Desktop type fanless network manager with good heat dissipation effect

Abstract

The utility model discloses a desktop-type fanless network manager with good heat dissipation effect, which comprises a shell and a cover plate, the shell and the cover plate define an accommodating space, and a mainboard, a heat dissipation assembly and a memory module are arranged in the accommodating space; the shell and the cover plate are made of aluminum materials; the heat dissipation assembly comprises a heat dissipation piece and a heat conduction block. The heat dissipation piece comprises a heat conduction seat, a plurality of first heat dissipation fins, a plurality of second heat dissipation fins and a positioning block, the heat conduction seat is arranged on the mainboard, and the first heat dissipation fins and the second heat dissipation fins are arranged on the upper end face of the heat conduction seat at intervals; the lower end face of the heat conduction block abuts against the positioning block, and the upper end face of the heat conduction block abuts against the inner end face of the cover plate, so that heat in the mainboard is conducted to the cover plate, a fan does not need to be installed for heat dissipation, the weight of the router is reduced, the router is suitable for being used in a small office space and an SOHO, aluminum has high heat conductivity, and the service life of the router is prolonged. And heat generated by electronic components in the shell can be quickly conducted out.

Description

Technical Field

[0001] This utility model relates to the field of network managers, and in particular to a desktop fanless network manager with good heat dissipation. Background Technology

[0002] A network manager is a broadband signal control device used to control a network. It is widely used in multi-device environments such as enterprises and educational institutions and is a common network device. With the development of existing network managers, the internal integration is becoming higher and higher. As the usage load increases, the internal temperature will be high. If the temperature is not dissipated in time, it will cause internal components to burn out, affecting the service life and causing economic losses.

[0003] A prior art network manager with rapid heat dissipation is disclosed, comprising a network manager body, a top cover, and a cooling fan. The base surface of the network manager body has multiple sets of connection interfaces and charging interfaces. First grooves are provided on both sides of the top of the base surface of the network manager body. Multiple sets of ventilation holes are opened on both sides of the network manager body. A mounting bracket is fixedly installed on the outside of the ventilation holes on the network manager body. A slot is provided on the inner wall of the mounting bracket. A filter frame is installed inside the mounting bracket. A pull handle is installed on the top of the filter frame. Locking blocks are provided on both sides of the filter frame. A second dust filter is embedded inside the filter frame. A controller and a temperature sensor are provided inside the network manager body. When the temperature sensor detects that the internal temperature is too high, it transmits a signal to the controller. The controller then controls the cooling fan to operate, dissipating the internal heat. The multiple sets of ventilation holes on both sides of the network manager body allow heat to dissipate through the ventilation holes. The intake air creates internal airflow, improving heat dissipation and preventing overheating that could shorten the device's lifespan. However, this type of network manager has several drawbacks: Firstly, it uses a cooling fan, which is ineffective and generates heat during operation. Secondly, the cooling fan produces noise, especially under high loads or during extended periods, potentially disrupting the quietness of the environment. In environments with high noise levels (such as libraries, offices, and bedrooms), this noise can be disruptive. Finally, the airflow created by the cooling fan acts like a vacuum cleaner, easily drawing dust, hair, and other debris into the network manager. Over time, this dust accumulates on electronic components, affecting heat dissipation and potentially causing short circuits, poor connections, and reduced component lifespan.

[0004] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a desktop fanless network manager with good heat dissipation. Through the design of the aluminum housing and cover plate and heat dissipation components, there is no need to install a fan for heat dissipation, reducing the weight of the router. This makes it suitable for use in smaller office spaces and SOHO environments. Furthermore, aluminum has high thermal conductivity, which can quickly conduct heat generated by the electronic components inside the housing away, helping to maintain a stable internal temperature of the device, preventing performance degradation or component damage due to overheating, and improving the reliability and stability of the network manager.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A desktop fanless network manager with good heat dissipation includes a housing and a removable cover plate on the housing. The housing and the cover plate form an accommodating space, in which a motherboard, a heat dissipation component and a memory module are disposed.

[0008] Both the housing and the cover are made of aluminum. The heat dissipation assembly includes a heat sink and a heat-conducting block. The heat sink includes a heat-conducting base, a plurality of first heat sinks, a plurality of second heat sinks, and a positioning block. The heat-conducting base is disposed on the motherboard, and the plurality of first heat sinks and the plurality of second heat sinks are spaced apart on the upper end surface of the heat-conducting base. The positioning block is disposed on the upper end surface of the heat-conducting base and is located beside the plurality of first heat sinks and the plurality of second heat sinks to separate the plurality of first heat sinks and the plurality of second heat sinks to form a first heat dissipation area and a second heat dissipation area. The lower end surface of the heat-conducting block abuts against the positioning block, and the upper end surface of the heat-conducting block abuts against the inner end surface of the cover to conduct heat from the motherboard to the cover.

[0009] As a preferred embodiment, the plurality of first heat sinks and the plurality of second heat sinks are integrally formed on the heat-conducting base.

[0010] As a preferred embodiment, the motherboard has several first locking holes; the heat-conducting base has a second locking hole corresponding to the first locking holes, and the heat-conducting base is locked to the motherboard by first screws passing through the first locking holes and the second locking holes respectively, so as to ensure the installation stability of the heat-conducting base and prevent it from loosening and affecting the heat conduction effect.

[0011] As a preferred embodiment, the positioning block is provided with a plurality of first positioning holes; the heat-conducting block is provided with a second positioning hole corresponding to the first positioning hole; the heat-conducting block is locked onto the positioning block by second screws passing through the first positioning hole and the second positioning hole respectively, so as to ensure the installation stability of the heat-conducting block and prevent it from loosening and affecting the heat conduction effect.

[0012] As a preferred embodiment, a first connecting post extends from the housing, and a second connecting post is provided on the cover plate for connecting with the first connecting post. The cover plate is detachably mounted on the housing through the cooperation of the second connecting post and the first connecting post.

[0013] As a preferred embodiment, the housing is provided with a power interface, a USB interface, multiple network interfaces, and a reset button; the power interface, USB interface, multiple network interfaces, and reset button are all electrically connected to the motherboard.

[0014] As a preferred embodiment, antennas are also provided on the left and right sides of the power interface, USB interface, and multiple network interfaces, and the antennas are electrically connected to the motherboard.

[0015] As a preferred embodiment, an indicator light is provided on the end of the housing away from the power interface, and the indicator light is at least partially exposed outside the housing and electrically connected to the motherboard.

[0016] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly uses the design of aluminum shell and cover plate. In this way, there is no need to install a fan for heat dissipation, reducing the weight of the router. It is suitable for use in smaller office spaces and SOHO. In addition, aluminum has high thermal conductivity, which can quickly conduct away the heat generated by the electronic components inside the shell, helping to maintain the stable internal temperature of the device, preventing performance degradation or component damage due to overheating, improving the reliability and stability of the network manager, and having a certain strength, which can effectively protect the internal components from external forces such as collision and compression, and is not easily deformed, ensuring that the device operates normally in various environments.

[0017] Secondly, there is the design of the heat dissipation component. The heat dissipation component includes a heat conduction base, several first heat sinks, several second heat sinks, and a positioning block. The heat conduction base is disposed on the motherboard, the lower end face of the heat conduction block abuts against the positioning block, and the upper end face of the heat conduction block abuts against the inner end face of the cover plate to conduct heat from the motherboard to the cover plate. In this way, the heat conduction base conducts heat to the heat sinks and then conducts it out through the aluminum shell and the cover plate.

[0018] Finally, the bottom shell and the cover plate are combined to form a closed space, which effectively protects the circuit components inside the shell and prevents dust from entering.

[0019] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a perspective view of an embodiment of the present utility model;

[0021] Figure 2 This is an exploded view of an embodiment of the present utility model;

[0022] Figure 3 This is another exploded view of an embodiment of the present utility model;

[0023] Figure 4 This is a cross-sectional view of an embodiment of the present utility model;

[0024] Figure 5 This is a structural diagram of a heat sink component according to an embodiment of this utility model.

[0025] Explanation of reference numerals in the attached diagram:

[0026] 1. Shell 2. Cover plate

[0027] 11. First connecting post; 12. Power interface

[0028] 13. USB interface 14. Network interface

[0029] 15. Reset button 16. Antenna

[0030] 17. Signal light; 21. Second connecting post

[0031] 3. Storage space 4. Motherboard

[0032] 41. First locking hole

[0033] 5. Heat dissipation components 6. Memory modules

[0034] 51. Heat sink 52. Heat conduction block

[0035] 511, Heat-conducting base; 512, First heat sink

[0036] 513. Second heat sink; 514. Positioning block

[0037] 515. First heat dissipation area; 516. Second heat dissipation area

[0038] 5111, Second locking hole; 5141, First positioning hole

[0039] 521. Second positioning hole. Detailed Implementation

[0040] Please refer to Figures 1 to 5 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0041] In the description of this utility model, it should be noted that the directional terms such as "up", "down", "front", "back", "left", and "right" indicate the orientation and positional relationship based on the accompanying drawings or the orientation or positional relationship shown when wearing and using the device normally. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0042] A desktop fanless network manager with good heat dissipation includes a housing 1 and a cover plate 2.

[0043] The cover plate 2 is detachably installed on the housing 1. The housing 1 and the cover plate 2 form an accommodating space 3, in which the motherboard 4, heat dissipation component 5 and memory module 6 are installed.

[0044] Both the housing 1 and the cover plate 2 are made of aluminum; thus, there is no need to install a fan for heat dissipation, reducing the weight of the router and making it suitable for use in smaller office spaces and SOHO. In addition, aluminum has high thermal conductivity, which can quickly conduct away the heat generated by the electronic components inside the housing 1, helping to maintain a stable internal temperature of the device, preventing performance degradation or component damage due to overheating, improving the reliability and stability of the network manager, and providing a certain degree of strength to effectively protect the internal components from external forces such as collisions and compression, and is not easily deformed, ensuring that the device operates normally in various environments.

[0045] The heat dissipation assembly 5 includes a heat sink 51 and a heat conduction block 52. The heat sink 51 includes a heat conduction base 511, a plurality of first heat sinks 512, a plurality of second heat sinks 513, and a positioning block 514. The heat conduction base 511 is disposed on the motherboard 4. Preferably, the motherboard 4 has a plurality of first locking holes 41. The heat conduction base 511 has a second locking hole 5111 corresponding to the first locking holes 41. The heat conduction base 511 is locked to the motherboard 4 by first screws passing through the first locking holes 41 and the second locking holes 5111 respectively, to ensure the installation stability of the heat conduction base 511 and prevent it from loosening and affecting the heat conduction effect.

[0046] A plurality of first heat sinks 512 and a plurality of second heat sinks 513 are spaced apart on the upper surface of the heat-conducting base 511; preferably, the plurality of first heat sinks 512 and the plurality of second heat sinks 513 are integrally formed on the heat-conducting base 511.

[0047] The positioning block 514 is disposed on the upper end surface of the heat-conducting base 511 and located beside a plurality of first heat sinks 512 and a plurality of second heat sinks 513, so as to separate the plurality of first heat sinks 512 and a plurality of second heat sinks 513 to form a first heat dissipation area 515 and a second heat dissipation area 516; the lower end surface of the heat-conducting block 52 abuts against the positioning block 514, and the upper end surface of the heat-conducting block 52 abuts against the inner end surface of the cover plate 2, so as to conduct the heat in the motherboard 4 to the cover plate 2.

[0048] Preferably, the positioning block 514 is provided with a plurality of first positioning holes 5141; the heat-conducting block 52 is provided with a second positioning hole 521 corresponding to the first positioning holes 5141. The heat-conducting block 52 is locked onto the positioning block 514 by second screws passing through the first positioning holes 5141 and the second positioning holes 521 respectively, so as to ensure the installation stability of the heat-conducting block 52 and prevent it from loosening, thus affecting the heat conduction effect.

[0049] Preferably, a first connecting post 11 extends from the housing 1, and a second connecting post 21 for connecting with the first connecting post 11 is provided on the cover plate 2. The cover plate 2 is detachably mounted on the housing 1 through the cooperation of the second connecting post 21 and the first connecting post 11.

[0050] Preferably, the housing 1 is provided with a power interface 12, a USB interface 13, multiple network interfaces 14, and a reset button 15; the power interface 12, USB interface 13, multiple network interfaces 14, and reset button 15 are all electrically connected to the motherboard 4. The multiple network interfaces 14 are WAN and LAN ports; the power interface 12 is used to connect a power adapter to supply power to the device; the USB interface can be used to connect external storage devices, etc., to achieve functions such as shared storage; the network interfaces 14 are used to connect external networks (such as broadband lines) and internal devices (such as computers, smart devices, etc.) to achieve network data transmission and sharing. The reset button 15 is used to restore the device to its initial state when the device malfunctions or needs to be restored to factory settings.

[0051] Preferably, antennas 16 are also provided on the left and right sides of the power interface 12, USB interface 13, and multiple network interfaces 14, and the antennas 16 are electrically connected to the motherboard 4. The antennas 16 are responsible for transmitting wireless signals between the antennas 16 and the motherboard 4 to realize the wireless network function. Preferably, an indicator light 17 is also provided on the end of the housing 1 away from the power interface 12, and the indicator light 17 is at least partially exposed outside the housing 1 and electrically connected to the motherboard 4.

[0052] The key design feature of this utility model lies in its use of aluminum for the casing and cover plate. This eliminates the need for a fan for heat dissipation, reducing the weight of the router and making it suitable for use in smaller office spaces and SOHO environments. Furthermore, aluminum has high thermal conductivity, which can quickly conduct heat generated by the electronic components inside the casing away, helping to maintain a stable internal temperature and prevent performance degradation or component damage due to overheating. This enhances the reliability and stability of the network manager. Additionally, aluminum provides sufficient strength to effectively protect internal components from external forces such as collisions and compression, and it is not easily deformed, ensuring the device operates normally in various environments.

[0053] Secondly, there is the design of the heat dissipation component. The heat dissipation component includes a heat conduction base, several first heat sinks, several second heat sinks, and a positioning block. The heat conduction base is disposed on the motherboard, the lower end face of the heat conduction block abuts against the positioning block, and the upper end face of the heat conduction block abuts against the inner end face of the cover plate to conduct heat from the motherboard to the cover plate. In this way, the heat conduction base conducts heat to the heat sinks and then conducts it out through the aluminum shell and the cover plate.

[0054] Finally, the bottom shell and the cover plate are combined to form a closed space, which effectively protects the circuit components inside the shell and prevents dust from entering.

[0055] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A desktop fanless network manager with good heat dissipation, characterized in that: It includes a housing and a removable cover plate on the housing, the housing and the cover plate forming an accommodating space, in which a motherboard, a heat dissipation component and a memory module are disposed; Both the housing and the cover are made of aluminum. The heat dissipation assembly includes a heat sink and a heat-conducting block. The heat sink includes a heat-conducting base, a plurality of first heat sinks, a plurality of second heat sinks, and a positioning block. The heat-conducting base is disposed on the motherboard, and the plurality of first heat sinks and the plurality of second heat sinks are spaced apart on the upper end surface of the heat-conducting base. The positioning block is disposed on the upper end surface of the heat-conducting base and is located beside the plurality of first heat sinks and the plurality of second heat sinks to separate the plurality of first heat sinks and the plurality of second heat sinks to form a first heat dissipation area and a second heat dissipation area. The lower end surface of the heat-conducting block abuts against the positioning block, and the upper end surface of the heat-conducting block abuts against the inner end surface of the cover to conduct heat from the motherboard to the cover.

2. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: The plurality of first heat sinks and the plurality of second heat sinks are integrally formed on the heat-conducting base.

3. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: The motherboard has several first locking holes; the heat-conducting base has a second locking hole corresponding to the first locking holes, and the heat-conducting base is locked to the motherboard by first screws passing through the first locking holes and the second locking holes respectively.

4. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: The positioning block is provided with a plurality of first positioning holes; the heat-conducting block is provided with a second positioning hole corresponding to the first positioning hole, and the heat-conducting block is locked onto the positioning block by a second screw passing through the first positioning hole and the second positioning hole respectively.

5. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: A first connecting post extends from the housing, and a second connecting post is provided on the cover plate for connecting with the first connecting post. The cover plate is detachably mounted on the housing through the cooperation of the second connecting post and the first connecting post.

6. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: The housing is equipped with a power interface, a USB interface, multiple network interfaces, and a reset button; the power interface, USB interface, multiple network interfaces, and reset button are all electrically connected to the motherboard.

7. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: Antennas are also provided on the left and right sides of the power interface, USB interface, and multiple network interfaces, and the antennas are electrically connected to the motherboard.

8. The desktop fanless network manager with good heat dissipation according to claim 1, characterized in that: An indicator light is also provided on the end of the housing away from the power interface. The indicator light is at least partially exposed outside the housing and electrically connected to the motherboard.

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