 and external mounting through holes 76; the control board includes The first circuit board 6 (a conventional technology in the art, which will not be described in detail here) is disposed in the mounting chamber 711 of the lower shell 7, and the second circuit board 5 is disposed above the first circuit board 6. The specific structure of the first circuit board 6 includes: a first printed circuit board 60, and a plurality of power devices 68 (usually power MOSFETs), a plurality of terminals 61, a plurality of mounting vias and a plurality of mounting through holes (a conventional technology in the art, which will not be described in detail here) disposed on the first printed circuit board 60; the specific structure of the second circuit board 5 includes: a second printed circuit board 50, and functional connectors 52 disposed on the second printed circuit board 50, and wiring... The magnetic ring 51 and terminal through holes corresponding to the posts 61, and the mounting through holes corresponding to the mounting through holes on the first printed circuit board; the lower shell 7 has a recessed mounting chamber 711 on the mounting surface 71 that mates with the first printed circuit board 60. The first printed circuit board is placed in the mounting chamber 711 and abuts against the bottom wall of the mounting chamber 711. The lower shell 7 has mounting through holes on the bottom wall of the mounting chamber 711 that correspond to the mounting through holes on the first printed circuit board 60 and mounting threaded holes that correspond to the mounting through holes on the second printed circuit board 50 (this is conventional technology in the art and will not be described in detail here). Screws are selected to pass through the first printed circuit board 60. The mounting through hole is screwed into the corresponding mounting threaded hole on the bottom wall of the mounting chamber 711 of the lower shell 7. The screw is selected, passes through the mounting through hole on the second printed circuit board 50, then through the cylindrical washer 78 placed in the mounting through hole on the first printed circuit board 60, and is screwed into the corresponding mounting threaded hole on the bottom wall of the mounting chamber 711 of the lower shell 7 (this is a conventional technique in the art and will not be described in detail here); the upper shell 4 is provided with a wiring chamber 41 and a plug-in window 43 corresponding to the functional connector 51. The functional connector 43 and the corresponding plug-in window 43 on the upper shell 4 are sealed together (this is a conventional technique in the art and will not be described in detail here).The upper shell 4 has terminal mounting holes 411 on the bottom wall of the wiring chamber 41, corresponding one-to-one with the terminal posts 61. The terminal posts 61 pass through the corresponding terminal vias and magnetic rings 51 on the second printed circuit board 50 and then extend into the corresponding terminal mounting holes 411 on the bottom wall of the wiring chamber 41 (this is conventional technology in the art and will not be described in detail here). A cable tray 3 is provided in the wiring chamber 41 of the upper shell 4, and the cable tray 3 is provided with cable routing channels 31 corresponding to the terminal posts 61. The upper shell 4 has corresponding cable routing channels 31 on the bottom wall of the wiring chamber 41. An arc-shaped wiring bayonet 45 corresponding to the terminal block 61 is provided on the side wall. An annular wiring chamber sealing groove 412 is provided around the upper edge of the wiring chamber 41. A sealing strip 2 is provided in the wiring chamber sealing groove 412. An annular wire buckle 25 corresponding to the arc-shaped wiring bayonet 45 is provided on the sealing strip 2. The annular wire buckle 25 has an open ring structure, that is, a transverse slit 251 is provided on the annular wire buckle 25. A protective cover 1 is provided above the sealing strip 2 on the upper shell 4. An arc-shaped wiring bayonet 15 corresponding to the annular wire buckle 25 is provided on the protective cover 1. Figure 3 As shown, the lower shell 7 is provided with a cooling chamber 75 and a bottom cover 9 covering the cooling chamber 75. The bottom wall of the cooling chamber 75 is covered with heat dissipation fins 77. The cooling chamber 75 has a transverse barrier dam 751 on one side wall facing the opposite side wall. The cooling chamber 75 has two transverse barrier dams 752 on the other side wall facing the opposite side wall, which are parallel to the transverse barrier dam 751. All the transverse barrier dams 751 and 752 are staggered, and the transverse barrier dam 751 is located between the two transverse barrier dams 752. The lengths of the transverse barrier dams 751 and 752 are equal and are both greater than half the distance between the two side walls, thereby forming an S-shaped flow channel composed of four transverse flow zones in the cooling chamber 75. The lower shell 7 has coolant passage holes 73 on one side wall near the two ends of the cooling chamber 75, which communicate with the transverse flow zones at the corresponding ends.

[0035] In practical applications, the functional connector 52 is mounted on the second printed circuit board via an adapter board 500 and corresponding pin headers and sockets. Specifically, the functional connector 52 is mounted on the adapter board 500, the pin headers are mounted on the adapter board 500, and the sockets are mounted on the second printed circuit board 50 (this is conventional technology in the art and will not be described further here). The first printed circuit board 60 is an aluminum-based printed circuit board (referred to as an aluminum substrate). The power device 68 is a surface-mount packaged power MOSFET.

[0036] When wiring, the screws on protective cover 1 need to be removed, and protective cover 1 needs to be removed (see...). Figure 5As shown), pass the wire through the annular wire buckle 25 of the sealing strip 2, and connect it to the corresponding terminal 61 in the corresponding wiring channel 31 of the cable tray 3 (this is a common technique in the art and will not be described in detail here). After wiring is completed, install the protective cover 1 (see...). Figure 4 (As shown). In actual operation, coolant continuously flows in from one coolant through-hole 73, passes through the S-shaped flow channel in the cooling chamber, and flows out from another coolant through-hole 73, achieving external circulation together with the external cooling pipes. Moreover, the heat dissipation fins covering the S-shaped flow channel greatly increase the heat dissipation area, achieving an ideal heat dissipation effect.

[0037] In summary, the above description is merely a preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model. All equivalent variations and modifications made to the shape, structure, features and spirit described in the claims of the present utility model should be included within the scope of the claims of the present utility model.

Claims

1. A liquid-cooled lower casing heat dissipation type controller, comprising: The housing and the control board disposed within the housing are characterized in that the housing comprises: a lower shell and an upper shell disposed on the lower shell, the inner side of the lower shell being a mounting surface; the control board comprises: a first circuit board disposed on the lower shell and a second circuit board disposed above the first circuit board, the specific structure of the first circuit board comprising: a first printed circuit board, and a plurality of power devices, a plurality of terminals, a plurality of mounting vias and a plurality of mounting through holes disposed on the first printed circuit board; the specific structure of the second circuit board comprises: a second printed circuit board, and at least one functional connector disposed on the second printed circuit board, and terminal vias corresponding one-to-one with the terminals. The upper shell has mounting through holes corresponding to the mounting via holes on the first printed circuit board; it also has a wiring chamber and plug-in windows corresponding to the functional connectors, with all functional connectors sealed together with their corresponding plug-in windows on the upper shell; the bottom wall of the wiring chamber has terminal mounting holes corresponding to the terminals, with the terminals passing through the corresponding terminal via holes on the second printed circuit board and extending into the corresponding terminal mounting holes on the bottom wall of the wiring chamber; the lower shell has a cooling chamber and a bottom cover covering the cooling chamber, with coolant through holes communicating with the cooling chamber at both ends near the cooling chamber.

2. The liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The upper shell has an annular sealing groove for the wiring chamber around the upper edge of the wiring chamber. A sealing strip is provided in the sealing groove, and an annular wire buckle for threading wires is provided on the sealing strip. A protective cover is provided on the upper shell to cover the sealing strip. Arc-shaped wiring clips corresponding to the annular wire buckles of the sealing strip are provided on the protective cover and the upper shell.

3. The liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The cooling chamber has transverse barrier dams on its opposite pair of side walls, and all the transverse barrier dams are staggered. The length of the transverse barrier dams is greater than half the distance between the pair of side walls, thereby forming an S-shaped flow channel composed of multiple transverse flow zones in the cooling chamber. The two coolant passages are connected to the transverse flow zones at both ends in a one-to-one correspondence.

4. A liquid-cooled lower shell heat dissipation controller according to claim 3, characterized in that, The bottom wall of the cooling chamber is provided with several heat dissipation fins.

5. A liquid-cooled lower shell heat dissipation controller according to claim 4, characterized in that, The heat dissipation fins cover the entire flow channel.

6. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The wiring compartment is equipped with a cable tray, and the cable tray has cable channels corresponding to the terminal blocks.

7. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The first printed circuit board is an aluminum-based printed circuit board.

8. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The lower casing has a recessed mounting chamber on its mounting surface that corresponds to the first printed circuit board. The first printed circuit board is placed in the mounting chamber and abuts against the bottom wall of the mounting chamber.

9. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The lower shell is provided with an annular glue injection groove around its edge.

10. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The second printed circuit board is provided with magnetic rings that correspond one-to-one with the terminals, and the terminals are inserted into the corresponding magnetic rings.

11. A liquid-cooled lower shell heat dissipation controller according to claim 2, characterized in that, The aforementioned ring-shaped buckle has an open-loop structure, that is, a transverse slit is provided on the ring-shaped buckle.

12. A liquid-cooled lower shell heat dissipation controller according to claim 1, characterized in that, The functional connectors are mounted on the second printed circuit board via an adapter board and corresponding pin headers and female headers. That is, the functional connectors are mounted on the adapter board, the pin headers are mounted on the adapter board, and the female headers are mounted on the second printed circuit board.

13. A liquid-cooled lower shell heat dissipation controller according to any one of claims 1 to 12, characterized in that, The mounting surface of the lower shell is provided with mounting threaded holes corresponding to the mounting through holes on the first printed circuit board and the mounting through holes on the second printed circuit board. A screw is selected, passes through the mounting through hole on the first printed circuit board, and is tightened into the corresponding mounting threaded hole on the lower shell. After the screw passes through the mounting through hole on the second printed circuit board, it passes through the cylindrical washer placed in the mounting through hole on the first printed circuit board and is tightened into the corresponding mounting threaded hole on the lower shell.

Images