Epoxy packaging pressure curing mold for silicon controlled rectifier chip

Abstract

The utility model belongs to the technical field of molds, and particularly relates to a silicon controlled rectifier chip epoxy packaging pressure curing mold, which comprises two mold bodies, the two mold bodies are respectively an upper mold and a lower mold, molding cavities are arranged in the upper mold and the lower mold, an epoxy resin feeding pipe and a telescopic conveying pipe capable of extending into the molding cavities are arranged on the upper mold, and the lower mold is provided with a pressure curing device. The telescopic conveying pipe comprises a first sleeve fixedly connected to the interior of the mold body, one end of the first sleeve communicates with a raw material feeding pipe, a sliding pipe capable of extending into the molding cavity is slidably connected to the interior of the first sleeve, and a first telescopic moving mechanism connected with the sliding pipe is further assembled on the mold body; a chip positioning mechanism capable of extending into the molding cavity is mounted on the mold body, the chip positioning mechanism comprises four second telescopic moving mechanisms fixedly connected to the mold body, and a positioning plate is mounted on each second telescopic moving mechanism. According to the utility model, the positioning accuracy of the silicon chip unit can be effectively improved in the epoxy resin packaging process.

Description

TECHNICAL FIELD

[0001] The utility model belongs to mould technical field, concretely relates to a silicon chip epoxy package pressure curing mould. BACKGROUND

[0002] In the production and manufacturing process of silicon chip, epoxy package is a crucial link. Epoxy package not only can protect silicon chip from the influence of external environmental factors (such as humidity, dust, mechanical impact, etc.), but also can provide good electrical insulation performance for chip, so as to ensure the normal operation and long-term stability of chip.

[0003] At present, in the epoxy package process of silicon chip, the commonly used pressure curing mould has some problems. On the one hand, in the injection process of epoxy resin, due to the flowability of epoxy resin and the thrust effect during injection, silicon chip unit is prone to displacement, so that the positioning of silicon chip unit in the mould deviates. This displacement not only affects the precision and quality of packaging, but also may cause problems in the connection between chip pin and packaging structure, and further affect the electrical performance of chip. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a silicon chip epoxy package pressure curing mould, which can effectively improve the positioning accuracy of silicon chip unit in the epoxy resin packaging process.

[0005] The technical scheme adopted by the utility model is as follows:

[0006] A silicon chip epoxy package pressure curing mould, comprising two mould bodies, the two mould bodies are respectively upper mould and lower mould, the upper mould and the lower mould are both internally provided with a shaping cavity, the upper mould is provided with an epoxy resin feeding pipe and a telescopic conveying pipe that can extend into the shaping cavity.

[0007] Further, the telescopic conveying pipe comprises a first sleeve fixedly connected in the mould body, one end of the first sleeve is communicated with a raw material feeding pipe, the inside of the first sleeve is slidably connected with a sliding pipe that can extend into the shaping cavity, and the mould body is further provided with a first telescopic moving mechanism connected with the sliding pipe.

[0008] Further, the mould body is provided with a chip positioning mechanism that can extend into the shaping cavity, the chip positioning mechanism comprises four second telescopic moving mechanisms fixedly connected to the mould body, and the second telescopic moving mechanisms are provided with positioning plates.

[0009] Further, the first telescopic moving mechanism and the second telescopic moving mechanism each comprise a second sleeve fixedly connected inside the mold body, one end of the second sleeve of the first telescopic moving mechanism is fixedly connected with a first air guide pipe, one end of the second sleeve of the second telescopic moving mechanism is fixedly connected with a second air guide pipe, the inside of the second sleeve is slidably connected with a gas pushing plate, one end of the gas pushing plate is fixedly connected with a slide rod extending to the outside of the second sleeve, the slide rod of the first telescopic moving mechanism is fixedly connected with the end of the slide pipe through a connecting plate, and the slide rod of the second telescopic moving mechanism is fixedly connected with a positioning plate.

[0010] Further, the first telescopic moving mechanism and the second telescopic moving mechanism each comprise a second sleeve fixedly connected inside the mold body, one end of the second sleeve of the first telescopic moving mechanism is fixedly connected with a first air guide pipe, one end of the second sleeve of the second telescopic moving mechanism is fixedly connected with a second air guide pipe, the inside of the second sleeve is slidably connected with a gas pushing plate, one end of the gas pushing plate is fixedly connected with a slide rod extending to the outside of the second sleeve, the slide rod of the first telescopic moving mechanism is fixedly connected with the end of the slide pipe through a connecting plate, and the slide rod of the second telescopic moving mechanism is fixedly connected with a positioning plate.

[0011] Further, the inside of the mold body is provided with a hollow air guide cavity, the outside of the mold body is fixedly connected with a heat dissipation fan in communication with the air guide cavity, and the outer wall of the mold body is provided with an air exchange hole in communication with the air guide cavity.

[0012] Further, the inside of the mold body is fixedly connected with a heat exchange copper sheet, the heat exchange copper sheet is made of copper, one side of the heat exchange copper sheet is the inner wall of the shaping cavity, and the other side of the heat exchange copper sheet is the inner wall of the air guide cavity.

[0013] The technical effects achieved by the mold body are as follows.

[0014] The mold body can effectively reduce the displacement of the silicon chip unit caused by the pushing force of the epoxy resin during feeding, thereby effectively improving the positioning accuracy of the silicon chip unit during the packaging process. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a structural schematic view of the embodiment 1 of the utility model;

[0016] Figure 2 is a structural schematic view of the embodiment 1 of the utility model when the upper mold is inverted;

[0017] Figure 3 is a partial enlarged view of the utility model Figure 2 ;

[0018] Figure 4 is a partial enlarged view of the mold body in the embodiment 2 of the utility model;

[0019] Figure 5 is a structural schematic view of the silicon chip unit after epoxy packaging.

[0020] The components represented by the reference numbers in the drawings are listed as follows:

[0021] 1, mold body; 2, shaping cavity; 3, first sleeve; 4, sliding pipe; 5, connecting plate; 6, second sleeve; 7, sliding rod; 8, first air guide pipe; 9, raw material feeding pipe; 10, first groove; 11, positioning plate; 12, second groove; 13, air pushing plate; 14, heat exchange copper sheet; 15, heat dissipation fan; 16, air exchange hole; 17, second air guide pipe; 18, silicon chip unit; 19, epoxy resin packaging layer. DETAILED DESCRIPTION

[0022] In order to make the purpose and advantages of the utility model more clear and apparent, the utility model is specifically described below in combination with examples. It should be understood that the following text is only used to describe one or several specific embodiments of the utility model, and does not strictly limit the specific protection scope requested by the utility model.

[0023] Example One:

[0024] As shown in Figures 1-3 A silicon chip epoxy packaging pressure curing mold, comprising two mold bodies 1, the two mold bodies 1 are respectively an upper mold and a lower mold, and shaping cavities 2 are formed in the interiors of the upper mold and the lower mold; when the mold bodies 1 are moved by vertical moving equipment such as a hydraulic rod or an electric push rod, the closing and separation of the two mold bodies 1 can be controlled.

[0025] The mold body 1 is provided with a chip positioning mechanism that can extend into the interior of the shaping cavity 2, which is used for positioning a silicon chip unit 18 placed in the interior of the shaping cavity 2; the upper mold is provided with an epoxy resin feeding pipe and a telescopic conveying pipe that can extend into the interior of the shaping cavity 2; when the silicon chip unit 18 is packaged, the silicon chip unit 18 is placed in the interior of the shaping cavity 2, the chip positioning mechanism is used to position the silicon chip unit 18, then the telescopic conveying pipe is extended to abut against the silicon chip unit 18, epoxy resin is injected into the interior of the telescopic conveying pipe, a vertical epoxy resin column is formed on the upper side of the silicon chip unit 18 after the epoxy resin cools, which is used for positioning the second sleeve 6, then the positioning of the silicon chip unit 18 by the chip positioning mechanism is cancelled, epoxy resin is added into the interior of the shaping cavity 2 through the epoxy resin feeding pipe, and an epoxy resin packaging layer 19 is formed on the outer side of the silicon chip unit 18. Figure 5

[0026] ​Due to the fact that the epoxy resin encapsulation layer 19 is formed outside the silicon chip unit 18 after the silicon chip unit 18 is positioned by first forming an epoxy resin column, the displacement of the silicon chip unit 18 caused by the pushing force during the epoxy resin encapsulation feeding can be effectively reduced, and thus the positioning accuracy of the silicon chip unit 18 during the encapsulation process can be effectively improved.

[0027] As shown in Figure 2 , Figure 2 is a structural schematic view when the upper mold is inverted, the epoxy resin feeding pipe is a tubular structure connected with the plasticizing cavity 2, the telescopic conveying pipe includes a first sleeve 3 fixedly connected inside the mold body 1, one end of the first sleeve 3 is connected with the raw material feeding pipe 9 for feeding the epoxy resin, the inside of the first sleeve 3 is slidably connected with a sliding pipe 4 which can extend into the plasticizing cavity 2, and the mold body 1 is further provided with a first telescopic moving mechanism connected with the sliding pipe 4, which can drive the sliding pipe 4 to extend or retract, so as to control the movement of the sliding pipe 4 in the plasticizing cavity 2.

[0028] The chip positioning mechanism can include four second telescopic moving mechanisms fixedly connected to the mold body 1, and the positioning plates 11 are installed on the second telescopic moving mechanisms, so that the positions of the four side edges of the silicon chip unit 18 can be positioned by moving the four positioning plates 11, thereby controlling the position of the silicon chip unit 18.

[0029] Specifically, as shown in Figures 2-3 , the first telescopic moving mechanism and the second telescopic moving mechanism each include a second sleeve 6 fixedly connected inside the mold body 1, one end of the second sleeve 6 of the first telescopic moving mechanism is fixedly connected with the first air guide pipe 8, and one end of the second sleeve 6 of the second telescopic moving mechanism is fixedly connected with the second air guide pipe 17 for air intake or exhaust into the second sleeve 6, the inside of the second sleeve 6 is slidably connected with a push air plate 13, the outside of the push air plate 13 is provided with a sealing ring in interference fit with the inner wall of the second sleeve 6, one end of the push air plate 13 is fixedly connected with a sliding rod 7 extending to the outside of the second sleeve 6, the sliding rod 7 of the first telescopic moving mechanism is fixedly connected with the end of the sliding pipe 4 through the connecting plate 5, and the sliding rod 7 of the second telescopic moving mechanism is fixedly connected with the positioning plate 11, the gas in the second sleeve 6 is extracted by the air pump connected with the first air guide pipe 8 or the second air guide pipe 17, so that negative pressure is generated in the second sleeve 6, the push air plate 13 is pulled, the sliding rod 7 is retracted into the second sleeve 6, the sliding pipe 4 or the positioning plate 11 is retracted, air is introduced into the second sleeve 6 by the air pump connected with the first air guide pipe 8 or the second air guide pipe 17, the sliding rod 7 is pushed out, and the sliding pipe 4 or the positioning plate 11 is extended.

[0030] Meanwhile, the inner wall of the shaping cavity 2 is provided with a first groove 10 and a second groove 12, the connecting plate 5 and the first groove 10 are in clearance fit, so that the connecting plate 5 can be retracted in the first groove 10, thereby the connecting plate 5 can keep a plane with the inner wall of the shaping cavity 2 when retracted, the positioning plate 11 and the second groove 12 are in clearance fit, so that the positioning plate 11 can be retracted in the second groove 12, thereby the positioning plate 11 can keep a plane with the inner wall of the shaping cavity 2 when retracted.

[0031] Embodiment two:

[0032] This embodiment improves the structure of the mold body 1 based on the embodiment one, and the specific structure is shown in the figure. Figures 4-5 The inside of the mold body 1 is provided with a hollow air guide cavity, the outside of the mold body 1 is fixedly connected with a heat dissipation fan 15 which is communicated with the air guide cavity, and the outer wall of the mold body 1 is provided with an air exchange hole 16 which is communicated with the air guide cavity, at this time, air is blown into the air guide cavity by the heat dissipation fan 15, and then is discharged through the air exchange hole 16, so that the air exchange of the inside of the mold body 1 is completed, and the temperature of the mold body 1 is reduced through the flow of air, so that the epoxy resin in the shaping cavity 2 is rapidly cooled.

[0033] The inside of the mold body 1 is fixedly connected with a heat exchange copper sheet 14, the material of the heat exchange copper sheet 14 is copper, one side of the heat exchange copper sheet 14 is the inner wall of the shaping cavity 2, and the other side of the heat exchange copper sheet 14 is the inner wall of the air guide cavity, at this time, the heat exchange of the shaping cavity 2 and the air guide cavity is rapidly completed through the heat exchange copper sheet 14 during the air exchange process, so that the cooling efficiency of the epoxy resin in the shaping cavity 2 is improved.

[0034] The above is only the preferred embodiment of the present application, it should be pointed out that, for those skilled in the art, without departing from the principle of the present application, a number of improvements and refinements can be made, these improvements and refinements should also be considered as the protection scope of the present application. The structures, devices and operation methods which are not specifically described and explained in the present application, such as no special description and limitation, are implemented according to the conventional means in the art.

Claims

1. A pressure-curing mold for epoxy encapsulation of silicon controlled rectifier chips, characterized by: The utility model provides a mould body (1) for epoxy resin, which comprises two mould bodies (1), the upper mould and the lower mould are respectively provided with a plastic cavity (2), and an epoxy resin feeding pipe and a telescopic conveying pipe extending into the plastic cavity (2) are arranged on the upper mould.

2. A pressure-curing mold for epoxy encapsulation of silicon controlled rectifier chips as defined in claim 1, wherein: The telescopic conveying pipe comprises a first sleeve (3) fixedly connected to the inside of the mould body (1), one end of the first sleeve (3) is communicated with a raw material feeding pipe (9), a sliding pipe (4) extending into the plastic cavity (2) is slidably connected to the inside of the first sleeve (3), and a first telescopic moving mechanism connected to the sliding pipe (4) is further arranged on the mould body (1).

3. A pressure-curing mold for epoxy encapsulation of silicon controlled rectifier chips as defined in claim 2, wherein: A chip positioning mechanism extending into the plastic cavity (2) is arranged on the mould body (1), the chip positioning mechanism comprises four second telescopic moving mechanisms fixedly connected to the mould body (1), and a positioning plate (11) is arranged on the second telescopic moving mechanism.

4. A pressure-curing mold for epoxy encapsulation of a silicon controlled rectifier chip as defined in claim 3, wherein: The first telescopic moving mechanism and the second telescopic moving mechanism each comprise a second sleeve (6) fixedly connected to the inside of the mould body (1), one end of the second sleeve (6) of the first telescopic moving mechanism is fixedly connected with a first air guide pipe (8), one end of the second sleeve (6) of the second telescopic moving mechanism is fixedly connected with a second air guide pipe (17), a push air plate (13) is slidably connected to the inside of the second sleeve (6), one end of the push air plate (13) is fixedly connected with a sliding rod (7) extending to the outside of the second sleeve (6), the sliding rod (7) of the first telescopic moving mechanism is fixedly connected to the end of the sliding pipe (4) through a connecting plate (5), and the sliding rod (7) of the second telescopic moving mechanism is fixedly connected with the positioning plate (11).

5. A pressure-curing mold for epoxy encapsulation of a silicon controlled rectifier chip as defined in claim 4, wherein: First and second grooves (10) and (12) are formed in the inner wall of the plastic cavity (2), the connecting plate (5) is in clearance fit with the first groove (10), and the positioning plate (11) is in clearance fit with the second groove (12).

6. A pressure-curing mold for epoxy encapsulation of silicon controlled rectifier chips as defined in claim 1, wherein: A hollow air guide cavity is formed in the inside of the mould body (1), a heat dissipation fan (15) in communication with the air guide cavity is fixedly connected to the outside of the mould body (1), and an air exchange hole (16) in communication with the air guide cavity is formed in the outer wall of the mould body (1).

7. A pressure-curing mold for epoxy encapsulation of a silicon controlled rectifier chip as defined in claim 6, wherein: A heat exchange copper sheet (14) is fixedly connected to the inside of the mould body (1), the heat exchange copper sheet (14) is made of copper, one side of the heat exchange copper sheet (14) is the inner wall of the plastic cavity (2), and the other side of the heat exchange copper sheet (14) is the inner wall of the air guide cavity.

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