Embossing and cooling device for EVA (Ethylene Vinyl Acetate) adhesive film for packaging solar cell

Abstract

The utility model relates to the technical field of EVA (Ethylene Vinyl Acetate) adhesive film processing, in particular to an EVA adhesive film embossing and cooling device for solar cell packaging, which comprises a printing device main body, a cooling shell is fixedly mounted at the front end of the printing device main body, a support frame is fixedly mounted at the top end of the cooling shell, and a cooling mechanism is arranged in the cooling shell; the cooling mechanism comprises a cooling cavity, the cooling cavity is formed in the cooling shell, a heat dissipation cavity is formed in one side of the cooling cavity in the cooling shell, and a heat pipe is fixedly installed in the cooling cavity. The cooling effect and comprehensiveness of the adhesive film can be improved, the cooling sufficiency is improved, adjustment and limiting can be conducted along with the size of the adhesive film, and the situation that the adhesive film can not correspond to the cold end of a heat pipe due to the fact that the adhesive film deflects in the conveying process is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to EVA adhesive film processing technical field especially is related to a solar cell packaging EVA adhesive film embossing cooling device. BACKGROUND

[0002] EVA solar cell adhesive film is with EVA as main raw material, adds various modified auxiliary agent, mixes after full, the film -shaped product that is formed by production equipment heat processing, the product is no tackiness under normal temperature, convenient cutting etc. Operation, EVA adhesive film in the production process, through specific process and equipment form various patterns or patterns on the adhesive film surface, in order to increase the friction between it and other materials, in solar cell module packaging, this helps adhesive film and battery piece, glass etc. Better fit, prevent adhesive film from sliding in laminating process, improve the stability and reliability of packaging.

[0003] In the prior art, during the embossing process of EVA adhesive film, a fan or air blower is arranged near the embossing device to blow air directly to the surface of EVA adhesive film, so that the air flows quickly and carries away the heat on the surface of EVA adhesive film, thereby achieving cooling.

[0004] In the prior art, during the embossing process of EVA adhesive film, a fan or air blower is arranged near the embossing device to blow air directly to the surface of EVA adhesive film, so that the air flows quickly and carries away the heat on the surface of EVA adhesive film, thereby achieving cooling. SUMMARY

[0005] The utility model discloses a solar cell packaging EVA adhesive film embossing cooling device, can improve the cooling effect and comprehensiveness of adhesive film, improve the fullness of cooling, and can adjust and limit with the size of adhesive film, avoid the deflection in the conveying process, lead to the cold end of heat pipe, to solve the problem in the above background art.

[0006] To achieve the above object, the utility model provides the following technical scheme: a solar cell packaging EVA adhesive film embossing cooling device, including printing device main part, the front end fixed mounting of printing device main part has cooling shell, and the top of cooling shell is fixedly installed with support frame, the inside of cooling shell is provided with cooling mechanism;

[0007] The cooling mechanism includes a cooling cavity, the cooling cavity is opened in the inside of the cooling shell, and a heat dissipation cavity is opened on one side of the cooling cavity in the cooling shell, a heat pipe is fixedly installed in the inside of the cooling cavity, a motor is embedded on the outer wall of the support frame, a double -sided threaded rod is fixedly installed on the power output end of the motor, and a sliding block is slidably connected to the outside of the double -sided threaded rod.

[0008] Preferably, a sliding plate is fixedly installed at the top of the slider, and an abutment plate is fixedly installed at the top of the sliding plate.

[0009] Preferably, a fixing block is fixedly installed on one side of the sliding plate abutting the top of the sliding plate, and a through hole is provided inside the fixing block.

[0010] Preferably, the heat pipe extends through a through hole into the interior of the fixing block, and a sliding structure is formed between the fixing block and the heat pipe.

[0011] Preferably, the top of the cooling shell is provided with a mounting groove, and a heat dissipation mechanism is provided inside the mounting groove.

[0012] Preferably, the heat dissipation mechanism includes a ventilation fan, which is embedded inside the mounting slot, and the outer wall of the cooling shell is fitted with cooling fins.

[0013] Preferably, the outer wall of the heat dissipation cavity is provided with ventilation holes, and a partition plate is fixedly installed inside the heat dissipation cavity.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] 1. This utility model utilizes the properties of a heat pipe to allow the hot and cold ends to circulate, thereby enabling the cold end to adhere to and contact the outer wall of the adhesive film. This improves the cooling effect and overall performance of the adhesive film, enhances the adequacy of cooling, and allows for adjustment and positioning according to the size of the adhesive film, preventing skew during transport and ensuring proper alignment of the cold end of the heat pipe.

[0016] 2. This utility model, through the combination of a ventilation fan and a partition plate, can improve air circulation in the cooling chamber, increase cooling efficiency through air cooling, and accelerate the cooling of the hot end of the heat pipe in the heat dissipation chamber, thereby improving circulation efficiency and thus improving the overall cooling effect. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is an overall structural view of the present invention;

[0019] Figure 2 This is a schematic diagram of the internal structure of the cooling chamber of this utility model;

[0020] Figure 3 This is a schematic diagram of the fixing block structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the partition plate structure of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Printing device main body; 2. Cooling shell; 3. Support frame; 4. Cooling mechanism; 401. Cooling chamber; 402. Heat dissipation chamber; 403. Heat pipe; 404. Motor; 405. Bidirectional threaded rod; 406. Slider; 407. Sliding plate; 408. Contact plate; 409. Fixing block; 410. Through hole; 5. Mounting slot; 6. Heat dissipation mechanism; 601. Ventilation fan; 602. Cooling element; 603. Ventilation hole; 604. Divider plate. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0025] This utility model provides a technical solution:

[0026] Please see Figures 1 to 4 A cooling device for embossing EVA film for solar cell encapsulation includes a printing device body 1. A cooling shell 2 is fixedly installed at the front end of the printing device body 1, and a support frame 3 is fixedly installed at the top end of the cooling shell 2. A cooling mechanism 4 is provided inside the cooling shell 2. The cooling mechanism 4 includes a cooling cavity 401, which is located inside the cooling shell 2. A heat dissipation cavity 402 is provided on one side of the cooling cavity 401 inside the cooling shell 2. A heat pipe 403 is fixedly installed inside the cooling cavity 401. A motor 404 is embedded in the outer wall of the support frame 3. A bidirectional threaded rod 405 is fixedly installed at the power output end of 404. A slider 406 is slidably connected to the outside of the bidirectional threaded rod 405. A sliding plate 407 is fixedly installed at the top of the slider 406. An abutment plate 408 is fixedly installed at the top of the sliding plate 407. A fixing block 409 is fixedly installed on one side of the abutment plate 408 at the top of the sliding plate 407. A through hole 410 is opened inside the fixing block 409. The heat pipe 403 passes through the through hole 410 and enters the interior of the fixing block 409. A sliding structure is formed between the fixing block 409 and the heat pipe 403.

[0027] By adopting the above technical solution, the adhesive film first enters the cooling chamber 401 of the cooling shell 2 through the main body 1 of the printing device, and then passes through the heat pipe 403 in an S-shape and adheres to it before entering the next process. The phase change of the working fluid of the heat pipe 403 is used to transfer heat, and the process is repeated so that the adhesive film can be fully cooled, thus improving the cooling effect. At the same time, the motor 404 drives the bidirectional threaded rod 405, which causes the slider 406 to drive the sliding plate 407 to limit the adhesive film from both sides via the contact plate 408. This can prevent the film from being misaligned during the conveying process, which would cause it to fail to correspond to the cooling end of the heat pipe 403. It can also be adjusted according to the width of the adhesive film, improving its applicability and comprehensiveness. During the sliding process of the sliding plate 407, the heat pipe 403 is fitted through the fixing block 409 and the through hole 410 to improve the stability of the sliding plate 407's displacement. The heat dissipation end of the heat pipe 403 is located in the heat dissipation chamber 402, which is separated from the cooling chamber 401 to avoid affecting the cooling effect of the adhesive film.

[0028] Specifically, such as Figure 1 , Figure 2 and Figure 4 As shown, the top of the cooling shell 2 is provided with a mounting groove 5, and a heat dissipation mechanism 6 is provided inside the mounting groove 5. The heat dissipation mechanism 6 includes a ventilation fan 601, which is embedded inside the mounting groove 5. Cooling fins 602 are embedded in the outer wall of the cooling shell 2. Ventilation holes 603 are provided in the outer wall of the heat dissipation cavity 402. A partition plate 604 is fixedly installed inside the heat dissipation cavity 402.

[0029] By adopting the above technical solution, the internal temperature of the heat dissipation cavity 402 is initially reduced by the cooling chip 602. The cold end of the cooling chip 602 is located inside the heat dissipation cavity 402, and the hot end is located outside the cooling shell 2 to avoid mutual interference. With the help of the ventilation fan 601 embedded in the mounting slot 5, the air circulation inside the cooling cavity 401 is improved. With the help of the partition plate 604, some cold air enters the cooling cavity 401 to achieve the air cooling effect, and accelerates the air circulation and exhaust, further improving the cooling efficiency of the film. Some cold air cools the hot end of the heat pipe 403, improving the circulation efficiency of the heat pipe 403.

[0030] Working principle: The cooling shell 2 is supported and fixed by the support frame 3. After the film passes through the main body 1 of the printing device, it enters the cooling chamber 401 of the cooling shell 2 and passes through the cooling shell 2 in an S-shape around multiple heat pipes 403. It is then wound up by a suitable winding device or conveyed to the next production equipment. The cooling end of the heat pipe 403 is attached to the outer wall of the film, and the hot end is inserted into the heat dissipation chamber 402 to avoid affecting the cooling effect. This allows the film to be conveyed with resistance while achieving a cooling effect. Through the cooperation of the motor 404 and the bidirectional threaded rod 405, the slider 406 drives the sliding plate 407 to slide, thereby causing the two sliding plates 407 to drive the contact plate. 408. The adhesive film is limited from both sides to prevent it from shifting and failing to align with the cooling end of the heat pipe 403. The sliding plate 407 slides along the heat pipe 403 through the through hole 410 of the fixing block 409, improving the stability of the displacement process. The cold end of the cooling chip 602 is located in the heat dissipation cavity 402 to cool it down. The ventilation fan 601 embedded in the mounting slot 5 improves air circulation. Some of the cold air is guided by the partition plate 604 and enters the cooling cavity 401 through the ventilation hole 603 to cool the adhesive film, while some of it flows through the heat dissipation cavity 402 to cool the hot end of the heat pipe 403, thus achieving a double-layer cooling effect.

[0031] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A cooling device for embossing EVA film for solar cell encapsulation, comprising a main body of an embossing device (1), characterized in that: A cooling shell (2) is fixedly installed at the front end of the main body (1) of the printing device, and a support frame (3) is fixedly installed at the top of the cooling shell (2). A cooling mechanism (4) is provided inside the cooling shell (2). The cooling mechanism (4) includes a cooling chamber (401), which is located inside the cooling shell (2). A heat dissipation chamber (402) is provided on one side of the cooling chamber (401) inside the cooling shell (2). A heat pipe (403) is fixedly installed inside the cooling chamber (401). A motor (404) is embedded in the outer wall of the support frame (3). A bidirectional threaded rod (405) is fixedly installed at the power output end of the motor (404). A slider (406) is slidably connected to the outside of the bidirectional threaded rod (405).

2. The EVA film embossing and cooling device for solar cell encapsulation according to claim 1, characterized in that: The top of the slider (406) is fixedly mounted with a sliding plate (407), and the top of the sliding plate (407) is fixedly mounted with an abutment plate (408).

3. The EVA film embossing and cooling device for solar cell encapsulation according to claim 2, characterized in that: A fixing block (409) is fixedly installed on one side of the sliding plate (408) at the top of the sliding plate (407), and a through hole (410) is provided inside the fixing block (409).

4. The EVA film embossing and cooling device for solar cell encapsulation according to claim 3, characterized in that: The heat pipe (403) passes through the through hole (410) into the interior of the fixing block (409), and the fixing block (409) and the heat pipe (403) form a sliding structure.

5. The EVA film embossing and cooling device for solar cell encapsulation according to claim 1, characterized in that: The top of the cooling shell (2) is provided with a mounting groove (5), and a heat dissipation mechanism (6) is provided inside the mounting groove (5).

6. The EVA film embossing and cooling device for solar cell encapsulation according to claim 5, characterized in that: The heat dissipation mechanism (6) includes a ventilation fan (601), which is embedded inside the mounting slot (5), and the outer wall of the cooling shell (2) is fitted with a cooling plate (602).

7. The EVA film embossing and cooling device for solar cell encapsulation according to claim 1, characterized in that: The outer wall of the heat dissipation cavity (402) is provided with ventilation holes (603), and a partition plate (604) is fixedly installed inside the heat dissipation cavity (402).

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