Terminal bonding device based on shell wrapping force enhancement

Abstract

The utility model provides a terminal bonding device based on shell wrapping force enhancement, and relates to the field of electronic packaging, the terminal bonding device comprises an epoxy resin shell and a terminal embedded in the epoxy resin shell, the terminal comprises a terminal body, a bonding area arranged on the terminal body, and a pin, the area of the bonding area is smaller than that of the terminal body; the wrapping area of the terminal by the epoxy resin shell is larger than the area of the terminal body, and the part, except the bonding area, of the terminal body is wrapped by the epoxy resin shell. According to the utility model, the epoxy resin shell and the terminal structure are improved, and the wrapping force of the epoxy resin shell on the terminal is increased, so that the terminal is relatively stable when the terminal surface is bonded, and the firmness of the terminal welding spot is improved, thereby greatly reducing the occurrence of the condition that the terminal welding spot falls off.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic packaging field especially is used for the terminal bonding device of IGBT (insulated gate bipolar transistor) shell module, concretely relates to a terminal bonding device based on shell tightness enhancement. BACKGROUND

[0002] In the production process of IGBT shell type module, the circuit structure on DBC (direct substrate circuit) must be welded with the terminal in the shell to form the electrical path. The traditional terminal welding technology has more obvious problems, especially in the case of using epoxy resin shell, the tightness of the shell to the terminal is insufficient, which causes the wedge force and shock energy applied in the bonding process to cause the terminal to shake, resulting in the terminal soldering point falling off, and finally leading to product failure.

[0003] In the prior art, the terminal is relatively prominent relative to the plane of the shell, which makes the tightness of the epoxy resin shell to the terminal insufficient, resulting in large terminal vibration during bonding, thereby affecting the stability of the soldering point. Through continuous testing, it is found that the soldering point of the terminal surface close to the shell area is usually more firm, and the soldering point of the area far from the shell is more prone to falling off. This phenomenon shows that the tightness between the terminal and the shell is crucial to the stability of the soldering point.

[0004] At present, many modules have the serious problem of terminal falling off during bonding, and the falling rate can be as high as 50%, which brings huge rework cost and waste to production and seriously affects the reliability of the product.

[0005] In order to solve this problem, it is urgent to propose a terminal bonding device based on the enhancement of the tightness of the epoxy resin shell, which optimizes the shape of the terminal and improves the wrapping area of the shell to the terminal, to enhance the firmness of the soldering point, thereby effectively reducing the falling rate of the terminal soldering point. UTILITY MODEL CONTENTS

[0006] Therefore, the utility model aims at providing a terminal bonding device based on shell tightness enhancement, which improves the structure of the epoxy resin shell and the terminal, increases the tightness of the shell to the terminal, improves the stability of the terminal bonding and the firmness of the soldering point, thereby effectively solving the problem of terminal soldering point falling off and improving the product reliability.

[0007] To achieve the above purpose, the utility model provides the following technical scheme:

[0008] In order to achieve the above object, the utility model provides a kind of terminal bonding device based on shell tightness enhancement, including epoxy resin shell and inlay in epoxy resin shell terminal, terminal is set on the terminal face of epoxy resin shell, the terminal includes terminal body, bonding area and pin needle being set on terminal body, the area of bonding area is less than the area of terminal body;The wrapping area of epoxy resin shell to terminal is greater than the area of terminal body, and the part of terminal body except bonding area is wrapped by epoxy resin shell.

[0009] As a further scheme of the utility model, the bonding area is arranged close to the epoxy resin shell.

[0010] As a further scheme of the utility model, the area of the bonding area is 50%-80% of the area of the terminal body.

[0011] As a further scheme of the utility model, the terminal body is of copper material, and an aluminum plate is pressed on the surface of the bonding area.

[0012] As a further scheme of the utility model, the wrapping area of the epoxy resin shell to the terminal is 120%-150% of the area of the terminal body.

[0013] As a further scheme of the utility model, the pin needle extends from the bottom of the epoxy resin shell, and a terminal inlaying area is further arranged on the terminal body between the pin needle and the bonding area, and a pouring positioning area is further arranged on the terminal on the other side of the bonding area, the pouring positioning area is a positioning area for positioning when pouring the epoxy resin shell, and is cut off after pouring is completed.

[0014] As a further scheme of the utility model, the bonding area is located on the side of the terminal body close to the epoxy resin shell, to increase the stability during bonding.

[0015] As a further scheme of the utility model, the wrapping part of the epoxy resin shell to the terminal forms a groove structure, to further increase the tightness of the terminal.

[0016] As a further scheme of the utility model, a roughened contact surface is arranged between the terminal body and the epoxy resin shell, to increase the friction between the terminal and the epoxy resin shell.

[0017] As a further scheme of the utility model, the terminal bonding device is used for manufacturing IGBT module, by enhancing the tightness of the epoxy resin shell to the terminal, the firmness of terminal welding point is improved, and the falling rate of terminal welding point is reduced.

[0018] Compared with the prior art, the terminal bonding device based on shell tightness enhancement has the following beneficial effects:

[0019] The terminal bonding device of the utility model improves the epoxy resin shell and the terminal structure, increases the tightness of the epoxy resin shell to the terminal, makes the terminal relatively stable when bonding the terminal face, improves the firmness of the terminal welding point, thereby greatly reduces the occurrence of the terminal welding point falling off. The utility model improves the stability when bonding by reducing the area of the terminal bonding area, makes the bonding position closer to the epoxy resin shell, increases the tightness of the epoxy resin shell to the terminal by increasing the wrapping area of the epoxy resin shell to the terminal, thereby improves the stability of the terminal when bonding, the device after improvement significantly reduces the terminal welding point falling off rate, basically eradicates the terminal off-line problem, greatly improves the product reliability.

[0020] These aspects or other aspects of the present application will be more apparent in the following description of the embodiments. It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or related technical scheme, the drawings needed to be used in the exemplary embodiments or related technical description will be briefly introduced as follows, the drawings are used to provide further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with the embodiments of the utility model, and do not constitute the limitation of the utility model. In the drawings:

[0022] Fig. 1 It is a structure schematic view of the terminal bonding device based on the shell tightness enhancement of the utility model embodiment.

[0023] Fig. 2 It is a front view of the terminal bonding device based on the shell tightness enhancement of the utility model embodiment.

[0024] Fig. 3 It is a structure schematic view of the terminal in the terminal bonding device based on the shell tightness enhancement of the utility model embodiment.

[0025] Fig. 4 It is a side view of the terminal in the terminal bonding device based on the shell tightness enhancement of the utility model embodiment.

[0026] Reference signs:

[0027] 1-epoxy resin shell, 2-terminal face, 3-terminal, 4-terminal body, 5-bonding area, 6-pin needle, 7-terminal inlay area, 8-pouring positioning area. DETAILED DESCRIPTION

[0028] The application will be further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments described below or technical features between the embodiments can be combined in any manner to form new embodiments without conflict.

[0029] To make the objectives, technical solutions and advantages of the present application clearer, the embodiments of the present application are further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.

[0030] It should be noted that all the expressions of "first" and "second" in the embodiments of the present application are used to distinguish two non-identical entities or non-identical parameters with the same name. It can be seen that "first" and "second" are only for the convenience of description and should not be understood as a limitation of the embodiments of the present application. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, other steps or units inherent to the process, method, system, product or equipment that include a series of steps or units.

[0031] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0032] The flowchart shown in the drawings is only an example and does not necessarily include all the contents and operations / steps, nor does it necessarily execute in the order described. For example, some operations / steps can be further divided, combined or partially merged, so the actual execution order may be changed according to the actual situation.

[0033] Some embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. In the case of no conflict, the embodiments described below and the features in the embodiments can be combined with each other.

[0034] Referring to Figs. 1 to 4 The embodiments of the present application provide a terminal bonding device based on shell wrapping force enhancement, which comprises an epoxy resin shell 1 and a terminal 3 embedded in the epoxy resin shell 1. The terminal 3 is arranged on a terminal face 2 of the epoxy resin shell 1. The terminal 3 comprises a terminal body 4, a bonding area 5 arranged on the terminal body 4 and a pin 6. The area of the bonding area 5 is smaller than the area of the terminal body 4. The wrapping area of the epoxy resin shell 1 to the terminal 3 is greater than the area of the terminal body 4. The part of the terminal body 4 except the bonding area 5 is wrapped by the epoxy resin shell 1.

[0035] In the embodiment, referring to Figs. 1 to 4 As shown, the bonding area 5 is arranged close to the epoxy shell 1, the area of the bonding area 5 is 50%-80% of the area of the terminal body 4, the terminal body 4 is made of copper, and a layer of aluminum plate is pressed on the surface of the bonding area 5. The wrapping area of the epoxy shell 1 to the terminal 3 is 120%-150% of the area of the terminal body 4.

[0036] In the embodiment, the pin 6 extends from the bottom of the epoxy shell 1, and a terminal inlay area 7 is further arranged on the terminal body 4 between the pin 6 and the bonding area 5. A pouring positioning area 8 is further arranged on the terminal on the other side of the bonding area 5, the pouring positioning area 8 is a positioning area for positioning when pouring the epoxy shell 1, and is cut off after pouring is completed.

[0037] The bonding area 5 is arranged on the side of the terminal body 4 close to the epoxy shell 1, so as to increase the stability during bonding. The wrapping part of the epoxy shell 1 to the terminal 3 is formed as a groove structure, so as to further increase the wrapping force of the epoxy shell 1 to the terminal 3. The shape of the terminal face 2 is optimized, the area of the terminal 3 far from the shell area is reduced, the bonding position is closer to the shell, the stability during bonding is improved, the wrapping area of the epoxy shell 1 to the terminal 3 is increased, the wrapping force of the epoxy shell to the terminal 3 is increased, and thus the stability of the terminal 3 during bonding is improved.

[0038] In the embodiment, a roughened contact surface is arranged between the terminal body 4 and the epoxy shell 1, so as to increase the friction force between the terminal 3 and the epoxy shell 1. The terminal bonding device is used for manufacturing an IGBT module, the wrapping force of the epoxy shell 1 to the terminal 3 is increased, the firmness of the terminal 3 welding point is improved, and the terminal 3 welding point falling rate is reduced.

[0039] The terminal bonding device improves the structure of the epoxy shell 1 and the terminal 3, increases the wrapping force of the epoxy shell 1 to the terminal 3, makes the terminal 3 relatively stable during bonding of the terminal face 3, improves the firmness of the terminal welding point, and thus greatly reduces the occurrence of terminal welding point falling. The terminal bonding area 5 is reduced, the bonding position is closer to the epoxy shell 1, the stability during bonding is improved, the wrapping area of the epoxy shell 1 to the terminal 3 is increased, the wrapping force of the epoxy shell 1 to the terminal 3 is increased, and thus the stability of the terminal 3 during bonding is improved. The falling rate of the terminal 3 welding point is significantly reduced, the terminal 3 falling problem is basically solved, and the product reliability is greatly improved.

[0040] The above is the exemplary embodiment disclosed by the utility model, but it should be noted that various changes and modifications can be made without departing from the scope of the utility model embodiment defined by the claims. The functions, steps and / or actions of the method claims described herein do not need to be performed in any particular order. Furthermore, although the elements of the utility model embodiment disclosed can be described or claimed in individual form, or in a hierarchical form, unless otherwise specified, each element can be fractionized into a plurality of elements.

[0041] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and not intended to suggest that the scope of the utility model embodiment disclosed (including the claims) is limited to these examples; the above embodiments or technical features among different embodiments can also be combined, and there are many other changes of the different aspects of the utility model embodiment as above. In order to be brief, they are not provided in details. Therefore, any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model embodiment should be included in the protection scope of the utility model embodiment.

Claims

1. A terminal bonding device based on enhanced housing clamping force, comprising an epoxy resin housing and terminals embedded in the epoxy resin housing, characterized in that: The terminal is disposed on the terminal surface of the epoxy resin shell. The terminal includes a terminal body, a bonding area disposed on the terminal body, and a pin. The area of ​​the bonding area is smaller than the area of ​​the terminal body. The epoxy resin shell covers a larger area of ​​the terminal body than the terminal body itself, and the portion of the terminal body other than the bonding area is covered by the epoxy resin shell.

2. The terminal bonding device based on enhanced shell clamping force as described in claim 1, characterized in that, The bonding area is located close to the epoxy resin shell.

3. The terminal bonding device based on enhanced shell clamping force as described in claim 2, characterized in that, The area of ​​the bonding region is 50%-80% of the terminal body area.

4. The terminal bonding device based on enhanced housing clamping force as described in claim 3, characterized in that, The terminal body is made of copper, and an aluminum plate is pressed onto the surface of the bonding area.

5. The terminal bonding device based on enhanced shell clamping force as described in claim 2, characterized in that, The epoxy resin shell covers 120%-150% of the terminal body area.

6. The terminal bonding device based on enhanced housing clamping force as described in claim 1, characterized in that, The pins extend from the bottom of the epoxy resin housing.

7. The terminal bonding device based on enhanced housing clamping force as described in claim 6, characterized in that, The terminal body between the pin and the bonding area is also provided with a terminal embedding area, and the terminal on the other side of the bonding area is also provided with a potting positioning area. The potting positioning area is the positioning area for positioning when potting the epoxy resin shell, and is cut off after potting is completed.

8. The terminal bonding device based on enhanced housing clamping force as described in any one of claims 1-7, characterized in that, The bonding area is located on the side of the terminal body near the epoxy resin shell.

9. The terminal bonding device based on enhanced housing clamping force as described in claim 8, characterized in that, The epoxy resin shell forms a groove structure around the terminals.

10. The terminal bonding device based on enhanced housing clamping force as described in claim 9, characterized in that, The terminal body and the epoxy resin shell have a roughened contact surface.

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