Edge computing acquisition device

Abstract

The utility model relates to an edge calculation acquisition device which is used for installing and fixing the device. The edge calculation and acquisition equipment comprises a box body, a mainboard, groove sliding rails and elastic positioning assemblies, wherein an air inlet channel and an air outlet channel are formed in the two sides of the box body respectively; the mainboard is mounted in the box body; the groove sliding rails are mounted on the two sides of the bottom of the box body; the groove sliding rail comprises main rails which are oppositely installed, limiting grooves formed in the opposite faces of the main rails, and limiting bosses arranged at the opening ends of the limiting grooves. The elastic positioning assembly comprises a spring installed in the limiting groove, a sliding block installed at the free end of the spring and arranged on the limiting groove in a sliding mode, and a steel ball arranged at the free end of the sliding block. The steel ball is limited and fixed in the limiting groove by the limiting boss; the groove sliding rail is connected with an external fixing device, and preliminary positioning is achieved in a rail insertion mode, so that the equipment installation process is simple and visual.

Description

Technical Field

[0001] This utility model relates to the field of equipment enclosure technology, and in particular to an edge computing acquisition device. Background Technology

[0002] With the continuous expansion of edge computing applications, the deployment scenarios for edge computing acquisition devices are becoming increasingly diverse and complex, with installation needs in various facilities such as industrial environments, smart buildings, and smart cities. In many practical application scenarios, traditional equipment installation methods often require operators to spend a significant amount of time precisely aligning and performing tedious fixing operations. This requires highly skilled operators, is time-consuming, and can easily affect the overall project schedule, leading to a longer equipment deployment cycle. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide an edge computing acquisition device that is easy to install and fix.

[0004] The present invention adopts the following technical solution:

[0005] An edge computing acquisition device is provided for installation and fixation. The edge computing acquisition device includes a housing with an air inlet channel and an air outlet channel on both sides, a main board installed in the housing, grooved slide rails installed on both sides of the bottom of the housing, and an elastic positioning component installed in the grooved slide rails. The grooved slide rails include a main track installed opposite to each other, a limiting groove provided on the opposite surface of the main track, and a limiting boss provided at the opening end of the limiting groove. The elastic positioning component includes a spring installed in the limiting groove, a slider installed on the free end of the spring and sliding on the limiting groove, and a steel ball provided at the free end of the slider. The limiting boss limits and fixes the steel ball in the limiting groove.

[0006] Furthermore, the edge computing acquisition device also includes heat dissipation fins mounted on the motherboard.

[0007] Furthermore, the edge computing acquisition device also includes cooling fans disposed on both sides of the heat dissipation fins, with the air outlet of the cooling fan facing one side of the heat dissipation fins and the air inlet of the cooling fan facing the side away from the heat dissipation fins.

[0008] Furthermore, the air outlet channel is located on one side of the air outlet of the cooling fan, and the edge computing acquisition device also includes an air outlet filter installed on the air outlet channel.

[0009] Furthermore, the edge computing acquisition device also includes an exhaust fan disposed on the exhaust duct, the exhaust fan being mounted on the housing on the side opposite to the exhaust filter.

[0010] Furthermore, the edge computing acquisition device also includes a heat-conducting plate inserted into the motherboard and a heat-conducting fan mounted on the heat-conducting plate. The air outlet of the heat-conducting fan is located on one side of the heat-conducting plate, and the air inlet of the heat-conducting plate is located on the side away from the heat-conducting plate.

[0011] Furthermore, the edge computing acquisition device also includes an air intake filter disposed on the air intake channel.

[0012] Furthermore, an intake fan is provided on the air intake channel on the side away from the intake filter, with the intake port of the intake fan facing the side of the intake filter and the exhaust port of the intake fan facing the inside of the housing.

[0013] Furthermore, the edge computing acquisition device also includes an air outlet window extending outward from the top of the housing, a top filter screen disposed on the air outlet window, and a top fan installed inside the housing. The top fan is installed on the housing on the side away from the top filter screen, the air outlet of the top filter screen is disposed facing the side of the top filter screen, and the air inlet of the top fan screen is disposed facing the side away from the top filter screen.

[0014] Furthermore, the edge computing acquisition device also includes a push-pull handle disposed on the outer wall of the housing, the push-pull handle being disposed on the outer wall of the housing on one side of the air inlet channel.

[0015] The beneficial effects of this utility model are as follows:

[0016] The edge computing acquisition device involved in this utility model connects to an external fixing device via a grooved slide rail. Initial positioning is achieved through track insertion, making the installation process simple and intuitive, facilitating quick installation and fixation. Operators can easily place the housing in the correct position without complex alignment operations, improving installation efficiency. Furthermore, the elastic positioning component ensures precise fixation; after insertion into the appropriate position, steel balls automatically embed into the positioning holes or slots, guaranteeing that the device is accurately positioned in the preset location each time it is installed. This facilitates connection and collaborative work between devices. Simultaneous fixation via the grooved slide rails on both sides provides balanced support, making the housing more stable in its fixed position. When the housing needs to be removed, only appropriate external force needs to be applied to overcome the elasticity of the steel balls to pull the housing out of the fixing device. This significantly reduces the time and workload of disassembly and installation, facilitating rapid repair or replacement of faulty equipment, and reducing equipment maintenance costs and downtime. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of an edge computing acquisition device according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A three-dimensional schematic diagram of the edge computing acquisition device from another angle;

[0019] Figure 3 for Figure 1 Exploded view of the edge computing acquisition device;

[0020] Figure 4 for Figure 3 An exploded view of the edge computing acquisition device from another angle;

[0021] Figure 5 for Figure 1 Left sectional view of the edge computing acquisition device. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the description of this utility model, it should be noted that the terms "vertical direction," "up," "down," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or a connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] Please see Figures 1 to 5This invention relates to an edge computing acquisition device, used for device installation and fixation. The edge computing acquisition device includes a housing 10 with an air inlet channel 11 and an air outlet channel 12 respectively on both sides, a main board 20 installed in the housing 10, grooved slide rails 30 installed on both sides of the bottom of the housing 10, and an elastic positioning component 40 installed in the grooved slide rails 30. The grooved slide rails 30 include a main track 31 installed opposite to each other, a limiting groove 32 provided on the opposite side of the main track 31, and a limiting boss 33 provided at the opening end of the limiting groove 32. The elastic positioning component 40 includes a spring 41 installed in the limiting groove 32, a slider 42 installed on the free end of the spring 41 and slidably disposed on the limiting groove 32, and a steel ball 43 provided at the free end of the slider 42. The limiting boss 33 limits and fixes the steel ball 43 in the limiting groove 32.

[0026] The working principle of this edge computing acquisition device is as follows: When the housing 10 needs to be fixed in a fixed position, it is connected to an external fixing device through the grooved slide rail 30 at the bottom of the housing 10; the grooved slide rail 30 at the bottom of the housing 10 is inserted along these external structures, just like inserting a drawer along a drawer track, to achieve initial positioning; since there is an elastic positioning component 40 in the grooved slide rail 30, the spring 41, slider 42 and steel ball 43 in the limiting groove 32 will play a role during the insertion process; when the slide rail contacts the external fixing device, the steel ball 43 will be subjected to a certain pressure, this pressure This will compress the spring 41, causing the slider 42 to slide within the limiting groove 32. When inserted into the appropriate position, the steel ball 43, under the elastic force of the spring 41, will embed into the positioning hole or slot of the external fixing device, thereby achieving precise fixation of the housing 10. The housing 10 of this device is provided with an air inlet channel 11 and an air outlet channel 12 on both sides. During operation, cold air enters the housing 10 through the air inlet channel 11, flows within the housing 10 and carries away the heat generated by the motherboard 20 and other devices, and then the hot air is discharged through the air outlet channel 12. When the cold air enters the housing 10, it will exchange heat with the heat-generating components such as the motherboard 20.

[0027] Compared to existing technologies, the edge computing acquisition device of this invention uses a grooved slide rail 30 connected to an external fixing device for initial positioning via track insertion, making the installation process simple and intuitive. Operators can easily place the housing 10 in the correct position without complex alignment operations, improving installation efficiency. Furthermore, the elastic positioning component 40 achieves precise fixing; after insertion into the appropriate position, the steel ball 43 automatically embeds into the positioning hole or slot, ensuring the device is accurately positioned in the preset location each time it is installed. This facilitates connection and collaborative work between devices. The grooved slide rails 30 on both sides provide balanced support, making the housing 10 more stable in its fixed position. This dual-point support structure can effectively resist… During operation, the equipment may be subjected to various external forces, such as vibration and collision. Meanwhile, the spring 41, slider 42, and steel ball 43 structure in the elastic positioning component 40 can provide a certain buffering effect when subjected to external impact, preventing damage to the equipment due to rigid collisions. Furthermore, the steel ball 43, embedded in the positioning hole or slot, ensures that the housing 10 will not easily shift, guaranteeing the stability of equipment operation and the accuracy of data acquisition. This connection method is also convenient when maintenance or replacement of the equipment is required; simply apply appropriate external force to overcome the elasticity of the steel ball 43 to pull the housing 10 out of the fixing device. This greatly reduces the time and workload of equipment disassembly and installation, facilitating rapid repair or replacement of faulty equipment, and reducing equipment maintenance costs and downtime.

[0028] Please see Figure 3 The edge computing acquisition device also includes heat sink fins 51 mounted on the motherboard 20. In this embodiment, the heat sink fins 51 are made of aluminum alloy. When the electronic components on the motherboard 20 generate heat, the heat is first transferred to the heat sink fins 51 by conduction. Because the heat sink fins 51 are directly mounted on the motherboard 20, the electronic components and the heat sink fins 51 are in close contact. According to the law of thermal conduction, heat will be transferred from the high-temperature electronic components to the low-temperature heat sink fins 51. The heat sink fins 51 are made of aluminum alloy, which has a high thermal conductivity, allowing heat to be conducted quickly inside the fins. This disperses the concentrated heat on the motherboard 20 onto the entire heat sink fins 51, increasing the heat dissipation area and improving heat exchange efficiency.

[0029] The edge computing acquisition device also includes cooling fans 52 disposed on both sides of the heat sink 51. The air outlet of the cooling fans 52 faces one side of the heat sink 51, and the air inlet of the cooling fans 52 faces the side away from the heat sink 51. With the air inlet of the cooling fans 52 facing away from the heat sink 51, when the fans are working, they actively draw in cool air from the surrounding environment. Under the action of the fans, cool air is continuously drawn into the fan's air inlet. This forced air intake method can provide a larger and faster supply of cool air compared to natural convection. With the air outlet of the cooling fans 52 facing one side of the heat sink 51, the drawn-in cool air is blown towards the heat sink 51 at a high speed under the drive of the fans. At this time, the airflow speed increases, facilitating heat exchange between the cool air and the heat sink 51. The cooling effect is more intense; the cold air can absorb the heat from the heat sink fins 51 more quickly, thus removing the heat generated by the motherboard 20 more efficiently; the two cooling fans 52 are respectively set on both sides of the heat sink fins 51, which can form a relatively stable directional airflow channel; the cold air is drawn in from one fan, and after absorbing heat through the heat sink fins 51, the hot air is blown out by the other fan, thus realizing a continuous and directional cooling airflow circulation; this design can ensure that all parts of the heat sink fins 51 can be fully flushed by the cold air, avoiding local overheating.

[0030] Please see Figure 2 and Figure 3 The air outlet duct 12 is located on one side of the air outlet of the cooling fan 52. The edge computing acquisition device also includes an air outlet filter 13 installed on the air outlet duct 12. The cooling fan 52 blows the hot air, after heat exchange with the heat dissipation fins 51, toward the air outlet, and the air outlet duct 12 is located at this position. In this way, the hot air smoothly enters the air outlet duct 12 under the drive of the fan. The air outlet duct 12 plays a guiding role, just like a chimney guiding smoke out, it guides the hot air to the outside of the equipment in an orderly manner, ensuring that the hot air can effectively leave the equipment casing and preventing the hot air from accumulating inside the casing. The air outlet filter 13 installed on the air outlet duct 12 can filter the exhaust air. During the operation of the equipment, external dust, debris and other impurities may be filtered out. Small particles that may enter the equipment with the airflow, or particles generated inside the equipment (such as particles generated by the wear and tear of electronic components), may be discharged with the hot air. The exhaust filter 13 acts like a sieve, blocking these impurities. When hot air passes through the filter, impurities are trapped on one side of the filter, while clean hot air can be discharged to the outside of the equipment. This keeps the inside of the equipment clean, prevents dust and other impurities from accumulating inside the equipment, and reduces the adverse effects of dust on electronic components and the heat dissipation system, such as avoiding problems such as reduced heat dissipation efficiency or short circuits caused by dust accumulation.

[0031] The edge computing acquisition device also includes an exhaust fan 54 mounted on the exhaust duct 12, which is installed on the housing 10 on the side opposite to the exhaust filter 13. When the device is operating, the cooling fan 52 blows hot air towards the exhaust duct 12, while the exhaust fan 54, mounted on the housing 10 on the side opposite to the exhaust filter 13, generates an outward suction force through its rotation direction and blade design. This suction force acts like a "booster," enhancing the power to expel hot air from the device. Even with the cooling fan 52 providing a certain level of airflow, the exhaust fan 54 can handle some complex situations. For example, when the device is installed in a poorly ventilated environment, or when excessive heat is generated inside the device, resulting in insufficient natural exhaust pressure, the exhaust fan 54 can actively expel the heat... Air extraction ensures that hot air can be expelled from the equipment more quickly and thoroughly, preventing hot air from accumulating in the exhaust duct 12 or inside the enclosure. The operation of the exhaust fan 54 helps optimize the airflow path of the entire equipment. It makes the airflow inside the enclosure more directional. After the cold air entering from the intake duct 11 undergoes heat exchange with the motherboard 20 and the heat sink fins 51, it is guided by the cooling fan 52 to the exhaust duct 12. Then, under the action of the exhaust fan 54, a stable, unidirectional hot air exhaust flow is formed. This stable airflow path can avoid the backflow of hot air and further improve the heat dissipation efficiency of the equipment.

[0032] The edge computing acquisition device also includes a heat-conducting plate 61 inserted into the motherboard 20 and a heat-conducting fan 62 mounted on the heat-conducting plate 61. The air outlet of the heat-conducting fan 62 is located on one side of the heat-conducting plate 61, and the air inlet of the heat-conducting plate 61 is located on the side away from the heat-conducting plate. The motherboard 20 generates heat during operation, and the heat-conducting plate 61, inserted into the motherboard 20, is in close contact with it. In this embodiment, the heat-conducting plate 61 is a copper plate. Since the heat-conducting plate 61 is made of copper, a material with good thermal conductivity, heat will be transferred from the hot motherboard 20 to the heat-conducting plate 61 according to the law of thermal conduction. Just as heat is transferred from a hot object to a cold object in contact with it, the heat from the motherboard 20 can quickly spread on the heat-conducting plate 61. The air inlet of the heat-conducting fan 62 is located on the side away from the heat-conducting plate 61. When the heat-conducting fan 62 is started, it will draw in cool air from the surrounding environment. This process is like a small exhaust fan, drawing in cooler air from the outside. Through this forced air intake, a stable source of cool air can be provided for heat dissipation. The air outlet of the heat-conducting fan 62 is located on one side of the heat-conducting plate 61. Driven by the fan, the drawn-in cool air is blown onto the heat-conducting plate 61 at a certain speed, which can more efficiently absorb the heat on the heat-conducting plate 61.

[0033] Please see Figure 3 and Figure 4The edge computing acquisition device also includes an air intake filter 14 installed on the air intake channel 11. The main function of the air intake filter 14 is to filter the air entering the device. During the operation of the device, dust, hair, fibers and other impurities in the external environment may be drawn into the air intake channel 11 along with the air. The air intake filter 14 plays a role in protecting the precision components inside the device. The motherboard 20 of the edge computing acquisition device has various high-precision electronic components, which have certain requirements for the cleanliness of the environment. By filtering the incoming air, the air intake filter 14 reduces the erosion and damage of impurities to these components. Moreover, for the heat dissipation system, the air intake filter 14 helps maintain the performance of the heat dissipation components. For example, it prevents dust from entering the internal structure of the cooling fan 52, avoiding the fan speed reduction or abnormal noise caused by dust accumulation, thereby ensuring that the cooling fan 52 can normally introduce cool air into the device, providing good initial conditions for the entire heat dissipation process.

[0034] An intake fan is installed on the air intake duct 11 on the side opposite to the intake filter 14. The intake fan's air inlet faces the intake filter 14, and its air outlet faces the inside of the housing. The intake fan's air inlet facing the intake filter 14 allows it to actively draw air from the outside environment when the fan is running. The rotation of the fan blades forces the air to flow towards the center of the fan, creating a negative pressure zone that allows outside air to be continuously drawn in through the intake filter 14. This active air intake method provides a more stable and larger supply of cold air compared to natural air intake. The intake fan's air outlet faces the inside of the housing. After being filtered by the intake filter 14, the drawn-in cold air is then pushed by the fan at a certain... The cold air enters the enclosure quickly; the air pressure generated by the fan allows the cold air to overcome some resistance that may exist inside the enclosure, such as the static pressure of the air inside the enclosure, the obstruction of airflow by the motherboard 20 and other components; after entering the enclosure, this cold air is guided to the components that need heat dissipation, such as the motherboard 20 and the heat sink fins 51; through heat exchange with these heat-generating components, the cold air absorbs heat and becomes hot air, thereby carrying away the heat inside the enclosure, providing a key cold source for the heat dissipation process of the equipment, helping to maintain the temperature balance inside the enclosure, and ensuring the normal operation of the equipment.

[0035] Please see Figure 1 , Figure 3 and Figure 4The edge computing acquisition device also includes an air outlet 15 extending outward from the top of the housing 10, a top filter 16 disposed on the air outlet 15, and a top fan 17 installed inside the housing 10. The top fan 17 is installed on the side of the housing 10 away from the top filter 16. The air outlet of the top filter 16 is disposed facing the side of the top filter 16, and the air inlet of the top fan 17 is disposed facing the side away from the top filter 16. The top fan 17 is installed inside the housing 10 with its air inlet facing away from the top filter 16. When the top fan 17 operates, it generates an upward suction force within the housing 10, drawing hot air upwards. Like an exhaust fan, it guides the air inside the housing 10 towards the top. The hot air drawn in by the top fan 17 flows towards the exhaust window 15. The outward-extending design of the exhaust window 15 provides a suitable outlet for the hot air. The top filter 16 is installed on the exhaust window 15, allowing heat... Air passes through the fan, which also filters the exhaust air to prevent dust and other impurities from entering the housing 10 through the exhaust window 15. During equipment operation, in addition to the original heat dissipation paths through the side air intake channel 11 and the exhaust channel 12, hot air inside the housing 10 can also be exhausted through the top fan 17 and the exhaust window 15. This alleviates the pressure on the side heat dissipation system to some extent. In particular, when the heat dissipation efficiency of the side heat dissipation channel is reduced due to certain reasons (such as partial blockage, external environmental interference, etc.), the top heat dissipation channel can play a supplementary role in heat dissipation.

[0036] The edge computing acquisition device also includes a push-pull handle 18 mounted on the outer wall of the housing 10, located on one side of the air intake duct 11. This placement of the handle 18 on the outer wall of the housing 10 is convenient for operators; when moving equipment, the operator can stand to one side of the device, naturally grasp the handle, and apply force using the grip points provided. When adjusting the device's position or installing it in a rack, the handle can be pushed forward to move the equipment. This push-pull operation allows operators to move equipment comfortably and effortlessly.

[0037] The above description merely illustrates the preferred technical solution of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and this utility model also intends to include these modifications and variations.

Claims

1. An edge computing acquisition device, used for device installation and fixation, characterized in that, The edge computing acquisition device includes a housing with an air inlet channel and an air outlet channel on both sides, a main board installed inside the housing, grooved slide rails installed on both sides of the bottom of the housing, and an elastic positioning component installed in the grooved slide rails. The grooved slide rails include a main track installed opposite to each other, a limiting groove provided on the opposite surface of the main track, and a limiting boss provided at the opening end of the limiting groove. The elastic positioning component includes a spring installed in the limiting groove, a slider installed on the free end of the spring and sliding on the limiting groove, and a steel ball provided at the free end of the slider. The limiting boss limits and fixes the steel ball in the limiting groove.

2. The edge computing acquisition device according to claim 1, characterized in that, The edge computing acquisition device also includes heat sinks mounted on the motherboard.

3. The edge computing acquisition device according to claim 2, characterized in that, The edge computing acquisition device also includes cooling fans disposed on both sides of the heat dissipation fins, with the air outlet of the cooling fan facing one side of the heat dissipation fins and the air inlet of the cooling fan facing the side away from the heat dissipation fins.

4. The edge computing acquisition device according to claim 3, characterized in that, The air outlet channel is located on one side of the air outlet of the cooling fan, and the edge computing acquisition device also includes an air outlet filter installed on the air outlet channel.

5. The edge computing acquisition device according to claim 4, characterized in that, The edge computing acquisition device also includes an exhaust fan disposed on the exhaust duct, the exhaust fan being mounted on the housing on the side opposite to the exhaust filter.

6. The edge computing acquisition device according to claim 1, characterized in that, The edge computing acquisition device also includes a heat-conducting plate inserted into the motherboard and a heat-conducting fan mounted on the heat-conducting plate. The air outlet of the heat-conducting fan is located on one side of the heat-conducting plate, and the air inlet of the heat-conducting plate is located on the side away from the heat-conducting plate.

7. The edge computing acquisition device according to claim 1, characterized in that, The edge computing acquisition device also includes an air intake filter installed on the air intake channel.

8. The edge computing acquisition device according to claim 7, characterized in that, An air intake fan is installed on the air intake channel on the side away from the air intake filter. The air intake of the air intake fan faces the side of the air intake filter, and the air outlet of the air intake fan faces the inside of the housing.

9. The edge computing acquisition device according to claim 1, characterized in that, The edge computing acquisition device also includes an air outlet window extending outward from the top of the housing, a top filter screen disposed on the air outlet window, and a top fan installed inside the housing. The top fan is installed on the housing on the side away from the top filter screen. The air outlet of the top filter screen is disposed facing the side of the top filter screen, and the air inlet of the top fan screen is disposed facing the side away from the top filter screen.

10. The edge computing acquisition device according to claim 1, characterized in that, The edge computing acquisition device also includes a push-pull handle disposed on the outer wall of the housing, the push-pull handle being disposed on the outer wall of the housing on one side of the air inlet channel.

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