Automobile lamp radiator

By combining a thermally conductive silicon layer and a thermally conductive copper pipe with a heat sink and fan, the problem of heat accumulation in traditional automotive headlight radiators is solved, achieving a more efficient heat dissipation effect and extending the lifespan of the headlights.

CN223924584UActive Publication Date: 2026-02-17DONGGUAN JIEBANG PRECISION METAL CO LTD
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Patent Information

Application Number
CN202520454263.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-17
Publication Date
2026-02-17
Estimated Expiration
2035-03-17

AI Technical Summary

Technical Problem

Traditional car headlight heat sinks accumulate heat after prolonged use, causing the headlight chip temperature to become too high and affecting its lifespan.

Method used

The system uses a thermally conductive silicon layer and thermally conductive copper pipes in conjunction with a heat sink and a fan. The thermally conductive silicon layer transfers heat to the thermally conductive copper pipes, and the heat sink and fan dissipate the heat, thus improving heat dissipation efficiency.

Benefits of technology

This improves the heat dissipation efficiency of the headlight chip and extends the lifespan of the headlight.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an automobile lamp radiator, which relates to the technical field of automobile lamp radiating, and comprises a fixing plate, a connecting piece and a radiating fin, the fixing plate is fixedly connected with the connecting piece, the connecting piece is fixedly connected with the radiating fin, the end part of the connecting piece is fixedly connected with a fan, the fan is arranged in the radiating fin, and the radiating fin is fixedly connected with the fixing plate. A heat dissipation groove is formed in the inner side end of the heat dissipation sheet, the fixing plate is coated with a heat conduction silicon layer, and a vehicle lamp chip is fixed to the heat conduction silicon layer; the utility model discloses an automobile lamp radiator. The heat conduction copper pipe and the heat conduction silicon layer are arranged, the fan in the cooling fin is matched to rotate, the overall heat dissipation effect of the automobile lamp radiator is improved, the heat conduction silicon layer absorbs heat emitted by the automobile lamp chip and transmits the heat to the heat conduction copper pipe, then the heat is dissipated through the cooling fin, and then the heat dissipation efficiency of the automobile lamp chip is improved.
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Description

Technical Field

[0001] This utility model relates to the field of vehicle headlight heat dissipation technology, specifically to a vehicle headlight heat sink. Background Technology

[0002] With the rapid development of the automotive industry, vehicle lights, as an important component of automobiles, directly affect driving safety in terms of performance and reliability. Traditional automotive lights typically use halogen or xenon lamps, which generate a lot of heat when working for extended periods. Poor heat dissipation can lead to a shortened lifespan or even damage to the lights.

[0003] Traditional car headlights dissipate heat through radiators made of aluminum alloy. However, the headlight chip is mounted on an aluminum plate, which simply transfers heat away from the plate. When the headlight is used for a long time, the aluminum plate becomes saturated with heat and can no longer dissipate heat, resulting in the headlight chip overheating and affecting the lifespan of the headlight over time. Utility Model Content

[0004] In view of the shortcomings of the prior art, this utility model provides an automotive headlight radiator, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an automotive headlight radiator, comprising a fixing plate, a connector, and a heat sink, wherein the fixing plate is fixedly connected to the connector, the connector is fixedly connected to the heat sink, a fan is fixedly connected to the end of the connector, the fan is located inside the heat sink, a heat dissipation groove is provided on the inner side of the heat sink, a thermally conductive silicon layer is coated on the fixing plate, and a headlight chip is fixed on the thermally conductive silicon layer.

[0006] Furthermore, thermally conductive copper pipes are fixedly connected to both sides of the fixing plate. One end of the thermally conductive copper pipe is connected to the thermally conductive silicon layer, and the other end of the thermally conductive copper pipe passes through the connector and is fixedly connected to the outer end of the heat sink.

[0007] Furthermore, a pressure plate is fixedly connected to the lower end of the connector, and a spring is fixedly connected to the lower end of the pressure plate. The spring abuts against the outer end face of the vehicle light chip.

[0008] Furthermore, the back of the fixing plate is provided with grooves, and there are multiple grooves with equal spacing.

[0009] Furthermore, the pressure plate and the heat-conducting copper pipe are arranged perpendicularly.

[0010] Furthermore, there are multiple heat dissipation slots, and they are equally spaced.

[0011] This utility model provides an automotive headlight radiator. Compared with the prior art, it has the following advantages:

[0012] This automotive headlight radiator improves overall heat dissipation by incorporating a heat-conducting copper pipe and a heat-conducting silicon layer, along with a fan inside the heat sink. The heat-conducting silicon layer absorbs and transfers the heat generated by the headlight chip to the heat-conducting copper pipe, which then dissipates through the heat sink, thereby enhancing the heat dissipation efficiency of the headlight chip. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the groove and fixing plate of this utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the fixing plate, heat-conducting copper pipe and heat sink of this utility model;

[0016] Figure 4 for Figure 2 Enlarged structural diagram at point A;

[0017] Figure 5 for Figure 3 Enlarged structural diagram at point B.

[0018] In the diagram: 1. Fixing plate; 2. Connector; 3. Heat sink; 4. Fan; 5. Headlight chip; 6. Thermal conductive silicon layer; 7. Thermal conductive copper pipe; 8. Pressure plate; 9. Spring; 10. Groove; 11. Heat dissipation slot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-5This utility model provides a technical solution: an automotive headlight radiator, comprising a fixing plate 1, a connector 2, and a heat sink 3. The fixing plate 1 is fixedly connected to the connector 2, and the connector 2 is fixedly connected to the heat sink 3. A fan 4 is fixedly connected to the end of the connector 2, and the fan 4 is located inside the heat sink 3. A heat dissipation groove 11 is formed on the inner side of the heat sink 3. A thermally conductive silicon layer 6 is coated on the fixing plate 1, and a headlight chip 5 is fixed on the thermally conductive silicon layer 6. The headlight chip 5 is fixed to the fixing plate 1 by screws, and a thermally conductive silicon layer 6 is coated between the headlight chip 5 and the fixing plate 1. The thermally conductive silicon layer 6 increases the contact area with the headlight chip 5, improving the efficiency of heat transfer. The heat is transferred to the connector 2 via the fixing plate 1, and then to the heat sink 3 via the connector 2. The heat sink 3 itself dissipates heat through contact with the air. At the same time, when the internal temperature of the headlight reaches the set value, the fan 4 starts, which increases the airflow inside the heat sink 3. This is a known technology and will not be elaborated on here. A heat dissipation groove 11 is provided inside the heat sink 3. The heat dissipation groove 11 increases the contact area, thereby allowing the internal temperature to dissipate faster and improving the heat dissipation efficiency.

[0021] like Figure 3 As shown, thermally conductive copper pipes 7 are fixedly connected to both sides of the fixing plate 1. One end of the thermally conductive copper pipe 7 is connected to the thermally conductive silicon layer 6, and the other end of the thermally conductive copper pipe 7 passes through the connector 2 and is fixedly connected to the outer end of the heat sink 3. The thermally conductive copper pipe 7 itself has good thermal conductivity. One end of it is connected to the thermally conductive silicon layer 6. The heat absorbed by the thermally conductive silicon layer 6 can be quickly transferred to the heat sink 3 through the thermally conductive copper pipe 7, and then the heat generated by the headlight chip 5 is dissipated through the internal fan 4 and the heat sink 3 itself.

[0022] like Figure 5 As shown, a pressure plate 8 is fixedly connected to the lower end of the connector 2, and a spring piece 9 is fixedly connected to the lower end of the pressure plate 8. The spring piece 9 abuts against the outer end face of the headlight chip 5. When the headlight chip 5 is installed, the pressure plate 8 and the fixing plate 1 are fixedly installed by screws. When the screws are installed and fixed, the pressure plate 8 gradually moves closer to the fixing plate 1. At this time, the spring piece 9 moves closer to the headlight chip 5 and presses the headlight chip 5 onto the thermally conductive silicon layer 6 through the spring piece 9 to form good contact and avoid loosening due to long-term bumps during driving.

[0023] like Figure 2 As shown, the back of the fixing plate 1 is provided with a groove 10. There are multiple grooves 10 and they are evenly spaced. The purpose of providing grooves 10 on the back of the fixing plate 1 is to improve the heat dissipation effect of the fixing plate 1. Multiple grooves 10 increase the contact area with air and improve the heat dissipation efficiency.

[0024] like Figure 3 and Figure 5As shown, the pressure plate 8 and the heat-conducting copper pipe 7 are arranged perpendicularly; the perpendicular arrangement of the pressure plate 8 and the heat-conducting copper pipe 7 provides stable support in four directions and can improve the heat transfer efficiency.

[0025] like Figure 4 As shown, there are multiple heat dissipation slots 11, and they are set with equal spacing. When the fan 4 is started, it circulates the air inside the heat sink 3, which allows the heat dissipated inside the heat dissipation slots 11 to be quickly carried out and circulated inside, thereby improving the heat dissipation effect. Multiple heat dissipation slots 11 can improve the heat dissipation efficiency.

Claims

1. A car headlight radiator, comprising a fixing plate (1), a connector (2), and a heat sink (3), wherein the fixing plate (1) is fixedly connected to the connector (2), and the connector (2) is fixedly connected to the heat sink (3), characterized in that, A fan (4) is fixedly connected to the end of the connector (2). The fan (4) is located inside the heat sink (3). A heat dissipation groove (11) is opened on the inner side of the heat sink (3). A thermally conductive silicon layer (6) is coated on the fixing plate (1). A car light chip (5) is fixed on the thermally conductive silicon layer (6).

2. The automotive headlight radiator according to claim 1, characterized in that, The two sides of the fixed plate (1) are fixedly connected with heat-conducting copper pipes (7). One end of the heat-conducting copper pipe (7) is connected to the heat-conducting silicon layer (6), and the other end of the heat-conducting copper pipe (7) passes through the connector (2) and is fixedly connected to the outer end of the heat sink (3).

3. The automotive headlight radiator according to claim 2, characterized in that, The lower end of the connector (2) is fixedly connected to a pressure plate (8), and the lower end of the pressure plate (8) is fixedly connected to a spring piece (9). The spring piece (9) is abutted against the outer end face of the vehicle light chip (5).

4. The automotive headlight radiator according to claim 2, characterized in that, The back of the fixing plate (1) is provided with a groove (10), and there are multiple grooves (10) with equal spacing.

5. The automotive headlight radiator according to claim 3, characterized in that, The pressure plate (8) and the heat-conducting copper pipe (7) are arranged perpendicularly.

6. The automotive headlight radiator according to claim 2, characterized in that, The number of heat dissipation slots (11) is multiple, and the spacing between them is equal.