Multi-band synthetic signal generating circuit module

Abstract

The utility model provides a multi-band synthetic signal generating circuit module, comprising a substrate and pins, and the edge of the substrate is fixedly connected with a plurality of pins. Compared with the prior art, the radiating device has the advantages that the radiating device aims at the directional reinforced radiating of a high-heating area, then the through holes are formed in a plurality of point positions on the substrate, the radiating cylinders are mounted in the through holes, the bottom of each radiating cylinder is fixedly connected with the base plate, the radiating fins are fixedly connected to the bottom of the base plate, and the radiating fins are circumferentially arrayed relative to the axis of the base plate. A heat conduction interface layer is mounted on one side or two sides of each module, heat is conducted to a heat dissipation cylinder through a heat conduction point, large-area heat dissipation is achieved through a plurality of heat dissipation fins at the bottom of the heat dissipation cylinder, heat is rapidly conducted to a bottom heat dissipation layer from a top layer, a composite structure of vertical heat conduction columns and radial heat dissipation fins is formed, efficient heat dissipation of the module is achieved, and the heat dissipation efficiency of the module is improved. The radiator is suitable for a compact space, and high-heat-flux heat dissipation can be achieved without an external large radiator.

Description

Technical Field

[0001] This utility model relates to the field of signal generation module technology, and in particular to a multi-band synthesized signal generation circuit module. Background Technology

[0002] Signal generators are used to produce electrical test signals with specific parameters. These signals can simulate signals in actual circuits and are used in fields such as testing, research and development, repair, measurement, and calibration. They are the best tool for electronic engineers to conduct signal simulation experiments and play a vital role in electronic experiments and test processing.

[0003] The multi-band synthesized signal generation circuit module generates a lot of heat during operation. This is because the multi-band synthesized signal generation circuit module needs to generate and amplify high-frequency signals. These high-frequency signals will generate energy loss when transmitted in the circuit, which will be converted into heat. Therefore, a new multi-band synthesized signal generation circuit module needs to be designed to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a multi-band synthesized signal generation circuit module to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides a multi-band synthesized signal generation circuit module, including a substrate and pins. Several pins are fixedly connected to the edge of the substrate, and a clock module, a frequency control module, a waveform generation module, a modulation module, an output amplification module, and a control module are mounted on the substrate.

[0007] The control module is located in the center of the substrate, the clock module and the frequency control module are located on one side of the control module, and the waveform generation module, the modulation module and the output amplification module are located on the other side of the control module.

[0008] Through holes are formed at several points on the substrate, and heat sinks are installed in the through holes;

[0009] The bottom of the heat sink is fixedly connected to a chassis, and the bottom of the chassis is fixedly connected to a plurality of heat sinks, which are arranged in a circular array about the axis of the chassis.

[0010] An interface layer is attached to one or both sides of the clock module, frequency control module, waveform generation module, modulation module, output amplification module, and control module. A thermal pad is fixedly connected to the top of the heat sink.

[0011] Preferably, in any of the above embodiments, the substrate is divided into three layers: a top layer, a middle layer, and a heat dissipation layer, which are formed by hot pressing.

[0012] Using the above technical solution: the top layer can be a copper foil layer, the middle layer is an insulating layer, and the heat dissipation layer is an aluminum layer.

[0013] Preferably, in any of the above schemes, the stable clock signal generated by the clock module is input to the frequency control module, and the waveform generation module generates a corresponding signal waveform according to the waveform type and parameters selected by the user, and outputs it to the modulation module.

[0014] The above technical solution employs the following: A clock module provides a stable clock signal, which serves as the reference for the entire signal generator. The stability and accuracy of the clock signal directly affect the frequency and phase of the output signal. A frequency control module adjusts the clock signal frequency according to user-defined frequency parameters via a frequency synthesizer or frequency divider. The frequency synthesizer can be based on Direct Digital Synthesis (DDS) technology, generating waveform data through a digital signal processor to precisely control the frequency of the output signal. A waveform generation module is responsible for generating various types of signal waveforms, such as sine waves, square waves, and triangle waves. These waveforms can be generated using analog or digital circuits. In digital circuits, waveform generation is typically based on DDS technology, storing digital amplitude information of different waveforms in a waveform memory, and then accessing the waveform memory according to the output address of the phase accumulator to obtain the corresponding waveform amplitude value. A modulation module is used to modulate the signal to achieve different communication requirements. Modulation methods include amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM). The modulation module consists of a modulator and a demodulator. During modulation, the modulation module loads the baseband signal (i.e., the information signal to be transmitted) onto the carrier signal to form a modulated signal. The modulated signal is then amplified and output to external devices or systems. The output amplification module amplifies the generated signal waveform to an appropriate amplitude to meet the needs of different application scenarios. The output amplification module typically consists of a power amplifier and attenuator components.

[0015] Clock signal generation: First, the clock module generates a stable clock signal as the reference for the entire signal generator.

[0016] Frequency control: The frequency control module adjusts the frequency of the clock signal through a frequency synthesizer or frequency divider according to the frequency parameters set by the user.

[0017] Waveform generation: The waveform generation module generates corresponding signal waveforms based on DDS technology or analog circuits, according to the waveform type and parameters selected by the user.

[0018] Modulation processing: If signal modulation is required, the modulation module will modulate the amplitude, frequency or phase of the generated signal.

[0019] Output processing: Finally, the output amplification module amplifies the modulated signal waveform to an appropriate amplitude and outputs it to an external device or system through the output interface.

[0020] Preferably, in any of the above schemes, the output amplification module amplifies the modulated signal waveform to an appropriate amplitude and outputs it to an external device or system. The control module receives control commands input by the user and adjusts the gain and attenuation parameters of the output amplification module according to the commands. The clock module, frequency control module, waveform generation module, modulation module, output amplification module and control module transmit signals to each other via signal lines or buses.

[0021] The special design of this circuit module is as follows: the control module is located in the center of the substrate, the clock module and frequency control module are located on one side of the control module, and the waveform generation module, modulation module, and output amplification module are located on the other side of the control module. High-heat-generating components such as the frequency control module and output amplification module are distributed to avoid heat concentration, simplify the heat dissipation path design, and facilitate targeted and enhanced heat dissipation in high-heat-generating areas. Then, through-holes are made at several points on the substrate, and heat sinks are installed in the through-holes. The bottom of the heat sink is fixedly connected to the chassis, and several heat sinks are fixedly connected to the bottom of the chassis. The heat sinks are arranged in a circumferential array about the axis of the chassis. Then, a thermally conductive interface layer is attached to one or both sides of each module to conduct heat to the heat sink through the hot spot, and then achieve large-area heat dissipation through the numerous heat sinks at the bottom. Heat is quickly conducted from the top layer to the bottom heat dissipation layer, forming a composite structure of "vertical heat conduction column + radial heat dissipation fins", which realizes the efficient heat dissipation of this module. It is suitable for compact spaces and can achieve high heat flux density heat dissipation without the need for external large heat sinks. The circumferential distribution of the heat sinks evens out the temperature of the heat dissipation surface and avoids local overheating.

[0022] Preferably, in any of the above embodiments, the heat sink is bonded or welded to the inner wall of the through hole, and the heat sink is made of copper.

[0023] Preferably, the interface layer and the heating pad are copper foil layers, as described in any of the above schemes.

[0024] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0025] This multi-band synthesized signal generation circuit module places the control module in the center of the substrate, the clock module and frequency control module on one side of the control module, and the waveform generation module, modulation module, and output amplification module on the other side of the control module. High-heat-generating components such as the frequency control module and output amplification module are distributed to avoid heat concentration, simplify the heat dissipation path design, and facilitate targeted heat dissipation enhancement in high-heat-generating areas. Through-holes are made at several points on the substrate, with heat sinks installed in the through-holes. A chassis is fixedly connected to the bottom of the heat sink, and several heat sinks are fixedly connected to the bottom of the chassis. The heat sinks are arranged in a circumferential array about the axis of the chassis. A thermally conductive interface layer is then attached to one or both sides of each module, conducting heat through hot spots to the heat sink, and then dissipating heat over a large area through the numerous heat sinks at its bottom. Heat is rapidly conducted from the top layer to the bottom heat dissipation layer, forming a composite structure of "vertical heat-conducting pillars + radial heat dissipation fins," achieving efficient heat dissipation for this module. It is suitable for compact spaces, achieving high heat flux density heat dissipation without the need for external large heat sinks. The circumferential distribution of the heat sinks evens out the surface temperature of the heat dissipation surface, preventing localized overheating.

[0026] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0027] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0028] Figure 1 This is a first-view structural schematic diagram of the present invention;

[0029] Figure 2 This is a structural schematic diagram of the present invention from a second perspective;

[0030] Figure 3 This is a structural schematic diagram of the present invention from a third-view perspective.

[0031] In the diagram: 1-substrate, 2-pin, 3-clock module, 4-frequency control module, 5-waveform generation module, 6-modulation module, 7-output amplification module, 8-control module, 9-via, 10-heat sink, 11-chassis, 12-heat sink, 13-interface layer, 14-thermal pad. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] like Figure 1-3 As shown, this multi-band synthesized signal generation circuit module includes a substrate 1 and pins 2. Several pins 2 are fixedly connected to the edge of the substrate 1. A clock module 3, a frequency control module 4, a waveform generation module 5, a modulation module 6, an output amplification module 7, and a control module 8 are mounted on the substrate 1.

[0035] The control module 8 is located in the center of the substrate 1, the clock module 3 and the frequency control module 4 are located on one side of the control module 8, and the waveform generation module 5, the modulation module 6 and the output amplification module 7 are located on the other side of the control module 8.

[0036] Through holes 9 are made at several points on the substrate 1, and heat sinks 10 are installed in the through holes 9;

[0037] The bottom of the heat sink 10 is fixedly connected to a chassis 11, and the bottom of the chassis 11 is fixedly connected to a plurality of heat sinks 12, which are arranged in a circular array about the axis of the chassis 11.

[0038] An interface layer 13 is attached to one or both sides of the clock module 3, frequency control module 4, waveform generation module 5, modulation module 6, output amplification module 7, and control module 8. A thermal pad 14 is fixedly connected to the top of the heat sink 10.

[0039] Example 1: The substrate 1 consists of three layers: a top layer, a middle layer, and a heat dissipation layer, which are thermoformed together. The top layer can be a copper foil layer, the middle layer is an insulating layer, and the heat dissipation layer is an aluminum layer. A stable clock signal generated by the clock module 3 is input to the frequency control module 4. The waveform generation module 5 generates a corresponding signal waveform according to the waveform type and parameters selected by the user and outputs it to the modulation module 6.

[0040] Example 2: The output amplification module 7 amplifies the modulated signal waveform to an appropriate amplitude and outputs it to an external device or system. The control module 8 receives control commands input by the user and adjusts the gain and attenuation parameters of the output amplification module 7 according to the commands. The clock module 3, frequency control module 4, waveform generation module 5, modulation module 6, output amplification module 7, and control module 8 transmit signals via signal lines and buses. The control module 8 is located in the center of the substrate 1, the clock module 3 and frequency control module 4 are located on one side of the control module 8, and the waveform generation module 5, modulation module 6, and output amplification module 7 are located on the other side of the control module 8. High-heat-generating components such as the frequency control module 4 and output amplification module 7 are distributed to avoid heat concentration and simplify the heat dissipation path design.

[0041] The heat sink 10 is bonded or welded to the inner wall of the through hole 9. The heat sink 10 is made of copper. The interface layer 13 and the heating pad 14 are copper foil layers.

[0042] The working principle of this utility model is as follows:

[0043] Clock module 3 provides a stable clock signal, which serves as the reference for the entire signal generator. The stability and accuracy of the clock signal directly affect the frequency and phase of the output signal. Frequency control module 4 adjusts the frequency of the clock signal according to the user-defined frequency parameters via a frequency synthesizer or frequency divider. The frequency synthesizer can be based on Direct Digital Synthesis (DDS) technology, generating waveform data through a digital signal processor to precisely control the frequency of the output signal. Waveform generation module 5 is responsible for generating various types of signal waveforms, such as sine waves, square waves, and triangle waves. These waveforms can be generated using analog or digital circuits. In digital circuits, waveform generation is typically based on DDS technology, storing digital amplitude information of different waveforms in a waveform memory, and then accessing the waveform memory according to the output address of the phase accumulator to obtain the corresponding waveform amplitude value. Modulation module 6 is used to modulate the signal to achieve different communication requirements. Modulation methods include amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM). Modulation module 6 consists of modulator and demodulator components. During modulation, modulation module 6 loads the baseband signal (i.e., the information signal to be transmitted) onto the carrier signal to form a modulated signal. The modulated signal is then amplified and output to an external device or system. Output amplification module 7 amplifies the generated signal waveform to an appropriate amplitude to meet the needs of different application scenarios. Output amplification module 7 typically consists of a power amplifier and attenuator components.

[0044] Clock signal generation: First, clock module 3 generates a stable clock signal as the reference for the entire signal generator.

[0045] Frequency control: The frequency control module 4 adjusts the frequency of the clock signal through a frequency synthesizer or frequency divider according to the frequency parameters set by the user.

[0046] Waveform generation: The waveform generation module 5 generates the corresponding signal waveform based on DDS technology or analog circuits according to the waveform type and parameters selected by the user.

[0047] Modulation processing: If signal modulation is required, modulation module 6 will modulate the amplitude, frequency or phase of the generated signal.

[0048] Output processing: Finally, the output amplification module 7 amplifies the modulated signal waveform to an appropriate amplitude and outputs it to an external device or system through the output interface.

[0049] Compared with the prior art, the present invention has the following advantages:

[0050] This multi-band synthesized signal generation circuit module places the control module 8 in the center of the substrate 1, the clock module 3 and the frequency control module 4 on one side of the control module 8, and the waveform generation module 5, the modulation module 6, and the output amplification module 7 on the other side of the control module 8. High-heat-generating components such as the frequency control module 4 and the output amplification module 7 are distributed to avoid heat concentration, simplify the heat dissipation path design, and facilitate targeted heat dissipation enhancement for high-heat-generating areas. Through-holes 9 are then made at several points on the substrate 1, and heat sinks 10 are installed in the through-holes 9. A base 11 is fixedly connected to the bottom of the heat sink 10. The module is fixedly connected to several heat sinks 12, which are arranged in a circumferential array about the axis of the chassis 11. Then, a thermally conductive interface layer 13 is attached to one or both sides of each module to conduct heat to the heat sink 10 through the heat conduction point 14. Then, heat dissipation is achieved over a large area through the numerous heat sinks 12 at the bottom. Heat is quickly conducted from the top layer to the bottom heat dissipation layer, forming a composite structure of "vertical heat conduction column + radial heat dissipation fins". This achieves efficient heat dissipation of the module, which is suitable for compact spaces and can achieve high heat flux density heat dissipation without the need for an external large heat sink. The circumferential distribution of the heat sinks 12 evens out the temperature of the heat dissipation surface and avoids local overheating.

Claims

1. A multi-band synthesized signal generation circuit module, characterized in that, Includes a substrate (1) and pins (2). Several pins (2) are fixedly connected to the edge of the substrate (1). A clock module (3), a frequency control module (4), a waveform generation module (5), a modulation module (6), an output amplification module (7), and a control module (8) are installed on the substrate (1). The control module (8) is located in the center of the substrate (1), the clock module (3) and the frequency control module (4) are located on one side of the control module (8), and the waveform generation module (5), the modulation module (6) and the output amplification module (7) are located on the other side of the control module (8). Through holes (9) are provided at several points on the substrate (1), and heat sinks (10) are installed in the through holes (9); The bottom of the heat sink (10) is fixedly connected to a chassis (11), and the bottom of the chassis (11) is fixedly connected to a plurality of heat sinks (12), which are arranged in a circular array about the axis of the chassis (11). An interface layer (13) is attached to one or both sides of the clock module (3), frequency control module (4), waveform generation module (5), modulation module (6), output amplification module (7) and control module (8), and a thermal pad (14) is fixedly connected to the top of the heat sink (10).

2. The multi-band synthesized signal generation circuit module as described in claim 1, characterized in that: The substrate (1) is divided into three layers, namely the top layer, the middle layer and the heat dissipation layer, which are formed by hot pressing.

3. The multi-band synthesized signal generation circuit module as described in claim 2, characterized in that: The stable clock signal generated by the clock module (3) is input to the frequency control module (4), and the waveform generation module (5) generates the corresponding signal waveform according to the waveform type and parameters selected by the user, and outputs it to the modulation module (6).

4. The multi-band synthesized signal generation circuit module as described in claim 3, characterized in that: The output amplification module (7) amplifies the modulated signal waveform to an appropriate amplitude and outputs it to an external device or system. The control module (8) receives the control command input by the user and adjusts the gain and attenuation parameters of the output amplification module (7) according to the command. The clock module (3), frequency control module (4), waveform generation module (5), modulation module (6), output amplification module (7) and control module (8) transmit signals to each other through signal lines and buses.

5. The multi-band synthesized signal generation circuit module as described in claim 4, characterized in that: The heat sink (10) is bonded or welded to the inner wall of the through hole (9), and the heat sink (10) is made of copper.

6. The multi-band synthesized signal generation circuit module as described in claim 5, characterized in that: The interface layer (13) and the thermal pad (14) are copper foil layers.

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